---
_id: '43437'
abstract:
- lang: eng
text: 'In virtual reality (VR), participants may not always have hands,
bodies, eyes, or even voices—using VR helmets and two controllers, participants
control an avatar through virtual worlds that do not necessarily obey familiar
laws of physics; moreover, the avatar’s bodily characteristics may not neatly
match our bodies in the physical world. Despite these limitations and specificities,
humans get things done through collaboration and the creative use of the environment.
While multiuser interactive VR is attracting greater numbers of participants,
there are currently few attempts to analyze the in situ interaction systematically.
This paper proposes a video-analytic detail-oriented methodological framework
for studying virtual reality interaction. Using multimodal conversation analysis,
the paper investigates a nonverbal, embodied, two-person interaction: two players
in a survival game strive to gesturally resolve a misunderstanding regarding an
in-game mechanic—however, both of their microphones are turned off for the duration
of play. The players’ inability to resort to complex language to resolve this
issue results in a dense sequence of back-and-forth activity involving gestures,
object manipulation, gaze, and body work. Most crucially, timing and modified
repetitions of previously produced actions turn out to be the key to overcome
both technical and communicative challenges. The paper analyzes these action sequences,
demonstrates how they generate intended outcomes, and proposes a vocabulary to
speak about these types of interaction more generally. The findings demonstrate
the viability of multimodal analysis of VR interaction, shed light on unique challenges
of analyzing interaction in virtual reality, and generate broader methodological
insights about the study of nonverbal action.'
article_type: original
author:
- first_name: Nils
full_name: Klowait, Nils
id: '98454'
last_name: Klowait
orcid: 0000-0002-7347-099X
citation:
ama: Klowait N. On the Multimodal Resolution of a Search Sequence in Virtual Reality.
Human Behavior and Emerging Technologies. 2023;2023:1-15. doi:10.1155/2023/8417012
apa: Klowait, N. (2023). On the Multimodal Resolution of a Search Sequence in Virtual
Reality. Human Behavior and Emerging Technologies, 2023, 1–15. https://doi.org/10.1155/2023/8417012
bibtex: '@article{Klowait_2023, title={On the Multimodal Resolution of a Search
Sequence in Virtual Reality}, volume={2023}, DOI={10.1155/2023/8417012},
journal={Human Behavior and Emerging Technologies}, publisher={Hindawi Limited},
author={Klowait, Nils}, year={2023}, pages={1–15} }'
chicago: 'Klowait, Nils. “On the Multimodal Resolution of a Search Sequence in Virtual
Reality.” Human Behavior and Emerging Technologies 2023 (2023): 1–15. https://doi.org/10.1155/2023/8417012.'
ieee: 'N. Klowait, “On the Multimodal Resolution of a Search Sequence in Virtual
Reality,” Human Behavior and Emerging Technologies, vol. 2023, pp. 1–15,
2023, doi: 10.1155/2023/8417012.'
mla: Klowait, Nils. “On the Multimodal Resolution of a Search Sequence in Virtual
Reality.” Human Behavior and Emerging Technologies, vol. 2023, Hindawi
Limited, 2023, pp. 1–15, doi:10.1155/2023/8417012.
short: N. Klowait, Human Behavior and Emerging Technologies 2023 (2023) 1–15.
date_created: 2023-04-06T10:57:28Z
date_updated: 2024-03-26T09:40:53Z
ddc:
- '300'
department:
- _id: '9'
doi: 10.1155/2023/8417012
file:
- access_level: closed
content_type: application/pdf
creator: nklowait
date_created: 2023-04-06T11:00:01Z
date_updated: 2023-04-06T11:00:01Z
file_id: '43438'
file_name: Klowait_2023a.pdf
file_size: 2877385
relation: main_file
success: 1
file_date_updated: 2023-04-06T11:00:01Z
funded_apc: '1'
has_accepted_license: '1'
intvolume: ' 2023'
keyword:
- Human-Computer Interaction
- General Social Sciences
- Social Psychology
- 'Virtual Reality : Multimodality'
- Nonverbal Interaction
- Search Sequence
- Gesture
- Co-Operative Action
- Goodwin
- Ethnomethodology
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://doi.org/10.1155/2023/8417012
oa: '1'
page: 1-15
project:
- _id: '119'
name: 'TRR 318 - Ö: TRR 318 - Project Area Ö'
publication: Human Behavior and Emerging Technologies
publication_identifier:
issn:
- 2578-1863
publication_status: published
publisher: Hindawi Limited
quality_controlled: '1'
status: public
title: On the Multimodal Resolution of a Search Sequence in Virtual Reality
type: journal_article
user_id: '98454'
volume: 2023
year: '2023'
...
---
_id: '41971'
abstract:
- lang: ger
text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau-
und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und
damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter
auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen
verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern
in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität.
In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand
von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst
wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen
von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten
die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität.
Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich
unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden
hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen
zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu
einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte
Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren
Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers
modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle
ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten
Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker
im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert
werden."
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
citation:
ama: Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Vol 15. Shaker; 2023.
apa: Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds
using a Friction Model Approach (Vol. 15). Shaker.
bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction
Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023},
collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds
Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik
Und Mechatronik. Shaker, 2023.
ieee: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using
a Friction Model Approach, vol. 15. Shaker, 2023.
mla: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Shaker, 2023.
short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach, Shaker, 2023.
date_created: 2023-02-10T13:05:19Z
date_updated: 2023-02-10T13:05:42Z
department:
- _id: '151'
extern: '1'
intvolume: ' 15'
keyword:
- heavy copper bonding
- wire bonding
- quality prediction
- friction model
- point-contact-element
language:
- iso: eng
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff
page: '192'
publication_identifier:
isbn:
- 978-3-8440-8903-5
publication_status: published
publisher: Shaker
related_material:
link:
- relation: confirmation
url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model
Approach
type: dissertation
user_id: '55222'
volume: 15
year: '2023'
...
---
_id: '43371'
abstract:
- lang: eng
text: Laser structuring to improve the adhesion properties of steel substrates in
fiber-metal laminates offers many advantages that are highly suitable for modern
industrial requirements. Maintenance and energy costs are relatively low, it is
easy to automate, and there are no by-products such as chemicals or abrasives
to dispose of or recycle. This makes laser structuring a particularly environmentally
friendly process, which is nowadays more important than ever. On the other hand,
the process time for laser structuring is much higher than for chemical pre-treatment,
for example. In past studies, the time and cost efficiency of the laser structuring
process has tended to play a minor role. However, there are approaches in which
laser structured surfaces are adapted to the shear stress peaks occurring within
the adhesive layer, thus requiring only partial structuring of the area to be
bonded, potentially saving process time. In this experimental study, electrolytically
galvanized steel substrates were partially laser structured to match the shear
stress distribution and then bonded to a carbon fiber-reinforced plastic. The
adhesion properties achieved were characterized using shear tensile tests and
compared with the properties of the fully structured ones. With the partial laser
structuring, a saving of 66 % of the conventional process time was achieved while
maintaining 95 % of the same shear strength.
author:
- first_name: Dietrich
full_name: Voswinkel, Dietrich
id: '52634'
last_name: Voswinkel
citation:
ama: Voswinkel D. Application of a new strategy for time-efficient laser treatment
of galvanized steel substrates to improve the adhesion properties. Journal
of Manufacturing Processes. 2023;94:10-19. doi:/10.1016/j.jmapro.2023.03.056
apa: Voswinkel, D. (2023). Application of a new strategy for time-efficient laser
treatment of galvanized steel substrates to improve the adhesion properties. Journal
of Manufacturing Processes, 94, 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056
bibtex: '@article{Voswinkel_2023, title={Application of a new strategy for time-efficient
laser treatment of galvanized steel substrates to improve the adhesion properties},
volume={94}, DOI={/10.1016/j.jmapro.2023.03.056},
journal={Journal of Manufacturing Processes}, publisher={Elsevier}, author={Voswinkel,
Dietrich}, year={2023}, pages={10–19} }'
chicago: 'Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient
Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.”
Journal of Manufacturing Processes 94 (2023): 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056.'
ieee: 'D. Voswinkel, “Application of a new strategy for time-efficient laser treatment
of galvanized steel substrates to improve the adhesion properties,” Journal
of Manufacturing Processes, vol. 94, pp. 10–19, 2023, doi: /10.1016/j.jmapro.2023.03.056.'
mla: Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser
Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.”
Journal of Manufacturing Processes, vol. 94, Elsevier, 2023, pp. 10–19,
doi:/10.1016/j.jmapro.2023.03.056.
short: D. Voswinkel, Journal of Manufacturing Processes 94 (2023) 10–19.
date_created: 2023-04-03T08:46:43Z
date_updated: 2023-04-03T08:47:06Z
department:
- _id: '9'
- _id: '321'
- _id: '158'
doi: /10.1016/j.jmapro.2023.03.056
intvolume: ' 94'
keyword:
- Laser treatment Adhesive bonding Surface technology Hybrid materials
language:
- iso: eng
main_file_link:
- url: https://www.sciencedirect.com/science/article/abs/pii/S1526612523002682?via%3Dihub
page: 10-19
publication: Journal of Manufacturing Processes
publisher: Elsevier
status: public
title: Application of a new strategy for time-efficient laser treatment of galvanized
steel substrates to improve the adhesion properties
type: journal_article
user_id: '52634'
volume: 94
year: '2023'
...
---
_id: '33988'
article_number: '2100396'
article_type: original
author:
- first_name: Elmar
full_name: Moritzer, Elmar
last_name: Moritzer
- first_name: Christine
full_name: Driediger, Christine
last_name: Driediger
citation:
ama: Moritzer E, Driediger C. Reactive Direct Bonding of Digital Light Process Components.
Macromolecular Symposia. 2022;404(1). doi:10.1002/masy.202100396
apa: Moritzer, E., & Driediger, C. (2022). Reactive Direct Bonding of Digital
Light Process Components. Macromolecular Symposia, 404(1), Article
2100396. https://doi.org/10.1002/masy.202100396
bibtex: '@article{Moritzer_Driediger_2022, title={Reactive Direct Bonding of Digital
Light Process Components}, volume={404}, DOI={10.1002/masy.202100396},
number={12100396}, journal={Macromolecular Symposia}, publisher={Wiley}, author={Moritzer,
Elmar and Driediger, Christine}, year={2022} }'
chicago: Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital
Light Process Components.” Macromolecular Symposia 404, no. 1 (2022). https://doi.org/10.1002/masy.202100396.
ieee: 'E. Moritzer and C. Driediger, “Reactive Direct Bonding of Digital Light Process
Components,” Macromolecular Symposia, vol. 404, no. 1, Art. no. 2100396,
2022, doi: 10.1002/masy.202100396.'
mla: Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital
Light Process Components.” Macromolecular Symposia, vol. 404, no. 1, 2100396,
Wiley, 2022, doi:10.1002/masy.202100396.
short: E. Moritzer, C. Driediger, Macromolecular Symposia 404 (2022).
date_created: 2022-11-03T13:21:13Z
date_updated: 2022-11-03T13:32:18Z
department:
- _id: '9'
- _id: '367'
doi: 10.1002/masy.202100396
has_accepted_license: '1'
intvolume: ' 404'
issue: '1'
keyword:
- digital light processing
- material combination
- reactive direct bonding
- vat photopolymerization
language:
- iso: eng
publication: Macromolecular Symposia
publication_identifier:
issn:
- 1022-1360
- 1521-3900
publication_status: published
publisher: Wiley
quality_controlled: '1'
status: public
title: Reactive Direct Bonding of Digital Light Process Components
type: journal_article
user_id: '38770'
volume: 404
year: '2022'
...
---
_id: '48894'
abstract:
- lang: eng
text: Recently different evolutionary computation approaches have been developed
that generate sets of high quality diverse solutions for a given optimisation
problem. Many studies have considered diversity 1) as a mean to explore niches
in behavioural space (quality diversity) or 2) to increase the structural differences
of solutions (evolutionary diversity optimisation). In this study, we introduce
a co-evolutionary algorithm to simultaneously explore the two spaces for the multi-component
traveling thief problem. The results show the capability of the co-evolutionary
algorithm to achieve significantly higher diversity compared to the baseline evolutionary
diversity algorithms from the literature.
author:
- first_name: Adel
full_name: Nikfarjam, Adel
last_name: Nikfarjam
- first_name: Aneta
full_name: Neumann, Aneta
last_name: Neumann
- first_name: Jakob
full_name: Bossek, Jakob
id: '102979'
last_name: Bossek
orcid: 0000-0002-4121-4668
- first_name: Frank
full_name: Neumann, Frank
last_name: Neumann
citation:
ama: 'Nikfarjam A, Neumann A, Bossek J, Neumann F. Co-Evolutionary Diversity Optimisation
for the Traveling Thief Problem. In: Rudolph G, Kononova AV, Aguirre H, Kerschke
P, Ochoa G, Tu\v sar T, eds. Parallel Problem Solving from Nature (PPSN XVII).
Lecture Notes in Computer Science. Springer International Publishing; 2022:237–249.
doi:10.1007/978-3-031-14714-2_17'
apa: Nikfarjam, A., Neumann, A., Bossek, J., & Neumann, F. (2022). Co-Evolutionary
Diversity Optimisation for the Traveling Thief Problem. In G. Rudolph, A. V. Kononova,
H. Aguirre, P. Kerschke, G. Ochoa, & T. Tu\v sar (Eds.), Parallel Problem
Solving from Nature (PPSN XVII) (pp. 237–249). Springer International Publishing.
https://doi.org/10.1007/978-3-031-14714-2_17
bibtex: '@inproceedings{Nikfarjam_Neumann_Bossek_Neumann_2022, place={Cham}, series={Lecture
Notes in Computer Science}, title={Co-Evolutionary Diversity Optimisation for
the Traveling Thief Problem}, DOI={10.1007/978-3-031-14714-2_17},
booktitle={Parallel Problem Solving from Nature (PPSN XVII)}, publisher={Springer
International Publishing}, author={Nikfarjam, Adel and Neumann, Aneta and Bossek,
Jakob and Neumann, Frank}, editor={Rudolph, Günter and Kononova, Anna V. and Aguirre,
Hernán and Kerschke, Pascal and Ochoa, Gabriela and Tu\v sar, Tea}, year={2022},
pages={237–249}, collection={Lecture Notes in Computer Science} }'
chicago: 'Nikfarjam, Adel, Aneta Neumann, Jakob Bossek, and Frank Neumann. “Co-Evolutionary
Diversity Optimisation for the Traveling Thief Problem.” In Parallel Problem
Solving from Nature (PPSN XVII), edited by Günter Rudolph, Anna V. Kononova,
Hernán Aguirre, Pascal Kerschke, Gabriela Ochoa, and Tea Tu\v sar, 237–249. Lecture
Notes in Computer Science. Cham: Springer International Publishing, 2022. https://doi.org/10.1007/978-3-031-14714-2_17.'
ieee: 'A. Nikfarjam, A. Neumann, J. Bossek, and F. Neumann, “Co-Evolutionary Diversity
Optimisation for the Traveling Thief Problem,” in Parallel Problem Solving
from Nature (PPSN XVII), 2022, pp. 237–249, doi: 10.1007/978-3-031-14714-2_17.'
mla: Nikfarjam, Adel, et al. “Co-Evolutionary Diversity Optimisation for the Traveling
Thief Problem.” Parallel Problem Solving from Nature (PPSN XVII), edited
by Günter Rudolph et al., Springer International Publishing, 2022, pp. 237–249,
doi:10.1007/978-3-031-14714-2_17.
short: 'A. Nikfarjam, A. Neumann, J. Bossek, F. Neumann, in: G. Rudolph, A.V. Kononova,
H. Aguirre, P. Kerschke, G. Ochoa, T. Tu\v sar (Eds.), Parallel Problem Solving
from Nature (PPSN XVII), Springer International Publishing, Cham, 2022, pp. 237–249.'
date_created: 2023-11-14T15:59:00Z
date_updated: 2023-12-13T10:49:51Z
department:
- _id: '819'
doi: 10.1007/978-3-031-14714-2_17
editor:
- first_name: Günter
full_name: Rudolph, Günter
last_name: Rudolph
- first_name: Anna V.
full_name: Kononova, Anna V.
last_name: Kononova
- first_name: Hernán
full_name: Aguirre, Hernán
last_name: Aguirre
- first_name: Pascal
full_name: Kerschke, Pascal
last_name: Kerschke
- first_name: Gabriela
full_name: Ochoa, Gabriela
last_name: Ochoa
- first_name: Tea
full_name: Tu\v sar, Tea
last_name: Tu\v sar
extern: '1'
keyword:
- Co-evolutionary algorithms
- Evolutionary diversity optimisation
- Quality diversity
- Traveling thief problem
language:
- iso: eng
page: 237–249
place: Cham
publication: Parallel Problem Solving from Nature (PPSN XVII)
publication_identifier:
isbn:
- 978-3-031-14714-2
publication_status: published
publisher: Springer International Publishing
series_title: Lecture Notes in Computer Science
status: public
title: Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem
type: conference
user_id: '102979'
year: '2022'
...
---
_id: '29803'
abstract:
- lang: eng
text: "Ultrasonic wire bonding is a solid-state joining process used to form electrical
interconnections in micro and\r\npower electronics and batteries. A high frequency
oscillation causes a metallurgical bond deformation in\r\nthe contact area. Due
to the numerous physical influencing factors, it is very difficult to accurately
capture\r\nthis process in a model. Therefore, our goal is to determine a suitable
feed-forward control strategy for the\r\nbonding process even without detailed
model knowledge. We propose the use of batch constrained Bayesian\r\noptimization
for the control design. Hence, Bayesian optimization is precisely adapted to the
application of\r\nbonding: the constraint is used to check one quality feature
of the process and the use of batches leads to\r\nmore efficient experiments.
Our approach is suitable to determine a feed-forward control for the bonding\r\nprocess
that provides very high quality bonds without using a physical model. We also
show that the quality\r\nof the Bayesian optimization based control outperforms
random search as well as manual search by a user.\r\nUsing a simple prior knowledge
model derived from data further improves the quality of the connection.\r\nThe
Bayesian optimization approach offers the possibility to perform a sensitivity
analysis of the control\r\nparameters, which allows to evaluate the influence
of each control parameter on the bond quality. In summary,\r\nBayesian optimization
applied to the bonding process provides an excellent opportunity to develop a
feedforward\r\ncontrol without full modeling of the underlying physical processes."
author:
- first_name: Michael
full_name: Hesse, Michael
id: '29222'
last_name: Hesse
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Julia
full_name: Timmermann, Julia
id: '15402'
last_name: Timmermann
- first_name: Ansgar
full_name: Trächtler, Ansgar
id: '552'
last_name: Trächtler
citation:
ama: 'Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian
Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: Proceedings
of the 11th International Conference on Pattern Recognition Applications and Methods
(ICPRAM). ; 2022:383-394.'
apa: Hesse, M., Hunstig, M., Timmermann, J., & Trächtler, A. (2022). Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design.
Proceedings of the 11th International Conference on Pattern Recognition Applications
and Methods (ICPRAM), 383–394.
bibtex: '@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design},
booktitle={Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias
and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }'
chicago: Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler.
“Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward
Control Design.” In Proceedings of the 11th International Conference on Pattern
Recognition Applications and Methods (ICPRAM), 383–94, 2022.
ieee: M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,”
in Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM), Online, 2022, pp. 383–394.
mla: Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire
Bonding Feed-Forward Control Design.” Proceedings of the 11th International
Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022,
pp. 383–94.
short: 'M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the
11th International Conference on Pattern Recognition Applications and Methods
(ICPRAM), 2022, pp. 383–394.'
conference:
end_date: 2022-02-05
location: Online
name: 11th International Conference on Pattern Recognition Applications and Methods
start_date: 2022-02-03
date_created: 2022-02-09T12:50:25Z
date_updated: 2024-11-13T08:44:17Z
department:
- _id: '153'
- _id: '880'
keyword:
- Bayesian optimization
- Wire bonding
- Feed-forward control
- model-free design
language:
- iso: eng
page: 383-394
publication: Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM)
publication_identifier:
isbn:
- 978-989-758-549-4
quality_controlled: '1'
status: public
title: Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward
Control Design
type: conference
user_id: '82875'
year: '2022'
...
---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '41958'
abstract:
- lang: ger
text: Das Nasspressverfahren ist ein Serienherstellungsprozess für Bauteile aus
duroplastischen Faserverbundkunststoffen (FVK) mit einer geringen Geometriekomplexität.
Im Rahmen dieser Arbeit wurde ein modifiziertes Nasspressverfahren untersucht,
welches die Herstellung von hybriden Blech-FVK-Strukturen ermöglicht. Die stoffschlüssige
Verbindung zwischen dem metallischen Trägerbauteil und einem lokalen FVK-Verstärkungselement
wird durch Co-Bonding im Nasspresswerkzeug aufgebaut. Epoxidbasierte Matrixharze
und Klebstoffe wurden mit Methoden der Klebtechnik sowie thermischen und rheometrischen
Prüfungen charakterisiert, um ein materialspezifisches Fertigungsprozessfenster
einzugrenzen. Experimentelle Untersuchungen zum Nasspressen von GFK-Laminaten
und Stahl-GFK-Hybridstrukturen fokussierten die Mikrostruktur und das strukturelle
Verhalten von stoffschlüssigen Hybridverbindungen. Unter anderem wurden Einflüsse
von zeit-, temperatur- und druckabhängigen Fertigungsparametern sowie der Einsatz
von Strukturklebstofffilmen und internen Trennmitteln analysiert. Anhand von Fallturmtests
an hybriden Demonstratorkomponenten konnte das modifizierte Nasspressverfahren
für die Herstellung crashrelevanter Karosseriebauteile qualifiziert werden.
author:
- first_name: Hermann
full_name: Opdemom, Hermann
last_name: Opdemom
citation:
ama: Opdemom H. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen.
Vol 2019,35. Shaker Verlag; 2019.
apa: 'Opdemom, H. (2019). Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen: Vol.
2019,35. Shaker Verlag.'
bibtex: '@book{Opdemom_2019, series={Schriftenreihe Institut für Leichtbau mit Hybridsystemen},
title={Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für
die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen}, volume={2019,35},
publisher={Shaker Verlag}, author={Opdemom, Hermann}, year={2019}, collection={Schriftenreihe
Institut für Leichtbau mit Hybridsystemen} }'
chicago: Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen.
Vol. 2019,35. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker
Verlag, 2019.
ieee: H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen,
vol. 2019,35. Shaker Verlag, 2019.
mla: Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen.
Shaker Verlag, 2019.
short: H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, Shaker
Verlag, 2019.
date_created: 2023-02-10T11:24:40Z
date_updated: 2023-02-10T11:24:47Z
department:
- _id: '9'
- _id: '149'
- _id: '321'
keyword:
- Leichtbau
- Faserverbundkunststoffe
- Nasspressverfahren
- Hybridbauteile
- Rheologie
- Klebtechnik
- Co-Bonding
language:
- iso: ger
page: '178'
publication_identifier:
isbn:
- 978-3-8440-6428-5
publication_status: published
publisher: Shaker Verlag
series_title: Schriftenreihe Institut für Leichtbau mit Hybridsystemen
status: public
supervisor:
- first_name: Thomas
full_name: Tröster, Thomas
id: '553'
last_name: Tröster
title: Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die
Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen
type: dissertation
user_id: '15952'
volume: 2019,35
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. In the electronics industry
it is used to form electrical connections, including those of dissimilar materials.
Multiple influencing factors in ultrasonic joining are known and extensively investigated;
process parameters like ultrasonic power, bond force, and bonding frequency of
the ultrasonic vibration are known to have a high impact on a reliable joining
process and need to be adapted for each new application with different geometry
or materials. This contribution is focused on increasing ultrasonic power transmitted
to the interface and keeping mechanical stresses during ultrasonic bonding low
by using a multi-dimensional ultrasonic transducer concept. Bonding results for
a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
bonding are discussed.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors
and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025'
apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro,
W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.
https://doi.org/10.1016/j.sna.2019.04.025'
bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
volume={295}, DOI={10.1016/j.sna.2019.04.025},
journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
Walter}, year={2019}, pages={653–662} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295
(2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.'
ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
“Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662,
2019, doi: 10.1016/j.sna.2019.04.025.'
mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical,
vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.'
short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: ' 295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '64018'
abstract:
- lang: eng
text: CO oxidation is an extensively studied reaction in heterogeneous catalysis
due to its seeming simplicity and its great importance for emission control. However,
the role of particle size and more specifically structure sensitivity in this
reaction is still controversial. In the present study, colloidal “surfactant-free”
Pt nanoparticles (NPs) in a size regime of 1–4 nm with narrow size distribution
and control over particle size were synthesized and subsequently supported on
Al2O3 to prepare model catalysts. CO oxidation was performed using Pt NPs catalysts
with particles sizes of 1, 2, 3, and 4 nm at different reaction temperatures.
It is shown that the reaction exhibits a particle size effect that depends strongly
on the reaction conditions. At 170 °C, the reaction seems to proceed within the
same kinetic regime for all particle sizes, but the surface normalized activity
depends strongly on the particle size, with maximum activity for nanoparticles
2 nm in diameter. A temperature increase to 200 °C leads to a change of the kinetic
regime that depends on the particle size. For Pt NPs 1 nm in diameter a reaction
order of 1 for O2 was observed, indicating that O2 adsorbs molecularly and dissociates
in a following step, which represents the generally accepted mechanism on Pt surfaces.
The reaction order of −1 for CO demonstrates that the surface is saturated with
CO under reaction conditions. With increasing particle size, the reaction orders
of O2 and CO change. For particles 2 nm in size, an increase in temperature also
results in reaction orders of 1 for O2 and −1 for CO; NPs of 3 and 4 nm, even
at higher temperatures, show no clear kinetic behavior that can be explained by
a single reaction mechanism. Instead, the Boudouard reaction between two adjacent
adsorbed CO molecules was identified as an important additional reaction pathway
that occurs preferentially on large particles and causes more complex kinetics.
author:
- first_name: Sarah
full_name: Neumann, Sarah
last_name: Neumann
- first_name: Torsten
full_name: Gutmann, Torsten
id: '118165'
last_name: Gutmann
- first_name: Gerd
full_name: Buntkowsky, Gerd
last_name: Buntkowsky
- first_name: Stephen
full_name: Paul, Stephen
last_name: Paul
- first_name: Greg
full_name: Thiele, Greg
last_name: Thiele
- first_name: Heiko
full_name: Sievers, Heiko
last_name: Sievers
- first_name: Marcus
full_name: Bäumer, Marcus
last_name: Bäumer
- first_name: Sebastian
full_name: Kunz, Sebastian
last_name: Kunz
citation:
ama: Neumann S, Gutmann T, Buntkowsky G, et al. Insights into the reaction mechanism
and particle size effects of CO oxidation over supported Pt nanoparticle catalysts.
Journal of Catalysis. 2019;377:662–672. doi:10.1016/j.jcat.2019.07.049
apa: Neumann, S., Gutmann, T., Buntkowsky, G., Paul, S., Thiele, G., Sievers, H.,
Bäumer, M., & Kunz, S. (2019). Insights into the reaction mechanism and particle
size effects of CO oxidation over supported Pt nanoparticle catalysts. Journal
of Catalysis, 377, 662–672. https://doi.org/10.1016/j.jcat.2019.07.049
bibtex: '@article{Neumann_Gutmann_Buntkowsky_Paul_Thiele_Sievers_Bäumer_Kunz_2019,
title={Insights into the reaction mechanism and particle size effects of CO oxidation
over supported Pt nanoparticle catalysts}, volume={377}, DOI={10.1016/j.jcat.2019.07.049},
journal={Journal of Catalysis}, author={Neumann, Sarah and Gutmann, Torsten and
Buntkowsky, Gerd and Paul, Stephen and Thiele, Greg and Sievers, Heiko and Bäumer,
Marcus and Kunz, Sebastian}, year={2019}, pages={662–672} }'
chicago: 'Neumann, Sarah, Torsten Gutmann, Gerd Buntkowsky, Stephen Paul, Greg Thiele,
Heiko Sievers, Marcus Bäumer, and Sebastian Kunz. “Insights into the Reaction
Mechanism and Particle Size Effects of CO Oxidation over Supported Pt Nanoparticle
Catalysts.” Journal of Catalysis 377 (2019): 662–672. https://doi.org/10.1016/j.jcat.2019.07.049.'
ieee: 'S. Neumann et al., “Insights into the reaction mechanism and particle
size effects of CO oxidation over supported Pt nanoparticle catalysts,” Journal
of Catalysis, vol. 377, pp. 662–672, 2019, doi: 10.1016/j.jcat.2019.07.049.'
mla: Neumann, Sarah, et al. “Insights into the Reaction Mechanism and Particle Size
Effects of CO Oxidation over Supported Pt Nanoparticle Catalysts.” Journal
of Catalysis, vol. 377, 2019, pp. 662–672, doi:10.1016/j.jcat.2019.07.049.
short: S. Neumann, T. Gutmann, G. Buntkowsky, S. Paul, G. Thiele, H. Sievers, M.
Bäumer, S. Kunz, Journal of Catalysis 377 (2019) 662–672.
date_created: 2026-02-07T16:02:06Z
date_updated: 2026-02-17T16:14:45Z
doi: 10.1016/j.jcat.2019.07.049
extern: '1'
intvolume: ' 377'
keyword:
- Solid state NMR
- “Surfactant-free” platinum nanoparticles
- CO oxidation
- Particle size effect
- Structure sensitivity
language:
- iso: eng
page: 662–672
publication: Journal of Catalysis
status: public
title: Insights into the reaction mechanism and particle size effects of CO oxidation
over supported Pt nanoparticle catalysts
type: journal_article
user_id: '100715'
volume: 377
year: '2019'
...
---
_id: '9992'
abstract:
- lang: eng
text: State-of-the-art industrial compact high power electronic packages require
copper-copper interconnections with larger cross sections made by ultrasonic bonding.
In comparison to aluminium-copper, copper-copper interconnections require increased
normal forces and ultrasonic power, which might lead to substrate damage due to
increased mechanical stresses. One option to raise friction energy without increasing
vibration amplitude between wire and substrate or bonding force is the use of
two-dimensional vibration. The first part of this contribution reports on the
development of a novel bonding system that executes two-dimensional vibrations
of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
bonds only form properly when surfaces are clean, oxide free and activated, the
geometries of tool-tip and pin were optimised using finite element analysis. To
maximize the area of the bonded annulus the distribution of normal pressure was
optimized by varying the convexity of the bottom side of the pin. Second, a statistical
model obtained from an experimental parameter study shows the influence of different
bonding parameters on the bond result. To find bonding parameters with the minimum
number of tests, the experiments have been planned using a D-optimal experimental
design approach.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
of weld formation in a novel two-dimensional copper-copper bonding process. In:
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany). ; 2018:1-6.'
apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process. In (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany)
(pp. 1–6).
bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
title={Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany), 1–6, 2018.
ieee: C. Dymel et al., “Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process,” in (Proceedings
of 7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '30935'
author:
- first_name: Juliane
full_name: Anderski, Juliane
last_name: Anderski
- first_name: Laura
full_name: Mahlert, Laura
last_name: Mahlert
- first_name: Jingjiang
full_name: Sun, Jingjiang
last_name: Sun
- first_name: Wolfgang
full_name: Birnbaum, Wolfgang
last_name: Birnbaum
- first_name: Dennis
full_name: Mulac, Dennis
last_name: Mulac
- first_name: Sebastian
full_name: Schreiber, Sebastian
last_name: Schreiber
- first_name: Fabian
full_name: Herrmann, Fabian
last_name: Herrmann
- first_name: Dirk
full_name: Kuckling, Dirk
id: '287'
last_name: Kuckling
- first_name: Klaus
full_name: Langer, Klaus
last_name: Langer
citation:
ama: Anderski J, Mahlert L, Sun J, et al. Light-responsive nanoparticles based on
new polycarbonate polymers as innovative drug delivery systems for photosensitizers
in PDT. International Journal of Pharmaceutics. 2018;557:182-191. doi:10.1016/j.ijpharm.2018.12.040
apa: Anderski, J., Mahlert, L., Sun, J., Birnbaum, W., Mulac, D., Schreiber, S.,
Herrmann, F., Kuckling, D., & Langer, K. (2018). Light-responsive nanoparticles
based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers
in PDT. International Journal of Pharmaceutics, 557, 182–191. https://doi.org/10.1016/j.ijpharm.2018.12.040
bibtex: '@article{Anderski_Mahlert_Sun_Birnbaum_Mulac_Schreiber_Herrmann_Kuckling_Langer_2018,
title={Light-responsive nanoparticles based on new polycarbonate polymers as innovative
drug delivery systems for photosensitizers in PDT}, volume={557}, DOI={10.1016/j.ijpharm.2018.12.040},
journal={International Journal of Pharmaceutics}, publisher={Elsevier BV}, author={Anderski,
Juliane and Mahlert, Laura and Sun, Jingjiang and Birnbaum, Wolfgang and Mulac,
Dennis and Schreiber, Sebastian and Herrmann, Fabian and Kuckling, Dirk and Langer,
Klaus}, year={2018}, pages={182–191} }'
chicago: 'Anderski, Juliane, Laura Mahlert, Jingjiang Sun, Wolfgang Birnbaum, Dennis
Mulac, Sebastian Schreiber, Fabian Herrmann, Dirk Kuckling, and Klaus Langer.
“Light-Responsive Nanoparticles Based on New Polycarbonate Polymers as Innovative
Drug Delivery Systems for Photosensitizers in PDT.” International Journal of
Pharmaceutics 557 (2018): 182–91. https://doi.org/10.1016/j.ijpharm.2018.12.040.'
ieee: 'J. Anderski et al., “Light-responsive nanoparticles based on new polycarbonate
polymers as innovative drug delivery systems for photosensitizers in PDT,” International
Journal of Pharmaceutics, vol. 557, pp. 182–191, 2018, doi: 10.1016/j.ijpharm.2018.12.040.'
mla: Anderski, Juliane, et al. “Light-Responsive Nanoparticles Based on New Polycarbonate
Polymers as Innovative Drug Delivery Systems for Photosensitizers in PDT.” International
Journal of Pharmaceutics, vol. 557, Elsevier BV, 2018, pp. 182–91, doi:10.1016/j.ijpharm.2018.12.040.
short: J. Anderski, L. Mahlert, J. Sun, W. Birnbaum, D. Mulac, S. Schreiber, F.
Herrmann, D. Kuckling, K. Langer, International Journal of Pharmaceutics 557 (2018)
182–191.
date_created: 2022-04-21T09:13:47Z
date_updated: 2022-04-21T09:14:49Z
department:
- _id: '311'
doi: 10.1016/j.ijpharm.2018.12.040
intvolume: ' 557'
keyword:
- NanoparticlesLight-responsive polymersPhotodynamic therapyPoly(lactic-co-glycolic
acid)Intestinal cancer
language:
- iso: eng
page: 182-191
publication: International Journal of Pharmaceutics
publication_identifier:
issn:
- 0378-5173
publication_status: published
publisher: Elsevier BV
status: public
title: Light-responsive nanoparticles based on new polycarbonate polymers as innovative
drug delivery systems for photosensitizers in PDT
type: journal_article
user_id: '94'
volume: 557
year: '2018'
...
---
_id: '9982'
abstract:
- lang: ger
text: ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten
genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung
kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der
geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb
verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der
Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte
zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen
Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein
einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde
in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands
zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung
entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt
die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld
von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer
zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller
Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die
sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie
verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung
bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L
/2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude
und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren
Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend
Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten
basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel
2017; 2017:611-614.'
apa: 'Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für
Akustik (pp. 611–614). Kiel 2017.'
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS:
Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43.
Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias
and Sextro, Walter}, year={2017}, pages={611–614} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile
Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche
Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.'
ieee: 'R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für
Akustik, 2017, pp. 611–614.'
mla: 'Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten
Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017,
pp. 611–14.'
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik,
Kiel 2017, 2017, pp. 611–614.'
date_created: 2019-05-27T09:48:10Z
date_updated: 2019-05-27T09:49:49Z
department:
- _id: '151'
keyword:
- wire bonding
- dynamic behavior
- modeling
language:
- iso: eng
page: 611-614
place: Kiel 2017
publication: 43. Deutsche Jahrestagung für Akustik
status: public
title: 'MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall'
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '13238'
abstract:
- lang: eng
text: A numerically efficient yet highly accurate implementation of the crystal
orbital Hamilton population (COHP) scheme for plane-wave calculations is presented.
It is based on the projector-augmented wave (PAW) formalism in combination with
norm-conserving pseudopotentials and allows to extract chemical interactions between
atoms from band-structure calculations even for large and complex systems. The
potential of the present COHP implementation is demonstrated by an in-depth analysis
of the intensively investigated metal-insulator transition in atomic-scale indium
wires self-assembled on the Si(111) surface. Thereby bond formation between In
atoms of adjacent zigzag chains is found to be instrumental for the phase change.
© 2017 Wiley Periodicals, Inc.
author:
- first_name: Andreas
full_name: Lücke, Andreas
last_name: Lücke
- first_name: Uwe
full_name: Gerstmann, Uwe
last_name: Gerstmann
- first_name: Thomas D.
full_name: Kühne, Thomas D.
last_name: Kühne
- first_name: Wolf G.
full_name: Schmidt, Wolf G.
last_name: Schmidt
citation:
ama: Lücke A, Gerstmann U, Kühne TD, Schmidt WG. Efficient PAW-based bond strength
analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. Journal
of Computational Chemistry. 2017;38(26):2276-2282. doi:10.1002/jcc.24878
apa: Lücke, A., Gerstmann, U., Kühne, T. D., & Schmidt, W. G. (2017). Efficient
PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4
× 1) phase transition. Journal of Computational Chemistry, 38(26),
2276–2282. https://doi.org/10.1002/jcc.24878
bibtex: '@article{Lücke_Gerstmann_Kühne_Schmidt_2017, title={Efficient PAW-based
bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase
transition}, volume={38}, DOI={10.1002/jcc.24878},
number={26}, journal={Journal of Computational Chemistry}, author={Lücke, Andreas
and Gerstmann, Uwe and Kühne, Thomas D. and Schmidt, Wolf G.}, year={2017}, pages={2276–2282}
}'
chicago: 'Lücke, Andreas, Uwe Gerstmann, Thomas D. Kühne, and Wolf G. Schmidt. “Efficient
PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4
× 1) Phase Transition.” Journal of Computational Chemistry 38, no. 26 (2017):
2276–82. https://doi.org/10.1002/jcc.24878.'
ieee: A. Lücke, U. Gerstmann, T. D. Kühne, and W. G. Schmidt, “Efficient PAW-based
bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase
transition,” Journal of Computational Chemistry, vol. 38, no. 26, pp. 2276–2282,
2017.
mla: Lücke, Andreas, et al. “Efficient PAW-Based Bond Strength Analysis for Understanding
the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” Journal of Computational
Chemistry, vol. 38, no. 26, 2017, pp. 2276–82, doi:10.1002/jcc.24878.
short: A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational
Chemistry 38 (2017) 2276–2282.
date_created: 2019-09-16T12:39:15Z
date_updated: 2022-01-06T06:51:31Z
department:
- _id: '304'
doi: 10.1002/jcc.24878
intvolume: ' 38'
issue: '26'
keyword:
- density functional theory
- bonding
- crystal orbital Hamilton population
- indium nanowires
- phase transition
language:
- iso: eng
page: 2276-2282
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Journal of Computational Chemistry
publication_status: published
status: public
title: Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8
× 2) – (4 × 1) phase transition
type: journal_article
user_id: '71692'
volume: 38
year: '2017'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9959'
abstract:
- lang: eng
text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical
devices in power electronics. In order to facilitate powerful solutions combined
with an increased efficiency, involving a material change from aluminum to copper
wire as conductor material takes place in recent years. Due to the material related
properties, copper wire bonding requires significant higher bond processing parameters
such as bond force and ultrasonic power compared to aluminum which can lead to
damages or a failure of the bonded component. Therefore, a profound knowledge
of the processes prevailing during wire bonding is essential to optimize the application
of the copper wires and consequently to achieve the demands on quality and reliability.
The behavior of different natural surface oxides of aluminum and copper are assumed
to be one reason for the deviation in the required bond parameters. Accordingly,
the impact of differently pre-treated substrates surfaces on which the bonding
is applied were investigated in this study. First, all conditions investigated
(as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning
electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy
and atomic force microscopy. In addition, hardness tests were performed as well
as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded
on the generated surfaces investigated. In consideration of the roughness, shear
test of various bond times and microscopic images were evaluated. Finally, the
results were compared and discussed. Overall, the current study indicates that
an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the
contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining
parts. Based on the obtained results, it can be expected that due to an ideal
set of Al-oxide layers, lower optimal bond parameters can used to reach high bond
strength with good reliability properties.
author:
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Olexandr
full_name: Grydin, Olexandr
last_name: Grydin
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on
the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91'
apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,
… Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire
bond process. In IEEE 66th Electronic Components and Technology Conference
(pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016,
title={Effect of different oxide layers on the ultrasonic copper wire bond process},
DOI={10.1109/ECTC.2016.91},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock,
Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach,
Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016},
pages={2111–2118} }'
chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian
Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different
Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic
Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
ieee: F. Eacock et al., “Effect of different oxide layers on the ultrasonic
copper wire bond process,” in IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 2111–2118.
mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic
Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M.
Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–2118.'
date_created: 2019-05-27T09:00:50Z
date_updated: 2019-09-16T10:38:59Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.91
keyword:
- Ultrasonic copper wire bonding
- Al-oxide
- Cuoxide
- oxide-free
- roughness
- morphology
language:
- iso: eng
page: 2111-2118
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Effect of different oxide layers on the ultrasonic copper wire bond process
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...