[{"quality_controlled":"1","year":"2022","publisher":"TANGER Ltd.","date_created":"2023-01-12T09:42:02Z","title":"Phase identification in twin-roll cast Al-Li alloys","publication":"METAL 2022 Conference Proeedings","abstract":[{"text":"Al-Li-based alloys are an attractive material for aircraft and aerospace applications. Preparation of these alloys by twin-roll casting (TRC), which combines rapid metal solidification and subsequent plastic reduction in a single processing step, could improve the properties of the alloys compared to materials prepared by conventional direct-chill casting. A commonly used approach for identifying primary phases is a chemical analysis by energy dispersive spectroscopy (EDS). More accurate results can be achieved by combining the method with diffraction analysis. This process can be considerably simplified in microscopes equipped with automated crystal orientation and phase mapping (ACOM-TEM). Al-Cu-Li-Mg-Zr alloy was prepared by twin-roll casting. A combination of TEM and STEM images with chemical analysis by EDS and ACOM-TEM was used to obtain complex information about phases of boundary primary particles. The efficiency of the individual methods for the phase identification in TRC Al-Li-based alloys is discussed.","lang":"eng"}],"keyword":["Al-Cu-Li-M-Zr-Fe alloy","twin-roll casting","phase identification","ACOM-TEM"],"language":[{"iso":"eng"}],"publication_status":"published","publication_identifier":{"issn":["2694-9296"]},"citation":{"apa":"BAJTOŠOVÁ, L., Grydin, O., STOLBCHENKO, M., Schaper, M., KŘIVSKÁ, B., KRÁLÍK, R., ŠLAPÁKOVÁ, M., &#38; CIESLAR, M. (2022). Phase identification in twin-roll cast Al-Li alloys. <i>METAL 2022 Conference Proeedings</i>. Metal 2022, Brno. <a href=\"https://doi.org/10.37904/metal.2022.4437\">https://doi.org/10.37904/metal.2022.4437</a>","short":"L. BAJTOŠOVÁ, O. Grydin, M. STOLBCHENKO, M. Schaper, B. KŘIVSKÁ, R. KRÁLÍK, M. ŠLAPÁKOVÁ, M. CIESLAR, in: METAL 2022 Conference Proeedings, TANGER Ltd., 2022.","mla":"BAJTOŠOVÁ, Lucia, et al. “Phase Identification in Twin-Roll Cast Al-Li Alloys.” <i>METAL 2022 Conference Proeedings</i>, TANGER Ltd., 2022, doi:<a href=\"https://doi.org/10.37904/metal.2022.4437\">10.37904/metal.2022.4437</a>.","bibtex":"@inproceedings{BAJTOŠOVÁ_Grydin_STOLBCHENKO_Schaper_KŘIVSKÁ_KRÁLÍK_ŠLAPÁKOVÁ_CIESLAR_2022, title={Phase identification in twin-roll cast Al-Li alloys}, DOI={<a href=\"https://doi.org/10.37904/metal.2022.4437\">10.37904/metal.2022.4437</a>}, booktitle={METAL 2022 Conference Proeedings}, publisher={TANGER Ltd.}, author={BAJTOŠOVÁ, Lucia and Grydin, Olexandr and STOLBCHENKO, Mykhailo and Schaper, Mirko and KŘIVSKÁ, Barbora and KRÁLÍK, Rostislav and ŠLAPÁKOVÁ, Michaela and CIESLAR, Miroslav}, year={2022} }","chicago":"BAJTOŠOVÁ, Lucia, Olexandr Grydin, Mykhailo STOLBCHENKO, Mirko Schaper, Barbora KŘIVSKÁ, Rostislav KRÁLÍK, Michaela ŠLAPÁKOVÁ, and Miroslav CIESLAR. “Phase Identification in Twin-Roll Cast Al-Li Alloys.” In <i>METAL 2022 Conference Proeedings</i>. TANGER Ltd., 2022. <a href=\"https://doi.org/10.37904/metal.2022.4437\">https://doi.org/10.37904/metal.2022.4437</a>.","ieee":"L. BAJTOŠOVÁ <i>et al.</i>, “Phase identification in twin-roll cast Al-Li alloys,” presented at the Metal 2022, Brno, 2022, doi: <a href=\"https://doi.org/10.37904/metal.2022.4437\">10.37904/metal.2022.4437</a>.","ama":"BAJTOŠOVÁ L, Grydin O, STOLBCHENKO M, et al. Phase identification in twin-roll cast Al-Li alloys. In: <i>METAL 2022 Conference Proeedings</i>. TANGER Ltd.; 2022. doi:<a href=\"https://doi.org/10.37904/metal.2022.4437\">10.37904/metal.2022.4437</a>"},"oa":"1","date_updated":"2023-04-27T16:35:42Z","author":[{"first_name":"Lucia","last_name":"BAJTOŠOVÁ","full_name":"BAJTOŠOVÁ, Lucia"},{"first_name":"Olexandr","id":"43822","full_name":"Grydin, Olexandr","last_name":"Grydin"},{"last_name":"STOLBCHENKO","full_name":"STOLBCHENKO, Mykhailo","first_name":"Mykhailo"},{"full_name":"Schaper, Mirko","id":"43720","last_name":"Schaper","first_name":"Mirko"},{"first_name":"Barbora","last_name":"KŘIVSKÁ","full_name":"KŘIVSKÁ, Barbora"},{"last_name":"KRÁLÍK","full_name":"KRÁLÍK, Rostislav","first_name":"Rostislav"},{"last_name":"ŠLAPÁKOVÁ","full_name":"ŠLAPÁKOVÁ, Michaela","first_name":"Michaela"},{"first_name":"Miroslav","full_name":"CIESLAR, Miroslav","last_name":"CIESLAR"}],"main_file_link":[{"open_access":"1","url":"https://www.confer.cz/metal/2022/4437-phase-identification-in-twin-roll-cast-al-li-alloys"}],"conference":{"end_date":"2022-05-19","location":"Brno","name":"Metal 2022","start_date":"2022-05-18"},"doi":"10.37904/metal.2022.4437","type":"conference","status":"public","_id":"36339","user_id":"43720","department":[{"_id":"158"},{"_id":"321"}]},{"keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"language":[{"iso":"eng"}],"_id":"9868","user_id":"55222","department":[{"_id":"151"}],"abstract":[{"text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool.","lang":"eng"}],"status":"public","type":"conference","publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","title":"Improving the bond quality of copper wire bonds using a friction model approach","doi":"10.1109/ECTC.2014.6897500","date_updated":"2019-09-16T10:57:58Z","author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"full_name":"Neuhaus, Jan","last_name":"Neuhaus","first_name":"Jan"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"date_created":"2019-05-20T12:11:44Z","year":"2014","citation":{"chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>.","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>"},"page":"1549-1555","quality_controlled":"1"}]