---
_id: '47009'
abstract:
- lang: eng
  text: We present a fully integrated radio frequency identifications transponder
    chip operating at 5.8 GHz, which is compatible with the class-1 generation-2 of
    the Electronic Product Code protocol (EPC-C1 G2). The tag chip including the analog
    front-end and the digital baseband processor, are designed in the sub-threshold
    regime (0.5 V) with a total supply current of less than 50 μA. As a power scavenging
    unit, a single-stage differential-drive rectifier structure is designed and fabricated
    with standard threshold voltage (SVT) MOS elements in a commercial 65-nm CMOS
    process, to provide 0.8 V of rectified voltage. Measurements performed on the
    fabricated single-stage structure show a maximum power conversion efficiency of
    69.6% for a 22 kΩ load and a sensitivity of -12.5 dBm, which corresponds to more
    than 1 m of reading range. The power conversion efficiency at this range is about
    64%.
author:
- first_name: Sanaz
  full_name: Haddadian, Sanaz
  id: '59648'
  last_name: Haddadian
- first_name: J. Christoph
  full_name: Scheytt, J. Christoph
  id: '37144'
  last_name: Scheytt
  orcid: '0000-0002-5950-6618 '
- first_name: Gerd
  full_name: von Bögel, Gerd
  last_name: von Bögel
- first_name: Thorben
  full_name: Grenter, Thorben
  last_name: Grenter
citation:
  ama: Haddadian S, Scheytt JC, von Bögel G, Grenter T. A Sub-Threshold Microwave
    RFID Tag Chip, Compatible With RFID MIMO Reader Technology. <i> IEEE Journal of
    Radio Frequency Identification</i>. Published online 2023. doi:<a href="https://doi.org/10.1109/JRFID.2023.3308332">10.1109/JRFID.2023.3308332</a>
  apa: Haddadian, S., Scheytt, J. C., von Bögel, G., &#38; Grenter, T. (2023). A Sub-Threshold
    Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology. <i> IEEE
    Journal of Radio Frequency Identification</i>. <a href="https://doi.org/10.1109/JRFID.2023.3308332">https://doi.org/10.1109/JRFID.2023.3308332</a>
  bibtex: '@article{Haddadian_Scheytt_von Bögel_Grenter_2023, title={A Sub-Threshold
    Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology}, DOI={<a
    href="https://doi.org/10.1109/JRFID.2023.3308332">10.1109/JRFID.2023.3308332</a>},
    journal={ IEEE Journal of Radio Frequency Identification}, publisher={IEEE}, author={Haddadian,
    Sanaz and Scheytt, J. Christoph and von Bögel, Gerd and Grenter, Thorben}, year={2023}
    }'
  chicago: Haddadian, Sanaz, J. Christoph Scheytt, Gerd von Bögel, and Thorben Grenter.
    “A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology.”
    <i> IEEE Journal of Radio Frequency Identification</i>, 2023. <a href="https://doi.org/10.1109/JRFID.2023.3308332">https://doi.org/10.1109/JRFID.2023.3308332</a>.
  ieee: 'S. Haddadian, J. C. Scheytt, G. von Bögel, and T. Grenter, “A Sub-Threshold
    Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology,” <i> IEEE
    Journal of Radio Frequency Identification</i>, 2023, doi: <a href="https://doi.org/10.1109/JRFID.2023.3308332">10.1109/JRFID.2023.3308332</a>.'
  mla: Haddadian, Sanaz, et al. “A Sub-Threshold Microwave RFID Tag Chip, Compatible
    With RFID MIMO Reader Technology.” <i> IEEE Journal of Radio Frequency Identification</i>,
    IEEE, 2023, doi:<a href="https://doi.org/10.1109/JRFID.2023.3308332">10.1109/JRFID.2023.3308332</a>.
  short: S. Haddadian, J.C. Scheytt, G. von Bögel, T. Grenter,  IEEE Journal of Radio
    Frequency Identification (2023).
conference:
  start_date: 2023-08-29
date_created: 2023-09-13T11:08:22Z
date_updated: 2025-02-13T14:24:24Z
department:
- _id: '58'
doi: 10.1109/JRFID.2023.3308332
language:
- iso: eng
publication: ' IEEE Journal of Radio Frequency Identification'
publication_identifier:
  eissn:
  - 2469-7281
publication_status: published
publisher: IEEE
status: public
title: A Sub-Threshold Microwave RFID Tag Chip, Compatible With RFID MIMO Reader Technology
type: journal_article
user_id: '59648'
year: '2023'
...
---
_id: '46426'
abstract:
- lang: eng
  text: 'One of the main challenges for next generation automotive radars is the improvement
    of angular resolution to a sub-degree level. In this context, wide aperture automotive
    radars of 1m length or more and resolution close to 0.1° in azimuth and 0.5° in
    elevation could be beneficial. To enable coherent processing of arrays with such
    large aperture, prior (i.e offline) and online calibration are necessary: channel
    imbalances (gains and phases) and three dimensional coordinates of transmit and
    receive elements need to be determined. We propose a calibration strategy based
    on alternating steps between the two subtasks of i) channel imbalance estimation
    with ‘known’ array positions, by applying a singular value decomposition to the
    resulting tensor calculus problem; and ii) antenna position estimation with ’known’
    channel imbalances, by numerically maximizing the Bayesian posterior probability;
    in both cases operating on range/Doppler snapshots of disjoint targets (with potentially
    unknown locations). Simulation studies based on the parameters of a MIMO 8x6 linear
    sparse array show promising results as long as the initial position errors do
    not exceed half a wavelength (2mm), beyond which we observe strong effects of
    ambiguity. Experimental results with real measurements show that after calibration
    in laboratory conditions, our MIMO 8x6 demonstrator with 50cm aperture is able
    to resolve two targets at the same range with angular separation at least as close
    as 0.4°.'
author:
- first_name: 'Christian '
  full_name: 'Greiff, Christian '
  last_name: Greiff
- first_name: David
  full_name: Mateos-Núñez, David
  last_name: Mateos-Núñez
- first_name: Renato
  full_name: Simoni, Renato
  last_name: Simoni
- first_name: Maria
  full_name: González-Huici, Maria
  last_name: González-Huici
- first_name: Stephan
  full_name: Kruse, Stephan
  id: '38254'
  last_name: Kruse
- first_name: J. Christoph
  full_name: Scheytt, J. Christoph
  id: '37144'
  last_name: Scheytt
  orcid: '0000-0002-5950-6618 '
- first_name: Karl
  full_name: Kolk, Karl
  last_name: Kolk
- first_name: Christian
  full_name: Höller, Christian
  last_name: Höller
- first_name: Heiko Gustav
  full_name: Kurz, Heiko Gustav
  last_name: Kurz
- first_name: Marc-Michael
  full_name: Meinecke, Marc-Michael
  last_name: Meinecke
- first_name: Thomas
  full_name: Gisder, Thomas
  last_name: Gisder
citation:
  ama: 'Greiff C, Mateos-Núñez D, Simoni R, et al. Calibration of Large Coherent MIMO
    Radar Arrays: Channel Imbalances and 3D Antenna Positions. In: <i>2023 24th International
    Radar Symposium (IRS)</i>. IEEE; 2023. doi:<a href="https://doi.org/10.23919/IRS57608.2023.10172475">10.23919/IRS57608.2023.10172475</a>'
  apa: 'Greiff, C., Mateos-Núñez, D., Simoni, R., González-Huici, M., Kruse, S., Scheytt,
    J. C., Kolk, K., Höller, C., Kurz, H. G., Meinecke, M.-M., &#38; Gisder, T. (2023).
    Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D Antenna
    Positions. <i>2023 24th International Radar Symposium (IRS)</i>. 2023 24th International
    Radar Symposium (IRS), Berlin, Germany. <a href="https://doi.org/10.23919/IRS57608.2023.10172475">https://doi.org/10.23919/IRS57608.2023.10172475</a>'
  bibtex: '@inproceedings{Greiff_Mateos-Núñez_Simoni_González-Huici_Kruse_Scheytt_Kolk_Höller_Kurz_Meinecke_et
    al._2023, title={Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances
    and 3D Antenna Positions}, DOI={<a href="https://doi.org/10.23919/IRS57608.2023.10172475">10.23919/IRS57608.2023.10172475</a>},
    booktitle={2023 24th International Radar Symposium (IRS)}, publisher={IEEE}, author={Greiff,
    Christian  and Mateos-Núñez, David and Simoni, Renato and González-Huici, Maria
    and Kruse, Stephan and Scheytt, J. Christoph and Kolk, Karl and Höller, Christian
    and Kurz, Heiko Gustav and Meinecke, Marc-Michael and et al.}, year={2023} }'
  chicago: 'Greiff, Christian , David Mateos-Núñez, Renato Simoni, Maria González-Huici,
    Stephan Kruse, J. Christoph Scheytt, Karl Kolk, et al. “Calibration of Large Coherent
    MIMO Radar Arrays: Channel Imbalances and 3D Antenna Positions.” In <i>2023 24th
    International Radar Symposium (IRS)</i>. IEEE, 2023. <a href="https://doi.org/10.23919/IRS57608.2023.10172475">https://doi.org/10.23919/IRS57608.2023.10172475</a>.'
  ieee: 'C. Greiff <i>et al.</i>, “Calibration of Large Coherent MIMO Radar Arrays:
    Channel Imbalances and 3D Antenna Positions,” presented at the 2023 24th International
    Radar Symposium (IRS), Berlin, Germany, 2023, doi: <a href="https://doi.org/10.23919/IRS57608.2023.10172475">10.23919/IRS57608.2023.10172475</a>.'
  mla: 'Greiff, Christian, et al. “Calibration of Large Coherent MIMO Radar Arrays:
    Channel Imbalances and 3D Antenna Positions.” <i>2023 24th International Radar
    Symposium (IRS)</i>, IEEE, 2023, doi:<a href="https://doi.org/10.23919/IRS57608.2023.10172475">10.23919/IRS57608.2023.10172475</a>.'
  short: 'C. Greiff, D. Mateos-Núñez, R. Simoni, M. González-Huici, S. Kruse, J.C.
    Scheytt, K. Kolk, C. Höller, H.G. Kurz, M.-M. Meinecke, T. Gisder, in: 2023 24th
    International Radar Symposium (IRS), IEEE, 2023.'
conference:
  end_date: 2023.05.26
  location: Berlin, Germany
  name: 2023 24th International Radar Symposium (IRS)
  start_date: 2023.05.24
date_created: 2023-08-07T06:45:11Z
date_updated: 2025-02-25T05:52:16Z
department:
- _id: '58'
doi: 10.23919/IRS57608.2023.10172475
language:
- iso: eng
publication: 2023 24th International Radar Symposium (IRS)
publication_identifier:
  eisbn:
  - 978-3-944976-34-1
publisher: IEEE
status: public
title: 'Calibration of Large Coherent MIMO Radar Arrays: Channel Imbalances and 3D
  Antenna Positions'
type: conference
user_id: '38254'
year: '2023'
...
---
_id: '47064'
author:
- first_name: Mohammed
  full_name: Iftekhar, Mohammed
  id: '47944'
  last_name: Iftekhar
- first_name: Harshan
  full_name: Nagaraju, Harshan
  last_name: Nagaraju
- first_name: Pascal
  full_name: Kneuper, Pascal
  id: '47367'
  last_name: Kneuper
- first_name: Babak
  full_name: Sadiye, Babak
  id: '93634'
  last_name: Sadiye
- first_name: Wolfgang
  full_name: Müller, Wolfgang
  id: '16243'
  last_name: Müller
- first_name: J. Christoph
  full_name: Scheytt, J. Christoph
  id: '37144'
  last_name: Scheytt
  orcid: '0000-0002-5950-6618 '
citation:
  ama: 'Iftekhar M, Nagaraju H, Kneuper P, Sadiye B, Müller W, Scheytt JC. A 28-Gb/s
    27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI CMOS Technology
    . In: <i>BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits
    and Technology Symposium</i>. ; 2023.'
  apa: Iftekhar, M., Nagaraju, H., Kneuper, P., Sadiye, B., Müller, W., &#38; Scheytt,
    J. C. (2023). A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery
    in 22 nm FD-SOI CMOS Technology . <i>BCICTS 2023 IEEE BiCMOS and Compound Semiconductor
    Integrated Circuits and Technology Symposium</i>.
  bibtex: '@inproceedings{Iftekhar_Nagaraju_Kneuper_Sadiye_Müller_Scheytt_2023, title={A
    28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI
    CMOS Technology }, booktitle={BCICTS 2023 IEEE BiCMOS and Compound Semiconductor
    Integrated Circuits and Technology Symposium}, author={Iftekhar, Mohammed and
    Nagaraju, Harshan and Kneuper, Pascal and Sadiye, Babak and Müller, Wolfgang and
    Scheytt, J. Christoph}, year={2023} }'
  chicago: Iftekhar, Mohammed, Harshan Nagaraju, Pascal Kneuper, Babak Sadiye, Wolfgang
    Müller, and J. Christoph Scheytt. “A 28-Gb/s 27.2 MW NRZ Full-Rate Bang-Bang Clock
    and Data Recovery in 22 Nm FD-SOI CMOS Technology .” In <i>BCICTS 2023 IEEE BiCMOS
    and Compound Semiconductor Integrated Circuits and Technology Symposium</i>, 2023.
  ieee: M. Iftekhar, H. Nagaraju, P. Kneuper, B. Sadiye, W. Müller, and J. C. Scheytt,
    “A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm FD-SOI
    CMOS Technology ,” MONTEREY, CALIFORNIA, USA, 2023.
  mla: Iftekhar, Mohammed, et al. “A 28-Gb/s 27.2 MW NRZ Full-Rate Bang-Bang Clock
    and Data Recovery in 22 Nm FD-SOI CMOS Technology .” <i>BCICTS 2023 IEEE BiCMOS
    and Compound Semiconductor Integrated Circuits and Technology Symposium</i>, 2023.
  short: 'M. Iftekhar, H. Nagaraju, P. Kneuper, B. Sadiye, W. Müller, J.C. Scheytt,
    in: BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and
    Technology Symposium, 2023.'
conference:
  end_date: 2023-10-18
  location: MONTEREY, CALIFORNIA, USA
  start_date: 2023-10-15
date_created: 2023-09-14T11:30:36Z
date_updated: 2025-02-26T14:41:53Z
department:
- _id: '58'
language:
- iso: eng
publication: BCICTS 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits
  and Technology Symposium
related_material:
  link:
  - relation: contains
    url: https://bcicts.org/
status: public
title: 'A 28-Gb/s 27.2 mW NRZ Full-Rate Bang-Bang Clock and Data Recovery in 22 nm
  FD-SOI CMOS Technology '
type: conference_abstract
user_id: '15931'
year: '2023'
...
---
_id: '60355'
abstract:
- lang: eng
  text: <jats:p>We present a method for the generation of higher-order tetrahedral
    meshes. In contrast to previous methods, the curved tetrahedral elements are guaranteed
    to be free of degeneracies and inversions while conforming exactly to prescribed
    piecewise polynomial surfaces, such as domain boundaries or material interfaces.
    Arbitrary polynomial order is supported. Algorithmically, the polynomial input
    surfaces are first covered by a single layer of carefully constructed curved elements
    using a recursive refinement procedure that provably avoids degeneracies and inversions.
    These tetrahedral elements are designed such that the remaining space is bounded
    piecewise linearly. In this way, our method effectively reduces the curved meshing
    problem to the classical problem of linear mesh generation (for the remaining
    space).</jats:p>
author:
- first_name: Payam
  full_name: Khanteimouri, Payam
  last_name: Khanteimouri
- first_name: Marcel
  full_name: Campen, Marcel
  id: '114904'
  last_name: Campen
  orcid: 0000-0003-2340-3462
citation:
  ama: 'Khanteimouri P, Campen M. 3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral
    Meshing. <i>ACM Transactions on Graphics</i>. 2023;42(6):1-19. doi:<a href="https://doi.org/10.1145/3618332">10.1145/3618332</a>'
  apa: 'Khanteimouri, P., &#38; Campen, M. (2023). 3D Bézier Guarding: Boundary-Conforming
    Curved Tetrahedral Meshing. <i>ACM Transactions on Graphics</i>, <i>42</i>(6),
    1–19. <a href="https://doi.org/10.1145/3618332">https://doi.org/10.1145/3618332</a>'
  bibtex: '@article{Khanteimouri_Campen_2023, title={3D Bézier Guarding: Boundary-Conforming
    Curved Tetrahedral Meshing}, volume={42}, DOI={<a href="https://doi.org/10.1145/3618332">10.1145/3618332</a>},
    number={6}, journal={ACM Transactions on Graphics}, publisher={Association for
    Computing Machinery (ACM)}, author={Khanteimouri, Payam and Campen, Marcel}, year={2023},
    pages={1–19} }'
  chicago: 'Khanteimouri, Payam, and Marcel Campen. “3D Bézier Guarding: Boundary-Conforming
    Curved Tetrahedral Meshing.” <i>ACM Transactions on Graphics</i> 42, no. 6 (2023):
    1–19. <a href="https://doi.org/10.1145/3618332">https://doi.org/10.1145/3618332</a>.'
  ieee: 'P. Khanteimouri and M. Campen, “3D Bézier Guarding: Boundary-Conforming Curved
    Tetrahedral Meshing,” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6, pp.
    1–19, 2023, doi: <a href="https://doi.org/10.1145/3618332">10.1145/3618332</a>.'
  mla: 'Khanteimouri, Payam, and Marcel Campen. “3D Bézier Guarding: Boundary-Conforming
    Curved Tetrahedral Meshing.” <i>ACM Transactions on Graphics</i>, vol. 42, no.
    6, Association for Computing Machinery (ACM), 2023, pp. 1–19, doi:<a href="https://doi.org/10.1145/3618332">10.1145/3618332</a>.'
  short: P. Khanteimouri, M. Campen, ACM Transactions on Graphics 42 (2023) 1–19.
date_created: 2025-06-24T07:46:53Z
date_updated: 2025-07-14T12:46:54Z
department:
- _id: '969'
doi: 10.1145/3618332
extern: '1'
intvolume: '        42'
issue: '6'
language:
- iso: eng
page: 1-19
publication: ACM Transactions on Graphics
publication_identifier:
  issn:
  - 0730-0301
  - 1557-7368
publication_status: published
publisher: Association for Computing Machinery (ACM)
status: public
title: '3D Bézier Guarding: Boundary-Conforming Curved Tetrahedral Meshing'
type: journal_article
user_id: '117512'
volume: 42
year: '2023'
...
---
_id: '60354'
abstract:
- lang: eng
  text: <jats:p>We present a set of operators to perform modifications, in particular
    collapses and splits, in volumetric cell complexes which are discretely embedded
    in a background mesh. Topological integrity and geometric embedding validity are
    carefully maintained. We apply these operators strategically to volumetric block
    decompositions, so-called T-meshes or base complexes, in the context of hexahedral
    mesh generation. This allows circumventing the expensive and unreliable global
    volumetric remapping step in the versatile meshing pipeline based on 3D integer-grid
    maps. In essence, we reduce this step to simpler local cube mapping problems,
    for which reliable solutions are available. As a consequence, the robustness of
    the mesh generation process is increased, especially when targeting coarse or
    block-structured hexahedral meshes. We furthermore extend this pipeline to support
    feature alignment constraints, and systematically respect these throughout, enabling
    the generation of meshes that align to points, curves, and surfaces of special
    interest, whether on the boundary or in the interior of the domain.</jats:p>
author:
- first_name: Hendrik
  full_name: Brückler, Hendrik
  id: '115694'
  last_name: Brückler
- first_name: Marcel
  full_name: Campen, Marcel
  id: '114904'
  last_name: Campen
  orcid: 0000-0003-2340-3462
citation:
  ama: Brückler H, Campen M. Collapsing Embedded Cell Complexes for Safer Hexahedral
    Meshing. <i>ACM Transactions on Graphics</i>. 2023;42(6):1-24. doi:<a href="https://doi.org/10.1145/3618384">10.1145/3618384</a>
  apa: Brückler, H., &#38; Campen, M. (2023). Collapsing Embedded Cell Complexes for
    Safer Hexahedral Meshing. <i>ACM Transactions on Graphics</i>, <i>42</i>(6), 1–24.
    <a href="https://doi.org/10.1145/3618384">https://doi.org/10.1145/3618384</a>
  bibtex: '@article{Brückler_Campen_2023, title={Collapsing Embedded Cell Complexes
    for Safer Hexahedral Meshing}, volume={42}, DOI={<a href="https://doi.org/10.1145/3618384">10.1145/3618384</a>},
    number={6}, journal={ACM Transactions on Graphics}, publisher={Association for
    Computing Machinery (ACM)}, author={Brückler, Hendrik and Campen, Marcel}, year={2023},
    pages={1–24} }'
  chicago: 'Brückler, Hendrik, and Marcel Campen. “Collapsing Embedded Cell Complexes
    for Safer Hexahedral Meshing.” <i>ACM Transactions on Graphics</i> 42, no. 6 (2023):
    1–24. <a href="https://doi.org/10.1145/3618384">https://doi.org/10.1145/3618384</a>.'
  ieee: 'H. Brückler and M. Campen, “Collapsing Embedded Cell Complexes for Safer
    Hexahedral Meshing,” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6, pp.
    1–24, 2023, doi: <a href="https://doi.org/10.1145/3618384">10.1145/3618384</a>.'
  mla: Brückler, Hendrik, and Marcel Campen. “Collapsing Embedded Cell Complexes for
    Safer Hexahedral Meshing.” <i>ACM Transactions on Graphics</i>, vol. 42, no. 6,
    Association for Computing Machinery (ACM), 2023, pp. 1–24, doi:<a href="https://doi.org/10.1145/3618384">10.1145/3618384</a>.
  short: H. Brückler, M. Campen, ACM Transactions on Graphics 42 (2023) 1–24.
date_created: 2025-06-24T07:45:44Z
date_updated: 2025-07-14T12:47:30Z
department:
- _id: '969'
doi: 10.1145/3618384
extern: '1'
intvolume: '        42'
issue: '6'
language:
- iso: eng
page: 1-24
publication: ACM Transactions on Graphics
publication_identifier:
  issn:
  - 0730-0301
  - 1557-7368
publication_status: published
publisher: Association for Computing Machinery (ACM)
status: public
title: Collapsing Embedded Cell Complexes for Safer Hexahedral Meshing
type: journal_article
user_id: '117512'
volume: 42
year: '2023'
...
---
_id: '60335'
abstract:
- lang: eng
  text: <jats:p>A method is presented to compute volumetric maps and parametrizations
    of objects over 3D domains. As a key feature, continuity and bijectivity are ensured
    by construction. Arbitrary objects of ball topology, represented as tetrahedral
    meshes, are supported. Arbitrary convex as well as star-shaped domains are supported.
    Full control over the boundary mapping is provided. The method is based on the
    technique of simplicial foliations, generalized to a broader class of domain shapes
    and applied adaptively in a novel localized manner. This increases flexibility
    as well as efficiency over the state of the art, while maintaining reliability
    in guaranteeing map bijectivity.</jats:p>
author:
- first_name: Steffen
  full_name: Hinderink, Steffen
  id: '116615'
  last_name: Hinderink
- first_name: Marcel
  full_name: Campen, Marcel
  id: '114904'
  last_name: Campen
  orcid: 0000-0003-2340-3462
citation:
  ama: 'Hinderink S, Campen M. Galaxy Maps: Localized Foliations for Bijective Volumetric
    Mapping. <i>ACM Transactions on Graphics</i>. 2023;42(4):1-16. doi:<a href="https://doi.org/10.1145/3592410">10.1145/3592410</a>'
  apa: 'Hinderink, S., &#38; Campen, M. (2023). Galaxy Maps: Localized Foliations
    for Bijective Volumetric Mapping. <i>ACM Transactions on Graphics</i>, <i>42</i>(4),
    1–16. <a href="https://doi.org/10.1145/3592410">https://doi.org/10.1145/3592410</a>'
  bibtex: '@article{Hinderink_Campen_2023, title={Galaxy Maps: Localized Foliations
    for Bijective Volumetric Mapping}, volume={42}, DOI={<a href="https://doi.org/10.1145/3592410">10.1145/3592410</a>},
    number={4}, journal={ACM Transactions on Graphics}, publisher={Association for
    Computing Machinery (ACM)}, author={Hinderink, Steffen and Campen, Marcel}, year={2023},
    pages={1–16} }'
  chicago: 'Hinderink, Steffen, and Marcel Campen. “Galaxy Maps: Localized Foliations
    for Bijective Volumetric Mapping.” <i>ACM Transactions on Graphics</i> 42, no.
    4 (2023): 1–16. <a href="https://doi.org/10.1145/3592410">https://doi.org/10.1145/3592410</a>.'
  ieee: 'S. Hinderink and M. Campen, “Galaxy Maps: Localized Foliations for Bijective
    Volumetric Mapping,” <i>ACM Transactions on Graphics</i>, vol. 42, no. 4, pp.
    1–16, 2023, doi: <a href="https://doi.org/10.1145/3592410">10.1145/3592410</a>.'
  mla: 'Hinderink, Steffen, and Marcel Campen. “Galaxy Maps: Localized Foliations
    for Bijective Volumetric Mapping.” <i>ACM Transactions on Graphics</i>, vol. 42,
    no. 4, Association for Computing Machinery (ACM), 2023, pp. 1–16, doi:<a href="https://doi.org/10.1145/3592410">10.1145/3592410</a>.'
  short: S. Hinderink, M. Campen, ACM Transactions on Graphics 42 (2023) 1–16.
date_created: 2025-06-23T10:38:02Z
date_updated: 2025-07-14T12:48:12Z
department:
- _id: '969'
doi: 10.1145/3592410
extern: '1'
intvolume: '        42'
issue: '4'
language:
- iso: eng
page: 1-16
publication: ACM Transactions on Graphics
publication_identifier:
  issn:
  - 0730-0301
  - 1557-7368
publication_status: published
publisher: Association for Computing Machinery (ACM)
status: public
title: 'Galaxy Maps: Localized Foliations for Bijective Volumetric Mapping'
type: journal_article
user_id: '117512'
volume: 42
year: '2023'
...
---
_id: '48012'
abstract:
- lang: eng
  text: '3D printing is a well-established technology with rapidly increasing usage
    scenarios both in the industry and consumer context. The growing popularity of
    3D printing has also attracted security researchers, who have analyzed possibilities
    for weakening 3D models or stealing intellectual property from 3D models. We extend
    these important aspects and provide the first comprehensive security analysis
    of 3D printing data formats. We performed our systematic study on the example
    of the 3D Manufacturing Format (3MF), which offers a large variety of features
    that could lead to critical attacks. Based on 3MF’s features, we systematized
    three attack goals: Data Exfiltration (dex), Denial of Service, and UI Spoofing
    (uis). We achieve these goals by exploiting the complexity of 3MF, which is based
    on the Open Packaging Conventions (OPC) format and uses XML to define 3D models.
    In total, our analysis led to 352 tests. To create and run these tests automatically,
    we implemented an open-source tool named 3MF Analyzer (tool), which helped us
    evaluate 20 applications.'
author:
- first_name: Jost
  full_name: Rossel, Jost
  id: '58331'
  last_name: Rossel
  orcid: 0000-0002-3182-4059
- first_name: Vladislav
  full_name: Mladenov, Vladislav
  last_name: Mladenov
- first_name: Juraj
  full_name: Somorovsky, Juraj
  id: '83504'
  last_name: Somorovsky
  orcid: 0000-0002-3593-7720
citation:
  ama: 'Rossel J, Mladenov V, Somorovsky J. Security Analysis of the 3MF Data Format.
    In: <i>Proceedings of the 26th International Symposium on Research in Attacks,
    Intrusions and Defenses</i>. ACM; 2023. doi:<a href="https://doi.org/10.1145/3607199.3607216">10.1145/3607199.3607216</a>'
  apa: Rossel, J., Mladenov, V., &#38; Somorovsky, J. (2023). Security Analysis of
    the 3MF Data Format. <i>Proceedings of the 26th International Symposium on Research
    in Attacks, Intrusions and Defenses</i>. 26th International Symposium on Research
    in Attacks, Intrusions and Defenses, Hongkong. <a href="https://doi.org/10.1145/3607199.3607216">https://doi.org/10.1145/3607199.3607216</a>
  bibtex: '@inproceedings{Rossel_Mladenov_Somorovsky_2023, title={Security Analysis
    of the 3MF Data Format}, DOI={<a href="https://doi.org/10.1145/3607199.3607216">10.1145/3607199.3607216</a>},
    booktitle={Proceedings of the 26th International Symposium on Research in Attacks,
    Intrusions and Defenses}, publisher={ACM}, author={Rossel, Jost and Mladenov,
    Vladislav and Somorovsky, Juraj}, year={2023} }'
  chicago: Rossel, Jost, Vladislav Mladenov, and Juraj Somorovsky. “Security Analysis
    of the 3MF Data Format.” In <i>Proceedings of the 26th International Symposium
    on Research in Attacks, Intrusions and Defenses</i>. ACM, 2023. <a href="https://doi.org/10.1145/3607199.3607216">https://doi.org/10.1145/3607199.3607216</a>.
  ieee: 'J. Rossel, V. Mladenov, and J. Somorovsky, “Security Analysis of the 3MF
    Data Format,” presented at the 26th International Symposium on Research in Attacks,
    Intrusions and Defenses, Hongkong, 2023, doi: <a href="https://doi.org/10.1145/3607199.3607216">10.1145/3607199.3607216</a>.'
  mla: Rossel, Jost, et al. “Security Analysis of the 3MF Data Format.” <i>Proceedings
    of the 26th International Symposium on Research in Attacks, Intrusions and Defenses</i>,
    ACM, 2023, doi:<a href="https://doi.org/10.1145/3607199.3607216">10.1145/3607199.3607216</a>.
  short: 'J. Rossel, V. Mladenov, J. Somorovsky, in: Proceedings of the 26th International
    Symposium on Research in Attacks, Intrusions and Defenses, ACM, 2023.'
conference:
  end_date: 2023-10-18
  location: Hongkong
  name: 26th International Symposium on Research in Attacks, Intrusions and Defenses
  start_date: 2023-10-16
date_created: 2023-10-11T13:42:09Z
date_updated: 2025-07-16T11:06:49Z
ddc:
- '000'
department:
- _id: '632'
doi: 10.1145/3607199.3607216
file:
- access_level: open_access
  content_type: application/pdf
  creator: jrossel
  date_created: 2023-10-16T03:48:08Z
  date_updated: 2024-09-05T11:14:40Z
  file_id: '48065'
  file_name: Security_Analysis_of_the_3mf_Data_Format.pdf
  file_size: 1054999
  relation: main_file
file_date_updated: 2024-09-05T11:14:40Z
has_accepted_license: '1'
keyword:
- Data Format Security
- 3D Manufacturing Format
- 3D Printing
- Additive Manufacturing
language:
- iso: eng
main_file_link:
- url: https://dl.acm.org/doi/abs/10.1145/3607199.3607216
oa: '1'
publication: Proceedings of the 26th International Symposium on Research in Attacks,
  Intrusions and Defenses
publication_status: published
publisher: ACM
quality_controlled: '1'
status: public
title: Security Analysis of the 3MF Data Format
type: conference
user_id: '58331'
year: '2023'
...
---
_id: '45360'
alternative_title:
- Implementation of optimized surface slitting for eddy current loss reduction on
  the surface of an additively manufactured pemanent magnet rotor
author:
- first_name: Michael
  full_name: Haase, Michael
  id: '35970'
  last_name: Haase
- first_name: Maximilian
  full_name: Bieber, Maximilian
  last_name: Bieber
- first_name: Frederik
  full_name: Tasche, Frederik
  last_name: Tasche
- first_name: Mirko
  full_name: Schaper, Mirko
  id: '43720'
  last_name: Schaper
- first_name: Kay-Peter
  full_name: Hoyer, Kay-Peter
  id: '48411'
  last_name: Hoyer
- first_name: Bernd
  full_name: Ponik, Bernd
  last_name: Ponik
- first_name: Balázs
  full_name: Magyar, Balázs
  id: '97759'
  last_name: Magyar
citation:
  ama: 'Haase M, Bieber M, Tasche F, et al. Umsetzung einer optimierten Oberflächenschlitzung
    zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors.
    In: Kynast M, Eichmann M, Witt G, eds. <i>Proceedings of the 19th Rapid.Tech 3D
    Conference Erfurt, Germany, 9–11 May 2023</i>. Carl Hanser Verlag GmbH &#38; Co.
    KG; 2023. doi:<a href="https://doi.org/10.3139/9783446479425.001 ">https://doi.org/10.3139/9783446479425.001
    </a>'
  apa: Haase, M., Bieber, M., Tasche, F., Schaper, M., Hoyer, K.-P., Ponik, B., &#38;
    Magyar, B. (2023). Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion
    auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors. In M. Kynast,
    M. Eichmann, &#38; G. Witt (Eds.), <i>Proceedings of the 19th Rapid.Tech 3D Conference
    Erfurt, Germany, 9–11 May 2023</i>. Carl Hanser Verlag GmbH &#38; Co. KG. <a href="https://doi.org/10.3139/9783446479425.001
    ">https://doi.org/10.3139/9783446479425.001 </a>
  bibtex: '@inbook{Haase_Bieber_Tasche_Schaper_Hoyer_Ponik_Magyar_2023, place={München},
    title={Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion
    auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors}, DOI={<a
    href="https://doi.org/10.3139/9783446479425.001 ">https://doi.org/10.3139/9783446479425.001
    </a>}, booktitle={Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany,
    9–11 May 2023}, publisher={Carl Hanser Verlag GmbH &#38; Co. KG}, author={Haase,
    Michael and Bieber, Maximilian and Tasche, Frederik and Schaper, Mirko and Hoyer,
    Kay-Peter and Ponik, Bernd and Magyar, Balázs}, editor={Kynast, Michael and Eichmann,
    Michael and Witt, Gerd}, year={2023} }'
  chicago: 'Haase, Michael, Maximilian Bieber, Frederik Tasche, Mirko Schaper, Kay-Peter
    Hoyer, Bernd Ponik, and Balázs Magyar. “Umsetzung einer optimierten Oberflächenschlitzung
    zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors.”
    In <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May
    2023</i>, edited by Michael Kynast, Michael Eichmann, and Gerd Witt. München:
    Carl Hanser Verlag GmbH &#38; Co. KG, 2023. <a href="https://doi.org/10.3139/9783446479425.001
    ">https://doi.org/10.3139/9783446479425.001 </a>.'
  ieee: 'M. Haase <i>et al.</i>, “Umsetzung einer optimierten Oberflächenschlitzung
    zur Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors,”
    in <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May
    2023</i>, M. Kynast, M. Eichmann, and G. Witt, Eds. München: Carl Hanser Verlag
    GmbH &#38; Co. KG, 2023.'
  mla: Haase, Michael, et al. “Umsetzung einer optimierten Oberflächenschlitzung zur
    Wirbelstromverlustreduktion auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors.”
    <i>Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11 May
    2023</i>, edited by Michael Kynast et al., Carl Hanser Verlag GmbH &#38; Co. KG,
    2023, doi:<a href="https://doi.org/10.3139/9783446479425.001 ">https://doi.org/10.3139/9783446479425.001
    </a>.
  short: 'M. Haase, M. Bieber, F. Tasche, M. Schaper, K.-P. Hoyer, B. Ponik, B. Magyar,
    in: M. Kynast, M. Eichmann, G. Witt (Eds.), Proceedings of the 19th Rapid.Tech
    3D Conference Erfurt, Germany, 9–11 May 2023, Carl Hanser Verlag GmbH &#38; Co.
    KG, München, 2023.'
date_created: 2023-05-30T05:55:15Z
date_updated: 2025-08-29T09:19:53Z
department:
- _id: '146'
- _id: '219'
- _id: '158'
doi: 'https://doi.org/10.3139/9783446479425.001 '
editor:
- first_name: Michael
  full_name: Kynast, Michael
  last_name: Kynast
- first_name: Michael
  full_name: Eichmann, Michael
  last_name: Eichmann
- first_name: Gerd
  full_name: Witt, Gerd
  last_name: Witt
language:
- iso: ger
place: München
popular_science: '1'
publication: Proceedings of the 19th Rapid.Tech 3D Conference Erfurt, Germany, 9–11
  May 2023
publication_identifier:
  eisbn:
  - 978-3-446-47942-5
  isbn:
  - 978-3-446-47941-8
publication_status: published
publisher: Carl Hanser Verlag GmbH & Co. KG
status: public
title: Umsetzung einer optimierten Oberflächenschlitzung zur Wirbelstromverlustreduktion
  auf der Oberfläche eines additiv gefertigten Permanentmagnet-Rotors
type: book_chapter
user_id: '35970'
year: '2023'
...
---
_id: '63043'
abstract:
- lang: eng
  text: Spatial modes of light have become highly attractive to increase the dimension
    and, thereby, security and information capacity in quantum key distribution (QKD).
    So far, only transverse electric field components have been considered, while
    longitudinal polarization components have remained neglected. Here, we present
    an approach to include all three spatial dimensions of electric field oscillation
    in QKD by implementing our tunable, on-a-chip vector beam decoder (VBD). This
    inversely designed device pioneers the "preparation" and "measurement" of three-dimensionally
    polarized mutually unbiased basis states for high-dimensional (HD) QKD and paves
    the way for the integration of HD QKD with spatial modes in multifunctional on-a-chip
    photonics platforms.
citation:
  ama: Tunable vector beam decoder by inverse design for high-dimensional quantum
    key distribution with 3D polarized spatial modes. Published online 2023. doi:<a
    href="https://doi.org/10.48550/ARXIV.2304.12296">10.48550/ARXIV.2304.12296</a>
  apa: <i>Tunable vector beam decoder by inverse design for high-dimensional quantum
    key distribution with 3D polarized spatial modes</i>. (2023). <a href="https://doi.org/10.48550/ARXIV.2304.12296">https://doi.org/10.48550/ARXIV.2304.12296</a>
  bibtex: '@article{Tunable vector beam decoder by inverse design for high-dimensional
    quantum key distribution with 3D polarized spatial modes_2023, DOI={<a href="https://doi.org/10.48550/ARXIV.2304.12296">10.48550/ARXIV.2304.12296</a>},
    year={2023} }'
  chicago: “Tunable Vector Beam Decoder by Inverse Design for High-Dimensional Quantum
    Key Distribution with 3D Polarized Spatial Modes,” 2023. <a href="https://doi.org/10.48550/ARXIV.2304.12296">https://doi.org/10.48550/ARXIV.2304.12296</a>.
  ieee: '“Tunable vector beam decoder by inverse design for high-dimensional quantum
    key distribution with 3D polarized spatial modes,” 2023, doi: <a href="https://doi.org/10.48550/ARXIV.2304.12296">10.48550/ARXIV.2304.12296</a>.'
  mla: <i>Tunable Vector Beam Decoder by Inverse Design for High-Dimensional Quantum
    Key Distribution with 3D Polarized Spatial Modes</i>. 2023, doi:<a href="https://doi.org/10.48550/ARXIV.2304.12296">10.48550/ARXIV.2304.12296</a>.
  short: (2023).
date_created: 2025-12-11T20:37:08Z
date_updated: 2025-12-11T20:46:50Z
department:
- _id: '623'
- _id: '15'
- _id: '230'
doi: 10.48550/ARXIV.2304.12296
status: public
title: Tunable vector beam decoder by inverse design for high-dimensional quantum
  key distribution with 3D polarized spatial modes
type: journal_article
user_id: '112030'
year: '2023'
...
---
_id: '57556'
abstract:
- lang: eng
  text: '<jats:title>Abstract</jats:title><jats:p>Mathematical modelling emphasizes
    the connection between mathematics and reality — still, tasks are often exclusively
    introduced inside the classroom. The paper examines the potential of different
    task settings for mathematical modelling with real objects: outdoors at the real
    object itself, with photographs and with a 3D model representation. It is the
    aim of the study to analyze how far the mathematical modelling steps of students
    solving the tasks differ in comparison to the settings and representations. In
    a qualitative study, 19 lower secondary school students worked on tasks of all
    three settings in a Latin square design. Their working processes in the settings
    are compared with a special focus on the modelling steps Simplifying and Structuring,
    as well as Mathematizing. The analysis by means of activity diagrams and a qualitative
    content analysis shows that both steps are particularly relevant when students
    work with real objects — independent from the three settings. Still, differences
    in the actual activities could be observed in the students’ discussion on the
    appropriateness of a model and in dealing with inaccuracies at the real object.
    In addition, the process of data collection shows different procedures depending
    on the setting which presents each of them as an enrichment for the acquisition
    of modelling skills.</jats:p>'
author:
- first_name: Simone
  full_name: Jablonski, Simone
  last_name: Jablonski
citation:
  ama: Jablonski S. Is it all about the setting? — A comparison of mathematical modelling
    with real objects and their representation. <i>Educational Studies in Mathematics</i>.
    2023;113(2):307-330. doi:<a href="https://doi.org/10.1007/s10649-023-10215-2">10.1007/s10649-023-10215-2</a>
  apa: Jablonski, S. (2023). Is it all about the setting? — A comparison of mathematical
    modelling with real objects and their representation. <i>Educational Studies in
    Mathematics</i>, <i>113</i>(2), 307–330. <a href="https://doi.org/10.1007/s10649-023-10215-2">https://doi.org/10.1007/s10649-023-10215-2</a>
  bibtex: '@article{Jablonski_2023, title={Is it all about the setting? — A comparison
    of mathematical modelling with real objects and their representation}, volume={113},
    DOI={<a href="https://doi.org/10.1007/s10649-023-10215-2">10.1007/s10649-023-10215-2</a>},
    number={2}, journal={Educational Studies in Mathematics}, publisher={Springer
    Science and Business Media LLC}, author={Jablonski, Simone}, year={2023}, pages={307–330}
    }'
  chicago: 'Jablonski, Simone. “Is It All about the Setting? — A Comparison of Mathematical
    Modelling with Real Objects and Their Representation.” <i>Educational Studies
    in Mathematics</i> 113, no. 2 (2023): 307–30. <a href="https://doi.org/10.1007/s10649-023-10215-2">https://doi.org/10.1007/s10649-023-10215-2</a>.'
  ieee: 'S. Jablonski, “Is it all about the setting? — A comparison of mathematical
    modelling with real objects and their representation,” <i>Educational Studies
    in Mathematics</i>, vol. 113, no. 2, pp. 307–330, 2023, doi: <a href="https://doi.org/10.1007/s10649-023-10215-2">10.1007/s10649-023-10215-2</a>.'
  mla: Jablonski, Simone. “Is It All about the Setting? — A Comparison of Mathematical
    Modelling with Real Objects and Their Representation.” <i>Educational Studies
    in Mathematics</i>, vol. 113, no. 2, Springer Science and Business Media LLC,
    2023, pp. 307–30, doi:<a href="https://doi.org/10.1007/s10649-023-10215-2">10.1007/s10649-023-10215-2</a>.
  short: S. Jablonski, Educational Studies in Mathematics 113 (2023) 307–330.
date_created: 2024-12-04T10:46:14Z
date_updated: 2025-12-17T08:56:50Z
doi: 10.1007/s10649-023-10215-2
intvolume: '       113'
issue: '2'
language:
- iso: eng
page: 307-330
publication: Educational Studies in Mathematics
publication_identifier:
  issn:
  - 0013-1954
  - 1573-0816
publication_status: published
publisher: Springer Science and Business Media LLC
status: public
title: Is it all about the setting? — A comparison of mathematical modelling with
  real objects and their representation
type: journal_article
user_id: '111489'
volume: 113
year: '2023'
...
---
_id: '52865'
abstract:
- lang: eng
  text: This paper addresses new challenges of detecting campaigns in social media,
    which emerged with the rise of Large Language Models (LLMs). LLMs particularly
    challenge algorithms focused on the temporal analysis of topical clusters. Simple
    similarity measures can no longer capture and map campaigns that were previously
    broadly similar in content. Herein, we analyze whether the classification of messages
    over time can be profitably used to rediscover poorly detectable campaigns at
    the content level. Thus, we evaluate classical classifiers and a new method based
    on siamese neural networks. Our results show that campaigns can be detected despite
    the limited reliability of the classifiers as long as they are based on a large
    amount of simultaneously spread artificial content.
author:
- first_name: Britta
  full_name: Grimme, Britta
  last_name: Grimme
- first_name: Janina
  full_name: Pohl, Janina
  last_name: Pohl
- first_name: Hendrik
  full_name: Winkelmann, Hendrik
  last_name: Winkelmann
- first_name: Lucas
  full_name: Stampe, Lucas
  last_name: Stampe
- first_name: Christian
  full_name: Grimme, Christian
  last_name: Grimme
citation:
  ama: 'Grimme B, Pohl J, Winkelmann H, Stampe L, Grimme C. Lost in Transformation:
    Rediscovering LLM-Generated Campaigns in Social Media. In: <i>Disinformation in
    Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023,
    Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>. Springer-Verlag;
    2023:72–87. doi:<a href="https://doi.org/10.1007/978-3-031-47896-3_6">10.1007/978-3-031-47896-3_6</a>'
  apa: 'Grimme, B., Pohl, J., Winkelmann, H., Stampe, L., &#38; Grimme, C. (2023).
    Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media.
    <i>Disinformation in Open Online Media: 5th Multidisciplinary International Symposium,
    MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>,
    72–87. <a href="https://doi.org/10.1007/978-3-031-47896-3_6">https://doi.org/10.1007/978-3-031-47896-3_6</a>'
  bibtex: '@inproceedings{Grimme_Pohl_Winkelmann_Stampe_Grimme_2023, place={Berlin,
    Heidelberg}, title={Lost in Transformation: Rediscovering LLM-Generated Campaigns
    in Social Media}, DOI={<a href="https://doi.org/10.1007/978-3-031-47896-3_6">10.1007/978-3-031-47896-3_6</a>},
    booktitle={Disinformation in Open Online Media: 5th Multidisciplinary International
    Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings},
    publisher={Springer-Verlag}, author={Grimme, Britta and Pohl, Janina and Winkelmann,
    Hendrik and Stampe, Lucas and Grimme, Christian}, year={2023}, pages={72–87} }'
  chicago: 'Grimme, Britta, Janina Pohl, Hendrik Winkelmann, Lucas Stampe, and Christian
    Grimme. “Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social
    Media.” In <i>Disinformation in Open Online Media: 5th Multidisciplinary International
    Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>,
    72–87. Berlin, Heidelberg: Springer-Verlag, 2023. <a href="https://doi.org/10.1007/978-3-031-47896-3_6">https://doi.org/10.1007/978-3-031-47896-3_6</a>.'
  ieee: 'B. Grimme, J. Pohl, H. Winkelmann, L. Stampe, and C. Grimme, “Lost in Transformation:
    Rediscovering LLM-Generated Campaigns in Social Media,” in <i>Disinformation in
    Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023,
    Amsterdam, The Netherlands, November 21–22, 2023, Proceedings</i>, 2023, pp. 72–87,
    doi: <a href="https://doi.org/10.1007/978-3-031-47896-3_6">10.1007/978-3-031-47896-3_6</a>.'
  mla: 'Grimme, Britta, et al. “Lost in Transformation: Rediscovering LLM-Generated
    Campaigns in Social Media.” <i>Disinformation in Open Online Media: 5th Multidisciplinary
    International Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22,
    2023, Proceedings</i>, Springer-Verlag, 2023, pp. 72–87, doi:<a href="https://doi.org/10.1007/978-3-031-47896-3_6">10.1007/978-3-031-47896-3_6</a>.'
  short: 'B. Grimme, J. Pohl, H. Winkelmann, L. Stampe, C. Grimme, in: Disinformation
    in Open Online Media: 5th Multidisciplinary International Symposium, MISDOOM 2023,
    Amsterdam, The Netherlands, November 21–22, 2023, Proceedings, Springer-Verlag,
    Berlin, Heidelberg, 2023, pp. 72–87.'
date_created: 2024-03-25T14:38:01Z
date_updated: 2026-03-19T07:48:51Z
doi: 10.1007/978-3-031-47896-3_6
keyword:
- Social Media
- Campaign Detection
- Large Language Models
- Siamese Neural Networks
page: 72–87
place: Berlin, Heidelberg
publication: 'Disinformation in Open Online Media: 5th Multidisciplinary International
  Symposium, MISDOOM 2023, Amsterdam, The Netherlands, November 21–22, 2023, Proceedings'
publication_identifier:
  isbn:
  - 978-3-031-47895-6
publisher: Springer-Verlag
status: public
title: 'Lost in Transformation: Rediscovering LLM-Generated Campaigns in Social Media'
type: conference
user_id: '103682'
year: '2023'
...
---
_id: '29852'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Tobias
  full_name: Aubel, Tobias
  last_name: Aubel
- first_name: Anton
  full_name: Matzenmiller, Anton
  last_name: Matzenmiller
citation:
  ama: 'Beule F, Teutenberg D, Meschut G, Aubel T, Matzenmiller A. Methodenentwicklung
    zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen
    in stahlintensiven Mischbaustrukturen. In: <i>22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik</i>. ; 2022.'
  apa: 'Beule, F., Teutenberg, D., Meschut, G., Aubel, T., &#38; Matzenmiller, A.
    (2022). Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter
    Klebverbindungen in stahlintensiven Mischbaustrukturen. <i>22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der
    Klebtechnik.'
  bibtex: '@inproceedings{Beule_Teutenberg_Meschut_Aubel_Matzenmiller_2022, title={Methodenentwicklung
    zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen
    in stahlintensiven Mischbaustrukturen}, booktitle={22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik}, author={Beule, Felix and Teutenberg, Dominik and
    Meschut, Gerson and Aubel, Tobias and Matzenmiller, Anton}, year={2022} }'
  chicago: 'Beule, Felix, Dominik Teutenberg, Gerson Meschut, Tobias Aubel, and Anton
    Matzenmiller. “Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung
    vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen.” In <i>22.
    Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.'
  ieee: 'F. Beule, D. Teutenberg, G. Meschut, T. Aubel, and A. Matzenmiller, “Methodenentwicklung
    zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen
    in stahlintensiven Mischbaustrukturen,” presented at the 22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik, 2022.'
  mla: 'Beule, Felix, et al. “Methodenentwicklung zur Versagensanalyse aufgrund der
    Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen.”
    <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.'
  short: 'F. Beule, D. Teutenberg, G. Meschut, T. Aubel, A. Matzenmiller, in: 22.
    Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.'
conference:
  end_date: 2022-02-16
  name: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2022-02-15
date_created: 2022-02-16T07:14:34Z
date_updated: 2022-02-16T07:15:15Z
department:
- _id: '157'
language:
- iso: ger
publication: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter
  Klebverbindungen in stahlintensiven Mischbaustrukturen
type: conference_abstract
user_id: '66192'
year: '2022'
...
---
_id: '29855'
author:
- first_name: Vinicius
  full_name: Carillo Beber, Vinicius
  last_name: Carillo Beber
- first_name: Christof
  full_name: Nagel, Christof
  last_name: Nagel
- first_name: Bernd
  full_name: Mayer, Bernd
  last_name: Mayer
- first_name: Christian
  full_name: Köster, Christian
  last_name: Köster
- first_name: Anton
  full_name: Matzenmiller, Anton
  last_name: Matzenmiller
- first_name: Matthias
  full_name: Hecht, Matthias
  last_name: Hecht
- first_name: Jörg
  full_name: Baumgartner, Jörg
  last_name: Baumgartner
- first_name: Tobias
  full_name: Melz, Tobias
  last_name: Melz
- first_name: Karina
  full_name: Tews, Karina
  id: '40263'
  last_name: Tews
- first_name: Serkan
  full_name: Çavdar, Serkan
  id: '36456'
  last_name: Çavdar
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Carillo Beber V, Nagel C, Mayer B, et al. Lebensdauerprognose für Stahlklebverbindungen
    bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung
    und variablen Amplituden. In: <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>.
    ; 2022.'
  apa: 'Carillo Beber, V., Nagel, C., Mayer, B., Köster, C., Matzenmiller, A., Hecht,
    M., Baumgartner, J., Melz, T., Tews, K., Çavdar, S., &#38; Meschut, G. (2022).
    Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung,
    veränderlicher Mittelspannung und variablen Amplituden. <i>22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der
    Klebtechnik.'
  bibtex: '@inproceedings{Carillo Beber_Nagel_Mayer_Köster_Matzenmiller_Hecht_Baumgartner_Melz_Tews_Çavdar_et
    al._2022, title={Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer
    Belastung mit Phasenverschiebung, veränderlicher Mittelspannung und variablen
    Amplituden}, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik},
    author={Carillo Beber, Vinicius and Nagel, Christof and Mayer, Bernd and Köster,
    Christian and Matzenmiller, Anton and Hecht, Matthias and Baumgartner, Jörg and
    Melz, Tobias and Tews, Karina and Çavdar, Serkan and et al.}, year={2022} }'
  chicago: 'Carillo Beber, Vinicius, Christof Nagel, Bernd Mayer, Christian Köster,
    Anton Matzenmiller, Matthias Hecht, Jörg Baumgartner, et al. “Lebensdauerprognose
    für Stahlklebverbindungen bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher
    Mittelspannung und variablen Amplituden.” In <i>22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik</i>, 2022.'
  ieee: 'V. Carillo Beber <i>et al.</i>, “Lebensdauerprognose für Stahlklebverbindungen
    bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung
    und variablen Amplituden,” presented at the 22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik, 2022.'
  mla: 'Carillo Beber, Vinicius, et al. “Lebensdauerprognose für Stahlklebverbindungen
    bei multiaxialer Belastung mit Phasenverschiebung, veränderlicher Mittelspannung
    und variablen Amplituden.” <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>,
    2022.'
  short: 'V. Carillo Beber, C. Nagel, B. Mayer, C. Köster, A. Matzenmiller, M. Hecht,
    J. Baumgartner, T. Melz, K. Tews, S. Çavdar, G. Meschut, in: 22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik, 2022.'
conference:
  end_date: 2022-02-16
  name: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2022-02-15
date_created: 2022-02-16T07:20:30Z
date_updated: 2022-02-16T07:21:38Z
department:
- _id: '157'
language:
- iso: ger
publication: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Lebensdauerprognose für Stahlklebverbindungen bei multiaxialer Belastung mit
  Phasenverschiebung, veränderlicher Mittelspannung und variablen Amplituden
type: conference
user_id: '40263'
year: '2022'
...
---
_id: '29344'
author:
- first_name: Jannik
  full_name: Kowatz, Jannik
  id: '32252'
  last_name: Kowatz
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Kowatz J, Teutenberg D, Meschut G. Weiterentwicklung der induktiven Schnellhärtung
    von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von
    serienrelevanten Einflussfaktoren. In: DECHEMA, Gesellschaft für Chemische Technik
    und Biotechnologie e.V., ed. <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>.
    ; 2022.'
  apa: Kowatz, J., Teutenberg, D., &#38; Meschut, G. (2022). Weiterentwicklung der
    induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse
    unter Berücksichtigung von serienrelevanten Einflussfaktoren. In DECHEMA, Gesellschaft
    für Chemische Technik und Biotechnologie e.V. (Ed.), <i>22. Kolloquium Gemeinsame
    Forschung in der Klebtechnik</i>.
  bibtex: '@inproceedings{Kowatz_Teutenberg_Meschut_2022, title={Weiterentwicklung
    der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse
    unter Berücksichtigung von serienrelevanten Einflussfaktoren}, booktitle={22.
    Kolloquium Gemeinsame Forschung in der Klebtechnik}, author={Kowatz, Jannik and
    Teutenberg, Dominik and Meschut, Gerson}, editor={DECHEMA, Gesellschaft für Chemische
    Technik und Biotechnologie e.V.}, year={2022} }'
  chicago: Kowatz, Jannik, Dominik Teutenberg, and Gerson Meschut. “Weiterentwicklung
    der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse
    unter Berücksichtigung von serienrelevanten Einflussfaktoren.” In <i>22. Kolloquium
    Gemeinsame Forschung in der Klebtechnik</i>, edited by DECHEMA, Gesellschaft für
    Chemische Technik und Biotechnologie e.V., 2022.
  ieee: J. Kowatz, D. Teutenberg, and G. Meschut, “Weiterentwicklung der induktiven
    Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung
    von serienrelevanten Einflussfaktoren,” in <i>22. Kolloquium Gemeinsame Forschung
    in der Klebtechnik</i>, Online, 2022.
  mla: Kowatz, Jannik, et al. “Weiterentwicklung der induktiven Schnellhärtung von
    Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten
    Einflussfaktoren.” <i>22. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>,
    edited by DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V.,
    2022.
  short: 'J. Kowatz, D. Teutenberg, G. Meschut, in: DECHEMA, Gesellschaft für Chemische
    Technik und Biotechnologie e.V. (Ed.), 22. Kolloquium Gemeinsame Forschung in
    der Klebtechnik, 2022.'
conference:
  end_date: 16.02.2022
  location: Online
  name: 22. Kolloquium Gemeinsame Forschung in der Klebtechnik
  start_date: 15.02.2022
corporate_editor:
- DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V.
date_created: 2022-01-14T08:10:43Z
date_updated: 2022-02-23T15:22:16Z
department:
- _id: '9'
- _id: '157'
language:
- iso: ger
publication: 22. Kolloquium Gemeinsame Forschung in der Klebtechnik
status: public
title: Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste
  Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren
type: conference
user_id: '32252'
year: '2022'
...
---
_id: '30003'
author:
- first_name: Nick
  full_name: Chudalla, Nick
  id: '41235'
  last_name: Chudalla
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Aurélie
  full_name: Bartley, Aurélie
  last_name: Bartley
- first_name: Tim Michael
  full_name: Wibbeke, Tim Michael
  last_name: Wibbeke
citation:
  ama: 'Chudalla N, Meschut G, Bartley A, Wibbeke TM. Analyse des Versagensverhaltens
    geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung.
    In: <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. ; 2022.'
  apa: 'Chudalla, N., Meschut, G., Bartley, A., &#38; Wibbeke, T. M. (2022). Analyse
    des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden
    Entfügen in der Karosserieinstandsetzung. <i>22. Kolloquium: Gemeinsame Forschung
    in Der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik.'
  bibtex: '@inproceedings{Chudalla_Meschut_Bartley_Wibbeke_2022, title={Analyse des
    Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen
    in der Karosserieinstandsetzung}, booktitle={22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik}, author={Chudalla, Nick and Meschut, Gerson and Bartley, Aurélie
    and Wibbeke, Tim Michael}, year={2022} }'
  chicago: 'Chudalla, Nick, Gerson Meschut, Aurélie Bartley, and Tim Michael Wibbeke.
    “Analyse Des Versagensverhaltens Geklebter Stahl-Verbindungen Beim Werkstoffschonenden
    Entfügen in Der Karosserieinstandsetzung.” In <i>22. Kolloquium: Gemeinsame Forschung
    in Der Klebtechnik</i>, 2022.'
  ieee: 'N. Chudalla, G. Meschut, A. Bartley, and T. M. Wibbeke, “Analyse des Versagensverhaltens
    geklebter Stahl-Verbindungen beim werkstoffschonenden Entfügen in der Karosserieinstandsetzung,”
    presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.'
  mla: 'Chudalla, Nick, et al. “Analyse Des Versagensverhaltens Geklebter Stahl-Verbindungen
    Beim Werkstoffschonenden Entfügen in Der Karosserieinstandsetzung.” <i>22. Kolloquium:
    Gemeinsame Forschung in Der Klebtechnik</i>, 2022.'
  short: 'N. Chudalla, G. Meschut, A. Bartley, T.M. Wibbeke, in: 22. Kolloquium: Gemeinsame
    Forschung in Der Klebtechnik, 2022.'
conference:
  end_date: 2022-02-16
  name: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2022-02-15
date_created: 2022-02-23T15:33:13Z
date_updated: 2022-02-23T15:33:31Z
department:
- _id: '157'
language:
- iso: eng
publication: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Analyse des Versagensverhaltens geklebter Stahl-Verbindungen beim werkstoffschonenden
  Entfügen in der Karosserieinstandsetzung
type: conference
user_id: '41235'
year: '2022'
...
---
_id: '30222'
author:
- first_name: Marius
  full_name: Striewe, Marius
  id: '30228'
  last_name: Striewe
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Lars
  full_name: Schmelzle, Lars
  last_name: Schmelzle
- first_name: Julia
  full_name: Mergheim, Julia
  last_name: Mergheim
- first_name: Gunnar
  full_name: Possart, Gunnar
  last_name: Possart
- first_name: Paul
  full_name: Steinmann, Paul
  last_name: Steinmann
citation:
  ama: 'Striewe M, Meschut G, Schmelzle L, Mergheim J, Possart G, Steinmann P. Experimentelle
    und numerische Untersuchung des Einflusses variabler Betriebstemperaturen auf
    das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung.
    In: <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. ; 2022.'
  apa: 'Striewe, M., Meschut, G., Schmelzle, L., Mergheim, J., Possart, G., &#38;
    Steinmann, P. (2022). Experimentelle und numerische Untersuchung des Einflusses
    variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller
    Klebverbindungen unter Crashbelastung. <i>22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik.'
  bibtex: '@inproceedings{Striewe_Meschut_Schmelzle_Mergheim_Possart_Steinmann_2022,
    title={Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen
    auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung},
    booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Striewe,
    Marius and Meschut, Gerson and Schmelzle, Lars and Mergheim, Julia and Possart,
    Gunnar and Steinmann, Paul}, year={2022} }'
  chicago: 'Striewe, Marius, Gerson Meschut, Lars Schmelzle, Julia Mergheim, Gunnar
    Possart, and Paul Steinmann. “Experimentelle und numerische Untersuchung des Einflusses
    variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller
    Klebverbindungen unter Crashbelastung.” In <i>22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik</i>, 2022.'
  ieee: 'M. Striewe, G. Meschut, L. Schmelzle, J. Mergheim, G. Possart, and P. Steinmann,
    “Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen
    auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung,”
    presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.'
  mla: 'Striewe, Marius, et al. “Experimentelle und numerische Untersuchung des Einflusses
    variabler Betriebstemperaturen auf das Trag- und Versagensverhalten struktureller
    Klebverbindungen unter Crashbelastung.” <i>22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik</i>, 2022.'
  short: 'M. Striewe, G. Meschut, L. Schmelzle, J. Mergheim, G. Possart, P. Steinmann,
    in: 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.'
conference:
  end_date: 2022-02-16
  name: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2022-02-15
date_created: 2022-03-10T08:44:01Z
date_updated: 2022-03-10T08:48:06Z
department:
- _id: '157'
language:
- iso: ger
publication: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Experimentelle und numerische Untersuchung des Einflusses variabler Betriebstemperaturen
  auf das Trag- und Versagensverhalten struktureller Klebverbindungen unter Crashbelastung
type: conference_abstract
user_id: '30228'
year: '2022'
...
---
_id: '30347'
author:
- first_name: Frank
  full_name: Schafmeister, Frank
  id: '71291'
  last_name: Schafmeister
citation:
  ama: 'Schafmeister F. Compensation of LF Common-Mode Noise by the internal DC/DC-Stage
    for transformerless On-Board Chargers at Three- and Single-Phase Operation. In:
    <i>International Conference on Electric &#38; Electronic in Hybrid and Electric
    Vehicles and Electric Energy Management (EEHE),</i>.'
  apa: Schafmeister, F. (n.d.). Compensation of LF Common-Mode Noise by the internal
    DC/DC-Stage for transformerless On-Board Chargers at Three- and Single-Phase Operation.
    <i>International Conference on Electric &#38; Electronic in Hybrid and Electric
    Vehicles and Electric Energy Management (EEHE),</i>. International Conference
    on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy
    Management (EEHE 22) , Bamberg, Germany.
  bibtex: '@inproceedings{Schafmeister, place={Bamberg, Germany}, title={Compensation
    of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless On-Board
    Chargers at Three- and Single-Phase Operation}, booktitle={International Conference
    on Electric &#38; Electronic in Hybrid and Electric Vehicles and Electric Energy
    Management (EEHE),}, author={Schafmeister, Frank} }'
  chicago: Schafmeister, Frank. “Compensation of LF Common-Mode Noise by the Internal
    DC/DC-Stage for Transformerless On-Board Chargers at Three- and Single-Phase Operation.”
    In <i>International Conference on Electric &#38; Electronic in Hybrid and Electric
    Vehicles and Electric Energy Management (EEHE),</i>. Bamberg, Germany, n.d.
  ieee: F. Schafmeister, “Compensation of LF Common-Mode Noise by the internal DC/DC-Stage
    for transformerless On-Board Chargers at Three- and Single-Phase Operation,” presented
    at the International Conference on Electric &#38; Electronic in Hybrid and Electric
    Vehicles and Electric Energy Management (EEHE 22) , Bamberg, Germany.
  mla: Schafmeister, Frank. “Compensation of LF Common-Mode Noise by the Internal
    DC/DC-Stage for Transformerless On-Board Chargers at Three- and Single-Phase Operation.”
    <i>International Conference on Electric &#38; Electronic in Hybrid and Electric
    Vehicles and Electric Energy Management (EEHE),</i>.
  short: 'F. Schafmeister, in: International Conference on Electric &#38; Electronic
    in Hybrid and Electric Vehicles and Electric Energy Management (EEHE), Bamberg,
    Germany, n.d.'
conference:
  end_date: 2022-06-23
  location: Bamberg, Germany
  name: 'International Conference on Electric & Electronic in Hybrid and Electric
    Vehicles and Electric Energy Management (EEHE 22) '
  start_date: 2022-06-22
date_created: 2022-03-16T12:24:47Z
date_updated: 2022-03-16T12:25:18Z
department:
- _id: '52'
language:
- iso: eng
place: Bamberg, Germany
publication: International Conference on Electric & Electronic in Hybrid and Electric
  Vehicles and Electric Energy Management (EEHE),
publication_status: accepted
status: public
title: Compensation of LF Common-Mode Noise by the internal DC/DC-Stage for transformerless
  On-Board Chargers at Three- and Single-Phase Operation
type: conference_abstract
user_id: '71291'
year: '2022'
...
---
_id: '30349'
author:
- first_name: Nikolas
  full_name: Förster, Nikolas
  last_name: Förster
- first_name: Philipp
  full_name: Rehlaender, Philipp
  id: '69469'
  last_name: Rehlaender
- first_name: Oliver
  full_name: Wallscheid, Oliver
  id: '11291'
  last_name: Wallscheid
  orcid: https://orcid.org/0000-0001-9362-8777
- first_name: Frank
  full_name: Schafmeister, Frank
  id: '71291'
  last_name: Schafmeister
- first_name: Joachim
  full_name: Böcker, Joachim
  id: '66'
  last_name: Böcker
  orcid: 0000-0002-8480-7295
citation:
  ama: 'Förster N, Rehlaender P, Wallscheid O, Schafmeister F, Böcker J. An Open-Source
    Transistor Database and Toolbox as an Unified Software Engineering Tool for Managing
    and Evaluating Power Transistors. In: <i>Proc. 37th IEEE Applied Power Electronics
    Conference (APEC)</i>. IEEE.'
  apa: Förster, N., Rehlaender, P., Wallscheid, O., Schafmeister, F., &#38; Böcker,
    J. (n.d.). An Open-Source Transistor Database and Toolbox as an Unified Software
    Engineering Tool for Managing and Evaluating Power Transistors. <i>Proc. 37th
    IEEE Applied Power Electronics Conference (APEC)</i>. 37th IEEE Applied Power
    Electronics Conference (APEC 22), Houston, TX, USA.
  bibtex: '@inproceedings{Förster_Rehlaender_Wallscheid_Schafmeister_Böcker, place={Houston,
    TX, USA}, title={An Open-Source Transistor Database and Toolbox as an Unified
    Software Engineering Tool for Managing and Evaluating Power Transistors}, booktitle={Proc.
    37th IEEE Applied Power Electronics Conference (APEC)}, publisher={IEEE}, author={Förster,
    Nikolas and Rehlaender, Philipp and Wallscheid, Oliver and Schafmeister, Frank
    and Böcker, Joachim} }'
  chicago: 'Förster, Nikolas, Philipp Rehlaender, Oliver Wallscheid, Frank Schafmeister,
    and Joachim Böcker. “An Open-Source Transistor Database and Toolbox as an Unified
    Software Engineering Tool for Managing and Evaluating Power Transistors.” In <i>Proc.
    37th IEEE Applied Power Electronics Conference (APEC)</i>. Houston, TX, USA: IEEE,
    n.d.'
  ieee: N. Förster, P. Rehlaender, O. Wallscheid, F. Schafmeister, and J. Böcker,
    “An Open-Source Transistor Database and Toolbox as an Unified Software Engineering
    Tool for Managing and Evaluating Power Transistors,” presented at the 37th IEEE
    Applied Power Electronics Conference (APEC 22), Houston, TX, USA.
  mla: Förster, Nikolas, et al. “An Open-Source Transistor Database and Toolbox as
    an Unified Software Engineering Tool for Managing and Evaluating Power Transistors.”
    <i>Proc. 37th IEEE Applied Power Electronics Conference (APEC)</i>, IEEE.
  short: 'N. Förster, P. Rehlaender, O. Wallscheid, F. Schafmeister, J. Böcker, in:
    Proc. 37th IEEE Applied Power Electronics Conference (APEC), IEEE, Houston, TX,
    USA, n.d.'
conference:
  end_date: 2022-03-24
  location: Houston, TX, USA
  name: 37th IEEE Applied Power Electronics Conference (APEC 22)
  start_date: 2022-03-20
date_created: 2022-03-16T12:41:02Z
date_updated: 2022-03-16T13:35:07Z
department:
- _id: '52'
language:
- iso: eng
place: Houston, TX, USA
publication: Proc. 37th IEEE Applied Power Electronics Conference (APEC)
publication_status: inpress
publisher: IEEE
status: public
title: An Open-Source Transistor Database and Toolbox as an Unified Software Engineering
  Tool for Managing and Evaluating Power Transistors
type: conference
user_id: '71291'
year: '2022'
...
---
_id: '30350'
author:
- first_name: Lukas
  full_name: Keuck, Lukas
  id: '42519'
  last_name: Keuck
- first_name: Frank
  full_name: Schafmeister, Frank
  id: '71291'
  last_name: Schafmeister
- first_name: Joachim
  full_name: Böcker, Joachim
  id: '66'
  last_name: Böcker
  orcid: 0000-0002-8480-7295
citation:
  ama: 'Keuck L, Schafmeister F, Böcker J. Robust Hysteresis Control for LLC Resonant
    Converters Using a Fully Isolated Measurement Scheme. In: <i>Proc. IEEE International
    Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
    Energy and Energy Management (PCIM)</i>. IEEE.'
  apa: Keuck, L., Schafmeister, F., &#38; Böcker, J. (n.d.). Robust Hysteresis Control
    for LLC Resonant Converters Using a Fully Isolated Measurement Scheme. <i>Proc.
    IEEE International Exhibition and Conference for Power Electronics, Intelligent
    Motion, Renewable Energy and Energy Management (PCIM)</i>.  IEEE International
    Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
    Energy and Energy Management (PCIM 22), Nuremberg, Germany.
  bibtex: '@inproceedings{Keuck_Schafmeister_Böcker, place={Nuremberg, Germany}, title={Robust
    Hysteresis Control for LLC Resonant Converters Using a Fully Isolated Measurement
    Scheme}, booktitle={Proc. IEEE International Exhibition and Conference for Power
    Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM)},
    publisher={IEEE}, author={Keuck, Lukas and Schafmeister, Frank and Böcker, Joachim}
    }'
  chicago: 'Keuck, Lukas, Frank Schafmeister, and Joachim Böcker. “Robust Hysteresis
    Control for LLC Resonant Converters Using a Fully Isolated Measurement Scheme.”
    In <i>Proc. IEEE International Exhibition and Conference for Power Electronics,
    Intelligent Motion, Renewable Energy and Energy Management (PCIM)</i>. Nuremberg,
    Germany: IEEE, n.d.'
  ieee: L. Keuck, F. Schafmeister, and J. Böcker, “Robust Hysteresis Control for LLC
    Resonant Converters Using a Fully Isolated Measurement Scheme,” presented at the  IEEE
    International Exhibition and Conference for Power Electronics, Intelligent Motion,
    Renewable Energy and Energy Management (PCIM 22), Nuremberg, Germany.
  mla: Keuck, Lukas, et al. “Robust Hysteresis Control for LLC Resonant Converters
    Using a Fully Isolated Measurement Scheme.” <i>Proc. IEEE International Exhibition
    and Conference for Power Electronics, Intelligent Motion, Renewable Energy and
    Energy Management (PCIM)</i>, IEEE.
  short: 'L. Keuck, F. Schafmeister, J. Böcker, in: Proc. IEEE International Exhibition
    and Conference for Power Electronics, Intelligent Motion, Renewable Energy and
    Energy Management (PCIM), IEEE, Nuremberg, Germany, n.d.'
conference:
  location: Nuremberg, Germany
  name: ' IEEE International Exhibition and Conference for Power Electronics, Intelligent
    Motion, Renewable Energy and Energy Management (PCIM 22)'
date_created: 2022-03-16T13:33:55Z
date_updated: 2022-03-16T13:35:02Z
department:
- _id: '52'
language:
- iso: eng
place: Nuremberg, Germany
publication: Proc. IEEE International Exhibition and Conference for Power Electronics,
  Intelligent Motion, Renewable Energy and Energy Management (PCIM)
publication_status: inpress
publisher: IEEE
status: public
title: Robust Hysteresis Control for LLC Resonant Converters Using a Fully Isolated
  Measurement Scheme
type: conference
user_id: '71291'
year: '2022'
...
---
_id: '30004'
author:
- first_name: Nick
  full_name: Chudalla, Nick
  id: '41235'
  last_name: Chudalla
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Miriam
  full_name: Schneider, Miriam
  last_name: Schneider
- first_name: Dominik
  full_name: Smart, Dominik
  last_name: Smart
citation:
  ama: 'Chudalla N, Teutenberg D, Meschut G, Schneider M, Smart D. Systematisierung
    einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen
    . In: <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. ; 2022.'
  apa: 'Chudalla, N., Teutenberg, D., Meschut, G., Schneider, M., &#38; Smart, D.
    (2022). Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse
    geklebter Verbindungen . <i>22. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>.
    22. Kolloquium: Gemeinsame Forschung in der Klebtechnik .'
  bibtex: '@inproceedings{Chudalla_Teutenberg_Meschut_Schneider_Smart_2022, title={Systematisierung
    einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen
    }, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Chudalla,
    Nick and Teutenberg, Dominik and Meschut, Gerson and Schneider, Miriam and Smart,
    Dominik}, year={2022} }'
  chicago: 'Chudalla, Nick, Dominik Teutenberg, Gerson Meschut, Miriam Schneider,
    and Dominik Smart. “Systematisierung Einer Rechnergestützten Auswertemethode Zur
    Versagensanalyse Geklebter Verbindungen .” In <i>22. Kolloquium: Gemeinsame Forschung
    in Der Klebtechnik</i>, 2022.'
  ieee: 'N. Chudalla, D. Teutenberg, G. Meschut, M. Schneider, and D. Smart, “Systematisierung
    einer rechnergestützten Auswertemethode zur Versagensanalyse geklebter Verbindungen
    ,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik ,
    2022.'
  mla: 'Chudalla, Nick, et al. “Systematisierung Einer Rechnergestützten Auswertemethode
    Zur Versagensanalyse Geklebter Verbindungen .” <i>22. Kolloquium: Gemeinsame Forschung
    in Der Klebtechnik</i>, 2022.'
  short: 'N. Chudalla, D. Teutenberg, G. Meschut, M. Schneider, D. Smart, in: 22.
    Kolloquium: Gemeinsame Forschung in Der Klebtechnik, 2022.'
conference:
  end_date: 2022-02-16
  name: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik '
  start_date: 2022-02-15
date_created: 2022-02-23T15:38:23Z
date_updated: 2022-04-25T11:23:42Z
department:
- _id: '157'
language:
- iso: eng
publication: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: 'Systematisierung einer rechnergestützten Auswertemethode zur Versagensanalyse
  geklebter Verbindungen '
type: conference
user_id: '41235'
year: '2022'
...
