[{"main_file_link":[{"open_access":"1","url":"https://doi.org/10.1155/2023/8417012"}],"doi":"10.1155/2023/8417012","date_updated":"2024-03-26T09:40:53Z","oa":"1","author":[{"orcid":"0000-0002-7347-099X","last_name":"Klowait","full_name":"Klowait, Nils","id":"98454","first_name":"Nils"}],"volume":2023,"citation":{"apa":"Klowait, N. (2023). On the Multimodal Resolution of a Search Sequence in Virtual Reality. <i>Human Behavior and Emerging Technologies</i>, <i>2023</i>, 1–15. <a href=\"https://doi.org/10.1155/2023/8417012\">https://doi.org/10.1155/2023/8417012</a>","bibtex":"@article{Klowait_2023, title={On the Multimodal Resolution of a Search Sequence in Virtual Reality}, volume={2023}, DOI={<a href=\"https://doi.org/10.1155/2023/8417012\">10.1155/2023/8417012</a>}, journal={Human Behavior and Emerging Technologies}, publisher={Hindawi Limited}, author={Klowait, Nils}, year={2023}, pages={1–15} }","mla":"Klowait, Nils. “On the Multimodal Resolution of a Search Sequence in Virtual Reality.” <i>Human Behavior and Emerging Technologies</i>, vol. 2023, Hindawi Limited, 2023, pp. 1–15, doi:<a href=\"https://doi.org/10.1155/2023/8417012\">10.1155/2023/8417012</a>.","short":"N. Klowait, Human Behavior and Emerging Technologies 2023 (2023) 1–15.","ama":"Klowait N. On the Multimodal Resolution of a Search Sequence in Virtual Reality. <i>Human Behavior and Emerging Technologies</i>. 2023;2023:1-15. doi:<a href=\"https://doi.org/10.1155/2023/8417012\">10.1155/2023/8417012</a>","chicago":"Klowait, Nils. “On the Multimodal Resolution of a Search Sequence in Virtual Reality.” <i>Human Behavior and Emerging Technologies</i> 2023 (2023): 1–15. <a href=\"https://doi.org/10.1155/2023/8417012\">https://doi.org/10.1155/2023/8417012</a>.","ieee":"N. Klowait, “On the Multimodal Resolution of a Search Sequence in Virtual Reality,” <i>Human Behavior and Emerging Technologies</i>, vol. 2023, pp. 1–15, 2023, doi: <a href=\"https://doi.org/10.1155/2023/8417012\">10.1155/2023/8417012</a>."},"page":"1-15","intvolume":"      2023","publication_status":"published","publication_identifier":{"issn":["2578-1863"]},"has_accepted_license":"1","article_type":"original","funded_apc":"1","file_date_updated":"2023-04-06T11:00:01Z","project":[{"name":"TRR 318 - Ö: TRR 318 - Project Area Ö","_id":"119"}],"_id":"43437","user_id":"98454","department":[{"_id":"9"}],"status":"public","type":"journal_article","title":"On the Multimodal Resolution of a Search Sequence in Virtual Reality","publisher":"Hindawi Limited","date_created":"2023-04-06T10:57:28Z","year":"2023","quality_controlled":"1","ddc":["300"],"keyword":["Human-Computer Interaction","General Social Sciences","Social Psychology","Virtual Reality : Multimodality","Nonverbal Interaction","Search Sequence","Gesture","Co-Operative Action","Goodwin","Ethnomethodology"],"language":[{"iso":"eng"}],"abstract":[{"text":"<jats:p>In virtual reality (VR), participants may not always have hands, bodies, eyes, or even voices—using VR helmets and two controllers, participants control an avatar through virtual worlds that do not necessarily obey familiar laws of physics; moreover, the avatar’s bodily characteristics may not neatly match our bodies in the physical world. Despite these limitations and specificities, humans get things done through collaboration and the creative use of the environment. While multiuser interactive VR is attracting greater numbers of participants, there are currently few attempts to analyze the in situ interaction systematically. This paper proposes a video-analytic detail-oriented methodological framework for studying virtual reality interaction. Using multimodal conversation analysis, the paper investigates a nonverbal, embodied, two-person interaction: two players in a survival game strive to gesturally resolve a misunderstanding regarding an in-game mechanic—however, both of their microphones are turned off for the duration of play. The players’ inability to resort to complex language to resolve this issue results in a dense sequence of back-and-forth activity involving gestures, object manipulation, gaze, and body work. Most crucially, timing and modified repetitions of previously produced actions turn out to be the key to overcome both technical and communicative challenges. The paper analyzes these action sequences, demonstrates how they generate intended outcomes, and proposes a vocabulary to speak about these types of interaction more generally. The findings demonstrate the viability of multimodal analysis of VR interaction, shed light on unique challenges of analyzing interaction in virtual reality, and generate broader methodological insights about the study of nonverbal action.</jats:p>","lang":"eng"}],"file":[{"creator":"nklowait","date_created":"2023-04-06T11:00:01Z","date_updated":"2023-04-06T11:00:01Z","file_id":"43438","access_level":"closed","file_name":"Klowait_2023a.pdf","file_size":2877385,"content_type":"application/pdf","relation":"main_file","success":1}],"publication":"Human Behavior and Emerging Technologies"},{"title":"Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach","date_created":"2023-02-10T13:05:19Z","publisher":"Shaker","year":"2023","language":[{"iso":"eng"}],"keyword":["heavy copper bonding","wire bonding","quality prediction","friction model","point-contact-element"],"abstract":[{"text":"Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden.","lang":"ger"}],"main_file_link":[{"url":"https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff"}],"supervisor":[{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"author":[{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"}],"volume":15,"date_updated":"2023-02-10T13:05:42Z","citation":{"ama":"Althoff S. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Vol 15. Shaker; 2023.","ieee":"S. Althoff, <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</i>, vol. 15. Shaker, 2023.","chicago":"Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.","apa":"Althoff, S. (2023). <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</i> (Vol. 15). Shaker.","mla":"Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Shaker, 2023.","short":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.","bibtex":"@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }"},"intvolume":"        15","page":"192","related_material":{"link":[{"relation":"confirmation","url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes"}]},"publication_status":"published","publication_identifier":{"isbn":["978-3-8440-8903-5"]},"extern":"1","user_id":"55222","series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","department":[{"_id":"151"}],"_id":"41971","status":"public","type":"dissertation"},{"title":"Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties","doi":"/10.1016/j.jmapro.2023.03.056","main_file_link":[{"url":"https://www.sciencedirect.com/science/article/abs/pii/S1526612523002682?via%3Dihub"}],"date_updated":"2023-04-03T08:47:06Z","publisher":"Elsevier","volume":94,"date_created":"2023-04-03T08:46:43Z","author":[{"id":"52634","full_name":"Voswinkel, Dietrich","last_name":"Voswinkel","first_name":"Dietrich"}],"year":"2023","intvolume":"        94","page":"10-19","citation":{"ama":"Voswinkel D. Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. <i>Journal of Manufacturing Processes</i>. 2023;94:10-19. doi:<a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>","ieee":"D. Voswinkel, “Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties,” <i>Journal of Manufacturing Processes</i>, vol. 94, pp. 10–19, 2023, doi: <a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>.","chicago":"Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” <i>Journal of Manufacturing Processes</i> 94 (2023): 10–19. <a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">https://doi.org//10.1016/j.jmapro.2023.03.056</a>.","apa":"Voswinkel, D. (2023). Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. <i>Journal of Manufacturing Processes</i>, <i>94</i>, 10–19. <a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">https://doi.org//10.1016/j.jmapro.2023.03.056</a>","bibtex":"@article{Voswinkel_2023, title={Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties}, volume={94}, DOI={<a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>}, journal={Journal of Manufacturing Processes}, publisher={Elsevier}, author={Voswinkel, Dietrich}, year={2023}, pages={10–19} }","mla":"Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” <i>Journal of Manufacturing Processes</i>, vol. 94, Elsevier, 2023, pp. 10–19, doi:<a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>.","short":"D. Voswinkel, Journal of Manufacturing Processes 94 (2023) 10–19."},"keyword":["Laser treatment Adhesive bonding Surface technology Hybrid materials"],"language":[{"iso":"eng"}],"_id":"43371","department":[{"_id":"9"},{"_id":"321"},{"_id":"158"}],"user_id":"52634","abstract":[{"text":"Laser structuring to improve the adhesion properties of steel substrates in fiber-metal laminates offers many advantages that are highly suitable for modern industrial requirements. Maintenance and energy costs are relatively low, it is easy to automate, and there are no by-products such as chemicals or abrasives to dispose of or recycle. This makes laser structuring a particularly environmentally friendly process, which is nowadays more important than ever. On the other hand, the process time for laser structuring is much higher than for chemical pre-treatment, for example. In past studies, the time and cost efficiency of the laser structuring process has tended to play a minor role. However, there are approaches in which laser structured surfaces are adapted to the shear stress peaks occurring within the adhesive layer, thus requiring only partial structuring of the area to be bonded, potentially saving process time. In this experimental study, electrolytically galvanized steel substrates were partially laser structured to match the shear stress distribution and then bonded to a carbon fiber-reinforced plastic. The adhesion properties achieved were characterized using shear tensile tests and compared with the properties of the fully structured ones. With the partial laser structuring, a saving of 66 % of the conventional process time was achieved while maintaining 95 % of the same shear strength.","lang":"eng"}],"status":"public","publication":"Journal of Manufacturing Processes","type":"journal_article"},{"article_type":"original","article_number":"2100396","department":[{"_id":"9"},{"_id":"367"}],"user_id":"38770","_id":"33988","status":"public","type":"journal_article","doi":"10.1002/masy.202100396","volume":404,"author":[{"last_name":"Moritzer","full_name":"Moritzer, Elmar","first_name":"Elmar"},{"first_name":"Christine","last_name":"Driediger","full_name":"Driediger, Christine"}],"date_updated":"2022-11-03T13:32:18Z","intvolume":"       404","citation":{"ama":"Moritzer E, Driediger C. Reactive Direct Bonding of Digital Light Process Components. <i>Macromolecular Symposia</i>. 2022;404(1). doi:<a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>","ieee":"E. Moritzer and C. Driediger, “Reactive Direct Bonding of Digital Light Process Components,” <i>Macromolecular Symposia</i>, vol. 404, no. 1, Art. no. 2100396, 2022, doi: <a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>.","chicago":"Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” <i>Macromolecular Symposia</i> 404, no. 1 (2022). <a href=\"https://doi.org/10.1002/masy.202100396\">https://doi.org/10.1002/masy.202100396</a>.","mla":"Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” <i>Macromolecular Symposia</i>, vol. 404, no. 1, 2100396, Wiley, 2022, doi:<a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>.","bibtex":"@article{Moritzer_Driediger_2022, title={Reactive Direct Bonding of Digital Light Process Components}, volume={404}, DOI={<a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>}, number={12100396}, journal={Macromolecular Symposia}, publisher={Wiley}, author={Moritzer, Elmar and Driediger, Christine}, year={2022} }","short":"E. Moritzer, C. Driediger, Macromolecular Symposia 404 (2022).","apa":"Moritzer, E., &#38; Driediger, C. (2022). Reactive Direct Bonding of Digital Light Process Components. <i>Macromolecular Symposia</i>, <i>404</i>(1), Article 2100396. <a href=\"https://doi.org/10.1002/masy.202100396\">https://doi.org/10.1002/masy.202100396</a>"},"publication_identifier":{"issn":["1022-1360","1521-3900"]},"has_accepted_license":"1","publication_status":"published","language":[{"iso":"eng"}],"keyword":["digital light processing","material combination","reactive direct bonding","vat photopolymerization"],"publication":"Macromolecular Symposia","title":"Reactive Direct Bonding of Digital Light Process Components","date_created":"2022-11-03T13:21:13Z","publisher":"Wiley","year":"2022","issue":"1","quality_controlled":"1"},{"date_created":"2023-11-14T15:59:00Z","publisher":"Springer International Publishing","title":"Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem","year":"2022","language":[{"iso":"eng"}],"keyword":["Co-evolutionary algorithms","Evolutionary diversity optimisation","Quality diversity","Traveling thief problem"],"publication":"Parallel Problem Solving from Nature (PPSN XVII)","abstract":[{"lang":"eng","text":"Recently different evolutionary computation approaches have been developed that generate sets of high quality diverse solutions for a given optimisation problem. Many studies have considered diversity 1) as a mean to explore niches in behavioural space (quality diversity) or 2) to increase the structural differences of solutions (evolutionary diversity optimisation). In this study, we introduce a co-evolutionary algorithm to simultaneously explore the two spaces for the multi-component traveling thief problem. The results show the capability of the co-evolutionary algorithm to achieve significantly higher diversity compared to the baseline evolutionary diversity algorithms from the literature."}],"author":[{"full_name":"Nikfarjam, Adel","last_name":"Nikfarjam","first_name":"Adel"},{"first_name":"Aneta","full_name":"Neumann, Aneta","last_name":"Neumann"},{"full_name":"Bossek, Jakob","id":"102979","last_name":"Bossek","orcid":"0000-0002-4121-4668","first_name":"Jakob"},{"last_name":"Neumann","full_name":"Neumann, Frank","first_name":"Frank"}],"date_updated":"2023-12-13T10:49:51Z","doi":"10.1007/978-3-031-14714-2_17","publication_identifier":{"isbn":["978-3-031-14714-2"]},"publication_status":"published","page":"237–249","citation":{"apa":"Nikfarjam, A., Neumann, A., Bossek, J., &#38; Neumann, F. (2022). Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem. In G. Rudolph, A. V. Kononova, H. Aguirre, P. Kerschke, G. Ochoa, &#38; T. Tu\\v sar (Eds.), <i>Parallel Problem Solving from Nature (PPSN XVII)</i> (pp. 237–249). Springer International Publishing. <a href=\"https://doi.org/10.1007/978-3-031-14714-2_17\">https://doi.org/10.1007/978-3-031-14714-2_17</a>","short":"A. Nikfarjam, A. Neumann, J. Bossek, F. Neumann, in: G. Rudolph, A.V. Kononova, H. Aguirre, P. Kerschke, G. Ochoa, T. Tu\\v sar (Eds.), Parallel Problem Solving from Nature (PPSN XVII), Springer International Publishing, Cham, 2022, pp. 237–249.","bibtex":"@inproceedings{Nikfarjam_Neumann_Bossek_Neumann_2022, place={Cham}, series={Lecture Notes in Computer Science}, title={Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem}, DOI={<a href=\"https://doi.org/10.1007/978-3-031-14714-2_17\">10.1007/978-3-031-14714-2_17</a>}, booktitle={Parallel Problem Solving from Nature (PPSN XVII)}, publisher={Springer International Publishing}, author={Nikfarjam, Adel and Neumann, Aneta and Bossek, Jakob and Neumann, Frank}, editor={Rudolph, Günter and Kononova, Anna V. and Aguirre, Hernán and Kerschke, Pascal and Ochoa, Gabriela and Tu\\v sar, Tea}, year={2022}, pages={237–249}, collection={Lecture Notes in Computer Science} }","mla":"Nikfarjam, Adel, et al. “Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem.” <i>Parallel Problem Solving from Nature (PPSN XVII)</i>, edited by Günter Rudolph et al., Springer International Publishing, 2022, pp. 237–249, doi:<a href=\"https://doi.org/10.1007/978-3-031-14714-2_17\">10.1007/978-3-031-14714-2_17</a>.","ama":"Nikfarjam A, Neumann A, Bossek J, Neumann F. Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem. In: Rudolph G, Kononova AV, Aguirre H, Kerschke P, Ochoa G, Tu\\v sar T, eds. <i>Parallel Problem Solving from Nature (PPSN XVII)</i>. Lecture Notes in Computer Science. Springer International Publishing; 2022:237–249. doi:<a href=\"https://doi.org/10.1007/978-3-031-14714-2_17\">10.1007/978-3-031-14714-2_17</a>","ieee":"A. Nikfarjam, A. Neumann, J. Bossek, and F. Neumann, “Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem,” in <i>Parallel Problem Solving from Nature (PPSN XVII)</i>, 2022, pp. 237–249, doi: <a href=\"https://doi.org/10.1007/978-3-031-14714-2_17\">10.1007/978-3-031-14714-2_17</a>.","chicago":"Nikfarjam, Adel, Aneta Neumann, Jakob Bossek, and Frank Neumann. “Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem.” In <i>Parallel Problem Solving from Nature (PPSN XVII)</i>, edited by Günter Rudolph, Anna V. Kononova, Hernán Aguirre, Pascal Kerschke, Gabriela Ochoa, and Tea Tu\\v sar, 237–249. Lecture Notes in Computer Science. Cham: Springer International Publishing, 2022. <a href=\"https://doi.org/10.1007/978-3-031-14714-2_17\">https://doi.org/10.1007/978-3-031-14714-2_17</a>."},"place":"Cham","department":[{"_id":"819"}],"series_title":"Lecture Notes in Computer Science","user_id":"102979","_id":"48894","extern":"1","type":"conference","status":"public","editor":[{"first_name":"Günter","full_name":"Rudolph, Günter","last_name":"Rudolph"},{"full_name":"Kononova, Anna V.","last_name":"Kononova","first_name":"Anna V."},{"full_name":"Aguirre, Hernán","last_name":"Aguirre","first_name":"Hernán"},{"last_name":"Kerschke","full_name":"Kerschke, Pascal","first_name":"Pascal"},{"first_name":"Gabriela","last_name":"Ochoa","full_name":"Ochoa, Gabriela"},{"first_name":"Tea","full_name":"Tu\\v sar, Tea","last_name":"Tu\\v sar"}]},{"conference":{"name":"11th International Conference on Pattern Recognition Applications and Methods","start_date":"2022-02-03","end_date":"2022-02-05","location":"Online"},"title":"Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design","author":[{"first_name":"Michael","last_name":"Hesse","full_name":"Hesse, Michael","id":"29222"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"first_name":"Julia","full_name":"Timmermann, Julia","id":"15402","last_name":"Timmermann"},{"first_name":"Ansgar","last_name":"Trächtler","full_name":"Trächtler, Ansgar","id":"552"}],"date_created":"2022-02-09T12:50:25Z","date_updated":"2024-11-13T08:44:17Z","citation":{"bibtex":"@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design}, booktitle={Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }","mla":"Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 2022, pp. 383–94.","short":"M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.","apa":"Hesse, M., Hunstig, M., Timmermann, J., &#38; Trächtler, A. (2022). Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 383–394.","ama":"Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>. ; 2022:383-394.","ieee":"M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,” in <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, Online, 2022, pp. 383–394.","chicago":"Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” In <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 383–94, 2022."},"page":"383-394","year":"2022","publication_identifier":{"isbn":["978-989-758-549-4"]},"quality_controlled":"1","language":[{"iso":"eng"}],"keyword":["Bayesian optimization","Wire bonding","Feed-forward control","model-free design"],"user_id":"82875","department":[{"_id":"153"},{"_id":"880"}],"_id":"29803","status":"public","abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process used to form electrical interconnections in micro and\r\npower electronics and batteries. A high frequency oscillation causes a metallurgical bond deformation in\r\nthe contact area. Due to the numerous physical influencing factors, it is very difficult to accurately capture\r\nthis process in a model. Therefore, our goal is to determine a suitable feed-forward control strategy for the\r\nbonding process even without detailed model knowledge. We propose the use of batch constrained Bayesian\r\noptimization for the control design. Hence, Bayesian optimization is precisely adapted to the application of\r\nbonding: the constraint is used to check one quality feature of the process and the use of batches leads to\r\nmore efficient experiments. Our approach is suitable to determine a feed-forward control for the bonding\r\nprocess that provides very high quality bonds without using a physical model. We also show that the quality\r\nof the Bayesian optimization based control outperforms random search as well as manual search by a user.\r\nUsing a simple prior knowledge model derived from data further improves the quality of the connection.\r\nThe Bayesian optimization approach offers the possibility to perform a sensitivity analysis of the control\r\nparameters, which allows to evaluate the influence of each control parameter on the bond quality. In summary,\r\nBayesian optimization applied to the bonding process provides an excellent opportunity to develop a feedforward\r\ncontrol without full modeling of the underlying physical processes.","lang":"eng"}],"type":"conference","publication":"Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)"},{"title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","doi":"https://doi.org/10.1016/j.microrel.2021.114077","date_updated":"2023-09-21T14:15:33Z","date_created":"2021-03-10T09:37:02Z","author":[{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"first_name":"Viktor","last_name":"Krieger","full_name":"Krieger, Viktor"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"volume":119,"year":"2021","citation":{"ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>. 2021;119:114077. doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>, <i>119</i>, 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol. 119, 2021, p. 114077, doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.","bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }"},"intvolume":"       119","page":"114077","publication_status":"published","quality_controlled":"1","publication_identifier":{"issn":["0026-2714"]},"keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"language":[{"iso":"eng"}],"_id":"21436","user_id":"210","department":[{"_id":"151"}],"abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area."}],"status":"public","type":"journal_article","publication":"Microelectronics Reliability"},{"_id":"41958","department":[{"_id":"9"},{"_id":"149"},{"_id":"321"}],"user_id":"15952","series_title":"Schriftenreihe Institut für Leichtbau mit Hybridsystemen","keyword":["Leichtbau","Faserverbundkunststoffe","Nasspressverfahren","Hybridbauteile","Rheologie","Klebtechnik","Co-Bonding"],"language":[{"iso":"ger"}],"type":"dissertation","abstract":[{"text":"Das Nasspressverfahren ist ein Serienherstellungsprozess für Bauteile aus duroplastischen Faserverbundkunststoffen (FVK) mit einer geringen Geometriekomplexität. Im Rahmen dieser Arbeit wurde ein modifiziertes Nasspressverfahren untersucht, welches die Herstellung von hybriden Blech-FVK-Strukturen ermöglicht. Die stoffschlüssige Verbindung zwischen dem metallischen Trägerbauteil und einem lokalen FVK-Verstärkungselement wird durch Co-Bonding im Nasspresswerkzeug aufgebaut. Epoxidbasierte Matrixharze und Klebstoffe wurden mit Methoden der Klebtechnik sowie thermischen und rheometrischen Prüfungen charakterisiert, um ein materialspezifisches Fertigungsprozessfenster einzugrenzen. Experimentelle Untersuchungen zum Nasspressen von GFK-Laminaten und Stahl-GFK-Hybridstrukturen fokussierten die Mikrostruktur und das strukturelle Verhalten von stoffschlüssigen Hybridverbindungen. Unter anderem wurden Einflüsse von zeit-, temperatur- und druckabhängigen Fertigungsparametern sowie der Einsatz von Strukturklebstofffilmen und internen Trennmitteln analysiert. Anhand von Fallturmtests an hybriden Demonstratorkomponenten konnte das modifizierte Nasspressverfahren für die Herstellung crashrelevanter Karosseriebauteile qualifiziert werden.","lang":"ger"}],"status":"public","publisher":"Shaker Verlag","date_updated":"2023-02-10T11:24:47Z","volume":"2019,35","supervisor":[{"first_name":"Thomas","last_name":"Tröster","full_name":"Tröster, Thomas","id":"553"}],"author":[{"first_name":"Hermann","last_name":"Opdemom","full_name":"Opdemom, Hermann"}],"date_created":"2023-02-10T11:24:40Z","title":"Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen","publication_identifier":{"isbn":["978-3-8440-6428-5"]},"publication_status":"published","year":"2019","page":"178","citation":{"chicago":"Opdemom, Hermann. <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>. Vol. 2019,35. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker Verlag, 2019.","ieee":"H. Opdemom, <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>, vol. 2019,35. Shaker Verlag, 2019.","ama":"Opdemom H. <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>. Vol 2019,35. Shaker Verlag; 2019.","apa":"Opdemom, H. (2019). <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen: Vol. 2019,35</i>. Shaker Verlag.","bibtex":"@book{Opdemom_2019, series={Schriftenreihe Institut für Leichtbau mit Hybridsystemen}, title={Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen}, volume={2019,35}, publisher={Shaker Verlag}, author={Opdemom, Hermann}, year={2019}, collection={Schriftenreihe Institut für Leichtbau mit Hybridsystemen} }","short":"H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, Shaker Verlag, 2019.","mla":"Opdemom, Hermann. <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>. Shaker Verlag, 2019."}},{"quality_controlled":"1","publication_identifier":{"issn":["0924-4247"]},"year":"2019","intvolume":"       295","page":"653 - 662","citation":{"ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>","ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662, 2019, doi: <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295 (2019): 653–62. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>.","short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>, vol. 295, 2019, pp. 653–62, doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>"},"date_updated":"2023-09-21T14:12:15Z","volume":295,"author":[{"first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"first_name":"Collin","full_name":"Dymel, Collin","id":"66833","last_name":"Dymel"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2019-07-01T07:32:07Z","title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding","doi":"10.1016/j.sna.2019.04.025","publication":"Sensors and Actuators A: Physical","type":"journal_article","abstract":[{"text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.","lang":"eng"}],"status":"public","_id":"10334","project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"department":[{"_id":"151"}],"user_id":"210","keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"],"language":[{"iso":"eng"}]},{"date_created":"2026-02-07T16:02:06Z","author":[{"last_name":"Neumann","full_name":"Neumann, Sarah","first_name":"Sarah"},{"id":"118165","full_name":"Gutmann, Torsten","last_name":"Gutmann","first_name":"Torsten"},{"full_name":"Buntkowsky, Gerd","last_name":"Buntkowsky","first_name":"Gerd"},{"last_name":"Paul","full_name":"Paul, Stephen","first_name":"Stephen"},{"first_name":"Greg","full_name":"Thiele, Greg","last_name":"Thiele"},{"first_name":"Heiko","full_name":"Sievers, Heiko","last_name":"Sievers"},{"last_name":"Bäumer","full_name":"Bäumer, Marcus","first_name":"Marcus"},{"full_name":"Kunz, Sebastian","last_name":"Kunz","first_name":"Sebastian"}],"volume":377,"date_updated":"2026-02-17T16:14:45Z","doi":"10.1016/j.jcat.2019.07.049","title":"Insights into the reaction mechanism and particle size effects of CO oxidation over supported Pt nanoparticle catalysts","citation":{"short":"S. Neumann, T. Gutmann, G. Buntkowsky, S. Paul, G. Thiele, H. Sievers, M. Bäumer, S. Kunz, Journal of Catalysis 377 (2019) 662–672.","bibtex":"@article{Neumann_Gutmann_Buntkowsky_Paul_Thiele_Sievers_Bäumer_Kunz_2019, title={Insights into the reaction mechanism and particle size effects of CO oxidation over supported Pt nanoparticle catalysts}, volume={377}, DOI={<a href=\"https://doi.org/10.1016/j.jcat.2019.07.049\">10.1016/j.jcat.2019.07.049</a>}, journal={Journal of Catalysis}, author={Neumann, Sarah and Gutmann, Torsten and Buntkowsky, Gerd and Paul, Stephen and Thiele, Greg and Sievers, Heiko and Bäumer, Marcus and Kunz, Sebastian}, year={2019}, pages={662–672} }","mla":"Neumann, Sarah, et al. “Insights into the Reaction Mechanism and Particle Size Effects of CO Oxidation over Supported Pt Nanoparticle Catalysts.” <i>Journal of Catalysis</i>, vol. 377, 2019, pp. 662–672, doi:<a href=\"https://doi.org/10.1016/j.jcat.2019.07.049\">10.1016/j.jcat.2019.07.049</a>.","apa":"Neumann, S., Gutmann, T., Buntkowsky, G., Paul, S., Thiele, G., Sievers, H., Bäumer, M., &#38; Kunz, S. (2019). Insights into the reaction mechanism and particle size effects of CO oxidation over supported Pt nanoparticle catalysts. <i>Journal of Catalysis</i>, <i>377</i>, 662–672. <a href=\"https://doi.org/10.1016/j.jcat.2019.07.049\">https://doi.org/10.1016/j.jcat.2019.07.049</a>","ieee":"S. Neumann <i>et al.</i>, “Insights into the reaction mechanism and particle size effects of CO oxidation over supported Pt nanoparticle catalysts,” <i>Journal of Catalysis</i>, vol. 377, pp. 662–672, 2019, doi: <a href=\"https://doi.org/10.1016/j.jcat.2019.07.049\">10.1016/j.jcat.2019.07.049</a>.","chicago":"Neumann, Sarah, Torsten Gutmann, Gerd Buntkowsky, Stephen Paul, Greg Thiele, Heiko Sievers, Marcus Bäumer, and Sebastian Kunz. “Insights into the Reaction Mechanism and Particle Size Effects of CO Oxidation over Supported Pt Nanoparticle Catalysts.” <i>Journal of Catalysis</i> 377 (2019): 662–672. <a href=\"https://doi.org/10.1016/j.jcat.2019.07.049\">https://doi.org/10.1016/j.jcat.2019.07.049</a>.","ama":"Neumann S, Gutmann T, Buntkowsky G, et al. Insights into the reaction mechanism and particle size effects of CO oxidation over supported Pt nanoparticle catalysts. <i>Journal of Catalysis</i>. 2019;377:662–672. doi:<a href=\"https://doi.org/10.1016/j.jcat.2019.07.049\">10.1016/j.jcat.2019.07.049</a>"},"page":"662–672","intvolume":"       377","year":"2019","user_id":"100715","_id":"64018","extern":"1","language":[{"iso":"eng"}],"keyword":["Solid state NMR","“Surfactant-free” platinum nanoparticles","CO oxidation","Particle size effect","Structure sensitivity"],"type":"journal_article","publication":"Journal of Catalysis","status":"public","abstract":[{"text":"CO oxidation is an extensively studied reaction in heterogeneous catalysis due to its seeming simplicity and its great importance for emission control. However, the role of particle size and more specifically structure sensitivity in this reaction is still controversial. In the present study, colloidal “surfactant-free” Pt nanoparticles (NPs) in a size regime of 1–4 nm with narrow size distribution and control over particle size were synthesized and subsequently supported on Al2O3 to prepare model catalysts. CO oxidation was performed using Pt NPs catalysts with particles sizes of 1, 2, 3, and 4 nm at different reaction temperatures. It is shown that the reaction exhibits a particle size effect that depends strongly on the reaction conditions. At 170 °C, the reaction seems to proceed within the same kinetic regime for all particle sizes, but the surface normalized activity depends strongly on the particle size, with maximum activity for nanoparticles 2 nm in diameter. A temperature increase to 200 °C leads to a change of the kinetic regime that depends on the particle size. For Pt NPs 1 nm in diameter a reaction order of 1 for O2 was observed, indicating that O2 adsorbs molecularly and dissociates in a following step, which represents the generally accepted mechanism on Pt surfaces. The reaction order of −1 for CO demonstrates that the surface is saturated with CO under reaction conditions. With increasing particle size, the reaction orders of O2 and CO change. For particles 2 nm in size, an increase in temperature also results in reaction orders of 1 for O2 and −1 for CO; NPs of 3 and 4 nm, even at higher temperatures, show no clear kinetic behavior that can be explained by a single reaction mechanism. Instead, the Boudouard reaction between two adjacent adsorbed CO molecules was identified as an important additional reaction pathway that occurs preferentially on large particles and causes more complex kinetics.","lang":"eng"}]},{"language":[{"iso":"eng"}],"keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"user_id":"210","department":[{"_id":"151"}],"project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"_id":"9992","status":"public","abstract":[{"lang":"eng","text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach."}],"type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","author":[{"last_name":"Dymel","id":"66833","full_name":"Dymel, Collin","first_name":"Collin"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-27T10:18:10Z","date_updated":"2020-05-07T05:33:56Z","citation":{"apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6).","bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018.","ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6."},"page":"1-6","year":"2018","quality_controlled":"1"},{"date_created":"2019-05-27T10:19:18Z","author":[{"last_name":"Dymel","full_name":"Dymel, Collin","id":"66833","first_name":"Collin"},{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"}],"date_updated":"2020-05-07T05:33:56Z","title":"Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding","quality_controlled":"1","citation":{"ama":"Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.","chicago":"Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44, 2018.","ieee":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","short":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","mla":"Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","bibtex":"@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }","apa":"Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44)."},"page":"41-44","year":"2018","user_id":"210","department":[{"_id":"151"}],"project":[{"name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93","grant_number":"MP-1-1-015"}],"_id":"9993","language":[{"iso":"eng"}],"keyword":["ultrasonic two-dimensional bonding","electrical interconnection","process parameters"],"type":"conference","publication":"(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)","status":"public","abstract":[{"text":"Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories.","lang":"eng"}]},{"type":"conference","publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives."}],"status":"public","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"_id":"9999","user_id":"210","department":[{"_id":"151"}],"keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"language":[{"iso":"eng"}],"quality_controlled":"1","year":"2018","citation":{"ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018."},"date_updated":"2020-05-07T05:33:56Z","author":[{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_created":"2019-05-27T10:27:45Z","volume":"Vol. 2018, No. 1, pp. 000572-000577.","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","doi":"10.4071/2380-4505-2018.1.000572"},{"date_created":"2022-04-21T09:13:47Z","author":[{"first_name":"Juliane","last_name":"Anderski","full_name":"Anderski, Juliane"},{"full_name":"Mahlert, Laura","last_name":"Mahlert","first_name":"Laura"},{"full_name":"Sun, Jingjiang","last_name":"Sun","first_name":"Jingjiang"},{"last_name":"Birnbaum","full_name":"Birnbaum, Wolfgang","first_name":"Wolfgang"},{"first_name":"Dennis","last_name":"Mulac","full_name":"Mulac, Dennis"},{"last_name":"Schreiber","full_name":"Schreiber, Sebastian","first_name":"Sebastian"},{"first_name":"Fabian","full_name":"Herrmann, Fabian","last_name":"Herrmann"},{"id":"287","full_name":"Kuckling, Dirk","last_name":"Kuckling","first_name":"Dirk"},{"first_name":"Klaus","last_name":"Langer","full_name":"Langer, Klaus"}],"volume":557,"publisher":"Elsevier BV","date_updated":"2022-04-21T09:14:49Z","doi":"10.1016/j.ijpharm.2018.12.040","title":"Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT","publication_status":"published","publication_identifier":{"issn":["0378-5173"]},"citation":{"ama":"Anderski J, Mahlert L, Sun J, et al. Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT. <i>International Journal of Pharmaceutics</i>. 2018;557:182-191. doi:<a href=\"https://doi.org/10.1016/j.ijpharm.2018.12.040\">10.1016/j.ijpharm.2018.12.040</a>","ieee":"J. Anderski <i>et al.</i>, “Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT,” <i>International Journal of Pharmaceutics</i>, vol. 557, pp. 182–191, 2018, doi: <a href=\"https://doi.org/10.1016/j.ijpharm.2018.12.040\">10.1016/j.ijpharm.2018.12.040</a>.","chicago":"Anderski, Juliane, Laura Mahlert, Jingjiang Sun, Wolfgang Birnbaum, Dennis Mulac, Sebastian Schreiber, Fabian Herrmann, Dirk Kuckling, and Klaus Langer. “Light-Responsive Nanoparticles Based on New Polycarbonate Polymers as Innovative Drug Delivery Systems for Photosensitizers in PDT.” <i>International Journal of Pharmaceutics</i> 557 (2018): 182–91. <a href=\"https://doi.org/10.1016/j.ijpharm.2018.12.040\">https://doi.org/10.1016/j.ijpharm.2018.12.040</a>.","apa":"Anderski, J., Mahlert, L., Sun, J., Birnbaum, W., Mulac, D., Schreiber, S., Herrmann, F., Kuckling, D., &#38; Langer, K. (2018). Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT. <i>International Journal of Pharmaceutics</i>, <i>557</i>, 182–191. <a href=\"https://doi.org/10.1016/j.ijpharm.2018.12.040\">https://doi.org/10.1016/j.ijpharm.2018.12.040</a>","short":"J. Anderski, L. Mahlert, J. Sun, W. Birnbaum, D. Mulac, S. Schreiber, F. Herrmann, D. Kuckling, K. Langer, International Journal of Pharmaceutics 557 (2018) 182–191.","bibtex":"@article{Anderski_Mahlert_Sun_Birnbaum_Mulac_Schreiber_Herrmann_Kuckling_Langer_2018, title={Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT}, volume={557}, DOI={<a href=\"https://doi.org/10.1016/j.ijpharm.2018.12.040\">10.1016/j.ijpharm.2018.12.040</a>}, journal={International Journal of Pharmaceutics}, publisher={Elsevier BV}, author={Anderski, Juliane and Mahlert, Laura and Sun, Jingjiang and Birnbaum, Wolfgang and Mulac, Dennis and Schreiber, Sebastian and Herrmann, Fabian and Kuckling, Dirk and Langer, Klaus}, year={2018}, pages={182–191} }","mla":"Anderski, Juliane, et al. “Light-Responsive Nanoparticles Based on New Polycarbonate Polymers as Innovative Drug Delivery Systems for Photosensitizers in PDT.” <i>International Journal of Pharmaceutics</i>, vol. 557, Elsevier BV, 2018, pp. 182–91, doi:<a href=\"https://doi.org/10.1016/j.ijpharm.2018.12.040\">10.1016/j.ijpharm.2018.12.040</a>."},"intvolume":"       557","page":"182-191","year":"2018","user_id":"94","department":[{"_id":"311"}],"_id":"30935","language":[{"iso":"eng"}],"keyword":["NanoparticlesLight-responsive polymersPhotodynamic therapyPoly(lactic-co-glycolic acid)Intestinal cancer"],"type":"journal_article","publication":"International Journal of Pharmaceutics","status":"public"},{"keyword":["wire bonding","dynamic behavior","modeling"],"language":[{"iso":"eng"}],"_id":"9982","department":[{"_id":"151"}],"user_id":"55222","abstract":[{"lang":"ger","text":"ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren."}],"status":"public","publication":"43. Deutsche Jahrestagung für Akustik","type":"conference","title":"MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall","date_updated":"2019-05-27T09:49:49Z","author":[{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-27T09:48:10Z","year":"2017","place":"Kiel 2017","page":"611-614","citation":{"apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In <i>43. Deutsche Jahrestagung für Akustik</i> (pp. 611–614). Kiel 2017.","mla":"Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” <i>43. Deutsche Jahrestagung Für Akustik</i>, 2017, pp. 611–14.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in <i>43. Deutsche Jahrestagung für Akustik</i>, 2017, pp. 611–614.","chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In <i>43. Deutsche Jahrestagung Für Akustik</i>, 611–14. Kiel 2017, 2017.","ama":"Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: <i>43. Deutsche Jahrestagung Für Akustik</i>. Kiel 2017; 2017:611-614."}},{"publication_status":"published","issue":"26","year":"2017","citation":{"chicago":"Lücke, Andreas, Uwe Gerstmann, Thomas D. Kühne, and Wolf G. Schmidt. “Efficient PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” <i>Journal of Computational Chemistry</i> 38, no. 26 (2017): 2276–82. <a href=\"https://doi.org/10.1002/jcc.24878\">https://doi.org/10.1002/jcc.24878</a>.","ieee":"A. Lücke, U. Gerstmann, T. D. Kühne, and W. G. Schmidt, “Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition,” <i>Journal of Computational Chemistry</i>, vol. 38, no. 26, pp. 2276–2282, 2017.","ama":"Lücke A, Gerstmann U, Kühne TD, Schmidt WG. Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. <i>Journal of Computational Chemistry</i>. 2017;38(26):2276-2282. doi:<a href=\"https://doi.org/10.1002/jcc.24878\">10.1002/jcc.24878</a>","apa":"Lücke, A., Gerstmann, U., Kühne, T. D., &#38; Schmidt, W. G. (2017). Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. <i>Journal of Computational Chemistry</i>, <i>38</i>(26), 2276–2282. <a href=\"https://doi.org/10.1002/jcc.24878\">https://doi.org/10.1002/jcc.24878</a>","bibtex":"@article{Lücke_Gerstmann_Kühne_Schmidt_2017, title={Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition}, volume={38}, DOI={<a href=\"https://doi.org/10.1002/jcc.24878\">10.1002/jcc.24878</a>}, number={26}, journal={Journal of Computational Chemistry}, author={Lücke, Andreas and Gerstmann, Uwe and Kühne, Thomas D. and Schmidt, Wolf G.}, year={2017}, pages={2276–2282} }","mla":"Lücke, Andreas, et al. “Efficient PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” <i>Journal of Computational Chemistry</i>, vol. 38, no. 26, 2017, pp. 2276–82, doi:<a href=\"https://doi.org/10.1002/jcc.24878\">10.1002/jcc.24878</a>.","short":"A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282."},"page":"2276-2282","intvolume":"        38","date_updated":"2022-01-06T06:51:31Z","author":[{"first_name":"Andreas","last_name":"Lücke","full_name":"Lücke, Andreas"},{"last_name":"Gerstmann","full_name":"Gerstmann, Uwe","first_name":"Uwe"},{"full_name":"Kühne, Thomas D.","last_name":"Kühne","first_name":"Thomas D."},{"first_name":"Wolf G.","full_name":"Schmidt, Wolf G.","last_name":"Schmidt"}],"date_created":"2019-09-16T12:39:15Z","volume":38,"title":"Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition","doi":"10.1002/jcc.24878","type":"journal_article","publication":"Journal of Computational Chemistry","abstract":[{"text":"A numerically efficient yet highly accurate implementation of the crystal orbital Hamilton population (COHP) scheme for plane-wave calculations is presented. It is based on the projector-augmented wave (PAW) formalism in combination with norm-conserving pseudopotentials and allows to extract chemical interactions between atoms from band-structure calculations even for large and complex systems. The potential of the present COHP implementation is demonstrated by an in-depth analysis of the intensively investigated metal-insulator transition in atomic-scale indium wires self-assembled on the Si(111) surface. Thereby bond formation between In atoms of adjacent zigzag chains is found to be instrumental for the phase change. © 2017 Wiley Periodicals, Inc.","lang":"eng"}],"status":"public","project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"_id":"13238","user_id":"71692","department":[{"_id":"304"}],"keyword":["density functional theory","bonding","crystal orbital Hamilton population","indium nanowires","phase transition"],"language":[{"iso":"eng"}]},{"keyword":["finite element simulation","wire bonding","tool geometry"],"language":[{"iso":"eng"}],"project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"_id":"9955","user_id":"210","department":[{"_id":"151"}],"abstract":[{"text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.","lang":"eng"}],"status":"public","type":"conference","publication":"IEEE 66th Electronic Components and Technology Conference","title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","doi":"10.1109/ECTC.2016.234","date_updated":"2020-05-07T05:33:52Z","author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"}],"date_created":"2019-05-27T08:47:52Z","year":"2016","citation":{"ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>","chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>","bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }","short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>."},"page":"2103-2110","quality_controlled":"1"},{"_id":"9959","user_id":"55222","department":[{"_id":"151"}],"keyword":["Ultrasonic copper wire bonding","Al-oxide","Cuoxide","oxide-free","roughness","morphology"],"language":[{"iso":"eng"}],"type":"conference","publication":"IEEE 66th Electronic Components and Technology Conference","abstract":[{"text":"Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties.","lang":"eng"}],"status":"public","date_updated":"2019-09-16T10:38:59Z","author":[{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"full_name":"Grydin, Olexandr","last_name":"Grydin","first_name":"Olexandr"},{"first_name":"Florian","last_name":"Hengsbach","full_name":"Hengsbach, Florian"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Mirko","full_name":"Schaper, Mirko","last_name":"Schaper"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"date_created":"2019-05-27T09:00:50Z","title":"Effect of different oxide layers on the ultrasonic copper wire bond process","doi":"10.1109/ECTC.2016.91","quality_controlled":"1","year":"2016","citation":{"ieee":"F. Eacock <i>et al.</i>, “Effect of different oxide layers on the ultrasonic copper wire bond process,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–2118.","chicago":"Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2111–18, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>.","ama":"Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2111-2118. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>","bibtex":"@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }","short":"F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.","mla":"Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–18, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>.","apa":"Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2111–2118). <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>"},"page":"2111-2118"},{"citation":{"ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan."},"page":"251-254","place":"IEEE CPMT Symposium Japan","year":"2016","quality_controlled":"1","title":"Validated Simulation of the Ultrasonic Wire Bonding Process","date_created":"2019-05-27T09:20:10Z","author":[{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"}],"date_updated":"2020-05-07T05:33:53Z","status":"public","abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"type":"conference","publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","language":[{"iso":"eng"}],"keyword":["the Ultrasonic Wire Bonding Process"],"user_id":"210","department":[{"_id":"151"}],"project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"_id":"9968"},{"publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","type":"conference","abstract":[{"text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool.","lang":"eng"}],"status":"public","_id":"9868","department":[{"_id":"151"}],"user_id":"55222","keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"language":[{"iso":"eng"}],"quality_controlled":"1","year":"2014","page":"1549-1555","citation":{"chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>.","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>"},"date_updated":"2019-09-16T10:57:58Z","date_created":"2019-05-20T12:11:44Z","author":[{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"first_name":"Jan","last_name":"Neuhaus","full_name":"Neuhaus, Jan"},{"first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"title":"Improving the bond quality of copper wire bonds using a friction model approach","doi":"10.1109/ECTC.2014.6897500"}]