[{"department":[{"_id":"151"}],"keyword":["Bonding","Copper","Microstructure evolution"],"user_id":"55222","citation":{"ama":"Eacock  F, Schaper M, Althoff S, et al. Microstructural investigations of aluminum and copper wire bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>. ; 2014. doi:<a href=\"https://doi.org/10.4071/isom-THP32\">10.4071/isom-THP32</a>","apa":"Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics</i>. <a href=\"https://doi.org/10.4071/isom-THP32\">https://doi.org/10.4071/isom-THP32</a>","chicago":"Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn,  Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014. <a href=\"https://doi.org/10.4071/isom-THP32\">https://doi.org/10.4071/isom-THP32</a>.","ieee":"F. Eacock  <i>et al.</i>, “Microstructural investigations of aluminum and copper wire bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014.","mla":"Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, doi:<a href=\"https://doi.org/10.4071/isom-THP32\">10.4071/isom-THP32</a>.","bibtex":"@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title={Microstructural investigations of aluminum and copper wire bonds}, DOI={<a href=\"https://doi.org/10.4071/isom-THP32\">10.4071/isom-THP32</a>}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig,  Martin Joachim and Guth, Karsten}, year={2014} }","short":"F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn,  Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014."},"abstract":[{"lang":"eng","text":"Nowadays wire bonding is a widely-used technology for interconnecting chips in the packaging industry. Thereby, it is known that the bond quality massively depends upon the microstructure prevailing in the bond and consequently the materials used as well as the bonding parameters. However the actually used materials such as aluminum and gold are either characterized by comparibly poor conductivity or high costs, respectively. Due to its outstanding properties copper is a more attractive candidate. Still, a thorough investigation on the interrelationship between the material combinations, the processing parameters and the resulting microstructure for copper and aluminum wire bonding was not carried out yet. Depending on the aforementioned factors the microstructural evolution can be completely different during the bonding process. Therefore, this study focuses on the microstructural evolution of heavy copper and heavy aluminum wires bonded on copper substrates. The evolution of the wire microstructure as well as the wire-substrate-interface was investigated by scanning electron microscope in combination with electron backscatter diffraction and microhardness measurements. Various samples were extracted at different points of the bonding process, namely the as-received condition, after touchdown and after completed bonding. The results of the aluminum and copper wires were compared to each other in both longitudinal and transversal direction. It was found, that the two wire materials were completely different in the as-received condition regarding the grain size, the grain morphology, the texture and the microhardness. After touchdown the microstructure did not show significant changes in both materials, yet a strain-hardening was observed in the copper wire resulting from the touchdown force. When the bonding process was completed a different microstructure could be observed in both the wire as well as the layer for the materials investigated. Furthermore, a destinctive increase in the wire hardness could be found in case of copper, which was not observed for the aluminum wire. The ramifications between the two wire materials presented in this work will be discussed with the objective of optimizing the quality of the bonds."}],"doi":"10.4071/isom-THP32","author":[{"first_name":"Florian","full_name":"Eacock , Florian","last_name":"Eacock "},{"first_name":"Mirko","full_name":"Schaper, Mirko","last_name":"Schaper"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"first_name":"Florian","full_name":"Hengsbach, Florian","last_name":"Hengsbach"},{"last_name":"Zinn","first_name":"Carolin","full_name":"Zinn, Carolin"},{"full_name":"Holzweissig,  Martin Joachim","first_name":" Martin Joachim","last_name":"Holzweissig"},{"last_name":"Guth","first_name":"Karsten","full_name":"Guth, Karsten"}],"title":"Microstructural investigations of aluminum and copper wire bonds","date_updated":"2019-09-16T10:58:50Z","_id":"9870","status":"public","language":[{"iso":"eng"}],"type":"conference","year":"2014","date_created":"2019-05-20T12:14:11Z","quality_controlled":"1","publication":"Proceedings of the 47th International Symposium on Microelectronics"},{"status":"public","language":[{"iso":"eng"}],"year":"2014","type":"conference","date_created":"2019-05-20T12:18:55Z","publication":"Proceedings of the 47th International Symposium on Microelectronics","date_updated":"2020-05-07T05:33:45Z","_id":"9871","page":"856-861","doi":"10.4071/isom-THP34","abstract":[{"lang":"eng","text":"Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the fields of renewable energies. One of the main cost factors in the manufacturing process is the consumables like bonding tools. The technological transition to copper as wire material causes significant wear on the millimeter large effective contact area of the bonding tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections which can be produced by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently a better understanding of wear and recognition of wear pattern is required. Therefore, the paper presents an analyzing method of the tool topography change of a heavy wire bonding tool by using a confocal microscope. Furthermore, the paper discusses the identification of the main wear indicators by the help of the named topography change for different bond parameters, like ultrasonic power and tool geometry. Reference topography has been carried out by choosing typical parameters of the production line. To judge whether the quality requirement of the bond connections made by a single tool cannot be fulfilled shear test of the source bond have been carried out after a defined number of produced bond connections. Main steps of analysis: (I)Topography of the tool surface is sampled after a defined number of bonds by means of a confocal microscope to detect the wear progress.(II)The recorded data is filtered using Matlab. So, measurement errors can be eliminated and the topography can be overlaid more easy to identify differences between diverse tools or differences in wear stages of the same tool.(III)The subsequent discretization of the topography into sub volumes allows to (IV)describe the loss of volume depending on the position in the groove. Thereby, intermediate status of wear of one tool can be used to obtain a persistent description of the topography change over the number of produced bonds by interpolating the confocal data. Afterwards the persistent change of the groove flank has been analyzed for the named test series to identify the main wear indicators and their effect on shear forces. All worn tools show dominant areas for volume loss especially for plastic deformation and accordingly abrasion. These wear mechanism can be referred to the change of main parts of the groove geometry like the rounding of the front and back radius. The most volume loss was identified in the upper part of the tool flanks or rather at the transition from the groove flank to the front or back radius. Furthermore the observation of the center of the groove flank shows just a little change in volume. All in all, the identification of the wear indicators will be discussed with the objective of increasing the tool lifetime by optimizing the tool geometry without losses in bond quality and reliability."}],"project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"author":[{"last_name":"Eichwald","first_name":"Paul","full_name":"Eichwald, Paul"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"full_name":"Althof, Simon","first_name":"Simon","last_name":"Althof"},{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"last_name":"Guth","first_name":"Karsten","full_name":"Guth, Karsten"}],"title":"Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding","department":[{"_id":"151"}],"keyword":["wedge/wedge bonding","copper wire","tool wear"],"user_id":"210","citation":{"bibtex":"@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }","mla":"Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–61, doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>.","short":"P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.","apa":"Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &#38; Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In <i>Proceedings of the 47th International Symposium on Microelectronics</i> (pp. 856–861). <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>","ama":"Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>. ; 2014:856-861. doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>","ieee":"P. Eichwald <i>et al.</i>, “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–861.","chicago":"Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 856–61, 2014. <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>."}},{"_id":"9895","page":"289-294","date_updated":"2020-05-07T05:33:47Z","date_created":"2019-05-20T13:35:09Z","publication":"Proceedings of the 47th International Symposium on Microelectronics (IMAPS)","status":"public","language":[{"iso":"eng"}],"type":"conference","year":"2014","keyword":["pre-deformation","copper wire bonding","finite element model"],"user_id":"210","citation":{"mla":"Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }","short":"A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.","ama":"Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US; 2014:289-294.","apa":"Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38; Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.","chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego, CA, US, 2014.","ieee":"A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–294."},"department":[{"_id":"151"}],"author":[{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"full_name":"Eichwald, Paul","first_name":"Paul","last_name":"Eichwald"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"last_name":"Eacock","first_name":"Florian","full_name":"Eacock, Florian"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"}],"title":"Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds","abstract":[{"lang":"eng","text":"Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding."}],"place":"San Diego, CA, US","project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}]},{"department":[{"_id":"749"}],"citation":{"chicago":"Vollmer, Anna-Lisa, Jonathan Grizou, Manuel Lopes, Katharina Rohlfing, and Pierre-Yves Oudeyer. “Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans.” In <i>2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics</i>, 208–15. IEEE, 2014.","ieee":"A.-L. Vollmer, J. Grizou, M. Lopes, K. Rohlfing, and P.-Y. Oudeyer, “Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans,” in <i>2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics</i>, 2014, pp. 208–215.","ama":"Vollmer A-L, Grizou J, Lopes M, Rohlfing K, Oudeyer P-Y. Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans. In: <i>2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics</i>. IEEE; 2014:208-215.","apa":"Vollmer, A.-L., Grizou, J., Lopes, M., Rohlfing, K., &#38; Oudeyer, P.-Y. (2014). Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans. <i>2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics</i>, 208–215.","short":"A.-L. Vollmer, J. Grizou, M. Lopes, K. Rohlfing, P.-Y. Oudeyer, in: 2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics, IEEE, 2014, pp. 208–215.","mla":"Vollmer, Anna-Lisa, et al. “Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans.” <i>2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics</i>, IEEE, 2014, pp. 208–15.","bibtex":"@inproceedings{Vollmer_Grizou_Lopes_Rohlfing_Oudeyer_2014, title={Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans}, booktitle={2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics}, publisher={IEEE}, author={Vollmer, Anna-Lisa and Grizou, Jonathan and Lopes, Manuel and Rohlfing, Katharina and Oudeyer, Pierre-Yves}, year={2014}, pages={208–215} }"},"user_id":"14931","keyword":["interaction","communication","co-construction","interaction protocols"],"title":"Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans","author":[{"first_name":"Anna-Lisa","full_name":"Vollmer, Anna-Lisa","last_name":"Vollmer"},{"last_name":"Grizou","first_name":"Jonathan","full_name":"Grizou, Jonathan"},{"first_name":"Manuel","full_name":"Lopes, Manuel","last_name":"Lopes"},{"first_name":"Katharina","full_name":"Rohlfing, Katharina","id":"50352","last_name":"Rohlfing"},{"first_name":"Pierre-Yves","full_name":"Oudeyer, Pierre-Yves","last_name":"Oudeyer"}],"date_updated":"2023-02-01T16:11:59Z","_id":"17202","page":"208 - 215","type":"conference","publication_identifier":{"isbn":["978-1-4799-7540-2"]},"year":"2014","language":[{"iso":"eng"}],"status":"public","publication":"2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics","date_created":"2020-06-24T13:01:21Z","publisher":"IEEE"},{"language":[{"iso":"eng"}],"type":"conference","year":"2013","status":"public","date_created":"2019-05-13T13:55:36Z","publication":"IMAPS 2013, 46th International Symposium on Microelectronics","date_updated":"2022-01-06T07:04:20Z","_id":"9797","place":"Orlando (Florida), USA","doi":"10.4071/isom-2013-TA67","abstract":[{"text":"A model approach for wedge/wedge bonding copper wire is presented. The connection between wire and substrate is based on a variety of physical effects, but the dominant one is the friction based welding while applying ultrasound. Consequently, a friction model was used to investigate the welding process. This model is built up universal and can be used to describe the formation of micro welds in the time variant contact area between wire and substrate. Aim of the model is to identify the interactions between touchdown, bond normal force, ultrasonic power and bonding time. To do so, the contact area is discretized into partial areas where a Point Contact Model is applied. Based on this approach it is possible to simulate micro and macro slip inside the contact area between wire and substrate. The work done by friction force is a main criterion to define occurring micro joints which influence the subsequent welding.","lang":"eng"}],"title":"A friction based approach for modeling wire bonding","author":[{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"full_name":"Neuhaus, Jan","first_name":"Jan","last_name":"Neuhaus"},{"last_name":"Hemsel","id":"210","first_name":"Tobias","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"department":[{"_id":"151"}],"citation":{"mla":"Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA; 2013. doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013."},"keyword":["Wire bonding","friction modeling","wire bond quality","contact element modeling"],"user_id":"55222"},{"keyword":["Co-Production","Culture","Customer Participation","Professional Services"],"user_id":"37741","abstract":[{"lang":"eng","text":"Although professional service providers increasingly deliver their services globally, little is known about cross-cultural differences in customers’ motivation to participate in service production. To address this lacuna, we survey a total of 2,284 banking customers in 11 countries on their motivation to provide personal information to, and follow the advice of, their service providers. We find differences in both aspects, but only the differences in providing personal information can be explained by the cultural values of uncertainty avoidance, individualism/collectivism, and masculinity/femininity. To perform certain tasks in the service process, global professional service providers should acknowledge cultural differences in customers’ motivations."}],"title":"Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.","issue":"2","volume":64,"page":"141-165","type":"journal_article","publication":"Schmalenbach Business Review","department":[{"_id":"181"}],"publication_status":"published","citation":{"short":"J.H. Schumann, N. Wünderlich, M.S. Zimmer, Schmalenbach Business Review 64 (2012) 141–165.","bibtex":"@article{Schumann_Wünderlich_Zimmer_2012, title={Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.}, volume={64}, number={2}, journal={Schmalenbach Business Review}, publisher={Springer}, author={Schumann, Jan H and Wünderlich, Nancy and Zimmer, Marcus S}, year={2012}, pages={141–165} }","mla":"Schumann, Jan H., et al. “Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.” <i>Schmalenbach Business Review</i>, vol. 64, no. 2, Springer, 2012, pp. 141–65.","ieee":"J. H. Schumann, N. Wünderlich, and M. S. Zimmer, “Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.,” <i>Schmalenbach Business Review</i>, vol. 64, no. 2, pp. 141–165, 2012.","chicago":"Schumann, Jan H, Nancy Wünderlich, and Marcus S Zimmer. “Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.” <i>Schmalenbach Business Review</i> 64, no. 2 (2012): 141–65.","ama":"Schumann JH, Wünderlich N, Zimmer MS. Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments. <i>Schmalenbach Business Review</i>. 2012;64(2):141-165.","apa":"Schumann, J. H., Wünderlich, N., &#38; Zimmer, M. S. (2012). Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments. <i>Schmalenbach Business Review</i>, <i>64</i>(2), 141–165."},"intvolume":"        64","author":[{"first_name":"Jan H","full_name":"Schumann, Jan H","last_name":"Schumann"},{"first_name":"Nancy","full_name":"Wünderlich, Nancy","id":"36392","last_name":"Wünderlich"},{"last_name":"Zimmer","full_name":"Zimmer, Marcus S","first_name":"Marcus S"}],"article_type":"original","date_updated":"2022-01-06T07:02:37Z","_id":"5717","status":"public","language":[{"iso":"eng"}],"year":"2012","publisher":"Springer","date_created":"2018-11-16T09:40:23Z"},{"title":"System-level performance evaluation of reconfigurable processors","author":[{"full_name":"Enzler, Rolf","first_name":"Rolf","last_name":"Enzler"},{"orcid":"0000-0001-5728-9982","full_name":"Plessl, Christian","first_name":"Christian","last_name":"Plessl","id":"16153"},{"id":"398","last_name":"Platzner","full_name":"Platzner, Marco","first_name":"Marco"}],"abstract":[{"lang":"eng","text":" Reconfigurable architectures that tightly integrate a standard CPU core with a field-programmable hardware structure have recently been receiving impact of these design decisions on the overall system performance is a challenging task. In this paper, we first present a framework for the cycle-accurate performance evaluation of hybrid reconfigurable processors on the system level. Then, we discuss a reconfigurable processor for data-streaming applications, which attaches a coarse-grained reconfigurable unit to the coprocessor interface of a standard embedded CPU core. By means of a case study we evaluate the system-level impact of certain design features for the reconfigurable unit, such as multiple contexts, register replication, and hardware context scheduling. The results illustrate that a system-level evaluation framework is of paramount importance for studying the architectural trade-offs and optimizing design parameters for reconfigurable processors."}],"intvolume":"        29","doi":"10.1016/j.micpro.2004.06.004","citation":{"chicago":"Enzler, Rolf, Christian Plessl, and Marco Platzner. “System-Level Performance Evaluation of Reconfigurable Processors.” <i>Microprocessors and Microsystems</i> 29, no. 2–3 (2005): 63–73. <a href=\"https://doi.org/10.1016/j.micpro.2004.06.004\">https://doi.org/10.1016/j.micpro.2004.06.004</a>.","ieee":"R. Enzler, C. Plessl, and M. Platzner, “System-level performance evaluation of reconfigurable processors,” <i>Microprocessors and Microsystems</i>, vol. 29, no. 2–3, pp. 63–73, 2005.","apa":"Enzler, R., Plessl, C., &#38; Platzner, M. (2005). System-level performance evaluation of reconfigurable processors. <i>Microprocessors and Microsystems</i>, <i>29</i>(2–3), 63–73. <a href=\"https://doi.org/10.1016/j.micpro.2004.06.004\">https://doi.org/10.1016/j.micpro.2004.06.004</a>","ama":"Enzler R, Plessl C, Platzner M. System-level performance evaluation of reconfigurable processors. <i>Microprocessors and Microsystems</i>. 2005;29(2-3):63-73. doi:<a href=\"https://doi.org/10.1016/j.micpro.2004.06.004\">10.1016/j.micpro.2004.06.004</a>","short":"R. Enzler, C. Plessl, M. Platzner, Microprocessors and Microsystems 29 (2005) 63–73.","mla":"Enzler, Rolf, et al. “System-Level Performance Evaluation of Reconfigurable Processors.” <i>Microprocessors and Microsystems</i>, vol. 29, no. 2–3, Elsevier, 2005, pp. 63–73, doi:<a href=\"https://doi.org/10.1016/j.micpro.2004.06.004\">10.1016/j.micpro.2004.06.004</a>.","bibtex":"@article{Enzler_Plessl_Platzner_2005, title={System-level performance evaluation of reconfigurable processors}, volume={29}, DOI={<a href=\"https://doi.org/10.1016/j.micpro.2004.06.004\">10.1016/j.micpro.2004.06.004</a>}, number={2–3}, journal={Microprocessors and Microsystems}, publisher={Elsevier}, author={Enzler, Rolf and Plessl, Christian and Platzner, Marco}, year={2005}, pages={63–73} }"},"user_id":"24135","keyword":["FPGA","reconfigurable computing","co-simulation","Zippy"],"department":[{"_id":"518"},{"_id":"78"}],"publication":"Microprocessors and Microsystems","date_created":"2018-04-17T14:36:10Z","publisher":"Elsevier","type":"journal_article","year":"2005","status":"public","_id":"2412","page":"63-73","volume":29,"date_updated":"2022-01-06T06:56:07Z","issue":"2-3"},{"_id":"39030","date_updated":"2023-01-24T08:12:26Z","publication":"Proceedings of ISNG 05","date_created":"2023-01-24T08:12:20Z","year":"2005","type":"conference","language":[{"iso":"eng"}],"status":"public","citation":{"short":"T. Schattkowsky, W. Müller, in: Proceedings of ISNG 05, Las Vegas, NV, 2005.","mla":"Schattkowsky, Tim, and Wolfgang Müller. “A UML Virtual Machine for Embedded Systems.” <i>Proceedings of ISNG 05</i>, 2005.","bibtex":"@inproceedings{Schattkowsky_Müller_2005, place={Las Vegas, NV}, title={A UML Virtual Machine for Embedded Systems}, booktitle={Proceedings of ISNG 05}, author={Schattkowsky, Tim and Müller, Wolfgang}, year={2005} }","chicago":"Schattkowsky, Tim, and Wolfgang Müller. “A UML Virtual Machine for Embedded Systems.” In <i>Proceedings of ISNG 05</i>. Las Vegas, NV, 2005.","ieee":"T. Schattkowsky and W. Müller, “A UML Virtual Machine for Embedded Systems,” 2005.","apa":"Schattkowsky, T., &#38; Müller, W. (2005). A UML Virtual Machine for Embedded Systems. <i>Proceedings of ISNG 05</i>.","ama":"Schattkowsky T, Müller W. A UML Virtual Machine for Embedded Systems. In: <i>Proceedings of ISNG 05</i>. ; 2005."},"user_id":"5786","keyword":["UML","Executable Models","Hardware/Software Co-design","Virtual Machine","Embedded Systems"],"department":[{"_id":"672"}],"title":"A UML Virtual Machine for Embedded Systems","author":[{"last_name":"Schattkowsky","full_name":"Schattkowsky, Tim","first_name":"Tim"},{"last_name":"Müller","id":"16243","first_name":"Wolfgang","full_name":"Müller, Wolfgang"}],"place":"Las Vegas, NV","abstract":[{"text":"StateCharts are well accepted for embedded systems\r\nspecification for various applications. However, for the\r\nspecification of complex systems they have several\r\nlimitations. In this article, we present a novel approach to\r\nefficiently execute an UML 2.0 subset for embedded real-\r\ntime systems implementation with focus on hardware\r\ninterrupts, software exceptions, and timeouts. We\r\nintroduce a UML Virtual Machine, which directly\r\nexecutes sequence diagrams, which are embedded into\r\nhierarchically structured state transition diagrams.\r\nWhereas state diagrams are directly executed as\r\nEmbedded State Machines (ESMs), sequence diagrams\r\nare translated into UVM Bytecode. The final UVM\r\nexecution is performed by the interaction of the ESM and\r\nthe Bytecode Interpreter. Due to our completely model-\r\nbased approach, the UVM runtime kernel is easily\r\nadaptable and scalable to different scheduling and\r\nmemory management strategies.","lang":"eng"}]},{"_id":"2422","page":"174-180","date_updated":"2022-01-06T06:56:13Z","publication":"Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)","date_created":"2018-04-17T15:12:56Z","publisher":"CSREA Press","publication_identifier":{"isbn":["1-932415-05-X"]},"year":"2003","type":"conference","status":"public","citation":{"ama":"Enzler R, Plessl C, Platzner M. Co-simulation of a Hybrid Multi-Context Architecture. In: <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)</i>. CSREA Press; 2003:174-180.","apa":"Enzler, R., Plessl, C., &#38; Platzner, M. (2003). Co-simulation of a Hybrid Multi-Context Architecture. In <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)</i> (pp. 174–180). CSREA Press.","chicago":"Enzler, Rolf, Christian Plessl, and Marco Platzner. “Co-Simulation of a Hybrid Multi-Context Architecture.” In <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)</i>, 174–80. CSREA Press, 2003.","ieee":"R. Enzler, C. Plessl, and M. Platzner, “Co-simulation of a Hybrid Multi-Context Architecture,” in <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)</i>, 2003, pp. 174–180.","mla":"Enzler, Rolf, et al. “Co-Simulation of a Hybrid Multi-Context Architecture.” <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)</i>, CSREA Press, 2003, pp. 174–80.","bibtex":"@inproceedings{Enzler_Plessl_Platzner_2003, title={Co-simulation of a Hybrid Multi-Context Architecture}, booktitle={Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)}, publisher={CSREA Press}, author={Enzler, Rolf and Plessl, Christian and Platzner, Marco}, year={2003}, pages={174–180} }","short":"R. Enzler, C. Plessl, M. Platzner, in: Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA), CSREA Press, 2003, pp. 174–180."},"user_id":"24135","keyword":["Zippy","co-simulation"],"department":[{"_id":"518"},{"_id":"78"}],"title":"Co-simulation of a Hybrid Multi-Context Architecture","author":[{"full_name":"Enzler, Rolf","first_name":"Rolf","last_name":"Enzler"},{"orcid":"0000-0001-5728-9982","last_name":"Plessl","id":"16153","full_name":"Plessl, Christian","first_name":"Christian"},{"last_name":"Platzner","id":"398","first_name":"Marco","full_name":"Platzner, Marco"}],"abstract":[{"text":"Reconfigurable computing architectures aim to dynamically adapt their hardware to the application at hand. As research shows, the time it takes to reconfigure the hardware forms an overhead that can significantly impair the benefits of hardware customization. Multi-context devices are one promising approach to overcome the limitations posed by long reconfiguration times. In contrast to more traditional reconfigurable architectures, multi-context devices hold several configurations on-chip. On demand, the device can quickly switch to another context. In this paper we present a co-simulation environment to investigate design trade-offs for hybrid multi-context architectures. Our architectural model comprises a reconfigurable unit closely coupled to a CPU core. As a case study, we discuss the implementation of a FIR filter partitioned into several contexts. We outline the mapping process and present simulation results for single- and multi-context reconfigurable units coupled with both embedded and high-end CPUs.","lang":"eng"}]},{"_id":"2433","date_updated":"2022-01-06T06:56:17Z","date_created":"2018-04-17T15:56:00Z","publisher":"Computer Engineering and Networks Lab, ETH Zurich, Switzerland","year":"2000","type":"mastersthesis","status":"public","citation":{"ieee":"C. Plessl and S. Maurer, <i>Hardware/Software Codesign in Speech Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich, Switzerland, 2000.","chicago":"Plessl, Christian, and Simon Maurer. <i>Hardware/Software Codesign in Speech Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich, Switzerland, 2000.","apa":"Plessl, C., &#38; Maurer, S. (2000). <i>Hardware/Software Codesign in Speech Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich, Switzerland.","ama":"Plessl C, Maurer S. <i>Hardware/Software Codesign in Speech Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich, Switzerland; 2000.","short":"C. Plessl, S. Maurer, Hardware/Software Codesign in Speech Compression Applications, Computer Engineering and Networks Lab, ETH Zurich, Switzerland, 2000.","bibtex":"@book{Plessl_Maurer_2000, title={Hardware/Software Codesign in Speech Compression Applications}, publisher={Computer Engineering and Networks Lab, ETH Zurich, Switzerland}, author={Plessl, Christian and Maurer, Simon}, year={2000} }","mla":"Plessl, Christian, and Simon Maurer. <i>Hardware/Software Codesign in Speech Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich, Switzerland, 2000."},"user_id":"24135","keyword":["co-design","speech processing"],"department":[{"_id":"518"}],"title":"Hardware/Software Codesign in Speech Compression Applications","author":[{"id":"16153","last_name":"Plessl","full_name":"Plessl, Christian","first_name":"Christian","orcid":"0000-0001-5728-9982"},{"last_name":"Maurer","first_name":"Simon","full_name":"Maurer, Simon"}]}]