[{"title":"Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach","related_material":{"link":[{"relation":"confirmation","url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes"}]},"publication_status":"published","publication_identifier":{"isbn":["978-3-8440-8903-5"]},"department":[{"_id":"151"}],"date_updated":"2023-02-10T13:05:42Z","language":[{"iso":"eng"}],"series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","user_id":"55222","extern":"1","abstract":[{"text":"Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden.","lang":"ger"}],"volume":15,"date_created":"2023-02-10T13:05:19Z","status":"public","keyword":["heavy copper bonding","wire bonding","quality prediction","friction model","point-contact-element"],"author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"}],"publisher":"Shaker","intvolume":" 15","_id":"41971","page":"192","type":"dissertation","citation":{"chicago":"Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.","ama":"Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.","apa":"Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.","mla":"Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.","bibtex":"@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","short":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.","ieee":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023."},"year":"2023","supervisor":[{"full_name":"Sextro, Walter","first_name":"Walter","id":"21220","last_name":"Sextro"}],"main_file_link":[{"url":"https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff"}]},{"year":"2021","type":"journal_article","citation":{"bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077","apa":"Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077."},"page":"114077","_id":"21436","intvolume":" 119","author":[{"id":"28647","last_name":"Schemmel","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"last_name":"Krieger","first_name":"Viktor","full_name":"Krieger, Viktor"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"quality_controlled":"1","publication":"Microelectronics Reliability","keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"status":"public","date_created":"2021-03-10T09:37:02Z","volume":119,"abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.","lang":"eng"}],"user_id":"210","language":[{"iso":"eng"}],"date_updated":"2023-09-21T14:15:33Z","doi":"https://doi.org/10.1016/j.microrel.2021.114077","department":[{"_id":"151"}],"publication_status":"published","publication_identifier":{"issn":["0026-2714"]},"title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization"},{"user_id":"210","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives."}],"status":"public","date_created":"2019-05-27T10:27:45Z","project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"volume":"Vol. 2018, No. 1, pp. 000572-000577.","author":[{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"}],"quality_controlled":"1","department":[{"_id":"151"}],"keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","doi":"10.4071/2380-4505-2018.1.000572","date_updated":"2020-05-07T05:33:56Z","_id":"9999","language":[{"iso":"eng"}],"year":"2018","type":"conference","citation":{"ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.","bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.). https://doi.org/10.4071/2380-4505-2018.1.000572","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572."}},{"year":"2018","citation":{"mla":"Rösener, Thomas, et al. “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility.” European Journal of Inorganic Chemistry, vol. 2018, no. 27, 2018, pp. 3164–75, doi:10.1002/ejic.201800511.","bibtex":"@article{Rösener_Hoffmann_Herres-Pawlis_2018, title={Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility}, volume={2018}, DOI={10.1002/ejic.201800511}, number={27}, journal={European Journal of Inorganic Chemistry}, author={Rösener, Thomas and Hoffmann, Alexander and Herres-Pawlis, Sonja}, year={2018}, pages={3164–3175} }","chicago":"Rösener, Thomas, Alexander Hoffmann, and Sonja Herres-Pawlis. “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility.” European Journal of Inorganic Chemistry 2018, no. 27 (2018): 3164–75. https://doi.org/10.1002/ejic.201800511.","ama":"Rösener T, Hoffmann A, Herres-Pawlis S. Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility. European Journal of Inorganic Chemistry. 2018;2018(27):3164-3175. doi:10.1002/ejic.201800511","apa":"Rösener, T., Hoffmann, A., & Herres-Pawlis, S. (2018). Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility. European Journal of Inorganic Chemistry, 2018(27), 3164–3175. https://doi.org/10.1002/ejic.201800511","ieee":"T. Rösener, A. Hoffmann, and S. Herres-Pawlis, “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility,” European Journal of Inorganic Chemistry, vol. 2018, no. 27, pp. 3164–3175, 2018.","short":"T. Rösener, A. Hoffmann, S. Herres-Pawlis, European Journal of Inorganic Chemistry 2018 (2018) 3164–3175."},"type":"journal_article","page":"3164-3175","language":[{"iso":"eng"}],"doi":"10.1002/ejic.201800511","issue":"27","intvolume":" 2018","_id":"13186","date_updated":"2022-01-06T06:51:30Z","volume":2018,"status":"public","project":[{"_id":"52","name":"Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"date_created":"2019-09-11T11:00:06Z","author":[{"first_name":"Thomas","full_name":"Rösener, Thomas","last_name":"Rösener"},{"last_name":"Hoffmann","first_name":"Alexander","full_name":"Hoffmann, Alexander"},{"first_name":"Sonja","full_name":"Herres-Pawlis, Sonja","last_name":"Herres-Pawlis"}],"keyword":["Copper","Polymerization","Redox chemistry","Structure elucidation","Ligand effects"],"publication":"European Journal of Inorganic Chemistry","title":"Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility","user_id":"40778","abstract":[{"text":"Ligands DMEG6etqu, TMG6etqu, DMEG6buqu, and TMG6buqu were developed on the basis of guanidine quinoline (GUAqu) ligands 1,3-dimethyl-N-(quinolin-8-yl)imidazolidin-2-imine (DMEGqu) and 1,1,3,3-tetramethyl-2-(quinolin-8-yl)guanidine (TMGqu). These ligands feature an alkyl substituent at the C6 of the quinoline backbone. The synthetic strategy developed here enables inexpensive syntheses of any kind of C6-substituted GUAqu ligands. On one hand, the alkylation increases the solubility of corresponding copper complexes in apolar atom transfer radical polymerization (ATRP) monomers like styrene. On the other hand, it has a significant electronic influence and thus an effect on the donor properties of the new ligands. Seven CuI and CuII complexes of DMEG6etqu and TMG6etqu have been crystallized and were studied with regard to their structural and electrochemical properties. CuI and CuII complexes of DMEG6buqu and TMG6buqu turned out to be perfectly soluble in pure styrene even at room temperature, which makes them excellent catalysts in the ATRP of apolar monomers. The key characteristics of the ATRP equilibrium, KATRP and kact, were determined for the new complexes. In addition, we used our recently developed DFT methodology, NBO analysis, and isodesmic reactions to predict the influence of the introduced alkyl substituents. It turned out that high conformational freedom in the complex structures leads to a significant uncertainty in prediction of the thermodynamic properties.","lang":"eng"}]},{"abstract":[{"text":"Abstract The reaction of Cu(I) bisguanidine complexes with nitric oxide and the formation of intermediate species were monitored via UV-vis spectroscopy at low temperature, with the occurrence of characteristic absorption bands. The origin of the emerging species and their character were substantiated by electron paramagnetic resonance (EPR) measurements and density functional theory (DFT) studies showing a delocalized {CuNO}11 radical species. Furthermore, this system was transferred to the SuperFocus mixer setup, which allows rapid mixing and the determination of decay constants at ambient temperatures of the thermally sensitive species. However, these experiments demonstrated the limits of these systems, such as the NO saturation in organic solvents and a preferably precise temperature control within the SuperFocus mixer, which should be addressed in the future.","lang":"eng"}],"title":"Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer","user_id":"40778","author":[{"last_name":"Oppermann","first_name":"Alexander","full_name":"Oppermann, Alexander"},{"last_name":"Laurini","full_name":"Laurini, Larissa","first_name":"Larissa"},{"full_name":"Etscheidt, Fabian","first_name":"Fabian","last_name":"Etscheidt"},{"last_name":"Hollmann","full_name":"Hollmann, Katharina","first_name":"Katharina"},{"last_name":"Strassl","full_name":"Strassl, Florian","first_name":"Florian"},{"full_name":"Hoffmann, Alexander","first_name":"Alexander","last_name":"Hoffmann"},{"full_name":"Schurr, Daniela","first_name":"Daniela","last_name":"Schurr"},{"full_name":"Dittmeyer, Roland","first_name":"Roland","last_name":"Dittmeyer"},{"last_name":"Rinke","first_name":"Günter","full_name":"Rinke, Günter"},{"last_name":"Herres-Pawlis","full_name":"Herres-Pawlis, Sonja","first_name":"Sonja"}],"keyword":["Copper guanidine complexes","Nitric oxide","SuperFocus mixer"],"publication":"Chemical Engineering \\& Technology","volume":40,"status":"public","project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"date_created":"2019-09-11T11:01:30Z","_id":"13187","intvolume":" 40","date_updated":"2022-01-06T06:51:30Z","doi":"10.1002/ceat.201600691","issue":"8","year":"2017","type":"journal_article","citation":{"bibtex":"@article{Oppermann_Laurini_Etscheidt_Hollmann_Strassl_Hoffmann_Schurr_Dittmeyer_Rinke_Herres-Pawlis_2017, title={Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer}, volume={40}, DOI={10.1002/ceat.201600691}, number={8}, journal={Chemical Engineering \\& Technology}, author={Oppermann, Alexander and Laurini, Larissa and Etscheidt, Fabian and Hollmann, Katharina and Strassl, Florian and Hoffmann, Alexander and Schurr, Daniela and Dittmeyer, Roland and Rinke, Günter and Herres-Pawlis, Sonja}, year={2017}, pages={1475–1483} }","mla":"Oppermann, Alexander, et al. “Detection of Copper Bisguanidine NO Adducts by UV-Vis Spectroscopy and a SuperFocus Mixer.” Chemical Engineering \\& Technology, vol. 40, no. 8, 2017, pp. 1475–83, doi:10.1002/ceat.201600691.","ama":"Oppermann A, Laurini L, Etscheidt F, et al. Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer. Chemical Engineering \\& Technology. 2017;40(8):1475-1483. doi:10.1002/ceat.201600691","apa":"Oppermann, A., Laurini, L., Etscheidt, F., Hollmann, K., Strassl, F., Hoffmann, A., … Herres-Pawlis, S. (2017). Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer. Chemical Engineering \\& Technology, 40(8), 1475–1483. https://doi.org/10.1002/ceat.201600691","chicago":"Oppermann, Alexander, Larissa Laurini, Fabian Etscheidt, Katharina Hollmann, Florian Strassl, Alexander Hoffmann, Daniela Schurr, Roland Dittmeyer, Günter Rinke, and Sonja Herres-Pawlis. “Detection of Copper Bisguanidine NO Adducts by UV-Vis Spectroscopy and a SuperFocus Mixer.” Chemical Engineering \\& Technology 40, no. 8 (2017): 1475–83. https://doi.org/10.1002/ceat.201600691.","ieee":"A. Oppermann et al., “Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer,” Chemical Engineering \\& Technology, vol. 40, no. 8, pp. 1475–1483, 2017.","short":"A. Oppermann, L. Laurini, F. Etscheidt, K. Hollmann, F. Strassl, A. Hoffmann, D. Schurr, R. Dittmeyer, G. Rinke, S. Herres-Pawlis, Chemical Engineering \\& Technology 40 (2017) 1475–1483."},"page":"1475-1483","language":[{"iso":"eng"}]},{"user_id":"55222","title":"Effect of different oxide layers on the ultrasonic copper wire bond process","abstract":[{"lang":"eng","text":"Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties."}],"date_created":"2019-05-27T09:00:50Z","status":"public","keyword":["Ultrasonic copper wire bonding","Al-oxide","Cuoxide","oxide-free","roughness","morphology"],"department":[{"_id":"151"}],"publication":"IEEE 66th Electronic Components and Technology Conference","author":[{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"full_name":"Eichwald, Paul","first_name":"Paul","last_name":"Eichwald"},{"last_name":"Grydin","first_name":"Olexandr","full_name":"Grydin, Olexandr"},{"last_name":"Hengsbach","full_name":"Hengsbach, Florian","first_name":"Florian"},{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"last_name":"Schaper","full_name":"Schaper, Mirko","first_name":"Mirko"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"}],"quality_controlled":"1","doi":"10.1109/ECTC.2016.91","_id":"9959","date_updated":"2019-09-16T10:38:59Z","language":[{"iso":"eng"}],"page":"2111-2118","year":"2016","citation":{"ieee":"F. Eacock et al., “Effect of different oxide layers on the ultrasonic copper wire bond process,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.","short":"F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.","mla":"Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.","bibtex":"@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={10.1109/ECTC.2016.91}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }","chicago":"Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.","apa":"Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In IEEE 66th Electronic Components and Technology Conference (pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91","ama":"Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91"},"type":"conference"},{"date_created":"2019-05-27T09:17:26Z","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"status":"public","publication":"IEEE 66th Electronic Components and Technology Conference","keyword":["Self-optimization","adaptive system","bond process","copper wire"],"department":[{"_id":"151"}],"author":[{"full_name":"Meyer , Tobias","first_name":"Tobias","last_name":"Meyer "},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"}],"quality_controlled":"1","title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","user_id":"210","abstract":[{"lang":"eng","text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented."}],"page":"622-628","year":"2016","type":"conference","citation":{"bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={10.1109/ECTC.2016.215}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.","ama":"Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215","apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215","ieee":"T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628."},"language":[{"iso":"eng"}],"doi":"10.1109/ECTC.2016.215","_id":"9966","date_updated":"2020-05-07T05:33:53Z"},{"doi":"10.1109/ECTC.2014.6897500","date_updated":"2019-09-16T10:57:58Z","_id":"9868","language":[{"iso":"eng"}],"citation":{"short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014. https://doi.org/10.1109/ECTC.2014.6897500.","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }"},"type":"conference","year":"2014","page":"1549-1555","user_id":"55222","title":"Improving the bond quality of copper wire bonds using a friction model approach","abstract":[{"text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool.","lang":"eng"}],"status":"public","date_created":"2019-05-20T12:11:44Z","author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"full_name":"Neuhaus, Jan","first_name":"Jan","last_name":"Neuhaus"},{"full_name":"Hemsel, Tobias","first_name":"Tobias","id":"210","last_name":"Hemsel"},{"first_name":"Walter","full_name":"Sextro, Walter","last_name":"Sextro","id":"21220"}],"quality_controlled":"1","keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","department":[{"_id":"151"}]},{"date_updated":"2019-09-16T10:58:50Z","_id":"9870","doi":"10.4071/isom-THP32","language":[{"iso":"eng"}],"year":"2014","citation":{"ieee":"F. Eacock et al., “Microstructural investigations of aluminum and copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics, 2014.","short":"F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.","mla":"Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” Proceedings of the 47th International Symposium on Microelectronics, 2014, doi:10.4071/isom-THP32.","bibtex":"@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title={Microstructural investigations of aluminum and copper wire bonds}, DOI={10.4071/isom-THP32}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig, Martin Joachim and Guth, Karsten}, year={2014} }","ama":"Eacock F, Schaper M, Althoff S, et al. Microstructural investigations of aluminum and copper wire bonds. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014. doi:10.4071/isom-THP32","apa":"Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics. https://doi.org/10.4071/isom-THP32","chicago":"Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In Proceedings of the 47th International Symposium on Microelectronics, 2014. https://doi.org/10.4071/isom-THP32."},"type":"conference","abstract":[{"lang":"eng","text":"Nowadays wire bonding is a widely-used technology for interconnecting chips in the packaging industry. Thereby, it is known that the bond quality massively depends upon the microstructure prevailing in the bond and consequently the materials used as well as the bonding parameters. However the actually used materials such as aluminum and gold are either characterized by comparibly poor conductivity or high costs, respectively. Due to its outstanding properties copper is a more attractive candidate. Still, a thorough investigation on the interrelationship between the material combinations, the processing parameters and the resulting microstructure for copper and aluminum wire bonding was not carried out yet. Depending on the aforementioned factors the microstructural evolution can be completely different during the bonding process. Therefore, this study focuses on the microstructural evolution of heavy copper and heavy aluminum wires bonded on copper substrates. The evolution of the wire microstructure as well as the wire-substrate-interface was investigated by scanning electron microscope in combination with electron backscatter diffraction and microhardness measurements. Various samples were extracted at different points of the bonding process, namely the as-received condition, after touchdown and after completed bonding. The results of the aluminum and copper wires were compared to each other in both longitudinal and transversal direction. It was found, that the two wire materials were completely different in the as-received condition regarding the grain size, the grain morphology, the texture and the microhardness. After touchdown the microstructure did not show significant changes in both materials, yet a strain-hardening was observed in the copper wire resulting from the touchdown force. When the bonding process was completed a different microstructure could be observed in both the wire as well as the layer for the materials investigated. Furthermore, a destinctive increase in the wire hardness could be found in case of copper, which was not observed for the aluminum wire. The ramifications between the two wire materials presented in this work will be discussed with the objective of optimizing the quality of the bonds."}],"user_id":"55222","title":"Microstructural investigations of aluminum and copper wire bonds","quality_controlled":"1","author":[{"full_name":"Eacock , Florian","first_name":"Florian","last_name":"Eacock "},{"last_name":"Schaper","full_name":"Schaper, Mirko","first_name":"Mirko"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"last_name":"Eichwald","first_name":"Paul","full_name":"Eichwald, Paul"},{"first_name":"Florian","full_name":"Hengsbach, Florian","last_name":"Hengsbach"},{"last_name":"Zinn","full_name":"Zinn, Carolin","first_name":"Carolin"},{"last_name":"Holzweissig","first_name":" Martin Joachim","full_name":"Holzweissig, Martin Joachim"},{"full_name":"Guth, Karsten","first_name":"Karsten","last_name":"Guth"}],"keyword":["Bonding","Copper","Microstructure evolution"],"department":[{"_id":"151"}],"publication":"Proceedings of the 47th International Symposium on Microelectronics","status":"public","date_created":"2019-05-20T12:14:11Z"},{"abstract":[{"lang":"eng","text":"Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the fields of renewable energies. One of the main cost factors in the manufacturing process is the consumables like bonding tools. The technological transition to copper as wire material causes significant wear on the millimeter large effective contact area of the bonding tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections which can be produced by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently a better understanding of wear and recognition of wear pattern is required. Therefore, the paper presents an analyzing method of the tool topography change of a heavy wire bonding tool by using a confocal microscope. Furthermore, the paper discusses the identification of the main wear indicators by the help of the named topography change for different bond parameters, like ultrasonic power and tool geometry. Reference topography has been carried out by choosing typical parameters of the production line. To judge whether the quality requirement of the bond connections made by a single tool cannot be fulfilled shear test of the source bond have been carried out after a defined number of produced bond connections. Main steps of analysis: (I)Topography of the tool surface is sampled after a defined number of bonds by means of a confocal microscope to detect the wear progress.(II)The recorded data is filtered using Matlab. So, measurement errors can be eliminated and the topography can be overlaid more easy to identify differences between diverse tools or differences in wear stages of the same tool.(III)The subsequent discretization of the topography into sub volumes allows to (IV)describe the loss of volume depending on the position in the groove. Thereby, intermediate status of wear of one tool can be used to obtain a persistent description of the topography change over the number of produced bonds by interpolating the confocal data. Afterwards the persistent change of the groove flank has been analyzed for the named test series to identify the main wear indicators and their effect on shear forces. All worn tools show dominant areas for volume loss especially for plastic deformation and accordingly abrasion. These wear mechanism can be referred to the change of main parts of the groove geometry like the rounding of the front and back radius. The most volume loss was identified in the upper part of the tool flanks or rather at the transition from the groove flank to the front or back radius. Furthermore the observation of the center of the groove flank shows just a little change in volume. All in all, the identification of the wear indicators will be discussed with the objective of increasing the tool lifetime by optimizing the tool geometry without losses in bond quality and reliability."}],"user_id":"210","title":"Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding","department":[{"_id":"151"}],"publication":"Proceedings of the 47th International Symposium on Microelectronics","keyword":["wedge/wedge bonding","copper wire","tool wear"],"author":[{"first_name":"Paul","full_name":"Eichwald, Paul","last_name":"Eichwald"},{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"},{"last_name":"Althof","full_name":"Althof, Simon","first_name":"Simon"},{"full_name":"Eacock, Florian","first_name":"Florian","last_name":"Eacock"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"full_name":"Guth, Karsten","first_name":"Karsten","last_name":"Guth"}],"date_created":"2019-05-20T12:18:55Z","project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"status":"public","_id":"9871","date_updated":"2020-05-07T05:33:45Z","doi":"10.4071/isom-THP34","language":[{"iso":"eng"}],"page":"856-861","type":"conference","year":"2014","citation":{"ieee":"P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.","short":"P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.","bibtex":"@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }","mla":"Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.","chicago":"Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.","ama":"Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014:856-861. doi:10.4071/isom-THP34","apa":"Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., & Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the 47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34"}},{"date_updated":"2020-05-07T05:33:47Z","_id":"9895","type":"conference","citation":{"ieee":"A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.","short":"A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.","mla":"Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }","apa":"Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., & Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.","ama":"Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.","chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014."},"year":"2014","page":"289-294","language":[{"iso":"eng"}],"place":"San Diego, CA, US","abstract":[{"text":"Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding.","lang":"eng"}],"title":"Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds","user_id":"210","author":[{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"full_name":"Sextro, Walter","first_name":"Walter","id":"21220","last_name":"Sextro"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"first_name":"Paul","full_name":"Eichwald, Paul","last_name":"Eichwald"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"},{"last_name":"Brökelmann","first_name":"Michael","full_name":"Brökelmann, Michael"}],"publication":"Proceedings of the 47th International Symposium on Microelectronics (IMAPS)","department":[{"_id":"151"}],"keyword":["pre-deformation","copper wire bonding","finite element model"],"status":"public","date_created":"2019-05-20T13:35:09Z","project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}]},{"issue":"10","intvolume":" 130","_id":"4548","type":"journal_article","citation":{"short":"S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, H.-J. Warnecke, Journal of Luminescence 130 (2010) 1958–1962.","ieee":"S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, and H.-J. Warnecke, “Oxygen sensing by fluorescence quenching of [Cu(btmgp)I],” Journal of Luminescence, vol. 130, no. 10, pp. 1958–1962, 2010.","chicago":"Herres-Pawlis, Sonja, Gerhard Berth, Volker Wiedemeier, Ludger Schmidt, Artur Zrenner, and Hans-Joachim Warnecke. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].” Journal of Luminescence 130, no. 10 (2010): 1958–62. https://doi.org/10.1016/j.jlumin.2010.05.012.","apa":"Herres-Pawlis, S., Berth, G., Wiedemeier, V., Schmidt, L., Zrenner, A., & Warnecke, H.-J. (2010). Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence, 130(10), 1958–1962. https://doi.org/10.1016/j.jlumin.2010.05.012","ama":"Herres-Pawlis S, Berth G, Wiedemeier V, Schmidt L, Zrenner A, Warnecke H-J. Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence. 2010;130(10):1958-1962. doi:10.1016/j.jlumin.2010.05.012","bibtex":"@article{Herres-Pawlis_Berth_Wiedemeier_Schmidt_Zrenner_Warnecke_2010, title={Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]}, volume={130}, DOI={10.1016/j.jlumin.2010.05.012}, number={10}, journal={Journal of Luminescence}, publisher={Elsevier BV}, author={Herres-Pawlis, Sonja and Berth, Gerhard and Wiedemeier, Volker and Schmidt, Ludger and Zrenner, Artur and Warnecke, Hans-Joachim}, year={2010}, pages={1958–1962} }","mla":"Herres-Pawlis, Sonja, et al. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].” Journal of Luminescence, vol. 130, no. 10, Elsevier BV, 2010, pp. 1958–62, doi:10.1016/j.jlumin.2010.05.012."},"year":"2010","page":"1958-1962","user_id":"49428","article_type":"original","abstract":[{"lang":"eng","text":"A fluorescence study of acetonitrile solutions of bis(tetramethylguanidine)propane, copper(I)-iodide and [Cu(btmgp)I] was performed and the chemical reaction of the latter species with O2 was investigated at room temperature. The actual quenching process via O2 gassing was studied and an exponential dependence of the fluorescence intensity with respect to the complex concentration was observed.\r\nFurthermore the survey was deepened on time resolved fluorescence properties of solved [Cu(btmgp)I] in a wider concentration range. The applicability of this complex for O2 sensing inside a microreactor system was proven by confocal fluorescence measurements. It was shown that the investigated system can be used for oxygen sensing in the copper concentration range from 10−2 to 10−9 mol/l."}],"status":"public","date_created":"2018-09-20T12:31:16Z","volume":130,"author":[{"last_name":"Herres-Pawlis","full_name":"Herres-Pawlis, Sonja","first_name":"Sonja"},{"first_name":"Gerhard","full_name":"Berth, Gerhard","last_name":"Berth","id":"53"},{"last_name":"Wiedemeier","first_name":"Volker","full_name":"Wiedemeier, Volker"},{"full_name":"Schmidt, Ludger","first_name":"Ludger","last_name":"Schmidt"},{"full_name":"Zrenner, Artur","orcid":"0000-0002-5190-0944","first_name":"Artur","id":"606","last_name":"Zrenner"},{"last_name":"Warnecke","full_name":"Warnecke, Hans-Joachim","first_name":"Hans-Joachim"}],"publisher":"Elsevier BV","publication":"Journal of Luminescence","keyword":["Copper Oxygen Fluorescence quenching N donor ligands"],"doi":"10.1016/j.jlumin.2010.05.012","date_updated":"2022-01-06T07:01:09Z","language":[{"iso":"eng"}],"title":"Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]","publication_identifier":{"issn":["0022-2313"]},"publication_status":"published","department":[{"_id":"15"},{"_id":"230"},{"_id":"35"}]}]