[{"language":[{"iso":"eng"}],"department":[{"_id":"58"}],"user_id":"59648","_id":"47009","status":"public","abstract":[{"lang":"eng","text":"We present a fully integrated radio frequency identifications transponder chip operating at 5.8 GHz, which is compatible with the class-1 generation-2 of the Electronic Product Code protocol (EPC-C1 G2). The tag chip including the analog front-end and the digital baseband processor, are designed in the sub-threshold regime (0.5 V) with a total supply current of less than 50 μA. As a power scavenging unit, a single-stage differential-drive rectifier structure is designed and fabricated with standard threshold voltage (SVT) MOS elements in a commercial 65-nm CMOS process, to provide 0.8 V of rectified voltage. Measurements performed on the fabricated single-stage structure show a maximum power conversion efficiency of 69.6% for a 22 kΩ load and a sensitivity of -12.5 dBm, which corresponds to more than 1 m of reading range. The power conversion efficiency at this range is about 64%."}],"publication":" IEEE Journal of Radio Frequency Identification","type":"journal_article","conference":{"start_date":"2023-08-29"},"doi":"10.1109/JRFID.2023.3308332","title":"A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology","author":[{"last_name":"Haddadian","full_name":"Haddadian, Sanaz","id":"59648","first_name":"Sanaz"},{"first_name":"J. Christoph","last_name":"Scheytt","orcid":"0000-0002-5950-6618 ","id":"37144","full_name":"Scheytt, J. Christoph"},{"full_name":"von Bögel, Gerd","last_name":"von Bögel","first_name":"Gerd"},{"first_name":"Thorben","full_name":"Grenter, Thorben","last_name":"Grenter"}],"date_created":"2023-09-13T11:08:22Z","publisher":"IEEE","date_updated":"2025-02-13T14:24:24Z","citation":{"apa":"Haddadian, S., Scheytt, J. C., von Bögel, G., &#38; Grenter, T. (2023). A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology. <i> IEEE Journal of Radio Frequency Identification</i>. <a href=\"https://doi.org/10.1109/JRFID.2023.3308332\">https://doi.org/10.1109/JRFID.2023.3308332</a>","mla":"Haddadian, Sanaz, et al. “A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology.” <i> IEEE Journal of Radio Frequency Identification</i>, IEEE, 2023, doi:<a href=\"https://doi.org/10.1109/JRFID.2023.3308332\">10.1109/JRFID.2023.3308332</a>.","short":"S. Haddadian, J.C. Scheytt, G. von Bögel, T. Grenter,  IEEE Journal of Radio Frequency Identification (2023).","bibtex":"@article{Haddadian_Scheytt_von Bögel_Grenter_2023, title={A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology}, DOI={<a href=\"https://doi.org/10.1109/JRFID.2023.3308332\">10.1109/JRFID.2023.3308332</a>}, journal={ IEEE Journal of Radio Frequency Identification}, publisher={IEEE}, author={Haddadian, Sanaz and Scheytt, J. Christoph and von Bögel, Gerd and Grenter, Thorben}, year={2023} }","ieee":"S. Haddadian, J. C. Scheytt, G. von Bögel, and T. Grenter, “A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology,” <i> IEEE Journal of Radio Frequency Identification</i>, 2023, doi: <a href=\"https://doi.org/10.1109/JRFID.2023.3308332\">10.1109/JRFID.2023.3308332</a>.","chicago":"Haddadian, Sanaz, J. Christoph Scheytt, Gerd von Bögel, and Thorben Grenter. “A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology.” <i> IEEE Journal of Radio Frequency Identification</i>, 2023. <a href=\"https://doi.org/10.1109/JRFID.2023.3308332\">https://doi.org/10.1109/JRFID.2023.3308332</a>.","ama":"Haddadian S, Scheytt JC, von Bögel G, Grenter T. A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology. <i> IEEE Journal of Radio Frequency Identification</i>. Published online 2023. doi:<a href=\"https://doi.org/10.1109/JRFID.2023.3308332\">10.1109/JRFID.2023.3308332</a>"},"year":"2023","publication_identifier":{"eissn":["2469-7281"]},"publication_status":"published"},{"type":"conference","publication":"2023 24th International Radar Symposium (IRS)","status":"public","abstract":[{"lang":"eng","text":"One of the main challenges for next generation automotive radars is the improvement of angular resolution to a sub-degree level. In this context, wide aperture automotive radars of 1m length or more and resolution close to 0.1° in azimuth and 0.5° in elevation could be beneficial. To enable coherent processing of arrays with such large aperture, prior (i.e offline) and online calibration are necessary: channel imbalances (gains and phases) and three dimensional coordinates of transmit and receive elements need to be determined. We propose a calibration strategy based on alternating steps between the two subtasks of i) channel imbalance estimation with ‘known’ array positions, by applying a singular value decomposition to the resulting tensor calculus problem; and ii) antenna position estimation with ’known’ channel imbalances, by numerically maximizing the Bayesian posterior probability; in both cases operating on range/Doppler snapshots of disjoint targets (with potentially unknown locations). Simulation studies based on the parameters of a MIMO 8x6 linear sparse array show promising results as long as the initial position errors do not exceed half a wavelength (2mm), beyond which we observe strong effects of ambiguity. Experimental results with real measurements show that after calibration in laboratory conditions, our MIMO 8x6 demonstrator with 50cm aperture is able to resolve two targets at the same range with angular separation at least as close as 0.4°."}],"user_id":"38254","department":[{"_id":"58"}],"_id":"46426","language":[{"iso":"eng"}],"publication_identifier":{"eisbn":["978-3-944976-34-1"]},"citation":{"ieee":"C. Greiff <i>et al.</i>, “Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions,” presented at the 2023 24th International Radar Symposium (IRS), Berlin, Germany, 2023, doi: <a href=\"https://doi.org/10.23919/IRS57608.2023.10172475\">10.23919/IRS57608.2023.10172475</a>.","chicago":"Greiff, Christian , David Mateos-Núñez, Renato Simoni, Maria González-Huici, Stephan Kruse, J. Christoph Scheytt, Karl Kolk, et al. “Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions.” In <i>2023 24th International Radar Symposium (IRS)</i>. IEEE, 2023. <a href=\"https://doi.org/10.23919/IRS57608.2023.10172475\">https://doi.org/10.23919/IRS57608.2023.10172475</a>.","ama":"Greiff C, Mateos-Núñez D, Simoni R, et al. Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions. In: <i>2023 24th International Radar Symposium (IRS)</i>. IEEE; 2023. doi:<a href=\"https://doi.org/10.23919/IRS57608.2023.10172475\">10.23919/IRS57608.2023.10172475</a>","apa":"Greiff, C., Mateos-Núñez, D., Simoni, R., González-Huici, M., Kruse, S., Scheytt, J. C., Kolk, K., Höller, C., Kurz, H. G., Meinecke, M.-M., &#38; Gisder, T. (2023). Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions. <i>2023 24th International Radar Symposium (IRS)</i>. 2023 24th International Radar Symposium (IRS), Berlin, Germany. <a href=\"https://doi.org/10.23919/IRS57608.2023.10172475\">https://doi.org/10.23919/IRS57608.2023.10172475</a>","bibtex":"@inproceedings{Greiff_Mateos-Núñez_Simoni_González-Huici_Kruse_Scheytt_Kolk_Höller_Kurz_Meinecke_et al._2023, title={Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions}, DOI={<a href=\"https://doi.org/10.23919/IRS57608.2023.10172475\">10.23919/IRS57608.2023.10172475</a>}, booktitle={2023 24th International Radar Symposium (IRS)}, publisher={IEEE}, author={Greiff, Christian  and Mateos-Núñez, David and Simoni, Renato and González-Huici, Maria and Kruse, Stephan and Scheytt, J. Christoph and Kolk, Karl and Höller, Christian and Kurz, Heiko Gustav and Meinecke, Marc-Michael and et al.}, year={2023} }","mla":"Greiff, Christian, et al. “Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions.” <i>2023 24th International Radar Symposium (IRS)</i>, IEEE, 2023, doi:<a href=\"https://doi.org/10.23919/IRS57608.2023.10172475\">10.23919/IRS57608.2023.10172475</a>.","short":"C. Greiff, D. Mateos-Núñez, R. Simoni, M. González-Huici, S. Kruse, J.C. Scheytt, K. Kolk, C. Höller, H.G. Kurz, M.-M. Meinecke, T. Gisder, in: 2023 24th International Radar Symposium (IRS), IEEE, 2023."},"year":"2023","date_created":"2023-08-07T06:45:11Z","author":[{"first_name":"Christian ","last_name":"Greiff","full_name":"Greiff, Christian "},{"full_name":"Mateos-Núñez, David","last_name":"Mateos-Núñez","first_name":"David"},{"first_name":"Renato","full_name":"Simoni, Renato","last_name":"Simoni"},{"full_name":"González-Huici, Maria","last_name":"González-Huici","first_name":"Maria"},{"last_name":"Kruse","full_name":"Kruse, Stephan","id":"38254","first_name":"Stephan"},{"first_name":"J. Christoph","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt","id":"37144","full_name":"Scheytt, J. Christoph"},{"first_name":"Karl","full_name":"Kolk, Karl","last_name":"Kolk"},{"last_name":"Höller","full_name":"Höller, Christian","first_name":"Christian"},{"first_name":"Heiko Gustav","full_name":"Kurz, Heiko Gustav","last_name":"Kurz"},{"first_name":"Marc-Michael","full_name":"Meinecke, Marc-Michael","last_name":"Meinecke"},{"first_name":"Thomas","full_name":"Gisder, Thomas","last_name":"Gisder"}],"publisher":"IEEE","date_updated":"2025-02-25T05:52:16Z","conference":{"name":"2023 24th International Radar Symposium (IRS)","start_date":"2023.05.24","end_date":"2023.05.26","location":"Berlin, Germany"},"doi":"10.23919/IRS57608.2023.10172475","title":"Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions"},{"status":"public","publication":"BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium","type":"conference_abstract","language":[{"iso":"eng"}],"department":[{"_id":"58"}],"user_id":"15931","_id":"47064","citation":{"ieee":"M. Iftekhar, H. Nagaraju, P. Kneuper, B. Sadiye, W. Müller, and J. C. Scheytt, “A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI CMOS Technology ,” MONTEREY, CALIFORNIA, USA, 2023.","chicago":"Iftekhar, Mohammed, Harshan Nagaraju, Pascal Kneuper, Babak Sadiye, Wolfgang Müller, and J. Christoph Scheytt. “A 28-Gb/s 27.2 MW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 Nm FD-SOI CMOS Technology .” In <i>BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium</i>, 2023.","ama":"Iftekhar M, Nagaraju H, Kneuper P, Sadiye B, Müller W, Scheytt JC. A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI CMOS Technology . In: <i>BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium</i>. ; 2023.","apa":"Iftekhar, M., Nagaraju, H., Kneuper, P., Sadiye, B., Müller, W., &#38; Scheytt, J. C. (2023). A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI CMOS Technology . <i>BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium</i>.","short":"M. Iftekhar, H. Nagaraju, P. Kneuper, B. Sadiye, W. Müller, J.C. Scheytt, in: BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2023.","bibtex":"@inproceedings{Iftekhar_Nagaraju_Kneuper_Sadiye_Müller_Scheytt_2023, title={A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI CMOS Technology }, booktitle={BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium}, author={Iftekhar, Mohammed and Nagaraju, Harshan and Kneuper, Pascal and Sadiye, Babak and Müller, Wolfgang and Scheytt, J. Christoph}, year={2023} }","mla":"Iftekhar, Mohammed, et al. “A 28-Gb/s 27.2 MW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 Nm FD-SOI CMOS Technology .” <i>BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium</i>, 2023."},"year":"2023","related_material":{"link":[{"url":"https://bcicts.org/","relation":"contains"}]},"conference":{"start_date":"2023-10-15","end_date":"2023-10-18","location":"MONTEREY, CALIFORNIA, USA"},"title":"A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI CMOS Technology ","date_created":"2023-09-14T11:30:36Z","author":[{"first_name":"Mohammed","full_name":"Iftekhar, Mohammed","id":"47944","last_name":"Iftekhar"},{"first_name":"Harshan","last_name":"Nagaraju","full_name":"Nagaraju, Harshan"},{"last_name":"Kneuper","full_name":"Kneuper, Pascal","id":"47367","first_name":"Pascal"},{"full_name":"Sadiye, Babak","id":"93634","last_name":"Sadiye","first_name":"Babak"},{"first_name":"Wolfgang","last_name":"Müller","id":"16243","full_name":"Müller, Wolfgang"},{"first_name":"J. Christoph","last_name":"Scheytt","orcid":"0000-0002-5950-6618 ","id":"37144","full_name":"Scheytt, J. Christoph"}],"date_updated":"2025-02-26T14:41:53Z"},{"issue":"6","publication_identifier":{"issn":["0730-0301","1557-7368"]},"publication_status":"published","page":"1-19","intvolume":"        42","citation":{"apa":"Khanteimouri, P., &#38; Campen, M. (2023). 3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing. <i>ACM Transactions on Graphics</i>, <i>42</i>(6), 1–19. <a href=\"https://doi.org/10.1145/3618332\">https://doi.org/10.1145/3618332</a>","mla":"Khanteimouri, Payam, and Marcel Campen. “3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing.” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6, Association for Computing Machinery (ACM), 2023, pp. 1–19, doi:<a href=\"https://doi.org/10.1145/3618332\">10.1145/3618332</a>.","short":"P. Khanteimouri, M. Campen, ACM Transactions on Graphics 42 (2023) 1–19.","bibtex":"@article{Khanteimouri_Campen_2023, title={3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing}, volume={42}, DOI={<a href=\"https://doi.org/10.1145/3618332\">10.1145/3618332</a>}, number={6}, journal={ACM Transactions on Graphics}, publisher={Association for Computing Machinery (ACM)}, author={Khanteimouri, Payam and Campen, Marcel}, year={2023}, pages={1–19} }","ama":"Khanteimouri P, Campen M. 3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing. <i>ACM Transactions on Graphics</i>. 2023;42(6):1-19. doi:<a href=\"https://doi.org/10.1145/3618332\">10.1145/3618332</a>","chicago":"Khanteimouri, Payam, and Marcel Campen. “3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing.” <i>ACM Transactions on Graphics</i> 42, no. 6 (2023): 1–19. <a href=\"https://doi.org/10.1145/3618332\">https://doi.org/10.1145/3618332</a>.","ieee":"P. Khanteimouri and M. Campen, “3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing,” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6, pp. 1–19, 2023, doi: <a href=\"https://doi.org/10.1145/3618332\">10.1145/3618332</a>."},"year":"2023","volume":42,"author":[{"last_name":"Khanteimouri","full_name":"Khanteimouri, Payam","first_name":"Payam"},{"first_name":"Marcel","last_name":"Campen","orcid":"0000-0003-2340-3462","full_name":"Campen, Marcel","id":"114904"}],"date_created":"2025-06-24T07:46:53Z","date_updated":"2025-07-14T12:46:54Z","publisher":"Association for Computing Machinery (ACM)","doi":"10.1145/3618332","title":"3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing","publication":"ACM Transactions on Graphics","type":"journal_article","status":"public","abstract":[{"text":"<jats:p>We present a method for the generation of higher-order tetrahedral meshes. In contrast to previous methods, the curved tetrahedral elements are guaranteed to be free of degeneracies and inversions while conforming exactly to prescribed piecewise polynomial surfaces, such as domain boundaries or material interfaces. Arbitrary polynomial order is supported. Algorithmically, the polynomial input surfaces are first covered by a single layer of carefully constructed curved elements using a recursive refinement procedure that provably avoids degeneracies and inversions. These tetrahedral elements are designed such that the remaining space is bounded piecewise linearly. In this way, our method effectively reduces the curved meshing problem to the classical problem of linear mesh generation (for the remaining space).</jats:p>","lang":"eng"}],"department":[{"_id":"969"}],"user_id":"117512","_id":"60355","extern":"1","language":[{"iso":"eng"}]},{"issue":"6","publication_identifier":{"issn":["0730-0301","1557-7368"]},"publication_status":"published","page":"1-24","intvolume":"        42","citation":{"bibtex":"@article{Brückler_Campen_2023, title={Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing}, volume={42}, DOI={<a href=\"https://doi.org/10.1145/3618384\">10.1145/3618384</a>}, number={6}, journal={ACM Transactions on Graphics}, publisher={Association for Computing Machinery (ACM)}, author={Brückler, Hendrik and Campen, Marcel}, year={2023}, pages={1–24} }","mla":"Brückler, Hendrik, and Marcel Campen. “Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing.” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6, Association for Computing Machinery (ACM), 2023, pp. 1–24, doi:<a href=\"https://doi.org/10.1145/3618384\">10.1145/3618384</a>.","short":"H. Brückler, M. Campen, ACM Transactions on Graphics 42 (2023) 1–24.","apa":"Brückler, H., &#38; Campen, M. (2023). Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing. <i>ACM Transactions on Graphics</i>, <i>42</i>(6), 1–24. <a href=\"https://doi.org/10.1145/3618384\">https://doi.org/10.1145/3618384</a>","ama":"Brückler H, Campen M. Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing. <i>ACM Transactions on Graphics</i>. 2023;42(6):1-24. doi:<a href=\"https://doi.org/10.1145/3618384\">10.1145/3618384</a>","ieee":"H. Brückler and M. Campen, “Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing,” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6, pp. 1–24, 2023, doi: <a href=\"https://doi.org/10.1145/3618384\">10.1145/3618384</a>.","chicago":"Brückler, Hendrik, and Marcel Campen. “Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing.” <i>ACM Transactions on Graphics</i> 42, no. 6 (2023): 1–24. <a href=\"https://doi.org/10.1145/3618384\">https://doi.org/10.1145/3618384</a>."},"year":"2023","volume":42,"date_created":"2025-06-24T07:45:44Z","author":[{"last_name":"Brückler","full_name":"Brückler, Hendrik","id":"115694","first_name":"Hendrik"},{"first_name":"Marcel","orcid":"0000-0003-2340-3462","last_name":"Campen","id":"114904","full_name":"Campen, Marcel"}],"publisher":"Association for Computing Machinery (ACM)","date_updated":"2025-07-14T12:47:30Z","doi":"10.1145/3618384","title":"Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing","publication":"ACM Transactions on Graphics","type":"journal_article","status":"public","abstract":[{"text":"<jats:p>We present a set of operators to perform modifications, in particular collapses and splits, in volumetric cell complexes which are discretely embedded in a background mesh. Topological integrity and geometric embedding validity are carefully maintained. We apply these operators strategically to volumetric block decompositions, so-called T-meshes or base complexes, in the context of hexahedral mesh generation. This allows circumventing the expensive and unreliable global volumetric remapping step in the versatile meshing pipeline based on 3D integer-grid maps. In essence, we reduce this step to simpler local cube mapping problems, for which reliable solutions are available. As a consequence, the robustness of the mesh generation process is increased, especially when targeting coarse or block-structured hexahedral meshes. We furthermore extend this pipeline to support feature alignment constraints, and systematically respect these throughout, enabling the generation of meshes that align to points, curves, and surfaces of special interest, whether on the boundary or in the interior of the domain.</jats:p>","lang":"eng"}],"department":[{"_id":"969"}],"user_id":"117512","_id":"60354","extern":"1","language":[{"iso":"eng"}]},{"user_id":"117512","department":[{"_id":"969"}],"_id":"60335","extern":"1","language":[{"iso":"eng"}],"type":"journal_article","publication":"ACM Transactions on Graphics","status":"public","abstract":[{"lang":"eng","text":"<jats:p>A method is presented to compute volumetric maps and parametrizations of objects over 3D domains. As a key feature, continuity and bijectivity are ensured by construction. Arbitrary objects of ball topology, represented as tetrahedral meshes, are supported. Arbitrary convex as well as star-shaped domains are supported. Full control over the boundary mapping is provided. The method is based on the technique of simplicial foliations, generalized to a broader class of domain shapes and applied adaptively in a novel localized manner. This increases flexibility as well as efficiency over the state of the art, while maintaining reliability in guaranteeing map bijectivity.</jats:p>"}],"date_created":"2025-06-23T10:38:02Z","author":[{"first_name":"Steffen","full_name":"Hinderink, Steffen","id":"116615","last_name":"Hinderink"},{"first_name":"Marcel","orcid":"0000-0003-2340-3462","last_name":"Campen","id":"114904","full_name":"Campen, Marcel"}],"volume":42,"date_updated":"2025-07-14T12:48:12Z","publisher":"Association for Computing Machinery (ACM)","doi":"10.1145/3592410","title":"Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping","issue":"4","publication_status":"published","publication_identifier":{"issn":["0730-0301","1557-7368"]},"citation":{"chicago":"Hinderink, Steffen, and Marcel Campen. “Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping.” <i>ACM Transactions on Graphics</i> 42, no. 4 (2023): 1–16. <a href=\"https://doi.org/10.1145/3592410\">https://doi.org/10.1145/3592410</a>.","ieee":"S. Hinderink and M. Campen, “Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping,” <i>ACM Transactions on Graphics</i>, vol. 42, no. 4, pp. 1–16, 2023, doi: <a href=\"https://doi.org/10.1145/3592410\">10.1145/3592410</a>.","ama":"Hinderink S, Campen M. Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping. <i>ACM Transactions on Graphics</i>. 2023;42(4):1-16. doi:<a href=\"https://doi.org/10.1145/3592410\">10.1145/3592410</a>","mla":"Hinderink, Steffen, and Marcel Campen. “Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping.” <i>ACM Transactions on Graphics</i>, vol. 42, no. 4, Association for Computing Machinery (ACM), 2023, pp. 1–16, doi:<a href=\"https://doi.org/10.1145/3592410\">10.1145/3592410</a>.","bibtex":"@article{Hinderink_Campen_2023, title={Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping}, volume={42}, DOI={<a href=\"https://doi.org/10.1145/3592410\">10.1145/3592410</a>}, number={4}, journal={ACM Transactions on Graphics}, publisher={Association for Computing Machinery (ACM)}, author={Hinderink, Steffen and Campen, Marcel}, year={2023}, pages={1–16} }","short":"S. Hinderink, M. Campen, ACM Transactions on Graphics 42 (2023) 1–16.","apa":"Hinderink, S., &#38; Campen, M. (2023). Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping. <i>ACM Transactions on Graphics</i>, <i>42</i>(4), 1–16. <a href=\"https://doi.org/10.1145/3592410\">https://doi.org/10.1145/3592410</a>"},"intvolume":"        42","page":"1-16","year":"2023"},{"title":"Security Analysis of the 3MF Data Format","publisher":"ACM","date_created":"2023-10-11T13:42:09Z","year":"2023","quality_controlled":"1","keyword":["Data Format Security","3D Manufacturing Format","3D Printing","Additive Manufacturing"],"ddc":["000"],"language":[{"iso":"eng"}],"abstract":[{"lang":"eng","text":"3D printing is a well-established technology with rapidly increasing usage scenarios both in the industry and consumer context. The growing popularity of 3D printing has also attracted security researchers, who have analyzed possibilities for weakening 3D models or stealing intellectual property from 3D models. We extend these important aspects and provide the first comprehensive security analysis of 3D printing data formats. We performed our systematic study on the example of the 3D Manufacturing Format (3MF), which offers a large variety of features that could lead to critical attacks. Based on 3MF’s features, we systematized three attack goals: Data Exfiltration (dex), Denial of Service, and UI Spoofing (uis). We achieve these goals by exploiting the complexity of 3MF, which is based on the Open Packaging Conventions (OPC) format and uses XML to define 3D models. In total, our analysis led to 352 tests. To create and run these tests automatically, we implemented an open-source tool named 3MF Analyzer (tool), which helped us evaluate 20 applications."}],"file":[{"creator":"jrossel","date_created":"2023-10-16T03:48:08Z","date_updated":"2024-09-05T11:14:40Z","access_level":"open_access","file_id":"48065","file_name":"Security_Analysis_of_the_3mf_Data_Format.pdf","file_size":1054999,"content_type":"application/pdf","relation":"main_file"}],"publication":"Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses","conference":{"name":"26th International Symposium on Research in Attacks, Intrusions and Defenses","start_date":"2023-10-16","end_date":"2023-10-18","location":"Hongkong"},"doi":"10.1145/3607199.3607216","main_file_link":[{"url":"https://dl.acm.org/doi/abs/10.1145/3607199.3607216"}],"oa":"1","date_updated":"2025-07-16T11:06:49Z","author":[{"first_name":"Jost","last_name":"Rossel","orcid":"0000-0002-3182-4059","id":"58331","full_name":"Rossel, Jost"},{"last_name":"Mladenov","full_name":"Mladenov, Vladislav","first_name":"Vladislav"},{"last_name":"Somorovsky","orcid":"0000-0002-3593-7720","id":"83504","full_name":"Somorovsky, Juraj","first_name":"Juraj"}],"citation":{"ama":"Rossel J, Mladenov V, Somorovsky J. Security Analysis of the 3MF Data Format. In: <i>Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses</i>. ACM; 2023. doi:<a href=\"https://doi.org/10.1145/3607199.3607216\">10.1145/3607199.3607216</a>","ieee":"J. Rossel, V. Mladenov, and J. Somorovsky, “Security Analysis of the 3MF Data Format,” presented at the 26th International Symposium on Research in Attacks, Intrusions and Defenses, Hongkong, 2023, doi: <a href=\"https://doi.org/10.1145/3607199.3607216\">10.1145/3607199.3607216</a>.","chicago":"Rossel, Jost, Vladislav Mladenov, and Juraj Somorovsky. “Security Analysis of the 3MF Data Format.” In <i>Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses</i>. ACM, 2023. <a href=\"https://doi.org/10.1145/3607199.3607216\">https://doi.org/10.1145/3607199.3607216</a>.","mla":"Rossel, Jost, et al. “Security Analysis of the 3MF Data Format.” <i>Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses</i>, ACM, 2023, doi:<a href=\"https://doi.org/10.1145/3607199.3607216\">10.1145/3607199.3607216</a>.","bibtex":"@inproceedings{Rossel_Mladenov_Somorovsky_2023, title={Security Analysis of the 3MF Data Format}, DOI={<a href=\"https://doi.org/10.1145/3607199.3607216\">10.1145/3607199.3607216</a>}, booktitle={Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses}, publisher={ACM}, author={Rossel, Jost and Mladenov, Vladislav and Somorovsky, Juraj}, year={2023} }","short":"J. Rossel, V. Mladenov, J. Somorovsky, in: Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses, ACM, 2023.","apa":"Rossel, J., Mladenov, V., &#38; Somorovsky, J. (2023). Security Analysis of the 3MF Data Format. <i>Proceedings of the 26th International Symposium on Research in Attacks, Intrusions and Defenses</i>. 26th International Symposium on Research in Attacks, Intrusions and Defenses, Hongkong. <a href=\"https://doi.org/10.1145/3607199.3607216\">https://doi.org/10.1145/3607199.3607216</a>"},"has_accepted_license":"1","publication_status":"published","file_date_updated":"2024-09-05T11:14:40Z","_id":"48012","department":[{"_id":"632"}],"user_id":"58331","status":"public","type":"conference"},{"language":[{"iso":"ger"}],"alternative_title":["Implementation of optimized surface slitting for eddy current loss reduction on the surface of an additively manufactured pemanent magnet rotor"],"_id":"45360","department":[{"_id":"146"},{"_id":"219"},{"_id":"158"}],"user_id":"35970","editor":[{"first_name":"Michael","full_name":"Kynast, Michael","last_name":"Kynast"},{"last_name":"Eichmann","full_name":"Eichmann, Michael","first_name":"Michael"},{"first_name":"Gerd","full_name":"Witt, Gerd","last_name":"Witt"}],"status":"public","publication":"Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023","popular_science":"1","type":"book_chapter","title":"Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors","doi":"https://doi.org/10.3139/9783446479425.001 ","date_updated":"2025-08-29T09:19:53Z","publisher":"Carl Hanser Verlag GmbH & Co. KG","date_created":"2023-05-30T05:55:15Z","author":[{"last_name":"Haase","full_name":"Haase, Michael","id":"35970","first_name":"Michael"},{"full_name":"Bieber, Maximilian","last_name":"Bieber","first_name":"Maximilian"},{"first_name":"Frederik","full_name":"Tasche, Frederik","last_name":"Tasche"},{"full_name":"Schaper, Mirko","id":"43720","last_name":"Schaper","first_name":"Mirko"},{"last_name":"Hoyer","full_name":"Hoyer, Kay-Peter","id":"48411","first_name":"Kay-Peter"},{"last_name":"Ponik","full_name":"Ponik, Bernd","first_name":"Bernd"},{"first_name":"Balázs","last_name":"Magyar","full_name":"Magyar, Balázs","id":"97759"}],"place":"München","year":"2023","citation":{"ama":"Haase M, Bieber M, Tasche F, et al. Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors. In: Kynast M, Eichmann M, Witt G, eds. <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023</i>. Carl Hanser Verlag GmbH &#38; Co. KG; 2023. doi:<a href=\"https://doi.org/10.3139/9783446479425.001 \">https://doi.org/10.3139/9783446479425.001 </a>","chicago":"Haase, Michael, Maximilian Bieber, Frederik Tasche, Mirko Schaper, Kay-Peter Hoyer, Bernd Ponik, and Balázs Magyar. “Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors.” In <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023</i>, edited by Michael Kynast, Michael Eichmann, and Gerd Witt. München: Carl Hanser Verlag GmbH &#38; Co. KG, 2023. <a href=\"https://doi.org/10.3139/9783446479425.001 \">https://doi.org/10.3139/9783446479425.001 </a>.","ieee":"M. Haase <i>et al.</i>, “Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors,” in <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023</i>, M. Kynast, M. Eichmann, and G. Witt, Eds. München: Carl Hanser Verlag GmbH &#38; Co. KG, 2023.","apa":"Haase, M., Bieber, M., Tasche, F., Schaper, M., Hoyer, K.-P., Ponik, B., &#38; Magyar, B. (2023). Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors. In M. Kynast, M. Eichmann, &#38; G. Witt (Eds.), <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023</i>. Carl Hanser Verlag GmbH &#38; Co. KG. <a href=\"https://doi.org/10.3139/9783446479425.001 \">https://doi.org/10.3139/9783446479425.001 </a>","short":"M. Haase, M. Bieber, F. Tasche, M. Schaper, K.-P. Hoyer, B. Ponik, B. Magyar, in: M. Kynast, M. Eichmann, G. Witt (Eds.), Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023, Carl Hanser Verlag GmbH &#38; Co. KG, München, 2023.","mla":"Haase, Michael, et al. “Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors.” <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023</i>, edited by Michael Kynast et al., Carl Hanser Verlag GmbH &#38; Co. KG, 2023, doi:<a href=\"https://doi.org/10.3139/9783446479425.001 \">https://doi.org/10.3139/9783446479425.001 </a>.","bibtex":"@inbook{Haase_Bieber_Tasche_Schaper_Hoyer_Ponik_Magyar_2023, place={München}, title={Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors}, DOI={<a href=\"https://doi.org/10.3139/9783446479425.001 \">https://doi.org/10.3139/9783446479425.001 </a>}, booktitle={Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May 2023}, publisher={Carl Hanser Verlag GmbH &#38; Co. KG}, author={Haase, Michael and Bieber, Maximilian and Tasche, Frederik and Schaper, Mirko and Hoyer, Kay-Peter and Ponik, Bernd and Magyar, Balázs}, editor={Kynast, Michael and Eichmann, Michael and Witt, Gerd}, year={2023} }"},"publication_identifier":{"eisbn":["978-3-446-47942-5"],"isbn":["978-3-446-47941-8"]},"publication_status":"published"},{"_id":"63043","user_id":"112030","department":[{"_id":"623"},{"_id":"15"},{"_id":"230"}],"abstract":[{"text":"Spatial modes of light have become highly attractive to increase the dimension and, thereby, security and information capacity in quantum key distribution (QKD). So far, only transverse electric field components have been considered, while longitudinal polarization components have remained neglected. Here, we present an approach to include all three spatial dimensions of electric field oscillation in QKD by implementing our tunable, on-a-chip vector beam decoder (VBD). This inversely designed device pioneers the \"preparation\" and \"measurement\" of three-dimensionally polarized mutually unbiased basis states for high-dimensional (HD) QKD and paves the way for the integration of HD QKD with spatial modes in multifunctional on-a-chip photonics platforms.","lang":"eng"}],"status":"public","type":"journal_article","title":"Tunable vector beam decoder by inverse design for high-dimensional quantum key distribution with 3D polarized spatial modes","doi":"10.48550/ARXIV.2304.12296","date_updated":"2025-12-11T20:46:50Z","date_created":"2025-12-11T20:37:08Z","year":"2023","citation":{"short":"(2023).","mla":"<i>Tunable Vector Beam Decoder by Inverse Design for High-Dimensional Quantum Key Distribution with 3D Polarized Spatial Modes</i>. 2023, doi:<a href=\"https://doi.org/10.48550/ARXIV.2304.12296\">10.48550/ARXIV.2304.12296</a>.","bibtex":"@article{Tunable vector beam decoder by inverse design for high-dimensional quantum key distribution with 3D polarized spatial modes_2023, DOI={<a href=\"https://doi.org/10.48550/ARXIV.2304.12296\">10.48550/ARXIV.2304.12296</a>}, year={2023} }","apa":"<i>Tunable vector beam decoder by inverse design for high-dimensional quantum key distribution with 3D polarized spatial modes</i>. (2023). <a href=\"https://doi.org/10.48550/ARXIV.2304.12296\">https://doi.org/10.48550/ARXIV.2304.12296</a>","chicago":"“Tunable Vector Beam Decoder by Inverse Design for High-Dimensional Quantum Key Distribution with 3D Polarized Spatial Modes,” 2023. <a href=\"https://doi.org/10.48550/ARXIV.2304.12296\">https://doi.org/10.48550/ARXIV.2304.12296</a>.","ieee":"“Tunable vector beam decoder by inverse design for high-dimensional quantum key distribution with 3D polarized spatial modes,” 2023, doi: <a href=\"https://doi.org/10.48550/ARXIV.2304.12296\">10.48550/ARXIV.2304.12296</a>.","ama":"Tunable vector beam decoder by inverse design for high-dimensional quantum key distribution with 3D polarized spatial modes. Published online 2023. doi:<a href=\"https://doi.org/10.48550/ARXIV.2304.12296\">10.48550/ARXIV.2304.12296</a>"}},{"publisher":"Springer Science and Business Media LLC","date_updated":"2025-12-17T08:56:50Z","author":[{"first_name":"Simone","full_name":"Jablonski, Simone","last_name":"Jablonski"}],"date_created":"2024-12-04T10:46:14Z","volume":113,"title":"Is it all about the setting? — A comparison of mathematical modelling with real objects and their representation","doi":"10.1007/s10649-023-10215-2","publication_status":"published","publication_identifier":{"issn":["0013-1954","1573-0816"]},"issue":"2","year":"2023","citation":{"ama":"Jablonski S. Is it all about the setting? — A comparison of mathematical modelling with real objects and their representation. <i>Educational Studies in Mathematics</i>. 2023;113(2):307-330. doi:<a href=\"https://doi.org/10.1007/s10649-023-10215-2\">10.1007/s10649-023-10215-2</a>","ieee":"S. Jablonski, “Is it all about the setting? — A comparison of mathematical modelling with real objects and their representation,” <i>Educational Studies in Mathematics</i>, vol. 113, no. 2, pp. 307–330, 2023, doi: <a href=\"https://doi.org/10.1007/s10649-023-10215-2\">10.1007/s10649-023-10215-2</a>.","chicago":"Jablonski, Simone. “Is It All about the Setting? — A Comparison of Mathematical Modelling with Real Objects and Their Representation.” <i>Educational Studies in Mathematics</i> 113, no. 2 (2023): 307–30. <a href=\"https://doi.org/10.1007/s10649-023-10215-2\">https://doi.org/10.1007/s10649-023-10215-2</a>.","short":"S. Jablonski, Educational Studies in Mathematics 113 (2023) 307–330.","bibtex":"@article{Jablonski_2023, title={Is it all about the setting? — A comparison of mathematical modelling with real objects and their representation}, volume={113}, DOI={<a href=\"https://doi.org/10.1007/s10649-023-10215-2\">10.1007/s10649-023-10215-2</a>}, number={2}, journal={Educational Studies in Mathematics}, publisher={Springer Science and Business Media LLC}, author={Jablonski, Simone}, year={2023}, pages={307–330} }","mla":"Jablonski, Simone. “Is It All about the Setting? — A Comparison of Mathematical Modelling with Real Objects and Their Representation.” <i>Educational Studies in Mathematics</i>, vol. 113, no. 2, Springer Science and Business Media LLC, 2023, pp. 307–30, doi:<a href=\"https://doi.org/10.1007/s10649-023-10215-2\">10.1007/s10649-023-10215-2</a>.","apa":"Jablonski, S. (2023). Is it all about the setting? — A comparison of mathematical modelling with real objects and their representation. <i>Educational Studies in Mathematics</i>, <i>113</i>(2), 307–330. <a href=\"https://doi.org/10.1007/s10649-023-10215-2\">https://doi.org/10.1007/s10649-023-10215-2</a>"},"page":"307-330","intvolume":"       113","_id":"57556","user_id":"111489","language":[{"iso":"eng"}],"type":"journal_article","publication":"Educational Studies in Mathematics","abstract":[{"lang":"eng","text":"<jats:title>Abstract</jats:title><jats:p>Mathematical modelling emphasizes the connection between mathematics and reality — still, tasks are often exclusively introduced inside the classroom. The paper examines the potential of different task settings for mathematical modelling with real objects: outdoors at the real object itself, with photographs and with a 3D model representation. It is the aim of the study to analyze how far the mathematical modelling steps of students solving the tasks differ in comparison to the settings and representations. In a qualitative study, 19 lower secondary school students worked on tasks of all three settings in a Latin square design. Their working processes in the settings are compared with a special focus on the modelling steps Simplifying and Structuring, as well as Mathematizing. The analysis by means of activity diagrams and a qualitative content analysis shows that both steps are particularly relevant when students work with real objects — independent from the three settings. Still, differences in the actual activities could be observed in the students’ discussion on the appropriateness of a model and in dealing with inaccuracies at the real object. In addition, the process of data collection shows different procedures depending on the setting which presents each of them as an enrichment for the acquisition of modelling skills.</jats:p>"}],"status":"public"},{"publication_identifier":{"isbn":["978-3-031-47895-6"]},"place":"Berlin, Heidelberg","year":"2023","page":"72–87","citation":{"apa":"Grimme, B., Pohl, J., Winkelmann, H., Stampe, L., &#38; Grimme, C. (2023). Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media. <i>Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>, 72–87. <a href=\"https://doi.org/10.1007/978-3-031-47896-3_6\">https://doi.org/10.1007/978-3-031-47896-3_6</a>","bibtex":"@inproceedings{Grimme_Pohl_Winkelmann_Stampe_Grimme_2023, place={Berlin, Heidelberg}, title={Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media}, DOI={<a href=\"https://doi.org/10.1007/978-3-031-47896-3_6\">10.1007/978-3-031-47896-3_6</a>}, booktitle={Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings}, publisher={Springer-Verlag}, author={Grimme, Britta and Pohl, Janina and Winkelmann, Hendrik and Stampe, Lucas and Grimme, Christian}, year={2023}, pages={72–87} }","mla":"Grimme, Britta, et al. “Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media.” <i>Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>, Springer-Verlag, 2023, pp. 72–87, doi:<a href=\"https://doi.org/10.1007/978-3-031-47896-3_6\">10.1007/978-3-031-47896-3_6</a>.","short":"B. Grimme, J. Pohl, H. Winkelmann, L. Stampe, C. Grimme, in: Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings, Springer-Verlag, Berlin, Heidelberg, 2023, pp. 72–87.","chicago":"Grimme, Britta, Janina Pohl, Hendrik Winkelmann, Lucas Stampe, and Christian Grimme. “Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media.” In <i>Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>, 72–87. Berlin, Heidelberg: Springer-Verlag, 2023. <a href=\"https://doi.org/10.1007/978-3-031-47896-3_6\">https://doi.org/10.1007/978-3-031-47896-3_6</a>.","ieee":"B. Grimme, J. Pohl, H. Winkelmann, L. Stampe, and C. Grimme, “Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media,” in <i>Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>, 2023, pp. 72–87, doi: <a href=\"https://doi.org/10.1007/978-3-031-47896-3_6\">10.1007/978-3-031-47896-3_6</a>.","ama":"Grimme B, Pohl J, Winkelmann H, Stampe L, Grimme C. Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media. In: <i>Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>. Springer-Verlag; 2023:72–87. doi:<a href=\"https://doi.org/10.1007/978-3-031-47896-3_6\">10.1007/978-3-031-47896-3_6</a>"},"date_updated":"2026-03-19T07:48:51Z","publisher":"Springer-Verlag","date_created":"2024-03-25T14:38:01Z","author":[{"last_name":"Grimme","full_name":"Grimme, Britta","first_name":"Britta"},{"full_name":"Pohl, Janina","last_name":"Pohl","first_name":"Janina"},{"first_name":"Hendrik","last_name":"Winkelmann","full_name":"Winkelmann, Hendrik"},{"first_name":"Lucas","full_name":"Stampe, Lucas","last_name":"Stampe"},{"last_name":"Grimme","full_name":"Grimme, Christian","first_name":"Christian"}],"title":"Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media","doi":"10.1007/978-3-031-47896-3_6","publication":"Disinformation in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings","type":"conference","abstract":[{"text":"This paper addresses new challenges of detecting campaigns in social media, which emerged with the rise of Large Language Models (LLMs). LLMs particularly challenge algorithms focused on the temporal analysis of topical clusters. Simple similarity measures can no longer capture and map campaigns that were previously broadly similar in content. Herein, we analyze whether the classification of messages over time can be profitably used to rediscover poorly detectable campaigns at the content level. Thus, we evaluate classical classifiers and a new method based on siamese neural networks. Our results show that campaigns can be detected despite the limited reliability of the classifiers as long as they are based on a large amount of simultaneously spread artificial content.","lang":"eng"}],"status":"public","_id":"52865","user_id":"103682","keyword":["Social Media","Campaign Detection","Large Language Models","Siamese Neural Networks"]},{"status":"public","publication":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","type":"conference_abstract","language":[{"iso":"ger"}],"_id":"29852","department":[{"_id":"157"}],"user_id":"66192","year":"2022","citation":{"ama":"Beule F, Teutenberg D, Meschut G, Aubel T, Matzenmiller A. Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen. In: <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. ; 2022.","chicago":"Beule, Felix, Dominik Teutenberg, Gerson Meschut, Tobias Aubel, and Anton Matzenmiller. “Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen.” In <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","ieee":"F. Beule, D. Teutenberg, G. Meschut, T. Aubel, and A. Matzenmiller, “Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","mla":"Beule, Felix, et al. “Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen.” <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","bibtex":"@inproceedings{Beule_Teutenberg_Meschut_Aubel_Matzenmiller_2022, title={Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen}, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Beule, Felix and Teutenberg, Dominik and Meschut, Gerson and Aubel, Tobias and Matzenmiller, Anton}, year={2022} }","short":"F. Beule, D. Teutenberg, G. Meschut, T. Aubel, A. Matzenmiller, in: 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","apa":"Beule, F., Teutenberg, D., Meschut, G., Aubel, T., &#38; Matzenmiller, A. (2022). Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen. <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik."},"title":"Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen","conference":{"end_date":"2022-02-16","name":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","start_date":"2022-02-15"},"date_updated":"2022-02-16T07:15:15Z","date_created":"2022-02-16T07:14:34Z","author":[{"id":"66192","full_name":"Beule, Felix","last_name":"Beule","first_name":"Felix"},{"first_name":"Dominik","last_name":"Teutenberg","id":"537","full_name":"Teutenberg, Dominik"},{"first_name":"Gerson","id":"32056","full_name":"Meschut, Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut"},{"first_name":"Tobias","last_name":"Aubel","full_name":"Aubel, Tobias"},{"full_name":"Matzenmiller, Anton","last_name":"Matzenmiller","first_name":"Anton"}]},{"title":"Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden","conference":{"end_date":"2022-02-16","start_date":"2022-02-15","name":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik"},"date_updated":"2022-02-16T07:21:38Z","date_created":"2022-02-16T07:20:30Z","author":[{"first_name":"Vinicius","last_name":"Carillo Beber","full_name":"Carillo Beber, Vinicius"},{"first_name":"Christof","last_name":"Nagel","full_name":"Nagel, Christof"},{"last_name":"Mayer","full_name":"Mayer, Bernd","first_name":"Bernd"},{"first_name":"Christian","last_name":"Köster","full_name":"Köster, Christian"},{"first_name":"Anton","full_name":"Matzenmiller, Anton","last_name":"Matzenmiller"},{"last_name":"Hecht","full_name":"Hecht, Matthias","first_name":"Matthias"},{"last_name":"Baumgartner","full_name":"Baumgartner, Jörg","first_name":"Jörg"},{"first_name":"Tobias","full_name":"Melz, Tobias","last_name":"Melz"},{"full_name":"Tews, Karina","id":"40263","last_name":"Tews","first_name":"Karina"},{"first_name":"Serkan","full_name":"Çavdar, Serkan","id":"36456","last_name":"Çavdar"},{"orcid":"0000-0002-2763-1246","last_name":"Meschut","id":"32056","full_name":"Meschut, Gerson","first_name":"Gerson"}],"year":"2022","citation":{"ama":"Carillo Beber V, Nagel C, Mayer B, et al. Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden. In: <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. ; 2022.","ieee":"V. Carillo Beber <i>et al.</i>, “Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","chicago":"Carillo Beber, Vinicius, Christof Nagel, Bernd Mayer, Christian Köster, Anton Matzenmiller, Matthias Hecht, Jörg Baumgartner, et al. “Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden.” In <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","short":"V. Carillo Beber, C. Nagel, B. Mayer, C. Köster, A. Matzenmiller, M. Hecht, J. Baumgartner, T. Melz, K. Tews, S. Çavdar, G. Meschut, in: 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","mla":"Carillo Beber, Vinicius, et al. “Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden.” <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","bibtex":"@inproceedings{Carillo Beber_Nagel_Mayer_Köster_Matzenmiller_Hecht_Baumgartner_Melz_Tews_Çavdar_et al._2022, title={Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden}, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Carillo Beber, Vinicius and Nagel, Christof and Mayer, Bernd and Köster, Christian and Matzenmiller, Anton and Hecht, Matthias and Baumgartner, Jörg and Melz, Tobias and Tews, Karina and Çavdar, Serkan and et al.}, year={2022} }","apa":"Carillo Beber, V., Nagel, C., Mayer, B., Köster, C., Matzenmiller, A., Hecht, M., Baumgartner, J., Melz, T., Tews, K., Çavdar, S., &#38; Meschut, G. (2022). Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden. <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik."},"language":[{"iso":"ger"}],"_id":"29855","user_id":"40263","department":[{"_id":"157"}],"status":"public","type":"conference","publication":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik"},{"status":"public","publication":"22. Kolloquium Gemeinsame Forschung in der Klebtechnik","type":"conference","language":[{"iso":"ger"}],"department":[{"_id":"9"},{"_id":"157"}],"user_id":"32252","_id":"29344","corporate_editor":["DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V."],"citation":{"apa":"Kowatz, J., Teutenberg, D., &#38; Meschut, G. (2022). Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren. In DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V. (Ed.), <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>.","short":"J. Kowatz, D. Teutenberg, G. Meschut, in: DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V. (Ed.), 22. Kolloquium Gemeinsame Forschung in der Klebtechnik, 2022.","mla":"Kowatz, Jannik, et al. “Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren.” <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>, edited by DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V., 2022.","bibtex":"@inproceedings{Kowatz_Teutenberg_Meschut_2022, title={Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren}, booktitle={22. Kolloquium Gemeinsame Forschung in der Klebtechnik}, author={Kowatz, Jannik and Teutenberg, Dominik and Meschut, Gerson}, editor={DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V.}, year={2022} }","chicago":"Kowatz, Jannik, Dominik Teutenberg, and Gerson Meschut. “Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren.” In <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>, edited by DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V., 2022.","ieee":"J. Kowatz, D. Teutenberg, and G. Meschut, “Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren,” in <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>, Online, 2022.","ama":"Kowatz J, Teutenberg D, Meschut G. Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren. In: DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V., ed. <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>. ; 2022."},"year":"2022","conference":{"end_date":"16.02.2022","location":"Online","name":"22. Kolloquium Gemeinsame Forschung in der Klebtechnik","start_date":"15.02.2022"},"title":"Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren","author":[{"first_name":"Jannik","last_name":"Kowatz","full_name":"Kowatz, Jannik","id":"32252"},{"first_name":"Dominik","last_name":"Teutenberg","id":"537","full_name":"Teutenberg, Dominik"},{"first_name":"Gerson","full_name":"Meschut, Gerson","id":"32056","last_name":"Meschut","orcid":"0000-0002-2763-1246"}],"date_created":"2022-01-14T08:10:43Z","date_updated":"2022-02-23T15:22:16Z"},{"year":"2022","citation":{"ama":"Chudalla N, Meschut G, Bartley A, Wibbeke TM. Analyse des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung. In: <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. ; 2022.","chicago":"Chudalla, Nick, Gerson Meschut, Aurélie Bartley, and Tim Michael Wibbeke. “Analyse Des Versagensverhaltens Geklebter Stahl-Verbindungen Beim Werkstoffschonenden Entfügen in Der Karosserieinstandsetzung.” In <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>, 2022.","ieee":"N. Chudalla, G. Meschut, A. Bartley, and T. M. Wibbeke, “Analyse des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","apa":"Chudalla, N., Meschut, G., Bartley, A., &#38; Wibbeke, T. M. (2022). Analyse des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung. <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik.","bibtex":"@inproceedings{Chudalla_Meschut_Bartley_Wibbeke_2022, title={Analyse des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung}, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Chudalla, Nick and Meschut, Gerson and Bartley, Aurélie and Wibbeke, Tim Michael}, year={2022} }","short":"N. Chudalla, G. Meschut, A. Bartley, T.M. Wibbeke, in: 22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik, 2022.","mla":"Chudalla, Nick, et al. “Analyse Des Versagensverhaltens Geklebter Stahl-Verbindungen Beim Werkstoffschonenden Entfügen in Der Karosserieinstandsetzung.” <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>, 2022."},"date_updated":"2022-02-23T15:33:31Z","date_created":"2022-02-23T15:33:13Z","author":[{"full_name":"Chudalla, Nick","id":"41235","last_name":"Chudalla","first_name":"Nick"},{"id":"32056","full_name":"Meschut, Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","first_name":"Gerson"},{"last_name":"Bartley","full_name":"Bartley, Aurélie","first_name":"Aurélie"},{"first_name":"Tim Michael","full_name":"Wibbeke, Tim Michael","last_name":"Wibbeke"}],"title":"Analyse des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung","conference":{"end_date":"2022-02-16","start_date":"2022-02-15","name":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik"},"publication":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","type":"conference","status":"public","_id":"30003","department":[{"_id":"157"}],"user_id":"41235","language":[{"iso":"eng"}]},{"department":[{"_id":"157"}],"user_id":"30228","_id":"30222","language":[{"iso":"ger"}],"publication":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","type":"conference_abstract","status":"public","date_created":"2022-03-10T08:44:01Z","author":[{"last_name":"Striewe","id":"30228","full_name":"Striewe, Marius","first_name":"Marius"},{"full_name":"Meschut, Gerson","id":"32056","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"full_name":"Schmelzle, Lars","last_name":"Schmelzle","first_name":"Lars"},{"first_name":"Julia","full_name":"Mergheim, Julia","last_name":"Mergheim"},{"full_name":"Possart, Gunnar","last_name":"Possart","first_name":"Gunnar"},{"first_name":"Paul","last_name":"Steinmann","full_name":"Steinmann, Paul"}],"date_updated":"2022-03-10T08:48:06Z","conference":{"name":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","start_date":"2022-02-15","end_date":"2022-02-16"},"title":"Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung","citation":{"ama":"Striewe M, Meschut G, Schmelzle L, Mergheim J, Possart G, Steinmann P. Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung. In: <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. ; 2022.","ieee":"M. Striewe, G. Meschut, L. Schmelzle, J. Mergheim, G. Possart, and P. Steinmann, “Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","chicago":"Striewe, Marius, Gerson Meschut, Lars Schmelzle, Julia Mergheim, Gunnar Possart, and Paul Steinmann. “Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung.” In <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","short":"M. Striewe, G. Meschut, L. Schmelzle, J. Mergheim, G. Possart, P. Steinmann, in: 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","mla":"Striewe, Marius, et al. “Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung.” <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","bibtex":"@inproceedings{Striewe_Meschut_Schmelzle_Mergheim_Possart_Steinmann_2022, title={Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung}, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Striewe, Marius and Meschut, Gerson and Schmelzle, Lars and Mergheim, Julia and Possart, Gunnar and Steinmann, Paul}, year={2022} }","apa":"Striewe, M., Meschut, G., Schmelzle, L., Mergheim, J., Possart, G., &#38; Steinmann, P. (2022). Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung. <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik."},"year":"2022"},{"status":"public","type":"conference_abstract","publication":"International Conference on Electric & Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE),","language":[{"iso":"eng"}],"_id":"30347","user_id":"71291","department":[{"_id":"52"}],"year":"2022","place":"Bamberg, Germany","citation":{"short":"F. Schafmeister, in: International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE), Bamberg, Germany, n.d.","mla":"Schafmeister, Frank. “Compensation of LF Common-Mode Noise by the Internal DC/DC-Stage for Transformerless On-Board Chargers at Three- and Single-Phase Operation.” <i>International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE),</i>.","bibtex":"@inproceedings{Schafmeister, place={Bamberg, Germany}, title={Compensation of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless On-Board Chargers at Three- and Single-Phase Operation}, booktitle={International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE),}, author={Schafmeister, Frank} }","apa":"Schafmeister, F. (n.d.). Compensation of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless On-Board Chargers at Three- and Single-Phase Operation. <i>International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE),</i>. International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE 22) , Bamberg, Germany.","ama":"Schafmeister F. Compensation of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless On-Board Chargers at Three- and Single-Phase Operation. In: <i>International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE),</i>.","ieee":"F. Schafmeister, “Compensation of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless On-Board Chargers at Three- and Single-Phase Operation,” presented at the International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE 22) , Bamberg, Germany.","chicago":"Schafmeister, Frank. “Compensation of LF Common-Mode Noise by the Internal DC/DC-Stage for Transformerless On-Board Chargers at Three- and Single-Phase Operation.” In <i>International Conference on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE),</i>. Bamberg, Germany, n.d."},"publication_status":"accepted","title":"Compensation of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless On-Board Chargers at Three- and Single-Phase Operation","conference":{"end_date":"2022-06-23","location":"Bamberg, Germany","name":"International Conference on Electric & Electronic in Hybrid and Electric Vehicles and Electric Energy Management (EEHE 22) ","start_date":"2022-06-22"},"date_updated":"2022-03-16T12:25:18Z","author":[{"first_name":"Frank","id":"71291","full_name":"Schafmeister, Frank","last_name":"Schafmeister"}],"date_created":"2022-03-16T12:24:47Z"},{"citation":{"ama":"Förster N, Rehlaender P, Wallscheid O, Schafmeister F, Böcker J. An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors. In: <i>Proc. 37th IEEE Applied Power Electronics Conference (APEC)</i>. IEEE.","chicago":"Förster, Nikolas, Philipp Rehlaender, Oliver Wallscheid, Frank Schafmeister, and Joachim Böcker. “An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors.” In <i>Proc. 37th IEEE Applied Power Electronics Conference (APEC)</i>. Houston, TX, USA: IEEE, n.d.","ieee":"N. Förster, P. Rehlaender, O. Wallscheid, F. Schafmeister, and J. Böcker, “An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors,” presented at the 37th IEEE Applied Power Electronics Conference (APEC 22), Houston, TX, USA.","apa":"Förster, N., Rehlaender, P., Wallscheid, O., Schafmeister, F., &#38; Böcker, J. (n.d.). An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors. <i>Proc. 37th IEEE Applied Power Electronics Conference (APEC)</i>. 37th IEEE Applied Power Electronics Conference (APEC 22), Houston, TX, USA.","mla":"Förster, Nikolas, et al. “An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors.” <i>Proc. 37th IEEE Applied Power Electronics Conference (APEC)</i>, IEEE.","bibtex":"@inproceedings{Förster_Rehlaender_Wallscheid_Schafmeister_Böcker, place={Houston, TX, USA}, title={An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors}, booktitle={Proc. 37th IEEE Applied Power Electronics Conference (APEC)}, publisher={IEEE}, author={Förster, Nikolas and Rehlaender, Philipp and Wallscheid, Oliver and Schafmeister, Frank and Böcker, Joachim} }","short":"N. Förster, P. Rehlaender, O. Wallscheid, F. Schafmeister, J. Böcker, in: Proc. 37th IEEE Applied Power Electronics Conference (APEC), IEEE, Houston, TX, USA, n.d."},"year":"2022","place":"Houston, TX, USA","publication_status":"inpress","conference":{"end_date":"2022-03-24","location":"Houston, TX, USA","name":"37th IEEE Applied Power Electronics Conference (APEC 22)","start_date":"2022-03-20"},"title":"An Open-Source Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing and Evaluating Power Transistors","author":[{"first_name":"Nikolas","full_name":"Förster, Nikolas","last_name":"Förster"},{"last_name":"Rehlaender","id":"69469","full_name":"Rehlaender, Philipp","first_name":"Philipp"},{"first_name":"Oliver","full_name":"Wallscheid, Oliver","id":"11291","orcid":"https://orcid.org/0000-0001-9362-8777","last_name":"Wallscheid"},{"id":"71291","full_name":"Schafmeister, Frank","last_name":"Schafmeister","first_name":"Frank"},{"full_name":"Böcker, Joachim","id":"66","orcid":"0000-0002-8480-7295","last_name":"Böcker","first_name":"Joachim"}],"date_created":"2022-03-16T12:41:02Z","date_updated":"2022-03-16T13:35:07Z","publisher":"IEEE","status":"public","type":"conference","publication":"Proc. 37th IEEE Applied Power Electronics Conference (APEC)","language":[{"iso":"eng"}],"user_id":"71291","department":[{"_id":"52"}],"_id":"30349"},{"status":"public","type":"conference","publication":"Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)","language":[{"iso":"eng"}],"_id":"30350","user_id":"71291","department":[{"_id":"52"}],"place":"Nuremberg, Germany","year":"2022","citation":{"apa":"Keuck, L., Schafmeister, F., &#38; Böcker, J. (n.d.). Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme. <i>Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)</i>.  IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 22), Nuremberg, Germany.","short":"L. Keuck, F. Schafmeister, J. Böcker, in: Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM), IEEE, Nuremberg, Germany, n.d.","mla":"Keuck, Lukas, et al. “Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme.” <i>Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)</i>, IEEE.","bibtex":"@inproceedings{Keuck_Schafmeister_Böcker, place={Nuremberg, Germany}, title={Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme}, booktitle={Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)}, publisher={IEEE}, author={Keuck, Lukas and Schafmeister, Frank and Böcker, Joachim} }","ieee":"L. Keuck, F. Schafmeister, and J. Böcker, “Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme,” presented at the  IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 22), Nuremberg, Germany.","chicago":"Keuck, Lukas, Frank Schafmeister, and Joachim Böcker. “Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme.” In <i>Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)</i>. Nuremberg, Germany: IEEE, n.d.","ama":"Keuck L, Schafmeister F, Böcker J. Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme. In: <i>Proc. IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)</i>. IEEE."},"publication_status":"inpress","title":"Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme","conference":{"name":" IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 22)","location":"Nuremberg, Germany"},"date_updated":"2022-03-16T13:35:02Z","publisher":"IEEE","author":[{"first_name":"Lukas","full_name":"Keuck, Lukas","id":"42519","last_name":"Keuck"},{"last_name":"Schafmeister","id":"71291","full_name":"Schafmeister, Frank","first_name":"Frank"},{"orcid":"0000-0002-8480-7295","last_name":"Böcker","id":"66","full_name":"Böcker, Joachim","first_name":"Joachim"}],"date_created":"2022-03-16T13:33:55Z"},{"citation":{"bibtex":"@inproceedings{Chudalla_Teutenberg_Meschut_Schneider_Smart_2022, title={Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen }, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Chudalla, Nick and Teutenberg, Dominik and Meschut, Gerson and Schneider, Miriam and Smart, Dominik}, year={2022} }","short":"N. Chudalla, D. Teutenberg, G. Meschut, M. Schneider, D. Smart, in: 22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik, 2022.","mla":"Chudalla, Nick, et al. “Systematisierung Einer Rechnergestützten Auswertemethode Zur Versagensanalyse Geklebter Verbindungen .” <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>, 2022.","apa":"Chudalla, N., Teutenberg, D., Meschut, G., Schneider, M., &#38; Smart, D. (2022). Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen . <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik .","ieee":"N. Chudalla, D. Teutenberg, G. Meschut, M. Schneider, and D. Smart, “Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen ,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik , 2022.","chicago":"Chudalla, Nick, Dominik Teutenberg, Gerson Meschut, Miriam Schneider, and Dominik Smart. “Systematisierung Einer Rechnergestützten Auswertemethode Zur Versagensanalyse Geklebter Verbindungen .” In <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>, 2022.","ama":"Chudalla N, Teutenberg D, Meschut G, Schneider M, Smart D. Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen . In: <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. ; 2022."},"year":"2022","date_created":"2022-02-23T15:38:23Z","author":[{"first_name":"Nick","id":"41235","full_name":"Chudalla, Nick","last_name":"Chudalla"},{"first_name":"Dominik","last_name":"Teutenberg","id":"537","full_name":"Teutenberg, Dominik"},{"first_name":"Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","id":"32056","full_name":"Meschut, Gerson"},{"first_name":"Miriam","last_name":"Schneider","full_name":"Schneider, Miriam"},{"last_name":"Smart","full_name":"Smart, Dominik","first_name":"Dominik"}],"date_updated":"2022-04-25T11:23:42Z","conference":{"name":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik ","start_date":"2022-02-15","end_date":"2022-02-16"},"title":"Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen ","type":"conference","publication":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","status":"public","user_id":"41235","department":[{"_id":"157"}],"_id":"30004","language":[{"iso":"eng"}]}]