---
_id: '41971'
abstract:
- lang: ger
text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau-
und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und
damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter
auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen
verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern
in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität.
In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand
von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst
wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen
von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten
die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität.
Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich
unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden
hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen
zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu
einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte
Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren
Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers
modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle
ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten
Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker
im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert
werden."
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
citation:
ama: Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Vol 15. Shaker; 2023.
apa: Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds
using a Friction Model Approach (Vol. 15). Shaker.
bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction
Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023},
collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds
Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik
Und Mechatronik. Shaker, 2023.
ieee: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using
a Friction Model Approach, vol. 15. Shaker, 2023.
mla: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Shaker, 2023.
short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach, Shaker, 2023.
date_created: 2023-02-10T13:05:19Z
date_updated: 2023-02-10T13:05:42Z
department:
- _id: '151'
extern: '1'
intvolume: ' 15'
keyword:
- heavy copper bonding
- wire bonding
- quality prediction
- friction model
- point-contact-element
language:
- iso: eng
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff
page: '192'
publication_identifier:
isbn:
- 978-3-8440-8903-5
publication_status: published
publisher: Shaker
related_material:
link:
- relation: confirmation
url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model
Approach
type: dissertation
user_id: '55222'
volume: 15
year: '2023'
...
---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '13186'
abstract:
- lang: eng
text: Ligands DMEG6etqu, TMG6etqu, DMEG6buqu, and TMG6buqu were developed on the
basis of guanidine quinoline (GUAqu) ligands 1,3-dimethyl-N-(quinolin-8-yl)imidazolidin-2-imine
(DMEGqu) and 1,1,3,3-tetramethyl-2-(quinolin-8-yl)guanidine (TMGqu). These ligands
feature an alkyl substituent at the C6 of the quinoline backbone. The synthetic
strategy developed here enables inexpensive syntheses of any kind of C6-substituted
GUAqu ligands. On one hand, the alkylation increases the solubility of corresponding
copper complexes in apolar atom transfer radical polymerization (ATRP) monomers
like styrene. On the other hand, it has a significant electronic influence and
thus an effect on the donor properties of the new ligands. Seven CuI and CuII
complexes of DMEG6etqu and TMG6etqu have been crystallized and were studied with
regard to their structural and electrochemical properties. CuI and CuII complexes
of DMEG6buqu and TMG6buqu turned out to be perfectly soluble in pure styrene even
at room temperature, which makes them excellent catalysts in the ATRP of apolar
monomers. The key characteristics of the ATRP equilibrium, KATRP and kact, were
determined for the new complexes. In addition, we used our recently developed
DFT methodology, NBO analysis, and isodesmic reactions to predict the influence
of the introduced alkyl substituents. It turned out that high conformational freedom
in the complex structures leads to a significant uncertainty in prediction of
the thermodynamic properties.
author:
- first_name: Thomas
full_name: Rösener, Thomas
last_name: Rösener
- first_name: Alexander
full_name: Hoffmann, Alexander
last_name: Hoffmann
- first_name: Sonja
full_name: Herres-Pawlis, Sonja
last_name: Herres-Pawlis
citation:
ama: 'Rösener T, Hoffmann A, Herres-Pawlis S. Next Generation of Guanidine Quinoline
Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution
on Redox Chemistry and Solubility. European Journal of Inorganic Chemistry.
2018;2018(27):3164-3175. doi:10.1002/ejic.201800511'
apa: 'Rösener, T., Hoffmann, A., & Herres-Pawlis, S. (2018). Next Generation
of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence
of Backbone Substitution on Redox Chemistry and Solubility. European Journal
of Inorganic Chemistry, 2018(27), 3164–3175. https://doi.org/10.1002/ejic.201800511'
bibtex: '@article{Rösener_Hoffmann_Herres-Pawlis_2018, title={Next Generation of
Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of
Backbone Substitution on Redox Chemistry and Solubility}, volume={2018}, DOI={10.1002/ejic.201800511}, number={27},
journal={European Journal of Inorganic Chemistry}, author={Rösener, Thomas and
Hoffmann, Alexander and Herres-Pawlis, Sonja}, year={2018}, pages={3164–3175}
}'
chicago: 'Rösener, Thomas, Alexander Hoffmann, and Sonja Herres-Pawlis. “Next Generation
of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence
of Backbone Substitution on Redox Chemistry and Solubility.” European Journal
of Inorganic Chemistry 2018, no. 27 (2018): 3164–75. https://doi.org/10.1002/ejic.201800511.'
ieee: 'T. Rösener, A. Hoffmann, and S. Herres-Pawlis, “Next Generation of Guanidine
Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution
on Redox Chemistry and Solubility,” European Journal of Inorganic Chemistry,
vol. 2018, no. 27, pp. 3164–3175, 2018.'
mla: 'Rösener, Thomas, et al. “Next Generation of Guanidine Quinoline Copper Complexes
for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry
and Solubility.” European Journal of Inorganic Chemistry, vol. 2018, no.
27, 2018, pp. 3164–75, doi:10.1002/ejic.201800511.'
short: T. Rösener, A. Hoffmann, S. Herres-Pawlis, European Journal of Inorganic
Chemistry 2018 (2018) 3164–3175.
date_created: 2019-09-11T11:00:06Z
date_updated: 2022-01-06T06:51:30Z
doi: 10.1002/ejic.201800511
intvolume: ' 2018'
issue: '27'
keyword:
- Copper
- Polymerization
- Redox chemistry
- Structure elucidation
- Ligand effects
language:
- iso: eng
page: 3164-3175
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: European Journal of Inorganic Chemistry
status: public
title: 'Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled
ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility'
type: journal_article
user_id: '40778'
volume: 2018
year: '2018'
...
---
_id: '13187'
abstract:
- lang: eng
text: Abstract The reaction of Cu(I) bisguanidine complexes with nitric oxide and
the formation of intermediate species were monitored via UV-vis spectroscopy at
low temperature, with the occurrence of characteristic absorption bands. The origin
of the emerging species and their character were substantiated by electron paramagnetic
resonance (EPR) measurements and density functional theory (DFT) studies showing
a delocalized {CuNO}11 radical species. Furthermore, this system was transferred
to the SuperFocus mixer setup, which allows rapid mixing and the determination
of decay constants at ambient temperatures of the thermally sensitive species.
However, these experiments demonstrated the limits of these systems, such as the
NO saturation in organic solvents and a preferably precise temperature control
within the SuperFocus mixer, which should be addressed in the future.
author:
- first_name: Alexander
full_name: Oppermann, Alexander
last_name: Oppermann
- first_name: Larissa
full_name: Laurini, Larissa
last_name: Laurini
- first_name: Fabian
full_name: Etscheidt, Fabian
last_name: Etscheidt
- first_name: Katharina
full_name: Hollmann, Katharina
last_name: Hollmann
- first_name: Florian
full_name: Strassl, Florian
last_name: Strassl
- first_name: Alexander
full_name: Hoffmann, Alexander
last_name: Hoffmann
- first_name: Daniela
full_name: Schurr, Daniela
last_name: Schurr
- first_name: Roland
full_name: Dittmeyer, Roland
last_name: Dittmeyer
- first_name: Günter
full_name: Rinke, Günter
last_name: Rinke
- first_name: Sonja
full_name: Herres-Pawlis, Sonja
last_name: Herres-Pawlis
citation:
ama: Oppermann A, Laurini L, Etscheidt F, et al. Detection of Copper Bisguanidine
NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer. Chemical Engineering
\& Technology. 2017;40(8):1475-1483. doi:10.1002/ceat.201600691
apa: Oppermann, A., Laurini, L., Etscheidt, F., Hollmann, K., Strassl, F., Hoffmann,
A., … Herres-Pawlis, S. (2017). Detection of Copper Bisguanidine NO Adducts by
UV-vis Spectroscopy and a SuperFocus Mixer. Chemical Engineering \& Technology,
40(8), 1475–1483. https://doi.org/10.1002/ceat.201600691
bibtex: '@article{Oppermann_Laurini_Etscheidt_Hollmann_Strassl_Hoffmann_Schurr_Dittmeyer_Rinke_Herres-Pawlis_2017,
title={Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and
a SuperFocus Mixer}, volume={40}, DOI={10.1002/ceat.201600691},
number={8}, journal={Chemical Engineering \& Technology}, author={Oppermann,
Alexander and Laurini, Larissa and Etscheidt, Fabian and Hollmann, Katharina and
Strassl, Florian and Hoffmann, Alexander and Schurr, Daniela and Dittmeyer, Roland
and Rinke, Günter and Herres-Pawlis, Sonja}, year={2017}, pages={1475–1483} }'
chicago: 'Oppermann, Alexander, Larissa Laurini, Fabian Etscheidt, Katharina Hollmann,
Florian Strassl, Alexander Hoffmann, Daniela Schurr, Roland Dittmeyer, Günter
Rinke, and Sonja Herres-Pawlis. “Detection of Copper Bisguanidine NO Adducts by
UV-Vis Spectroscopy and a SuperFocus Mixer.” Chemical Engineering \& Technology
40, no. 8 (2017): 1475–83. https://doi.org/10.1002/ceat.201600691.'
ieee: A. Oppermann et al., “Detection of Copper Bisguanidine NO Adducts by
UV-vis Spectroscopy and a SuperFocus Mixer,” Chemical Engineering \& Technology,
vol. 40, no. 8, pp. 1475–1483, 2017.
mla: Oppermann, Alexander, et al. “Detection of Copper Bisguanidine NO Adducts by
UV-Vis Spectroscopy and a SuperFocus Mixer.” Chemical Engineering \& Technology,
vol. 40, no. 8, 2017, pp. 1475–83, doi:10.1002/ceat.201600691.
short: A. Oppermann, L. Laurini, F. Etscheidt, K. Hollmann, F. Strassl, A. Hoffmann,
D. Schurr, R. Dittmeyer, G. Rinke, S. Herres-Pawlis, Chemical Engineering \&
Technology 40 (2017) 1475–1483.
date_created: 2019-09-11T11:01:30Z
date_updated: 2022-01-06T06:51:30Z
doi: 10.1002/ceat.201600691
intvolume: ' 40'
issue: '8'
keyword:
- Copper guanidine complexes
- Nitric oxide
- SuperFocus mixer
language:
- iso: eng
page: 1475-1483
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Chemical Engineering \& Technology
status: public
title: Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus
Mixer
type: journal_article
user_id: '40778'
volume: 40
year: '2017'
...
---
_id: '9959'
abstract:
- lang: eng
text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical
devices in power electronics. In order to facilitate powerful solutions combined
with an increased efficiency, involving a material change from aluminum to copper
wire as conductor material takes place in recent years. Due to the material related
properties, copper wire bonding requires significant higher bond processing parameters
such as bond force and ultrasonic power compared to aluminum which can lead to
damages or a failure of the bonded component. Therefore, a profound knowledge
of the processes prevailing during wire bonding is essential to optimize the application
of the copper wires and consequently to achieve the demands on quality and reliability.
The behavior of different natural surface oxides of aluminum and copper are assumed
to be one reason for the deviation in the required bond parameters. Accordingly,
the impact of differently pre-treated substrates surfaces on which the bonding
is applied were investigated in this study. First, all conditions investigated
(as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning
electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy
and atomic force microscopy. In addition, hardness tests were performed as well
as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded
on the generated surfaces investigated. In consideration of the roughness, shear
test of various bond times and microscopic images were evaluated. Finally, the
results were compared and discussed. Overall, the current study indicates that
an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the
contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining
parts. Based on the obtained results, it can be expected that due to an ideal
set of Al-oxide layers, lower optimal bond parameters can used to reach high bond
strength with good reliability properties.
author:
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Olexandr
full_name: Grydin, Olexandr
last_name: Grydin
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on
the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91'
apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,
… Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire
bond process. In IEEE 66th Electronic Components and Technology Conference
(pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016,
title={Effect of different oxide layers on the ultrasonic copper wire bond process},
DOI={10.1109/ECTC.2016.91},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock,
Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach,
Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016},
pages={2111–2118} }'
chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian
Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different
Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic
Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
ieee: F. Eacock et al., “Effect of different oxide layers on the ultrasonic
copper wire bond process,” in IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 2111–2118.
mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic
Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M.
Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–2118.'
date_created: 2019-05-27T09:00:50Z
date_updated: 2019-09-16T10:38:59Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.91
keyword:
- Ultrasonic copper wire bonding
- Al-oxide
- Cuoxide
- oxide-free
- roughness
- morphology
language:
- iso: eng
page: 2111-2118
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Effect of different oxide layers on the ultrasonic copper wire bond process
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9870'
abstract:
- lang: eng
text: Nowadays wire bonding is a widely-used technology for interconnecting chips
in the packaging industry. Thereby, it is known that the bond quality massively
depends upon the microstructure prevailing in the bond and consequently the materials
used as well as the bonding parameters. However the actually used materials such
as aluminum and gold are either characterized by comparibly poor conductivity
or high costs, respectively. Due to its outstanding properties copper is a more
attractive candidate. Still, a thorough investigation on the interrelationship
between the material combinations, the processing parameters and the resulting
microstructure for copper and aluminum wire bonding was not carried out yet. Depending
on the aforementioned factors the microstructural evolution can be completely
different during the bonding process. Therefore, this study focuses on the microstructural
evolution of heavy copper and heavy aluminum wires bonded on copper substrates.
The evolution of the wire microstructure as well as the wire-substrate-interface
was investigated by scanning electron microscope in combination with electron
backscatter diffraction and microhardness measurements. Various samples were extracted
at different points of the bonding process, namely the as-received condition,
after touchdown and after completed bonding. The results of the aluminum and copper
wires were compared to each other in both longitudinal and transversal direction.
It was found, that the two wire materials were completely different in the as-received
condition regarding the grain size, the grain morphology, the texture and the
microhardness. After touchdown the microstructure did not show significant changes
in both materials, yet a strain-hardening was observed in the copper wire resulting
from the touchdown force. When the bonding process was completed a different microstructure
could be observed in both the wire as well as the layer for the materials investigated.
Furthermore, a destinctive increase in the wire hardness could be found in case
of copper, which was not observed for the aluminum wire. The ramifications between
the two wire materials presented in this work will be discussed with the objective
of optimizing the quality of the bonds.
author:
- first_name: Florian
full_name: Eacock , Florian
last_name: 'Eacock '
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Carolin
full_name: Zinn, Carolin
last_name: Zinn
- first_name: ' Martin Joachim'
full_name: Holzweissig, Martin Joachim
last_name: Holzweissig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Schaper M, Althoff S, et al. Microstructural investigations of
aluminum and copper wire bonds. In: Proceedings of the 47th International Symposium
on Microelectronics. ; 2014. doi:10.4071/isom-THP32'
apa: Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach,
F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire
bonds. In Proceedings of the 47th International Symposium on Microelectronics.
https://doi.org/10.4071/isom-THP32
bibtex: '@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014,
title={Microstructural investigations of aluminum and copper wire bonds}, DOI={10.4071/isom-THP32}, booktitle={Proceedings
of the 47th International Symposium on Microelectronics}, author={Eacock , Florian
and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and
Hengsbach, Florian and Zinn, Carolin and Holzweissig, Martin Joachim and Guth,
Karsten}, year={2014} }'
chicago: Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald,
Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth.
“Microstructural Investigations of Aluminum and Copper Wire Bonds.” In Proceedings
of the 47th International Symposium on Microelectronics, 2014. https://doi.org/10.4071/isom-THP32.
ieee: F. Eacock et al., “Microstructural investigations of aluminum and
copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics,
2014.
mla: Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper
Wire Bonds.” Proceedings of the 47th International Symposium on Microelectronics,
2014, doi:10.4071/isom-THP32.
short: 'F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach,
C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International
Symposium on Microelectronics, 2014.'
date_created: 2019-05-20T12:14:11Z
date_updated: 2019-09-16T10:58:50Z
department:
- _id: '151'
doi: 10.4071/isom-THP32
keyword:
- Bonding
- Copper
- Microstructure evolution
language:
- iso: eng
publication: Proceedings of the 47th International Symposium on Microelectronics
quality_controlled: '1'
status: public
title: Microstructural investigations of aluminum and copper wire bonds
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9871'
abstract:
- lang: eng
text: 'Wire bonding is the most common technology for connecting electronic components.
Due to their efficiency bond interconnections made of copper wire are used for
example in the aerospace and medical technology as well as in the fields of renewable
energies. One of the main cost factors in the manufacturing process is the consumables
like bonding tools. The technological transition to copper as wire material causes
significant wear on the millimeter large effective contact area of the bonding
tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
which can be produced by a single tool. To reduce setting-up time in the production
and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
a better understanding of wear and recognition of wear pattern is required. Therefore,
the paper presents an analyzing method of the tool topography change of a heavy
wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
the identification of the main wear indicators by the help of the named topography
change for different bond parameters, like ultrasonic power and tool geometry.
Reference topography has been carried out by choosing typical parameters of the
production line. To judge whether the quality requirement of the bond connections
made by a single tool cannot be fulfilled shear test of the source bond have been
carried out after a defined number of produced bond connections. Main steps of
analysis: (I)Topography of the tool surface is sampled after a defined number
of bonds by means of a confocal microscope to detect the wear progress.(II)The
recorded data is filtered using Matlab. So, measurement errors can be eliminated
and the topography can be overlaid more easy to identify differences between diverse
tools or differences in wear stages of the same tool.(III)The subsequent discretization
of the topography into sub volumes allows to (IV)describe the loss of volume depending
on the position in the groove. Thereby, intermediate status of wear of one tool
can be used to obtain a persistent description of the topography change over the
number of produced bonds by interpolating the confocal data. Afterwards the persistent
change of the groove flank has been analyzed for the named test series to identify
the main wear indicators and their effect on shear forces. All worn tools show
dominant areas for volume loss especially for plastic deformation and accordingly
abrasion. These wear mechanism can be referred to the change of main parts of
the groove geometry like the rounding of the front and back radius. The most volume
loss was identified in the upper part of the tool flanks or rather at the transition
from the groove flank to the front or back radius. Furthermore the observation
of the center of the groove flank shows just a little change in volume. All in
all, the identification of the wear indicators will be discussed with the objective
of increasing the tool lifetime by optimizing the tool geometry without losses
in bond quality and reliability.'
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althof, Simon
last_name: Althof
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
In: Proceedings of the 47th International Symposium on Microelectronics.
; 2014:856-861. doi:10.4071/isom-THP34'
apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &
Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the
47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
Method of Tool Topography Change and Identification of Wear Indicators for Heavy
Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34},
booktitle={Proceedings of the 47th International Symposium on Microelectronics},
author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
}'
chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings
of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
ieee: P. Eichwald et al., “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings
of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the
47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9895'
abstract:
- lang: eng
text: Power semiconductor modules are used to control and switch high electrical
currents and voltages. Within the power module package wire bonding is used as
an interconnection technology. In recent years, aluminum wire has been used preferably,
but an ever-growing market of powerful and efficient power modules requires a
material with better mechanical and electrical properties. For this reason, a
technology change from aluminum to copper is indispensable. However, the copper
wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
reliable copper bond connections a challenging task. The aim of the BMBF funded
project Itsowl-InCuB is the development of self-optimizing techniques to enable
the reliable production of copper bond connections under varying conditions. A
model of the process is essential to achieve this aim. This model needs to include
the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
process. In the touchdown phase, the wire is pressed into the V-groove of the
tool and a small initial contact area between wire and substrate arise. The local
characteristics of the material change abruptly because of the cold forming. Consequently,
the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
effect during the touchdown process of aluminum wires by cracking of oxide layers
was presented. These interactions of the process parameters are still largely
unknown for copper. In a first step, this paper validates the importance of modeling
the pre-deformation by showing its impact on the wire deformation characteristic
experimentally. Creating cross-section views of pre-deformed copper wires has
shown a low deformation degree compared to aluminum. By using a digital microscope
and a scanning confocal microscope an analysis about the contact areas and penetration
depths after touchdown has been made. Additionally, it has to be taken into account
that the dynamical touchdown force depends on the touchdown speed and the touchdown
force set in the bonding machine. In order to measure the overshoot in the force
signals, a strain gauge sensor has been used. Subsequently, the affecting factors
have been interpreted independently Furthermore, the material properties of copper
wire have been investigated with tensile tests and hardness measurements. In a
second step, the paper presents finite element models of the touchdown process
for source and destination bonds. These models take the measured overshoot in
the touchdown forces into account. A multi-linear, isotropic material model has
been selected to map the material properties of the copper. A validation of the
model with the experimental determined contact areas, normal pressures and penetration
depths reveals the high model quality. Thus, the simulation is able to calculate
and visualize the three dimensional pre-deformation with an integrated material
parameter of the wire if the touchdown parameters of the bonding machine are known.
Based on the calculated deformation degrees of wire and substrate, it is probably
possible to investigate the effect of the pre-deformation on the pre-cleaning
phase in the copper wire bonding.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the
47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US;
2014:289-294.'
apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &
Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium
on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the
47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego,
CA, US, 2014.
ieee: A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–294.
mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–94.
short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...
---
_id: '4548'
abstract:
- lang: eng
text: "A fluorescence study of acetonitrile solutions of bis(tetramethylguanidine)propane,
copper(I)-iodide and [Cu(btmgp)I] was performed and the chemical reaction of the
latter species with O2 was investigated at room temperature. The actual quenching
process via O2 gassing was studied and an exponential dependence of the fluorescence
intensity with respect to the complex concentration was observed.\r\nFurthermore
the survey was deepened on time resolved fluorescence properties of solved [Cu(btmgp)I]
in a wider concentration range. The applicability of this complex for O2 sensing
inside a microreactor system was proven by confocal fluorescence measurements.
It was shown that the investigated system can be used for oxygen sensing in the
copper concentration range from 10−2 to 10−9 mol/l."
article_type: original
author:
- first_name: Sonja
full_name: Herres-Pawlis, Sonja
last_name: Herres-Pawlis
- first_name: Gerhard
full_name: Berth, Gerhard
id: '53'
last_name: Berth
- first_name: Volker
full_name: Wiedemeier, Volker
last_name: Wiedemeier
- first_name: Ludger
full_name: Schmidt, Ludger
last_name: Schmidt
- first_name: Artur
full_name: Zrenner, Artur
id: '606'
last_name: Zrenner
orcid: 0000-0002-5190-0944
- first_name: Hans-Joachim
full_name: Warnecke, Hans-Joachim
last_name: Warnecke
citation:
ama: Herres-Pawlis S, Berth G, Wiedemeier V, Schmidt L, Zrenner A, Warnecke H-J.
Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence.
2010;130(10):1958-1962. doi:10.1016/j.jlumin.2010.05.012
apa: Herres-Pawlis, S., Berth, G., Wiedemeier, V., Schmidt, L., Zrenner, A., &
Warnecke, H.-J. (2010). Oxygen sensing by fluorescence quenching of [Cu(btmgp)I].
Journal of Luminescence, 130(10), 1958–1962. https://doi.org/10.1016/j.jlumin.2010.05.012
bibtex: '@article{Herres-Pawlis_Berth_Wiedemeier_Schmidt_Zrenner_Warnecke_2010,
title={Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]}, volume={130},
DOI={10.1016/j.jlumin.2010.05.012},
number={10}, journal={Journal of Luminescence}, publisher={Elsevier BV}, author={Herres-Pawlis,
Sonja and Berth, Gerhard and Wiedemeier, Volker and Schmidt, Ludger and Zrenner,
Artur and Warnecke, Hans-Joachim}, year={2010}, pages={1958–1962} }'
chicago: 'Herres-Pawlis, Sonja, Gerhard Berth, Volker Wiedemeier, Ludger Schmidt,
Artur Zrenner, and Hans-Joachim Warnecke. “Oxygen Sensing by Fluorescence Quenching
of [Cu(Btmgp)I].” Journal of Luminescence 130, no. 10 (2010): 1958–62.
https://doi.org/10.1016/j.jlumin.2010.05.012.'
ieee: S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, and H.-J.
Warnecke, “Oxygen sensing by fluorescence quenching of [Cu(btmgp)I],” Journal
of Luminescence, vol. 130, no. 10, pp. 1958–1962, 2010.
mla: Herres-Pawlis, Sonja, et al. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].”
Journal of Luminescence, vol. 130, no. 10, Elsevier BV, 2010, pp. 1958–62,
doi:10.1016/j.jlumin.2010.05.012.
short: S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, H.-J.
Warnecke, Journal of Luminescence 130 (2010) 1958–1962.
date_created: 2018-09-20T12:31:16Z
date_updated: 2022-01-06T07:01:09Z
department:
- _id: '15'
- _id: '230'
- _id: '35'
doi: 10.1016/j.jlumin.2010.05.012
intvolume: ' 130'
issue: '10'
keyword:
- Copper Oxygen Fluorescence quenching N donor ligands
language:
- iso: eng
page: 1958-1962
publication: Journal of Luminescence
publication_identifier:
issn:
- 0022-2313
publication_status: published
publisher: Elsevier BV
status: public
title: Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]
type: journal_article
user_id: '49428'
volume: 130
year: '2010'
...