---
_id: '21436'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
    industry to form electrical connections, e.g. to connect electrical terminals
    within semiconductor modules. Many process parameters affect the bond strength,
    such like the bond normal force, ultrasonic power, wire material and bonding frequency.
    Today, process design, development, and optimization is most likely based on the
    knowledge of process engineers and is mainly performed by experimental testing.
    In this contribution, a newly developed simulation tool is presented, to reduce
    time and costs and efficiently determine optimized process parameter. Based on
    a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
    bonding process are considered using finite element simulation for the complex
    plastic deformation of the wire and reduced order models for the transient dynamics
    of the transducer, wire, substrate and bond formation. The model parameters such
    as the coefficients of friction between bond tool and wire and between wire and
    substrate were determined for aluminium and copper wire in experiments with a
    test rig specially developed for the requirements of heavy wire bonding. To reduce
    simulation time, for the finite element simulation a restart analysis and high
    performance computing is utilized. Detailed analysis of the bond formation showed,
    that the normal pressure distribution in the contact between wire and substrate
    has high impact on bond formation and distribution of welded areas in the contact
    area.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Viktor
  full_name: Krieger, Viktor
  last_name: Krieger
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
    for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>.
    2021;119:114077. doi:<a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>
  apa: Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation
    of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics
    Reliability</i>, <i>119</i>, 114077. <a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>
  bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
    and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a
    href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>},
    journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
    Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
  chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
    “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
    <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>.'
  ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
    and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics
    Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>.'
  mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
    Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol.
    119, 2021, p. 114077, doi:<a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>.
  short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
    119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: '       119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
  issn:
  - 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...