@article{58473,
  abstract     = {{Using a large unique longitudinal survey data set from Germany covering more than 5,000 households, we analyze stated intentions and actual implementations of both flood-proofing and heat stress reduction measures to assess the intention behavior gap (IBG) in climate change adaptation. Our results do not only reveal a substantial IBG for most stated intentions, but also show their limits in serving as a good predictor for realized actions later. Moreover, the IBG itself can hardly be explained by observable household data characteristics. While we do find some similarities in explanatory variables affecting both intentions and implementations, these variables provide only little insights into the actual levels of implemented actions. In line with regret theory, the IBG in our data can be partly explained by anticipated regret caused by a feeling of having invested in vain in cases where adaptation measures are installed, but extreme weather events do not occur for the time being. Our results are informative for adaptation-related communication campaigns and public policy interventions, especially in the aftermath of natural disasters.}},
  author       = {{Osberghaus, Daniel and Botzen, Wouter and Kesternich, Martin}},
  journal      = {{Ecological Economics }},
  keywords     = {{Intention-behavior gap, Adaptation, Climate Change, Flooding, Heat}},
  title        = {{{The intention-behavior gap in climate change adaptation: Evidence from longitudinal survey data}}},
  year         = {{2025}},
}

@phdthesis{59239,
  abstract     = {{Diese Arbeit behandelt die Modellierung und Optimierung von mit Phasenwechselmaterialien (PCM) ausgestatteten, energietechnischen Komponenten anhand zweier Fallstudien. PCM sind Materialien, deren Phasenwechseleigenschaften während des Schmelzens und Erstarrens für Heiz- und Kühlzwecke genutzt werden. Zunächst werden die theoretischen Grundlagen zu Wärmeübertragungsproblemen mit Phasenwechsel erörtert und entsprechende numerische Lösungsmethoden diskutiert. Ein Modell für Phasenwechselvorgänge wird vorgestellt, welches anhand analytischer Lösungen validiert wurde und in den Fallstudien zum Einsatz kam. Für beide Fallstudien wird der Stand der Technik erörtert und die entsprechenden Forschungsfragen werden formuliert. Die erste Fallstudie behandelt PCM-integrierte Photovoltaikmodule und die zweite Festbett-Latentwärmespeicher, welche nicht-kugelförmiger PCM-Kapseln verwenden. Für beide Systeme wurden thermische Model-le entwickelt und anhand experimenteller Daten mit guter Genauigkeit validiert. Diese Modelle wurden in Parameterstudien eingesetzt, um optimierte Systemkonfigurationen zu identifizieren. Die vorgestellten Ergebnisse zeigen, dass ein PCM-Kühlkörper mit ausreichender Dicke und Wärmeleitfähigkeit den Wirkungsgrad und die Lebensdauer von Photovoltaikmodulen erheblich erhöht. Darüber hinaus verbessern PCM-Kapseln mit hoher Packungs-dichte und Oberfläche sowohl die volumenspezifische Speicherkapazität als auch die thermische Leistung von Festbett-Latentwärmespeichern.}},
  author       = {{Grabo, Matti}},
  keywords     = {{Heat transfer, PCM, numerical simulation, renewable energy, heat storage}},
  title        = {{{Modeling and optimization of energy system components equipped with phase change materials}}},
  doi          = {{10.17619/UNIPB/1-2199}},
  year         = {{2025}},
}

@inproceedings{63019,
  author       = {{Donner, Johannes Aurelius Tamino and Schlüter, Alexander}},
  booktitle    = {{SDEWES Conference 2025}},
  keywords     = {{5GDHC, district heating, DHC, waste heat, AI-Driven}},
  location     = {{Dubrovnik}},
  title        = {{{Development of an AI-driven decentralized control for fifth generation district heating and cooling networks}}},
  year         = {{2025}},
}

@inproceedings{49430,
  abstract     = {{Within the current energy and environmental crisis, new material- and energy-saving processes are needed. For this reason, this study focuses on the development of a new forming technology for Ti-6Al-4V sheet metal. It is based on combination of solution treatment by resistive heating with rapid tool-based quenching and subsequent annealing. This new “TISTRAQ” process is comparable with press-hardening already known for steels and hot die quenching known for aluminium alloys. One of the main influencing factors for this process is the heat transfer coefficient (HTC). It is an important driver for adjustment of basic parameters, as selection of tool material or the forming speed but also plays an important role while elaborating temperature distribution in the numerical model. Therefore, a new and unique test rig was developed to determine the HTC and to perform tool-based heat treatment at specimen level under laboratory conditions. The test rig was used to investigate the influence of the titanium-tool-lubricant system on HTC and cooling rate. Further the effect of heat treatment in the test rig and tool-based quenching on microstructure and mechanical properties was studied. To improve the prediction of the temperature distribution of the titanium during cooling, the HTC was integrated into the numerical process simulation}},
  author       = {{Kaiser, Maximilian Alexander and Höschen, Fabian and Pfeffer, Nina and Merten, Mathias and Meyer, Thomas and Marten, Thorsten and Rockicki, Pawel and Höppel, Heinz Werner and Tröster, Thomas}},
  booktitle    = {{IOM3. Chapter 14: Forming, Machining & Joining [version 1; not peer reviewed]}},
  keywords     = {{Interfacial heat transfer coefficient, Ti-6Al-4V, nonisothermal forming, thermomechanical processing, TISTRAQ process}},
  location     = {{Edinburgh}},
  title        = {{{The new TISTRAQ process: Solution treatment with rapid quenching and annealing for Ti-6Al-4V sheet metal part forming - investigation on heat transfer coefficient and influence on cooling rates}}},
  doi          = {{doi.org/10.7490/f1000research.1119929.1}},
  year         = {{2024}},
}

@article{60300,
  abstract     = {{This study focuses on the phenomenological change in material strength caused by a specific heat treatment and the subsequent analysis of the influence on the clinching process and the resulting joint properties. For this purpose, three series of tests were performed. In the first series of tests, the influence of heat treatment up to 340 °C on the mechanical properties of an age-hardenable AlMgSi alloy was investigated. Holding time and temperature were varied and the material strength was evaluated by tensile and hardness tests. Two strength-increasing and two strength-reducing heat treatment parameters were identified. In the second series of tests, selected heat treatment parameters were applied to a larger number of specimens and the joint strength was investigated by shear and head tensile tests. In the shear tensile test, mainly the properties of the punch-side material have an influence on the resulting joint strength. A change in strength of the die-side material can be neglected. In contrast, the properties of both sheets are important in the head tensile test. The strength of the joint will only increase if the strength of both sheets is increased. In general, a strength increasing heat treatment resulted in higher joint strength. In the third series of tests, the factor of punch displacement was considered, which was demonstrated to directly influence the formation of the clinched joint geometry.}},
  author       = {{Steinfelder, Christian and Rempel, Dennis and Brosius, Alexander}},
  issn         = {{2666-3309}},
  journal      = {{Journal of Advanced Joining Processes}},
  keywords     = {{Joining by forming, Clinching, EN AW-6014, Heat treatment, Load-bearing capacity}},
  publisher    = {{Elsevier BV}},
  title        = {{{Influence of the material properties on the clinching process and the resulting load-bearing capacity of the joint}}},
  doi          = {{10.1016/j.jajp.2024.100263}},
  volume       = {{10}},
  year         = {{2024}},
}

@inproceedings{63497,
  author       = {{Förster, Nikolas and Wallscheid, Oliver and Schafmeister, Frank}},
  booktitle    = {{2024 IEEE Design Methodologies Conference (DMC)}},
  keywords     = {{MOSFET, Thermal resistance, Surface resistance, Bridge circuits, Zero voltage switching, Pareto optimization, Capacitance, Numerical simulation, Optimization, Resistance heating, Pareto Optimization, Dual-Active Bridge, ZVS, Inductor Optimization, Transformer Optimization, Heat Sink Optimization}},
  pages        = {{1--8}},
  title        = {{{Dual-Active Bridge Sequential Pareto Optimization for Fast Pre-Design and Final Component Selection}}},
  doi          = {{10.1109/DMC62632.2024.10812131}},
  year         = {{2024}},
}

@inproceedings{49433,
  author       = {{Kaiser, Maximilian Alexander and Rockicki, Pawel and Höschen, Fabian and Wesendahl, Jan-Niklas and Konrad, Stefan and Meyer, Thomas and Marten, Thorsten and Tröster, Thomas}},
  keywords     = {{Ti-6Al-4V, heat transfer coefficient}},
  location     = {{Orlando}},
  title        = {{{ Heat transfer coefficient investigation for hot die quenching process of Ti-6Al-4V alloy}}},
  year         = {{2022}},
}

@inproceedings{9868,
  abstract     = {{In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\mu$m copper wire and a standard V-groove tool.}},
  author       = {{Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}},
  keywords     = {{adhesion, circuit reliability, deformation, diffusion, fatigue cracks, friction, interconnections, lead bonding, van der Waals forces, Cu, adhering process, adhesion process, ampacity improvement, bond quality improvement, cleaning process, diffusing process, fatigue fracture failure, friction energy, friction model, heat dissipation, mechanical strength, piezoelectric triaxial force sensor, predeforming process, size 500 mum, total contact area, van der Waals forces, wedge copper wire bonding, Bonding, Copper, Finite element analysis, Force, Friction, Substrates, Wires}},
  pages        = {{1549--1555}},
  title        = {{{Improving the bond quality of copper wire bonds using a friction model approach}}},
  doi          = {{10.1109/ECTC.2014.6897500}},
  year         = {{2014}},
}