---
_id: '58473'
abstract:
- lang: eng
  text: Using a large unique longitudinal survey data set from Germany covering more
    than 5,000 households, we analyze stated intentions and actual implementations
    of both flood-proofing and heat stress reduction measures to assess the intention
    behavior gap (IBG) in climate change adaptation. Our results do not only reveal
    a substantial IBG for most stated intentions, but also show their limits in serving
    as a good predictor for realized actions later. Moreover, the IBG itself can hardly
    be explained by observable household data characteristics. While we do find some
    similarities in explanatory variables affecting both intentions and implementations,
    these variables provide only little insights into the actual levels of implemented
    actions. In line with regret theory, the IBG in our data can be partly explained
    by anticipated regret caused by a feeling of having invested in vain in cases
    where adaptation measures are installed, but extreme weather events do not occur
    for the time being. Our results are informative for adaptation-related communication
    campaigns and public policy interventions, especially in the aftermath of natural
    disasters.
article_type: original
author:
- first_name: Daniel
  full_name: Osberghaus, Daniel
  last_name: Osberghaus
- first_name: Wouter
  full_name: Botzen, Wouter
  last_name: Botzen
- first_name: Martin
  full_name: Kesternich, Martin
  id: '98922'
  last_name: Kesternich
  orcid: 0000-0002-0653-7680
citation:
  ama: 'Osberghaus D, Botzen W, Kesternich M. The intention-behavior gap in climate
    change adaptation: Evidence from longitudinal survey data. <i>Ecological Economics
    </i>. Published online 2025.'
  apa: 'Osberghaus, D., Botzen, W., &#38; Kesternich, M. (2025). The intention-behavior
    gap in climate change adaptation: Evidence from longitudinal survey data. <i>Ecological
    Economics </i>.'
  bibtex: '@article{Osberghaus_Botzen_Kesternich_2025, title={The intention-behavior
    gap in climate change adaptation: Evidence from longitudinal survey data}, journal={Ecological
    Economics }, author={Osberghaus, Daniel and Botzen, Wouter and Kesternich, Martin},
    year={2025} }'
  chicago: 'Osberghaus, Daniel, Wouter Botzen, and Martin Kesternich. “The Intention-Behavior
    Gap in Climate Change Adaptation: Evidence from Longitudinal Survey Data.” <i>Ecological
    Economics </i>, 2025.'
  ieee: 'D. Osberghaus, W. Botzen, and M. Kesternich, “The intention-behavior gap
    in climate change adaptation: Evidence from longitudinal survey data,” <i>Ecological
    Economics </i>, 2025.'
  mla: 'Osberghaus, Daniel, et al. “The Intention-Behavior Gap in Climate Change Adaptation:
    Evidence from Longitudinal Survey Data.” <i>Ecological Economics </i>, 2025.'
  short: D. Osberghaus, W. Botzen, M. Kesternich, Ecological Economics  (2025).
date_created: 2025-01-31T14:20:46Z
date_updated: 2025-02-03T12:04:07Z
keyword:
- Intention-behavior gap
- Adaptation
- Climate Change
- Flooding
- Heat
language:
- iso: eng
publication: 'Ecological Economics '
status: public
title: 'The intention-behavior gap in climate change adaptation: Evidence from longitudinal
  survey data'
type: journal_article
user_id: '98922'
year: '2025'
...
---
_id: '59239'
abstract:
- lang: ger
  text: Diese Arbeit behandelt die Modellierung und Optimierung von mit Phasenwechselmaterialien
    (PCM) ausgestatteten, energietechnischen Komponenten anhand zweier Fallstudien.
    PCM sind Materialien, deren Phasenwechseleigenschaften während des Schmelzens
    und Erstarrens für Heiz- und Kühlzwecke genutzt werden. Zunächst werden die theoretischen
    Grundlagen zu Wärmeübertragungsproblemen mit Phasenwechsel erörtert und entsprechende
    numerische Lösungsmethoden diskutiert. Ein Modell für Phasenwechselvorgänge wird
    vorgestellt, welches anhand analytischer Lösungen validiert wurde und in den Fallstudien
    zum Einsatz kam. Für beide Fallstudien wird der Stand der Technik erörtert und
    die entsprechenden Forschungsfragen werden formuliert. Die erste Fallstudie behandelt
    PCM-integrierte Photovoltaikmodule und die zweite Festbett-Latentwärmespeicher,
    welche nicht-kugelförmiger PCM-Kapseln verwenden. Für beide Systeme wurden thermische
    Model-le entwickelt und anhand experimenteller Daten mit guter Genauigkeit validiert.
    Diese Modelle wurden in Parameterstudien eingesetzt, um optimierte Systemkonfigurationen
    zu identifizieren. Die vorgestellten Ergebnisse zeigen, dass ein PCM-Kühlkörper
    mit ausreichender Dicke und Wärmeleitfähigkeit den Wirkungsgrad und die Lebensdauer
    von Photovoltaikmodulen erheblich erhöht. Darüber hinaus verbessern PCM-Kapseln
    mit hoher Packungs-dichte und Oberfläche sowohl die volumenspezifische Speicherkapazität
    als auch die thermische Leistung von Festbett-Latentwärmespeichern.
- lang: eng
  text: This thesis explores the modeling and optimization of energy system components
    incorporating phase change materials (PCM) through two different case studies.
    PCM are materials whose phase change characteristics during melting and solidification
    are utilized for heating and cooling purposes. The theoretical foundations of
    heat transfer problems involving phase change, along with the relevant numerical
    solution methods, are discussed. A phase change model is presented, which was
    validated against analytical solutions and applied in the case studies. For both
    case studies, a review of the state of the art is provided, followed by the formulation
    of specific research problems. The first case study investigated PCM-enhanced
    photovoltaic modules, while the second focused on packed bed latent heat storages
    (PBLHS) utilizing non-spherical PCM capsules. Thermal models were developed for
    both systems and validated with good accuracy against experimental data. These
    models were employed in parameter studies to identify optimized system configurations.
    The presented results demonstrate that a PCM heat sink with sufficient thickness
    and thermal conductivity can significantly improve the efficiency and lifespan
    of photovoltaic modules. Furthermore, PCM capsules with both high packing density
    and surface area increase the volume-specific storage capacity and thermal power
    output of PBLHS.
author:
- first_name: Matti
  full_name: Grabo, Matti
  id: '66520'
  last_name: Grabo
citation:
  ama: Grabo M. <i>Modeling and Optimization of Energy System Components Equipped
    with Phase Change Materials</i>.; 2025. doi:<a href="https://doi.org/10.17619/UNIPB/1-2199">10.17619/UNIPB/1-2199</a>
  apa: Grabo, M. (2025). <i>Modeling and optimization of energy system components
    equipped with phase change materials</i>. <a href="https://doi.org/10.17619/UNIPB/1-2199">https://doi.org/10.17619/UNIPB/1-2199</a>
  bibtex: '@book{Grabo_2025, place={Paderborn}, title={Modeling and optimization of
    energy system components equipped with phase change materials}, DOI={<a href="https://doi.org/10.17619/UNIPB/1-2199">10.17619/UNIPB/1-2199</a>},
    author={Grabo, Matti}, year={2025} }'
  chicago: Grabo, Matti. <i>Modeling and Optimization of Energy System Components
    Equipped with Phase Change Materials</i>. Paderborn, 2025. <a href="https://doi.org/10.17619/UNIPB/1-2199">https://doi.org/10.17619/UNIPB/1-2199</a>.
  ieee: M. Grabo, <i>Modeling and optimization of energy system components equipped
    with phase change materials</i>. Paderborn, 2025.
  mla: Grabo, Matti. <i>Modeling and Optimization of Energy System Components Equipped
    with Phase Change Materials</i>. 2025, doi:<a href="https://doi.org/10.17619/UNIPB/1-2199">10.17619/UNIPB/1-2199</a>.
  short: M. Grabo, Modeling and Optimization of Energy System Components Equipped
    with Phase Change Materials, Paderborn, 2025.
date_created: 2025-04-02T09:25:58Z
date_updated: 2025-04-02T09:44:05Z
department:
- _id: '9'
doi: 10.17619/UNIPB/1-2199
keyword:
- Heat transfer
- PCM
- numerical simulation
- renewable energy
- heat storage
language:
- iso: eng
place: Paderborn
publication_status: published
status: public
supervisor:
- first_name: Eugeny
  full_name: Kenig, Eugeny
  id: '665'
  last_name: Kenig
title: Modeling and optimization of energy system components equipped with phase change
  materials
type: dissertation
user_id: '66520'
year: '2025'
...
---
_id: '63019'
author:
- first_name: Johannes Aurelius Tamino
  full_name: Donner, Johannes Aurelius Tamino
  id: '72054'
  last_name: Donner
  orcid: 0009-0007-4757-4393
- first_name: Alexander
  full_name: Schlüter, Alexander
  id: '103302'
  last_name: Schlüter
  orcid: 0000-0002-2569-1624
citation:
  ama: 'Donner JAT, Schlüter A. Development of an AI-driven decentralized control
    for fifth generation district heating and cooling networks. In: <i>SDEWES Conference
    2025</i>. ; 2025.'
  apa: Donner, J. A. T., &#38; Schlüter, A. (2025). Development of an AI-driven decentralized
    control for fifth generation district heating and cooling networks. <i>SDEWES
    Conference 2025</i>. 20th SDEWES Conference, Dubrovnik.
  bibtex: '@inproceedings{Donner_Schlüter_2025, title={Development of an AI-driven
    decentralized control for fifth generation district heating and cooling networks},
    booktitle={SDEWES Conference 2025}, author={Donner, Johannes Aurelius Tamino and
    Schlüter, Alexander}, year={2025} }'
  chicago: Donner, Johannes Aurelius Tamino, and Alexander Schlüter. “Development
    of an AI-Driven Decentralized Control for Fifth Generation District Heating and
    Cooling Networks.” In <i>SDEWES Conference 2025</i>, 2025.
  ieee: J. A. T. Donner and A. Schlüter, “Development of an AI-driven decentralized
    control for fifth generation district heating and cooling networks,” presented
    at the 20th SDEWES Conference, Dubrovnik, 2025.
  mla: Donner, Johannes Aurelius Tamino, and Alexander Schlüter. “Development of an
    AI-Driven Decentralized Control for Fifth Generation District Heating and Cooling
    Networks.” <i>SDEWES Conference 2025</i>, 2025.
  short: 'J.A.T. Donner, A. Schlüter, in: SDEWES Conference 2025, 2025.'
conference:
  end_date: 10.10.2025
  location: Dubrovnik
  name: 20th SDEWES Conference
  start_date: 05.10.2025
date_created: 2025-12-10T12:30:59Z
date_updated: 2026-01-06T07:53:40Z
department:
- _id: '876'
- _id: '321'
- _id: '9'
- _id: '393'
keyword:
- 5GDHC
- district heating
- DHC
- waste heat
- AI-Driven
language:
- iso: eng
publication: SDEWES Conference 2025
status: public
title: Development of an AI-driven decentralized control for fifth generation district
  heating and cooling networks
type: conference_abstract
user_id: '103302'
year: '2025'
...
---
_id: '49430'
abstract:
- lang: eng
  text: Within the current energy and environmental crisis, new material- and energy-saving
    processes are needed. For this reason, this study focuses on the development of
    a new forming technology for Ti-6Al-4V sheet metal. It is based on combination
    of solution treatment by resistive heating with rapid tool-based quenching and
    subsequent annealing. This new “TISTRAQ” process is comparable with press-hardening
    already known for steels and hot die quenching known for aluminium alloys. One
    of the main influencing factors for this process is the heat transfer coefficient
    (HTC). It is an important driver for adjustment of basic parameters, as selection
    of tool material or the forming speed but also plays an important role while elaborating
    temperature distribution in the numerical model. Therefore, a new and unique test
    rig was developed to determine the HTC and to perform tool-based heat treatment
    at specimen level under laboratory conditions. The test rig was used to investigate
    the influence of the titanium-tool-lubricant system on HTC and cooling rate. Further
    the effect of heat treatment in the test rig and tool-based quenching on microstructure
    and mechanical properties was studied. To improve the prediction of the temperature
    distribution of the titanium during cooling, the HTC was integrated into the numerical
    process simulation
author:
- first_name: Maximilian Alexander
  full_name: Kaiser, Maximilian Alexander
  id: '72351'
  last_name: Kaiser
  orcid: 0009-0008-1333-3396
- first_name: Fabian
  full_name: Höschen, Fabian
  last_name: Höschen
- first_name: Nina
  full_name: Pfeffer, Nina
  last_name: Pfeffer
- first_name: Mathias
  full_name: Merten, Mathias
  last_name: Merten
- first_name: Thomas
  full_name: Meyer, Thomas
  last_name: Meyer
- first_name: Thorsten
  full_name: Marten, Thorsten
  id: '338'
  last_name: Marten
  orcid: 0009-0001-6433-7839
- first_name: Pawel
  full_name: Rockicki, Pawel
  last_name: Rockicki
- first_name: Heinz Werner
  full_name: Höppel, Heinz Werner
  last_name: Höppel
- first_name: Thomas
  full_name: Tröster, Thomas
  id: '553'
  last_name: Tröster
citation:
  ama: 'Kaiser MA, Höschen F, Pfeffer N, et al. The new TISTRAQ process: Solution
    treatment with rapid quenching and annealing for Ti-6Al-4V sheet metal part forming
    - investigation on heat transfer coefficient and influence on cooling rates. In:
    <i>IOM3. Chapter 14: Forming, Machining &#38; Joining [Version 1; Not Peer Reviewed]</i>.
    ; 2024. doi:<a href="https://doi.org/doi.org/10.7490/f1000research.1119929.1">doi.org/10.7490/f1000research.1119929.1</a>'
  apa: 'Kaiser, M. A., Höschen, F., Pfeffer, N., Merten, M., Meyer, T., Marten, T.,
    Rockicki, P., Höppel, H. W., &#38; Tröster, T. (2024). The new TISTRAQ process:
    Solution treatment with rapid quenching and annealing for Ti-6Al-4V sheet metal
    part forming - investigation on heat transfer coefficient and influence on cooling
    rates. <i>IOM3. Chapter 14: Forming, Machining &#38; Joining [Version 1; Not Peer
    Reviewed]</i>. 15th World Conference on Titanium, Edinburgh. <a href="https://doi.org/doi.org/10.7490/f1000research.1119929.1">https://doi.org/doi.org/10.7490/f1000research.1119929.1</a>'
  bibtex: '@inproceedings{Kaiser_Höschen_Pfeffer_Merten_Meyer_Marten_Rockicki_Höppel_Tröster_2024,
    title={The new TISTRAQ process: Solution treatment with rapid quenching and annealing
    for Ti-6Al-4V sheet metal part forming - investigation on heat transfer coefficient
    and influence on cooling rates}, DOI={<a href="https://doi.org/doi.org/10.7490/f1000research.1119929.1">doi.org/10.7490/f1000research.1119929.1</a>},
    booktitle={IOM3. Chapter 14: Forming, Machining &#38; Joining [version 1; not
    peer reviewed]}, author={Kaiser, Maximilian Alexander and Höschen, Fabian and
    Pfeffer, Nina and Merten, Mathias and Meyer, Thomas and Marten, Thorsten and Rockicki,
    Pawel and Höppel, Heinz Werner and Tröster, Thomas}, year={2024} }'
  chicago: 'Kaiser, Maximilian Alexander, Fabian Höschen, Nina Pfeffer, Mathias Merten,
    Thomas Meyer, Thorsten Marten, Pawel Rockicki, Heinz Werner Höppel, and Thomas
    Tröster. “The New TISTRAQ Process: Solution Treatment with Rapid Quenching and
    Annealing for Ti-6Al-4V Sheet Metal Part Forming - Investigation on Heat Transfer
    Coefficient and Influence on Cooling Rates.” In <i>IOM3. Chapter 14: Forming,
    Machining &#38; Joining [Version 1; Not Peer Reviewed]</i>, 2024. <a href="https://doi.org/doi.org/10.7490/f1000research.1119929.1">https://doi.org/doi.org/10.7490/f1000research.1119929.1</a>.'
  ieee: 'M. A. Kaiser <i>et al.</i>, “The new TISTRAQ process: Solution treatment
    with rapid quenching and annealing for Ti-6Al-4V sheet metal part forming - investigation
    on heat transfer coefficient and influence on cooling rates,” presented at the
    15th World Conference on Titanium, Edinburgh, 2024, doi: <a href="https://doi.org/doi.org/10.7490/f1000research.1119929.1">doi.org/10.7490/f1000research.1119929.1</a>.'
  mla: 'Kaiser, Maximilian Alexander, et al. “The New TISTRAQ Process: Solution Treatment
    with Rapid Quenching and Annealing for Ti-6Al-4V Sheet Metal Part Forming - Investigation
    on Heat Transfer Coefficient and Influence on Cooling Rates.” <i>IOM3. Chapter
    14: Forming, Machining &#38; Joining [Version 1; Not Peer Reviewed]</i>, 2024,
    doi:<a href="https://doi.org/doi.org/10.7490/f1000research.1119929.1">doi.org/10.7490/f1000research.1119929.1</a>.'
  short: 'M.A. Kaiser, F. Höschen, N. Pfeffer, M. Merten, T. Meyer, T. Marten, P.
    Rockicki, H.W. Höppel, T. Tröster, in: IOM3. Chapter 14: Forming, Machining &#38;
    Joining [Version 1; Not Peer Reviewed], 2024.'
conference:
  end_date: 2023-06-16
  location: Edinburgh
  name: 15th World Conference on Titanium
  start_date: 2023-06-12
date_created: 2023-12-04T10:00:21Z
date_updated: 2025-05-19T11:46:47Z
department:
- _id: '9'
- _id: '321'
- _id: '149'
doi: doi.org/10.7490/f1000research.1119929.1
keyword:
- Interfacial heat transfer coefficient
- Ti-6Al-4V
- nonisothermal forming
- thermomechanical processing
- TISTRAQ process
language:
- iso: eng
publication: 'IOM3. Chapter 14: Forming, Machining & Joining [version 1; not peer
  reviewed]'
publication_status: published
quality_controlled: '1'
status: public
title: 'The new TISTRAQ process: Solution treatment with rapid quenching and annealing
  for Ti-6Al-4V sheet metal part forming - investigation on heat transfer coefficient
  and influence on cooling rates'
type: conference
user_id: '72351'
year: '2024'
...
---
_id: '60300'
abstract:
- lang: eng
  text: This study focuses on the phenomenological change in material strength caused
    by a specific heat treatment and the subsequent analysis of the influence on the
    clinching process and the resulting joint properties. For this purpose, three
    series of tests were performed. In the first series of tests, the influence of
    heat treatment up to 340 °C on the mechanical properties of an age-hardenable
    AlMgSi alloy was investigated. Holding time and temperature were varied and the
    material strength was evaluated by tensile and hardness tests. Two strength-increasing
    and two strength-reducing heat treatment parameters were identified. In the second
    series of tests, selected heat treatment parameters were applied to a larger number
    of specimens and the joint strength was investigated by shear and head tensile
    tests. In the shear tensile test, mainly the properties of the punch-side material
    have an influence on the resulting joint strength. A change in strength of the
    die-side material can be neglected. In contrast, the properties of both sheets
    are important in the head tensile test. The strength of the joint will only increase
    if the strength of both sheets is increased. In general, a strength increasing
    heat treatment resulted in higher joint strength. In the third series of tests,
    the factor of punch displacement was considered, which was demonstrated to directly
    influence the formation of the clinched joint geometry.
article_number: '100263'
author:
- first_name: Christian
  full_name: Steinfelder, Christian
  last_name: Steinfelder
- first_name: Dennis
  full_name: Rempel, Dennis
  last_name: Rempel
- first_name: Alexander
  full_name: Brosius, Alexander
  last_name: Brosius
citation:
  ama: Steinfelder C, Rempel D, Brosius A. Influence of the material properties on
    the clinching process and the resulting load-bearing capacity of the joint. <i>Journal
    of Advanced Joining Processes</i>. 2024;10. doi:<a href="https://doi.org/10.1016/j.jajp.2024.100263">10.1016/j.jajp.2024.100263</a>
  apa: Steinfelder, C., Rempel, D., &#38; Brosius, A. (2024). Influence of the material
    properties on the clinching process and the resulting load-bearing capacity of
    the joint. <i>Journal of Advanced Joining Processes</i>, <i>10</i>, Article 100263.
    <a href="https://doi.org/10.1016/j.jajp.2024.100263">https://doi.org/10.1016/j.jajp.2024.100263</a>
  bibtex: '@article{Steinfelder_Rempel_Brosius_2024, title={Influence of the material
    properties on the clinching process and the resulting load-bearing capacity of
    the joint}, volume={10}, DOI={<a href="https://doi.org/10.1016/j.jajp.2024.100263">10.1016/j.jajp.2024.100263</a>},
    number={100263}, journal={Journal of Advanced Joining Processes}, publisher={Elsevier
    BV}, author={Steinfelder, Christian and Rempel, Dennis and Brosius, Alexander},
    year={2024} }'
  chicago: Steinfelder, Christian, Dennis Rempel, and Alexander Brosius. “Influence
    of the Material Properties on the Clinching Process and the Resulting Load-Bearing
    Capacity of the Joint.” <i>Journal of Advanced Joining Processes</i> 10 (2024).
    <a href="https://doi.org/10.1016/j.jajp.2024.100263">https://doi.org/10.1016/j.jajp.2024.100263</a>.
  ieee: 'C. Steinfelder, D. Rempel, and A. Brosius, “Influence of the material properties
    on the clinching process and the resulting load-bearing capacity of the joint,”
    <i>Journal of Advanced Joining Processes</i>, vol. 10, Art. no. 100263, 2024,
    doi: <a href="https://doi.org/10.1016/j.jajp.2024.100263">10.1016/j.jajp.2024.100263</a>.'
  mla: Steinfelder, Christian, et al. “Influence of the Material Properties on the
    Clinching Process and the Resulting Load-Bearing Capacity of the Joint.” <i>Journal
    of Advanced Joining Processes</i>, vol. 10, 100263, Elsevier BV, 2024, doi:<a
    href="https://doi.org/10.1016/j.jajp.2024.100263">10.1016/j.jajp.2024.100263</a>.
  short: C. Steinfelder, D. Rempel, A. Brosius, Journal of Advanced Joining Processes
    10 (2024).
date_created: 2025-06-23T07:54:23Z
date_updated: 2025-06-23T07:57:53Z
department:
- _id: '630'
doi: 10.1016/j.jajp.2024.100263
intvolume: '        10'
keyword:
- Joining by forming
- Clinching
- EN AW-6014
- Heat treatment
- Load-bearing capacity
language:
- iso: eng
project:
- _id: '130'
  grant_number: '418701707'
  name: 'TRR 285: TRR 285:  Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen
    Prozessketten'
- _id: '132'
  name: 'TRR 285 - B: TRR 285 - Project Area B'
- _id: '140'
  name: 'TRR 285 – B01: TRR 285 - Subproject B01'
publication: Journal of Advanced Joining Processes
publication_identifier:
  issn:
  - 2666-3309
publication_status: published
publisher: Elsevier BV
status: public
title: Influence of the material properties on the clinching process and the resulting
  load-bearing capacity of the joint
type: journal_article
user_id: '104464'
volume: 10
year: '2024'
...
---
_id: '63497'
author:
- first_name: Nikolas
  full_name: Förster, Nikolas
  last_name: Förster
- first_name: Oliver
  full_name: Wallscheid, Oliver
  last_name: Wallscheid
- first_name: Frank
  full_name: Schafmeister, Frank
  last_name: Schafmeister
citation:
  ama: 'Förster N, Wallscheid O, Schafmeister F. Dual-Active Bridge Sequential Pareto
    Optimization for Fast Pre-Design and Final Component Selection. In: <i>2024 IEEE
    Design Methodologies Conference (DMC)</i>. ; 2024:1-8. doi:<a href="https://doi.org/10.1109/DMC62632.2024.10812131">10.1109/DMC62632.2024.10812131</a>'
  apa: Förster, N., Wallscheid, O., &#38; Schafmeister, F. (2024). Dual-Active Bridge
    Sequential Pareto Optimization for Fast Pre-Design and Final Component Selection.
    <i>2024 IEEE Design Methodologies Conference (DMC)</i>, 1–8. <a href="https://doi.org/10.1109/DMC62632.2024.10812131">https://doi.org/10.1109/DMC62632.2024.10812131</a>
  bibtex: '@inproceedings{Förster_Wallscheid_Schafmeister_2024, title={Dual-Active
    Bridge Sequential Pareto Optimization for Fast Pre-Design and Final Component
    Selection}, DOI={<a href="https://doi.org/10.1109/DMC62632.2024.10812131">10.1109/DMC62632.2024.10812131</a>},
    booktitle={2024 IEEE Design Methodologies Conference (DMC)}, author={Förster,
    Nikolas and Wallscheid, Oliver and Schafmeister, Frank}, year={2024}, pages={1–8}
    }'
  chicago: Förster, Nikolas, Oliver Wallscheid, and Frank Schafmeister. “Dual-Active
    Bridge Sequential Pareto Optimization for Fast Pre-Design and Final Component
    Selection.” In <i>2024 IEEE Design Methodologies Conference (DMC)</i>, 1–8, 2024.
    <a href="https://doi.org/10.1109/DMC62632.2024.10812131">https://doi.org/10.1109/DMC62632.2024.10812131</a>.
  ieee: 'N. Förster, O. Wallscheid, and F. Schafmeister, “Dual-Active Bridge Sequential
    Pareto Optimization for Fast Pre-Design and Final Component Selection,” in <i>2024
    IEEE Design Methodologies Conference (DMC)</i>, 2024, pp. 1–8, doi: <a href="https://doi.org/10.1109/DMC62632.2024.10812131">10.1109/DMC62632.2024.10812131</a>.'
  mla: Förster, Nikolas, et al. “Dual-Active Bridge Sequential Pareto Optimization
    for Fast Pre-Design and Final Component Selection.” <i>2024 IEEE Design Methodologies
    Conference (DMC)</i>, 2024, pp. 1–8, doi:<a href="https://doi.org/10.1109/DMC62632.2024.10812131">10.1109/DMC62632.2024.10812131</a>.
  short: 'N. Förster, O. Wallscheid, F. Schafmeister, in: 2024 IEEE Design Methodologies
    Conference (DMC), 2024, pp. 1–8.'
date_created: 2026-01-06T08:06:24Z
date_updated: 2026-01-06T08:07:50Z
department:
- _id: '52'
doi: 10.1109/DMC62632.2024.10812131
keyword:
- MOSFET
- Thermal resistance
- Surface resistance
- Bridge circuits
- Zero voltage switching
- Pareto optimization
- Capacitance
- Numerical simulation
- Optimization
- Resistance heating
- Pareto Optimization
- Dual-Active Bridge
- ZVS
- Inductor Optimization
- Transformer Optimization
- Heat Sink Optimization
language:
- iso: eng
page: 1-8
publication: 2024 IEEE Design Methodologies Conference (DMC)
status: public
title: Dual-Active Bridge Sequential Pareto Optimization for Fast Pre-Design and Final
  Component Selection
type: conference
user_id: '83383'
year: '2024'
...
---
_id: '49433'
author:
- first_name: Maximilian Alexander
  full_name: Kaiser, Maximilian Alexander
  id: '72351'
  last_name: Kaiser
  orcid: 0009-0008-1333-3396
- first_name: Pawel
  full_name: Rockicki, Pawel
  last_name: Rockicki
- first_name: Fabian
  full_name: Höschen, Fabian
  last_name: Höschen
- first_name: Jan-Niklas
  full_name: Wesendahl, Jan-Niklas
  last_name: Wesendahl
- first_name: Stefan
  full_name: Konrad, Stefan
  last_name: Konrad
- first_name: Thomas
  full_name: Meyer, Thomas
  last_name: Meyer
- first_name: Thorsten
  full_name: Marten, Thorsten
  id: '338'
  last_name: Marten
  orcid: 0009-0001-6433-7839
- first_name: Thomas
  full_name: Tröster, Thomas
  id: '553'
  last_name: Tröster
citation:
  ama: 'Kaiser MA, Rockicki P, Höschen F, et al.  Heat transfer coefficient investigation
    for hot die quenching process of Ti-6Al-4V alloy. In: ; 2022.'
  apa: Kaiser, M. A., Rockicki, P., Höschen, F., Wesendahl, J.-N., Konrad, S., Meyer,
    T., Marten, T., &#38; Tröster, T. (2022). <i> Heat transfer coefficient investigation
    for hot die quenching process of Ti-6Al-4V alloy</i>. Titanium USA 2022 Conference
    , Orlando.
  bibtex: '@inproceedings{Kaiser_Rockicki_Höschen_Wesendahl_Konrad_Meyer_Marten_Tröster_2022,
    title={ Heat transfer coefficient investigation for hot die quenching process
    of Ti-6Al-4V alloy}, author={Kaiser, Maximilian Alexander and Rockicki, Pawel
    and Höschen, Fabian and Wesendahl, Jan-Niklas and Konrad, Stefan and Meyer, Thomas
    and Marten, Thorsten and Tröster, Thomas}, year={2022} }'
  chicago: Kaiser, Maximilian Alexander, Pawel Rockicki, Fabian Höschen, Jan-Niklas
    Wesendahl, Stefan Konrad, Thomas Meyer, Thorsten Marten, and Thomas Tröster. “
    Heat Transfer Coefficient Investigation for Hot Die Quenching Process of Ti-6Al-4V
    Alloy,” 2022.
  ieee: M. A. Kaiser <i>et al.</i>, “ Heat transfer coefficient investigation for
    hot die quenching process of Ti-6Al-4V alloy,” presented at the Titanium USA 2022
    Conference , Orlando, 2022.
  mla: Kaiser, Maximilian Alexander, et al. <i> Heat Transfer Coefficient Investigation
    for Hot Die Quenching Process of Ti-6Al-4V Alloy</i>. 2022.
  short: 'M.A. Kaiser, P. Rockicki, F. Höschen, J.-N. Wesendahl, S. Konrad, T. Meyer,
    T. Marten, T. Tröster, in: 2022.'
conference:
  end_date: 2022-10-12
  location: Orlando
  name: 'Titanium USA 2022 Conference '
  start_date: 2022-10-09
date_created: 2023-12-04T10:17:16Z
date_updated: 2025-05-19T11:46:03Z
department:
- _id: '9'
- _id: '321'
- _id: '149'
keyword:
- Ti-6Al-4V
- heat transfer coefficient
language:
- iso: eng
status: public
title: ' Heat transfer coefficient investigation for hot die quenching process of
  Ti-6Al-4V alloy'
type: conference_abstract
user_id: '72351'
year: '2022'
...
---
_id: '9868'
abstract:
- lang: eng
  text: In order to increase mechanical strength, heat dissipation and ampacity and
    to decrease failure through fatigue fracture, wedge copper wire bonding is being
    introduced as a standard interconnection method for mass production. To achieve
    the same process stability when using copper wire instead of aluminum wire a profound
    understanding of the bonding process is needed. Due to the higher hardness of
    copper compared to aluminum wire it is more difficult to approach the surfaces
    of wire and substrate to a level where van der Waals forces are able to arise
    between atoms. Also, enough friction energy referred to the total contact area
    has to be generated to activate the surfaces. Therefore, a friction model is used
    to simulate the joining process. This model calculates the resulting energy of
    partial areas in the contact surface and provides information about the adhesion
    process of each area. The focus here is on the arising of micro joints in the
    contact area depending on the location in the contact and time. To validate the
    model, different touchdown forces are used to vary the initial contact areas of
    wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
    up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
    for the real bonding process to map with the model. Test substrates as DBC and
    copper plate are used to show the different formations of a wedge bond connection
    due to hardness and reaction propensity. The experiments were done by using 500
    $\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
    wire bonds using a friction model approach. In: <i>Electronic Components and Technology
    Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the
    bond quality of copper wire bonds using a friction model approach. In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555).
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
    bond quality of copper wire bonds using a friction model approach}, DOI={<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>},
    booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
    author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
    year={2014}, pages={1549–1555} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
    the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014.
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
    of copper wire bonds using a friction model approach,” in <i>Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.
  mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
    a Friction Model Approach.” <i>Electronic Components and Technology Conference
    (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...