---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...