@inproceedings{9868,
  abstract     = {{In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\mu$m copper wire and a standard V-groove tool.}},
  author       = {{Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}},
  keywords     = {{adhesion, circuit reliability, deformation, diffusion, fatigue cracks, friction, interconnections, lead bonding, van der Waals forces, Cu, adhering process, adhesion process, ampacity improvement, bond quality improvement, cleaning process, diffusing process, fatigue fracture failure, friction energy, friction model, heat dissipation, mechanical strength, piezoelectric triaxial force sensor, predeforming process, size 500 mum, total contact area, van der Waals forces, wedge copper wire bonding, Bonding, Copper, Finite element analysis, Force, Friction, Substrates, Wires}},
  pages        = {{1549--1555}},
  title        = {{{Improving the bond quality of copper wire bonds using a friction model approach}}},
  doi          = {{10.1109/ECTC.2014.6897500}},
  year         = {{2014}},
}

@inproceedings{36918,
  abstract     = {{This paper presents an advanced eight levels spanning SystemC based virtual platform methodology and framework - referred to as HeroeS 3 - providing smooth application to platform mapping and continuous co-refinement of a virtual prototype with its physical environment model. For heterogeneity support, various SystemC extensions are combined covering continuous/discrete models of computation and different communication abstractions, such as analog mixed-signal models, abstract RTOS/HAL/middleware models, TLM bus models, and QEMU wrappers. We enable dependability assessment by Fault Effect Modeling (FEM) at the virtual prototype in order to avoid risking physical injury or damage. Also, simulation results are deterministic and can be evaluated interactively or offline. We apply FEM to both the physical environment model and the different abstractions of the virtual prototype. Currently, we focus on sensor failures and application control flow errors.}},
  author       = {{Becker, Markus and Kuznik, Christoph and Müller, Wolfgang}},
  keywords     = {{Computational modeling, Finite element analysis, Prototypes, Abstracts, Software, Fault tolerance, Fault tolerant systems}},
  location     = {{Berlin}},
  publisher    = {{IEEE}},
  title        = {{{Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems}}},
  doi          = {{10.1109/ICCPS.2014.6843726}},
  year         = {{2014}},
}