---
_id: '9870'
abstract:
- lang: eng
  text: Nowadays wire bonding is a widely-used technology for interconnecting chips
    in the packaging industry. Thereby, it is known that the bond quality massively
    depends upon the microstructure prevailing in the bond and consequently the materials
    used as well as the bonding parameters. However the actually used materials such
    as aluminum and gold are either characterized by comparibly poor conductivity
    or high costs, respectively. Due to its outstanding properties copper is a more
    attractive candidate. Still, a thorough investigation on the interrelationship
    between the material combinations, the processing parameters and the resulting
    microstructure for copper and aluminum wire bonding was not carried out yet. Depending
    on the aforementioned factors the microstructural evolution can be completely
    different during the bonding process. Therefore, this study focuses on the microstructural
    evolution of heavy copper and heavy aluminum wires bonded on copper substrates.
    The evolution of the wire microstructure as well as the wire-substrate-interface
    was investigated by scanning electron microscope in combination with electron
    backscatter diffraction and microhardness measurements. Various samples were extracted
    at different points of the bonding process, namely the as-received condition,
    after touchdown and after completed bonding. The results of the aluminum and copper
    wires were compared to each other in both longitudinal and transversal direction.
    It was found, that the two wire materials were completely different in the as-received
    condition regarding the grain size, the grain morphology, the texture and the
    microhardness. After touchdown the microstructure did not show significant changes
    in both materials, yet a strain-hardening was observed in the copper wire resulting
    from the touchdown force. When the bonding process was completed a different microstructure
    could be observed in both the wire as well as the layer for the materials investigated.
    Furthermore, a destinctive increase in the wire hardness could be found in case
    of copper, which was not observed for the aluminum wire. The ramifications between
    the two wire materials presented in this work will be discussed with the objective
    of optimizing the quality of the bonds.
author:
- first_name: Florian
  full_name: Eacock , Florian
  last_name: 'Eacock '
- first_name: Mirko
  full_name: Schaper, Mirko
  last_name: Schaper
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Florian
  full_name: Hengsbach, Florian
  last_name: Hengsbach
- first_name: Carolin
  full_name: Zinn, Carolin
  last_name: Zinn
- first_name: ' Martin Joachim'
  full_name: Holzweissig,  Martin Joachim
  last_name: Holzweissig
- first_name: Karsten
  full_name: Guth, Karsten
  last_name: Guth
citation:
  ama: 'Eacock  F, Schaper M, Althoff S, et al. Microstructural investigations of
    aluminum and copper wire bonds. In: <i>Proceedings of the 47th International Symposium
    on Microelectronics</i>. ; 2014. doi:<a href="https://doi.org/10.4071/isom-THP32">10.4071/isom-THP32</a>'
  apa: Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach,
    F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire
    bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics</i>.
    <a href="https://doi.org/10.4071/isom-THP32">https://doi.org/10.4071/isom-THP32</a>
  bibtex: '@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014,
    title={Microstructural investigations of aluminum and copper wire bonds}, DOI={<a
    href="https://doi.org/10.4071/isom-THP32">10.4071/isom-THP32</a>}, booktitle={Proceedings
    of the 47th International Symposium on Microelectronics}, author={Eacock , Florian
    and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and
    Hengsbach, Florian and Zinn, Carolin and Holzweissig,  Martin Joachim and Guth,
    Karsten}, year={2014} }'
  chicago: Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald,
    Florian Hengsbach, Carolin Zinn,  Martin Joachim Holzweissig, and Karsten Guth.
    “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In <i>Proceedings
    of the 47th International Symposium on Microelectronics</i>, 2014. <a href="https://doi.org/10.4071/isom-THP32">https://doi.org/10.4071/isom-THP32</a>.
  ieee: F. Eacock  <i>et al.</i>, “Microstructural investigations of aluminum and
    copper wire bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>,
    2014.
  mla: Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper
    Wire Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>,
    2014, doi:<a href="https://doi.org/10.4071/isom-THP32">10.4071/isom-THP32</a>.
  short: 'F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach,
    C. Zinn,  Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International
    Symposium on Microelectronics, 2014.'
date_created: 2019-05-20T12:14:11Z
date_updated: 2019-09-16T10:58:50Z
department:
- _id: '151'
doi: 10.4071/isom-THP32
keyword:
- Bonding
- Copper
- Microstructure evolution
language:
- iso: eng
publication: Proceedings of the 47th International Symposium on Microelectronics
quality_controlled: '1'
status: public
title: Microstructural investigations of aluminum and copper wire bonds
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9871'
abstract:
- lang: eng
  text: 'Wire bonding is the most common technology for connecting electronic components.
    Due to their efficiency bond interconnections made of copper wire are used for
    example in the aerospace and medical technology as well as in the fields of renewable
    energies. One of the main cost factors in the manufacturing process is the consumables
    like bonding tools. The technological transition to copper as wire material causes
    significant wear on the millimeter large effective contact area of the bonding
    tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
    which can be produced by a single tool. To reduce setting-up time in the production
    and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
    a better understanding of wear and recognition of wear pattern is required. Therefore,
    the paper presents an analyzing method of the tool topography change of a heavy
    wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
    the identification of the main wear indicators by the help of the named topography
    change for different bond parameters, like ultrasonic power and tool geometry.
    Reference topography has been carried out by choosing typical parameters of the
    production line. To judge whether the quality requirement of the bond connections
    made by a single tool cannot be fulfilled shear test of the source bond have been
    carried out after a defined number of produced bond connections. Main steps of
    analysis: (I)Topography of the tool surface is sampled after a defined number
    of bonds by means of a confocal microscope to detect the wear progress.(II)The
    recorded data is filtered using Matlab. So, measurement errors can be eliminated
    and the topography can be overlaid more easy to identify differences between diverse
    tools or differences in wear stages of the same tool.(III)The subsequent discretization
    of the topography into sub volumes allows to (IV)describe the loss of volume depending
    on the position in the groove. Thereby, intermediate status of wear of one tool
    can be used to obtain a persistent description of the topography change over the
    number of produced bonds by interpolating the confocal data. Afterwards the persistent
    change of the groove flank has been analyzed for the named test series to identify
    the main wear indicators and their effect on shear forces. All worn tools show
    dominant areas for volume loss especially for plastic deformation and accordingly
    abrasion. These wear mechanism can be referred to the change of main parts of
    the groove geometry like the rounding of the front and back radius. The most volume
    loss was identified in the upper part of the tool flanks or rather at the transition
    from the groove flank to the front or back radius. Furthermore the observation
    of the center of the groove flank shows just a little change in volume. All in
    all, the identification of the wear indicators will be discussed with the objective
    of increasing the tool lifetime by optimizing the tool geometry without losses
    in bond quality and reliability.'
author:
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Simon
  full_name: Althof, Simon
  last_name: Althof
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Karsten
  full_name: Guth, Karsten
  last_name: Guth
citation:
  ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
    Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
    In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>.
    ; 2014:856-861. doi:<a href="https://doi.org/10.4071/isom-THP34">10.4071/isom-THP34</a>'
  apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &#38;
    Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
    of Wear Indicators for Heavy Copper Wire Wedge Bonding. In <i>Proceedings of the
    47th International Symposium on Microelectronics</i> (pp. 856–861). <a href="https://doi.org/10.4071/isom-THP34">https://doi.org/10.4071/isom-THP34</a>
  bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
    Method of Tool Topography Change and Identification of Wear Indicators for Heavy
    Copper Wire Wedge Bonding}, DOI={<a href="https://doi.org/10.4071/isom-THP34">10.4071/isom-THP34</a>},
    booktitle={Proceedings of the 47th International Symposium on Microelectronics},
    author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
    and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
    }'
  chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
    Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
    Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In <i>Proceedings
    of the 47th International Symposium on Microelectronics</i>, 856–61, 2014. <a
    href="https://doi.org/10.4071/isom-THP34">https://doi.org/10.4071/isom-THP34</a>.
  ieee: P. Eichwald <i>et al.</i>, “Analysis Method of Tool Topography Change and
    Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in <i>Proceedings
    of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–861.
  mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
    of Wear Indicators for Heavy Copper Wire Wedge Bonding.” <i>Proceedings of the
    47th International Symposium on Microelectronics</i>, 2014, pp. 856–61, doi:<a
    href="https://doi.org/10.4071/isom-THP34">10.4071/isom-THP34</a>.
  short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
    in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
    pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
  for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9895'
abstract:
- lang: eng
  text: Power semiconductor modules are used to control and switch high electrical
    currents and voltages. Within the power module package wire bonding is used as
    an interconnection technology. In recent years, aluminum wire has been used preferably,
    but an ever-growing market of powerful and efficient power modules requires a
    material with better mechanical and electrical properties. For this reason, a
    technology change from aluminum to copper is indispensable. However, the copper
    wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
    reliable copper bond connections a challenging task. The aim of the BMBF funded
    project Itsowl-InCuB is the development of self-optimizing techniques to enable
    the reliable production of copper bond connections under varying conditions. A
    model of the process is essential to achieve this aim. This model needs to include
    the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
    proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
    process. In the touchdown phase, the wire is pressed into the V-groove of the
    tool and a small initial contact area between wire and substrate arise. The local
    characteristics of the material change abruptly because of the cold forming. Consequently,
    the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
    effect during the touchdown process of aluminum wires by cracking of oxide layers
    was presented. These interactions of the process parameters are still largely
    unknown for copper. In a first step, this paper validates the importance of modeling
    the pre-deformation by showing its impact on the wire deformation characteristic
    experimentally. Creating cross-section views of pre-deformed copper wires has
    shown a low deformation degree compared to aluminum. By using a digital microscope
    and a scanning confocal microscope an analysis about the contact areas and penetration
    depths after touchdown has been made. Additionally, it has to be taken into account
    that the dynamical touchdown force depends on the touchdown speed and the touchdown
    force set in the bonding machine. In order to measure the overshoot in the force
    signals, a strain gauge sensor has been used. Subsequently, the affecting factors
    have been interpreted independently Furthermore, the material properties of copper
    wire have been investigated with tensile tests and hardness measurements. In a
    second step, the paper presents finite element models of the touchdown process
    for source and destination bonds. These models take the measured overshoot in
    the touchdown forces into account. A multi-linear, isotropic material model has
    been selected to map the material properties of the copper. A validation of the
    model with the experimental determined contact areas, normal pressures and penetration
    depths reveals the high model quality. Thus, the simulation is able to calculate
    and visualize the three dimensional pre-deformation with an integrated material
    parameter of the wire if the touchdown parameters of the bonding machine are known.
    Based on the calculated deformation degrees of wire and substrate, it is probably
    possible to investigate the effect of the pre-deformation on the pre-cleaning
    phase in the copper wire bonding.
author:
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
citation:
  ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
    Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US;
    2014:289-294.'
  apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38;
    Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.
  bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
    place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
    of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
    and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
    Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
  chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
    Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
    Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego,
    CA, US, 2014.
  ieee: A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.
  mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.
  short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
    in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
    San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
  Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...
---
_id: '17202'
author:
- first_name: Anna-Lisa
  full_name: Vollmer, Anna-Lisa
  last_name: Vollmer
- first_name: Jonathan
  full_name: Grizou, Jonathan
  last_name: Grizou
- first_name: Manuel
  full_name: Lopes, Manuel
  last_name: Lopes
- first_name: Katharina
  full_name: Rohlfing, Katharina
  id: '50352'
  last_name: Rohlfing
- first_name: Pierre-Yves
  full_name: Oudeyer, Pierre-Yves
  last_name: Oudeyer
citation:
  ama: 'Vollmer A-L, Grizou J, Lopes M, Rohlfing K, Oudeyer P-Y. Studying the Co-Construction
    of Interaction Protocols in Collaborative Tasks with Humans. In: <i>2014 Joint
    IEEE International Conference on Development and Learning and on Epigenetic Robotics</i>.
    IEEE; 2014:208-215.'
  apa: Vollmer, A.-L., Grizou, J., Lopes, M., Rohlfing, K., &#38; Oudeyer, P.-Y. (2014).
    Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with
    Humans. <i>2014 Joint IEEE International Conference on Development and Learning
    and on Epigenetic Robotics</i>, 208–215.
  bibtex: '@inproceedings{Vollmer_Grizou_Lopes_Rohlfing_Oudeyer_2014, title={Studying
    the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans},
    booktitle={2014 Joint IEEE International Conference on Development and Learning
    and on Epigenetic Robotics}, publisher={IEEE}, author={Vollmer, Anna-Lisa and
    Grizou, Jonathan and Lopes, Manuel and Rohlfing, Katharina and Oudeyer, Pierre-Yves},
    year={2014}, pages={208–215} }'
  chicago: Vollmer, Anna-Lisa, Jonathan Grizou, Manuel Lopes, Katharina Rohlfing,
    and Pierre-Yves Oudeyer. “Studying the Co-Construction of Interaction Protocols
    in Collaborative Tasks with Humans.” In <i>2014 Joint IEEE International Conference
    on Development and Learning and on Epigenetic Robotics</i>, 208–15. IEEE, 2014.
  ieee: A.-L. Vollmer, J. Grizou, M. Lopes, K. Rohlfing, and P.-Y. Oudeyer, “Studying
    the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans,”
    in <i>2014 Joint IEEE International Conference on Development and Learning and
    on Epigenetic Robotics</i>, 2014, pp. 208–215.
  mla: Vollmer, Anna-Lisa, et al. “Studying the Co-Construction of Interaction Protocols
    in Collaborative Tasks with Humans.” <i>2014 Joint IEEE International Conference
    on Development and Learning and on Epigenetic Robotics</i>, IEEE, 2014, pp. 208–15.
  short: 'A.-L. Vollmer, J. Grizou, M. Lopes, K. Rohlfing, P.-Y. Oudeyer, in: 2014
    Joint IEEE International Conference on Development and Learning and on Epigenetic
    Robotics, IEEE, 2014, pp. 208–215.'
date_created: 2020-06-24T13:01:21Z
date_updated: 2023-02-01T16:11:59Z
department:
- _id: '749'
keyword:
- interaction
- communication
- co-construction
- interaction protocols
language:
- iso: eng
page: 208 - 215
publication: 2014 Joint IEEE International Conference on Development and Learning
  and on Epigenetic Robotics
publication_identifier:
  isbn:
  - 978-1-4799-7540-2
publisher: IEEE
status: public
title: Studying the Co-Construction of Interaction Protocols in Collaborative Tasks
  with Humans
type: conference
user_id: '14931'
year: '2014'
...
---
_id: '9797'
abstract:
- lang: eng
  text: A model approach for wedge/wedge bonding copper wire is presented. The connection
    between wire and substrate is based on a variety of physical effects, but the
    dominant one is the friction based welding while applying ultrasound. Consequently,
    a friction model was used to investigate the welding process. This model is built
    up universal and can be used to describe the formation of micro welds in the time
    variant contact area between wire and substrate. Aim of the model is to identify
    the interactions between touchdown, bond normal force, ultrasonic power and bonding
    time. To do so, the contact area is discretized into partial areas where a Point
    Contact Model is applied. Based on this approach it is possible to simulate micro
    and macro slip inside the contact area between wire and substrate. The work done
    by friction force is a main criterion to define occurring micro joints which influence
    the subsequent welding.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling
    wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>.
    Orlando (Florida), USA; 2013. doi:<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based
    approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium
    on Microelectronics</i>. Orlando (Florida), USA. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida),
    USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>},
    booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff,
    Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction
    Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International
    Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach
    for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on
    Microelectronics</i>, 2013.
  mla: Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.”
    <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a
    href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International
    Symposium on Microelectronics, Orlando (Florida), USA, 2013.'
date_created: 2019-05-13T13:55:36Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.4071/isom-2013-TA67
keyword:
- Wire bonding
- friction modeling
- wire bond quality
- contact element modeling
language:
- iso: eng
place: Orlando (Florida), USA
publication: IMAPS 2013, 46th International Symposium on Microelectronics
status: public
title: A friction based approach for modeling wire bonding
type: conference
user_id: '55222'
year: '2013'
...
---
_id: '5717'
abstract:
- lang: eng
  text: Although professional service providers increasingly deliver their services
    globally, little is known about cross-cultural differences in customers’ motivation
    to participate in service production. To address this lacuna, we survey a total
    of 2,284 banking customers in 11 countries on their motivation to provide personal
    information to, and follow the advice of, their service providers. We find differences
    in both aspects, but only the differences in providing personal information can
    be explained by the cultural values of uncertainty avoidance, individualism/collectivism,
    and masculinity/femininity. To perform certain tasks in the service process, global
    professional service providers should acknowledge cultural differences in customers’
    motivations.
article_type: original
author:
- first_name: Jan H
  full_name: Schumann, Jan H
  last_name: Schumann
- first_name: Nancy
  full_name: Wünderlich, Nancy
  id: '36392'
  last_name: Wünderlich
- first_name: Marcus S
  full_name: Zimmer, Marcus S
  last_name: Zimmer
citation:
  ama: Schumann JH, Wünderlich N, Zimmer MS. Culture’s Impact on Customer Motivation
    to Engage in Professional Service Enactments. <i>Schmalenbach Business Review</i>.
    2012;64(2):141-165.
  apa: Schumann, J. H., Wünderlich, N., &#38; Zimmer, M. S. (2012). Culture’s Impact
    on Customer Motivation to Engage in Professional Service Enactments. <i>Schmalenbach
    Business Review</i>, <i>64</i>(2), 141–165.
  bibtex: '@article{Schumann_Wünderlich_Zimmer_2012, title={Culture’s Impact on Customer
    Motivation to Engage in Professional Service Enactments.}, volume={64}, number={2},
    journal={Schmalenbach Business Review}, publisher={Springer}, author={Schumann,
    Jan H and Wünderlich, Nancy and Zimmer, Marcus S}, year={2012}, pages={141–165}
    }'
  chicago: 'Schumann, Jan H, Nancy Wünderlich, and Marcus S Zimmer. “Culture’s Impact
    on Customer Motivation to Engage in Professional Service Enactments.” <i>Schmalenbach
    Business Review</i> 64, no. 2 (2012): 141–65.'
  ieee: J. H. Schumann, N. Wünderlich, and M. S. Zimmer, “Culture’s Impact on Customer
    Motivation to Engage in Professional Service Enactments.,” <i>Schmalenbach Business
    Review</i>, vol. 64, no. 2, pp. 141–165, 2012.
  mla: Schumann, Jan H., et al. “Culture’s Impact on Customer Motivation to Engage
    in Professional Service Enactments.” <i>Schmalenbach Business Review</i>, vol.
    64, no. 2, Springer, 2012, pp. 141–65.
  short: J.H. Schumann, N. Wünderlich, M.S. Zimmer, Schmalenbach Business Review 64
    (2012) 141–165.
date_created: 2018-11-16T09:40:23Z
date_updated: 2022-01-06T07:02:37Z
department:
- _id: '181'
intvolume: '        64'
issue: '2'
keyword:
- Co-Production
- Culture
- Customer Participation
- Professional Services
language:
- iso: eng
page: 141-165
publication: Schmalenbach Business Review
publication_status: published
publisher: Springer
status: public
title: Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.
type: journal_article
user_id: '37741'
volume: 64
year: '2012'
...
---
_id: '2412'
abstract:
- lang: eng
  text: ' Reconfigurable architectures that tightly integrate a standard CPU core
    with a field-programmable hardware structure have recently been receiving impact
    of these design decisions on the overall system performance is a challenging task.
    In this paper, we first present a framework for the cycle-accurate performance
    evaluation of hybrid reconfigurable processors on the system level. Then, we discuss
    a reconfigurable processor for data-streaming applications, which attaches a coarse-grained
    reconfigurable unit to the coprocessor interface of a standard embedded CPU core.
    By means of a case study we evaluate the system-level impact of certain design
    features for the reconfigurable unit, such as multiple contexts, register replication,
    and hardware context scheduling. The results illustrate that a system-level evaluation
    framework is of paramount importance for studying the architectural trade-offs
    and optimizing design parameters for reconfigurable processors.'
author:
- first_name: Rolf
  full_name: Enzler, Rolf
  last_name: Enzler
- first_name: Christian
  full_name: Plessl, Christian
  id: '16153'
  last_name: Plessl
  orcid: 0000-0001-5728-9982
- first_name: Marco
  full_name: Platzner, Marco
  id: '398'
  last_name: Platzner
citation:
  ama: Enzler R, Plessl C, Platzner M. System-level performance evaluation of reconfigurable
    processors. <i>Microprocessors and Microsystems</i>. 2005;29(2-3):63-73. doi:<a
    href="https://doi.org/10.1016/j.micpro.2004.06.004">10.1016/j.micpro.2004.06.004</a>
  apa: Enzler, R., Plessl, C., &#38; Platzner, M. (2005). System-level performance
    evaluation of reconfigurable processors. <i>Microprocessors and Microsystems</i>,
    <i>29</i>(2–3), 63–73. <a href="https://doi.org/10.1016/j.micpro.2004.06.004">https://doi.org/10.1016/j.micpro.2004.06.004</a>
  bibtex: '@article{Enzler_Plessl_Platzner_2005, title={System-level performance evaluation
    of reconfigurable processors}, volume={29}, DOI={<a href="https://doi.org/10.1016/j.micpro.2004.06.004">10.1016/j.micpro.2004.06.004</a>},
    number={2–3}, journal={Microprocessors and Microsystems}, publisher={Elsevier},
    author={Enzler, Rolf and Plessl, Christian and Platzner, Marco}, year={2005},
    pages={63–73} }'
  chicago: 'Enzler, Rolf, Christian Plessl, and Marco Platzner. “System-Level Performance
    Evaluation of Reconfigurable Processors.” <i>Microprocessors and Microsystems</i>
    29, no. 2–3 (2005): 63–73. <a href="https://doi.org/10.1016/j.micpro.2004.06.004">https://doi.org/10.1016/j.micpro.2004.06.004</a>.'
  ieee: R. Enzler, C. Plessl, and M. Platzner, “System-level performance evaluation
    of reconfigurable processors,” <i>Microprocessors and Microsystems</i>, vol. 29,
    no. 2–3, pp. 63–73, 2005.
  mla: Enzler, Rolf, et al. “System-Level Performance Evaluation of Reconfigurable
    Processors.” <i>Microprocessors and Microsystems</i>, vol. 29, no. 2–3, Elsevier,
    2005, pp. 63–73, doi:<a href="https://doi.org/10.1016/j.micpro.2004.06.004">10.1016/j.micpro.2004.06.004</a>.
  short: R. Enzler, C. Plessl, M. Platzner, Microprocessors and Microsystems 29 (2005)
    63–73.
date_created: 2018-04-17T14:36:10Z
date_updated: 2022-01-06T06:56:07Z
department:
- _id: '518'
- _id: '78'
doi: 10.1016/j.micpro.2004.06.004
intvolume: '        29'
issue: 2-3
keyword:
- FPGA
- reconfigurable computing
- co-simulation
- Zippy
page: 63-73
publication: Microprocessors and Microsystems
publisher: Elsevier
status: public
title: System-level performance evaluation of reconfigurable processors
type: journal_article
user_id: '24135'
volume: 29
year: '2005'
...
---
_id: '39030'
abstract:
- lang: eng
  text: "StateCharts are well accepted for embedded systems\r\nspecification for various
    applications. However, for the\r\nspecification of complex systems they have several\r\nlimitations.
    In this article, we present a novel approach to\r\nefficiently execute an UML
    2.0 subset for embedded real-\r\ntime systems implementation with focus on hardware\r\ninterrupts,
    software exceptions, and timeouts. We\r\nintroduce a UML Virtual Machine, which
    directly\r\nexecutes sequence diagrams, which are embedded into\r\nhierarchically
    structured state transition diagrams.\r\nWhereas state diagrams are directly executed
    as\r\nEmbedded State Machines (ESMs), sequence diagrams\r\nare translated into
    UVM Bytecode. The final UVM\r\nexecution is performed by the interaction of the
    ESM and\r\nthe Bytecode Interpreter. Due to our completely model-\r\nbased approach,
    the UVM runtime kernel is easily\r\nadaptable and scalable to different scheduling
    and\r\nmemory management strategies."
author:
- first_name: Tim
  full_name: Schattkowsky, Tim
  last_name: Schattkowsky
- first_name: Wolfgang
  full_name: Müller, Wolfgang
  id: '16243'
  last_name: Müller
citation:
  ama: 'Schattkowsky T, Müller W. A UML Virtual Machine for Embedded Systems. In:
    <i>Proceedings of ISNG 05</i>. ; 2005.'
  apa: Schattkowsky, T., &#38; Müller, W. (2005). A UML Virtual Machine for Embedded
    Systems. <i>Proceedings of ISNG 05</i>.
  bibtex: '@inproceedings{Schattkowsky_Müller_2005, place={Las Vegas, NV}, title={A
    UML Virtual Machine for Embedded Systems}, booktitle={Proceedings of ISNG 05},
    author={Schattkowsky, Tim and Müller, Wolfgang}, year={2005} }'
  chicago: Schattkowsky, Tim, and Wolfgang Müller. “A UML Virtual Machine for Embedded
    Systems.” In <i>Proceedings of ISNG 05</i>. Las Vegas, NV, 2005.
  ieee: T. Schattkowsky and W. Müller, “A UML Virtual Machine for Embedded Systems,”
    2005.
  mla: Schattkowsky, Tim, and Wolfgang Müller. “A UML Virtual Machine for Embedded
    Systems.” <i>Proceedings of ISNG 05</i>, 2005.
  short: 'T. Schattkowsky, W. Müller, in: Proceedings of ISNG 05, Las Vegas, NV, 2005.'
date_created: 2023-01-24T08:12:20Z
date_updated: 2023-01-24T08:12:26Z
department:
- _id: '672'
keyword:
- UML
- Executable Models
- Hardware/Software Co-design
- Virtual Machine
- Embedded Systems
language:
- iso: eng
place: Las Vegas, NV
publication: Proceedings of ISNG 05
status: public
title: A UML Virtual Machine for Embedded Systems
type: conference
user_id: '5786'
year: '2005'
...
---
_id: '2422'
abstract:
- lang: eng
  text: Reconfigurable computing architectures aim to dynamically adapt their hardware
    to the application at hand. As research shows, the time it takes to reconfigure
    the hardware forms an overhead that can significantly impair the benefits of hardware
    customization. Multi-context devices are one promising approach to overcome the
    limitations posed by long reconfiguration times. In contrast to more traditional
    reconfigurable architectures, multi-context devices hold several configurations
    on-chip. On demand, the device can quickly switch to another context. In this
    paper we present a co-simulation environment to investigate design trade-offs
    for hybrid multi-context architectures. Our architectural model comprises a reconfigurable
    unit closely coupled to a CPU core. As a case study, we discuss the implementation
    of a FIR filter partitioned into several contexts. We outline the mapping process
    and present simulation results for single- and multi-context reconfigurable units
    coupled with both embedded and high-end CPUs.
author:
- first_name: Rolf
  full_name: Enzler, Rolf
  last_name: Enzler
- first_name: Christian
  full_name: Plessl, Christian
  id: '16153'
  last_name: Plessl
  orcid: 0000-0001-5728-9982
- first_name: Marco
  full_name: Platzner, Marco
  id: '398'
  last_name: Platzner
citation:
  ama: 'Enzler R, Plessl C, Platzner M. Co-simulation of a Hybrid Multi-Context Architecture.
    In: <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms
    (ERSA)</i>. CSREA Press; 2003:174-180.'
  apa: Enzler, R., Plessl, C., &#38; Platzner, M. (2003). Co-simulation of a Hybrid
    Multi-Context Architecture. In <i>Proc. Int. Conf. on Engineering of Reconfigurable
    Systems and Algorithms (ERSA)</i> (pp. 174–180). CSREA Press.
  bibtex: '@inproceedings{Enzler_Plessl_Platzner_2003, title={Co-simulation of a Hybrid
    Multi-Context Architecture}, booktitle={Proc. Int. Conf. on Engineering of Reconfigurable
    Systems and Algorithms (ERSA)}, publisher={CSREA Press}, author={Enzler, Rolf
    and Plessl, Christian and Platzner, Marco}, year={2003}, pages={174–180} }'
  chicago: Enzler, Rolf, Christian Plessl, and Marco Platzner. “Co-Simulation of a
    Hybrid Multi-Context Architecture.” In <i>Proc. Int. Conf. on Engineering of Reconfigurable
    Systems and Algorithms (ERSA)</i>, 174–80. CSREA Press, 2003.
  ieee: R. Enzler, C. Plessl, and M. Platzner, “Co-simulation of a Hybrid Multi-Context
    Architecture,” in <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems
    and Algorithms (ERSA)</i>, 2003, pp. 174–180.
  mla: Enzler, Rolf, et al. “Co-Simulation of a Hybrid Multi-Context Architecture.”
    <i>Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA)</i>,
    CSREA Press, 2003, pp. 174–80.
  short: 'R. Enzler, C. Plessl, M. Platzner, in: Proc. Int. Conf. on Engineering of
    Reconfigurable Systems and Algorithms (ERSA), CSREA Press, 2003, pp. 174–180.'
date_created: 2018-04-17T15:12:56Z
date_updated: 2022-01-06T06:56:13Z
department:
- _id: '518'
- _id: '78'
keyword:
- Zippy
- co-simulation
page: 174-180
publication: Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms
  (ERSA)
publication_identifier:
  isbn:
  - 1-932415-05-X
publisher: CSREA Press
status: public
title: Co-simulation of a Hybrid Multi-Context Architecture
type: conference
user_id: '24135'
year: '2003'
...
---
_id: '2433'
author:
- first_name: Christian
  full_name: Plessl, Christian
  id: '16153'
  last_name: Plessl
  orcid: 0000-0001-5728-9982
- first_name: Simon
  full_name: Maurer, Simon
  last_name: Maurer
citation:
  ama: Plessl C, Maurer S. <i>Hardware/Software Codesign in Speech Compression Applications</i>.
    Computer Engineering and Networks Lab, ETH Zurich, Switzerland; 2000.
  apa: Plessl, C., &#38; Maurer, S. (2000). <i>Hardware/Software Codesign in Speech
    Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich,
    Switzerland.
  bibtex: '@book{Plessl_Maurer_2000, title={Hardware/Software Codesign in Speech Compression
    Applications}, publisher={Computer Engineering and Networks Lab, ETH Zurich, Switzerland},
    author={Plessl, Christian and Maurer, Simon}, year={2000} }'
  chicago: Plessl, Christian, and Simon Maurer. <i>Hardware/Software Codesign in Speech
    Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich,
    Switzerland, 2000.
  ieee: C. Plessl and S. Maurer, <i>Hardware/Software Codesign in Speech Compression
    Applications</i>. Computer Engineering and Networks Lab, ETH Zurich, Switzerland,
    2000.
  mla: Plessl, Christian, and Simon Maurer. <i>Hardware/Software Codesign in Speech
    Compression Applications</i>. Computer Engineering and Networks Lab, ETH Zurich,
    Switzerland, 2000.
  short: C. Plessl, S. Maurer, Hardware/Software Codesign in Speech Compression Applications,
    Computer Engineering and Networks Lab, ETH Zurich, Switzerland, 2000.
date_created: 2018-04-17T15:56:00Z
date_updated: 2022-01-06T06:56:17Z
department:
- _id: '518'
keyword:
- co-design
- speech processing
publisher: Computer Engineering and Networks Lab, ETH Zurich, Switzerland
status: public
title: Hardware/Software Codesign in Speech Compression Applications
type: mastersthesis
user_id: '24135'
year: '2000'
...