[{"date_updated":"2020-05-07T05:33:56Z","author":[{"id":"66833","full_name":"Dymel, Collin","last_name":"Dymel","first_name":"Collin"},{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"}],"date_created":"2019-05-27T10:19:18Z","title":"Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding","quality_controlled":"1","year":"2018","page":"41-44","citation":{"ama":"Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.","ieee":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","chicago":"Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44, 2018.","apa":"Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44).","bibtex":"@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }","short":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","mla":"Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44."},"_id":"9993","project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"department":[{"_id":"151"}],"user_id":"210","keyword":["ultrasonic two-dimensional bonding","electrical interconnection","process parameters"],"language":[{"iso":"eng"}],"publication":"(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)","type":"conference","abstract":[{"text":"Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories.","lang":"eng"}],"status":"public"},{"citation":{"chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018."},"year":"2018","quality_controlled":"1","doi":"10.4071/2380-4505-2018.1.000572","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","author":[{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2019-05-27T10:27:45Z","volume":"Vol. 2018, No. 1, pp. 000572-000577.","date_updated":"2020-05-07T05:33:56Z","status":"public","abstract":[{"text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives.","lang":"eng"}],"type":"conference","publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","language":[{"iso":"eng"}],"keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"user_id":"210","department":[{"_id":"151"}],"project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"_id":"9999"},{"publication_status":"published","publication_identifier":{"issn":["0255-2701"]},"quality_controlled":"1","year":"2017","citation":{"ama":"Lier S, Riese J, Cvetanoska G, et al. Innovative scaling strategies for a fast development of apparatuses by modular process engineering. <i>Chemical Engineering and Processing - Process Intensification</i>. 2017;123:111-125. doi:<a href=\"https://doi.org/10.1016/j.cep.2017.10.026\">10.1016/j.cep.2017.10.026</a>","ieee":"S. Lier <i>et al.</i>, “Innovative scaling strategies for a fast development of apparatuses by modular process engineering,” <i>Chemical Engineering and Processing - Process Intensification</i>, vol. 123, pp. 111–125, 2017, doi: <a href=\"https://doi.org/10.1016/j.cep.2017.10.026\">10.1016/j.cep.2017.10.026</a>.","chicago":"Lier, Stefan, Julia Riese, Gordana Cvetanoska, Anna Katharina Lesniak, Stephan Müller, Sarah Paul, Laura Sengen, and Marcus Grünewald. “Innovative Scaling Strategies for a Fast Development of Apparatuses by Modular Process Engineering.” <i>Chemical Engineering and Processing - Process Intensification</i> 123 (2017): 111–25. <a href=\"https://doi.org/10.1016/j.cep.2017.10.026\">https://doi.org/10.1016/j.cep.2017.10.026</a>.","short":"S. Lier, J. Riese, G. Cvetanoska, A.K. Lesniak, S. Müller, S. Paul, L. Sengen, M. Grünewald, Chemical Engineering and Processing - Process Intensification 123 (2017) 111–125.","bibtex":"@article{Lier_Riese_Cvetanoska_Lesniak_Müller_Paul_Sengen_Grünewald_2017, title={Innovative scaling strategies for a fast development of apparatuses by modular process engineering}, volume={123}, DOI={<a href=\"https://doi.org/10.1016/j.cep.2017.10.026\">10.1016/j.cep.2017.10.026</a>}, journal={Chemical Engineering and Processing - Process Intensification}, publisher={Elsevier BV}, author={Lier, Stefan and Riese, Julia and Cvetanoska, Gordana and Lesniak, Anna Katharina and Müller, Stephan and Paul, Sarah and Sengen, Laura and Grünewald, Marcus}, year={2017}, pages={111–125} }","mla":"Lier, Stefan, et al. “Innovative Scaling Strategies for a Fast Development of Apparatuses by Modular Process Engineering.” <i>Chemical Engineering and Processing - Process Intensification</i>, vol. 123, Elsevier BV, 2017, pp. 111–25, doi:<a href=\"https://doi.org/10.1016/j.cep.2017.10.026\">10.1016/j.cep.2017.10.026</a>.","apa":"Lier, S., Riese, J., Cvetanoska, G., Lesniak, A. K., Müller, S., Paul, S., Sengen, L., &#38; Grünewald, M. (2017). Innovative scaling strategies for a fast development of apparatuses by modular process engineering. <i>Chemical Engineering and Processing - Process Intensification</i>, <i>123</i>, 111–125. <a href=\"https://doi.org/10.1016/j.cep.2017.10.026\">https://doi.org/10.1016/j.cep.2017.10.026</a>"},"intvolume":"       123","page":"111-125","publisher":"Elsevier BV","date_updated":"2024-03-08T11:32:13Z","date_created":"2023-10-04T14:19:52Z","author":[{"first_name":"Stefan","full_name":"Lier, Stefan","last_name":"Lier"},{"last_name":"Riese","orcid":"0000-0002-3053-0534","full_name":"Riese, Julia","id":"101499","first_name":"Julia"},{"first_name":"Gordana","full_name":"Cvetanoska, Gordana","last_name":"Cvetanoska"},{"first_name":"Anna Katharina","full_name":"Lesniak, Anna Katharina","last_name":"Lesniak"},{"last_name":"Müller","full_name":"Müller, Stephan","first_name":"Stephan"},{"first_name":"Sarah","last_name":"Paul","full_name":"Paul, Sarah"},{"first_name":"Laura","full_name":"Sengen, Laura","last_name":"Sengen"},{"first_name":"Marcus","last_name":"Grünewald","full_name":"Grünewald, Marcus"}],"volume":123,"title":"Innovative scaling strategies for a fast development of apparatuses by modular process engineering","doi":"10.1016/j.cep.2017.10.026","type":"journal_article","publication":"Chemical Engineering and Processing - Process Intensification","status":"public","_id":"47586","user_id":"101499","keyword":["Industrial and Manufacturing Engineering","Process Chemistry and Technology","Energy Engineering and Power Technology","General Chemical Engineering","General Chemistry"],"language":[{"iso":"eng"}],"extern":"1"},{"_id":"4690","user_id":"72849","keyword":["BPM workforce","Business process management","Competences","Gender diversity","Latent semantic analysis","Skills","Text mining"],"language":[{"iso":"eng"}],"extern":"1","type":"journal_article","publication":"Business and Information Systems Engineering","status":"public","date_updated":"2022-01-06T07:01:18Z","author":[{"first_name":"Elena","last_name":"Gorbacheva","full_name":"Gorbacheva, Elena"},{"first_name":"Armin","last_name":"Stein","full_name":"Stein, Armin"},{"first_name":"Theresa","full_name":"Schmiedel, Theresa","last_name":"Schmiedel"},{"last_name":"Müller","id":"72849","full_name":"Müller, Oliver","first_name":"Oliver"}],"date_created":"2018-10-12T08:29:58Z","title":"The Role of Gender in Business Process Management Competence Supply","doi":"10.1007/s12599-016-0428-2","publication_identifier":{"issn":["18670202"]},"issue":"3","year":"2016","citation":{"ama":"Gorbacheva E, Stein A, Schmiedel T, Müller O. The Role of Gender in Business Process Management Competence Supply. <i>Business and Information Systems Engineering</i>. 2016;(3):213--231. doi:<a href=\"https://doi.org/10.1007/s12599-016-0428-2\">10.1007/s12599-016-0428-2</a>","chicago":"Gorbacheva, Elena, Armin Stein, Theresa Schmiedel, and Oliver Müller. “The Role of Gender in Business Process Management Competence Supply.” <i>Business and Information Systems Engineering</i>, no. 3 (2016): 213--231. <a href=\"https://doi.org/10.1007/s12599-016-0428-2\">https://doi.org/10.1007/s12599-016-0428-2</a>.","ieee":"E. Gorbacheva, A. Stein, T. Schmiedel, and O. Müller, “The Role of Gender in Business Process Management Competence Supply,” <i>Business and Information Systems Engineering</i>, no. 3, pp. 213--231, 2016.","apa":"Gorbacheva, E., Stein, A., Schmiedel, T., &#38; Müller, O. (2016). The Role of Gender in Business Process Management Competence Supply. <i>Business and Information Systems Engineering</i>, (3), 213--231. <a href=\"https://doi.org/10.1007/s12599-016-0428-2\">https://doi.org/10.1007/s12599-016-0428-2</a>","bibtex":"@article{Gorbacheva_Stein_Schmiedel_Müller_2016, title={The Role of Gender in Business Process Management Competence Supply}, DOI={<a href=\"https://doi.org/10.1007/s12599-016-0428-2\">10.1007/s12599-016-0428-2</a>}, number={3}, journal={Business and Information Systems Engineering}, author={Gorbacheva, Elena and Stein, Armin and Schmiedel, Theresa and Müller, Oliver}, year={2016}, pages={213--231} }","short":"E. Gorbacheva, A. Stein, T. Schmiedel, O. Müller, Business and Information Systems Engineering (2016) 213--231.","mla":"Gorbacheva, Elena, et al. “The Role of Gender in Business Process Management Competence Supply.” <i>Business and Information Systems Engineering</i>, no. 3, 2016, pp. 213--231, doi:<a href=\"https://doi.org/10.1007/s12599-016-0428-2\">10.1007/s12599-016-0428-2</a>."},"page":"213--231"},{"citation":{"apa":"Müller, O., Schmiedel, T., Gorbacheva, E., &#38; vom Brocke, J. (2016). Towards a typology of business process management professionals: identifying patterns of competences through latent semantic analysis. <i>Enterprise Information Systems</i>, (1), 50--80. <a href=\"https://doi.org/10.1080/17517575.2014.923514\">https://doi.org/10.1080/17517575.2014.923514</a>","mla":"Müller, Oliver, et al. “Towards a Typology of Business Process Management Professionals: Identifying Patterns of Competences through Latent Semantic Analysis.” <i>Enterprise Information Systems</i>, no. 1, 2016, pp. 50--80, doi:<a href=\"https://doi.org/10.1080/17517575.2014.923514\">10.1080/17517575.2014.923514</a>.","short":"O. Müller, T. Schmiedel, E. Gorbacheva, J. vom Brocke, Enterprise Information Systems (2016) 50--80.","bibtex":"@article{Müller_Schmiedel_Gorbacheva_vom Brocke_2016, title={Towards a typology of business process management professionals: identifying patterns of competences through latent semantic analysis}, DOI={<a href=\"https://doi.org/10.1080/17517575.2014.923514\">10.1080/17517575.2014.923514</a>}, number={1}, journal={Enterprise Information Systems}, author={Müller, Oliver and Schmiedel, Theresa and Gorbacheva, Elena and vom Brocke, Jan}, year={2016}, pages={50--80} }","ama":"Müller O, Schmiedel T, Gorbacheva E, vom Brocke J. Towards a typology of business process management professionals: identifying patterns of competences through latent semantic analysis. <i>Enterprise Information Systems</i>. 2016;(1):50--80. doi:<a href=\"https://doi.org/10.1080/17517575.2014.923514\">10.1080/17517575.2014.923514</a>","ieee":"O. Müller, T. Schmiedel, E. Gorbacheva, and J. vom Brocke, “Towards a typology of business process management professionals: identifying patterns of competences through latent semantic analysis,” <i>Enterprise Information Systems</i>, no. 1, pp. 50--80, 2016.","chicago":"Müller, Oliver, Theresa Schmiedel, Elena Gorbacheva, and Jan vom Brocke. “Towards a Typology of Business Process Management Professionals: Identifying Patterns of Competences through Latent Semantic Analysis.” <i>Enterprise Information Systems</i>, no. 1 (2016): 50--80. <a href=\"https://doi.org/10.1080/17517575.2014.923514\">https://doi.org/10.1080/17517575.2014.923514</a>."},"page":"50--80","year":"2016","issue":"1","publication_identifier":{"issn":["17517583"]},"doi":"10.1080/17517575.2014.923514","title":"Towards a typology of business process management professionals: identifying patterns of competences through latent semantic analysis","date_created":"2018-10-12T08:30:10Z","author":[{"first_name":"Oliver","last_name":"Müller","id":"72849","full_name":"Müller, Oliver"},{"last_name":"Schmiedel","full_name":"Schmiedel, Theresa","first_name":"Theresa"},{"full_name":"Gorbacheva, Elena","last_name":"Gorbacheva","first_name":"Elena"},{"last_name":"vom Brocke","full_name":"vom Brocke, Jan","first_name":"Jan"}],"date_updated":"2022-01-06T07:01:18Z","status":"public","type":"journal_article","publication":"Enterprise Information Systems","language":[{"iso":"eng"}],"extern":"1","keyword":["abilities","business process management","competences","knowledge","latent semantic analysis","professionals","skills","typology"],"user_id":"72849","_id":"4692"},{"abstract":[{"lang":"eng","text":"While Islamic State is the most present example, it is a fact that in many places around the globe, throughout history initially small groups have tried to challenge and destabilize or even overthrow governments by means of terrorist and guerrilla strategies. Therefore, we answer two questions. Why does a small group of insurgents believe it can overthrow the government by turning violent, even if the government is clearly superior? And how does a conflict develop into terrorism, a guerilla war, or a major conventional civil war, or is resolved peacefully? We develop a formal model for rebels and government and derive optimal choices. Further, we focus on three elements as important ingredients of a \"destabilization war\". All three of these - large random events, time preference (which we relate to ideology), and choice of duration of fight - are rarely considered in formal conflict theory. We can answer the above two questions using game theory analysis. First, insurgents rise up because they hope to destabilize through permanent challenging attacks. In this context, large randomness is an important ally of rebels. While each individual attack may have a low impact, at some point a large random event could lead to success. Hence, the duration of activities is a constitutive element of this kind of armed conflict. Patience (low time preference), which may reflect rebels' degree of ideological motivation, is crucial. Second, the mode of warfare or the conflict resolutions that develop are generally path-dependent and conditioned on the full set of options (including compromise). Various conditions (level of funding, ease of recruitment, access to weapons) influence different modes of warfare or a peaceful compromise in a complex way."}],"file":[{"date_created":"2019-04-08T06:49:16Z","creator":"cjhaake","date_updated":"2019-04-08T06:49:16Z","file_name":"WP - An Economic Theory of ’Destabilization War'.pdf","access_level":"closed","file_id":"8838","file_size":516125,"content_type":"application/pdf","relation":"main_file","success":1}],"ddc":["040"],"keyword":["terrorism","civil war","conflict duration","game theory","stochastic process","ideology"],"language":[{"iso":"eng"}],"year":"2016","date_created":"2019-04-08T06:45:02Z","title":"An Economic Theory of 'Destabilization War'","type":"working_paper","status":"public","_id":"8836","user_id":"20801","series_title":"Working Papers CIE","department":[{"_id":"205"},{"_id":"475"}],"file_date_updated":"2019-04-08T06:49:16Z","has_accepted_license":"1","citation":{"short":"T. Gries, C.-J. Haake, An Economic Theory of “Destabilization War,” 2016.","bibtex":"@book{Gries_Haake_2016, series={Working Papers CIE}, title={An Economic Theory of “Destabilization War”}, volume={95}, author={Gries, Thomas and Haake, Claus-Jochen}, year={2016}, collection={Working Papers CIE} }","mla":"Gries, Thomas, and Claus-Jochen Haake. <i>An Economic Theory of “Destabilization War.”</i> Vol. 95, 2016.","apa":"Gries, T., &#38; Haake, C.-J. (2016). <i>An Economic Theory of “Destabilization War”</i> (Vol. 95).","ama":"Gries T, Haake C-J. <i>An Economic Theory of “Destabilization War.”</i> Vol 95.; 2016.","ieee":"T. Gries and C.-J. Haake, <i>An Economic Theory of “Destabilization War,”</i> vol. 95. 2016.","chicago":"Gries, Thomas, and Claus-Jochen Haake. <i>An Economic Theory of “Destabilization War.”</i> Vol. 95. Working Papers CIE, 2016."},"jel":["H56","O10","D84","C72","D74"],"intvolume":"        95","date_updated":"2022-01-06T07:04:03Z","author":[{"first_name":"Thomas","full_name":"Gries, Thomas","id":"186","last_name":"Gries"},{"last_name":"Haake","id":"20801","full_name":"Haake, Claus-Jochen","first_name":"Claus-Jochen"}],"volume":95},{"department":[{"_id":"151"}],"user_id":"210","_id":"9966","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"language":[{"iso":"eng"}],"keyword":["Self-optimization","adaptive system","bond process","copper wire"],"publication":"IEEE 66th Electronic Components and Technology Conference","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented."}],"author":[{"full_name":"Meyer , Tobias","last_name":"Meyer ","first_name":"Tobias"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}],"date_created":"2019-05-27T09:17:26Z","date_updated":"2020-05-07T05:33:53Z","doi":"10.1109/ECTC.2016.215","title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","quality_controlled":"1","page":"622-628","citation":{"ama":"Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:622-628. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 622–28, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>.","ieee":"T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–628.","mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–28, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>.","bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.","apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 622–628). <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>"},"year":"2016"},{"title":"Validated Simulation of the Ultrasonic Wire Bonding Process","author":[{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}],"date_created":"2019-05-27T09:20:10Z","date_updated":"2020-05-07T05:33:53Z","page":"251-254","citation":{"bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254."},"year":"2016","place":"IEEE CPMT Symposium Japan","quality_controlled":"1","language":[{"iso":"eng"}],"keyword":["the Ultrasonic Wire Bonding Process"],"department":[{"_id":"151"}],"user_id":"210","_id":"9968","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"status":"public","abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","type":"conference"},{"doi":"10.15372/fgv20160302","title":"Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame","date_created":"2022-08-02T10:19:27Z","date_updated":"2022-08-15T13:54:41Z","publisher":"Publishing House SB RAS","citation":{"chicago":"“Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame.” <i>Физика Горения и Взрыва</i>, no. 3 (2016). <a href=\"https://doi.org/10.15372/fgv20160302\">https://doi.org/10.15372/fgv20160302</a>.","ieee":"“Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame,” <i>Физика горения и взрыва</i>, no. 3, 2016, doi: <a href=\"https://doi.org/10.15372/fgv20160302\">10.15372/fgv20160302</a>.","ama":"Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame. <i>Физика горения и взрыва</i>. 2016;(3). doi:<a href=\"https://doi.org/10.15372/fgv20160302\">10.15372/fgv20160302</a>","mla":"“Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame.” <i>Физика Горения и Взрыва</i>, no. 3, Publishing House SB RAS, 2016, doi:<a href=\"https://doi.org/10.15372/fgv20160302\">10.15372/fgv20160302</a>.","short":"Физика Горения и Взрыва (2016).","bibtex":"@article{Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame_2016, DOI={<a href=\"https://doi.org/10.15372/fgv20160302\">10.15372/fgv20160302</a>}, number={3}, journal={Физика горения и взрыва}, publisher={Publishing House SB RAS}, year={2016} }","apa":"Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame. (2016). <i>Физика Горения и Взрыва</i>, <i>3</i>. <a href=\"https://doi.org/10.15372/fgv20160302\">https://doi.org/10.15372/fgv20160302</a>"},"year":"2016","issue":"3","publication_identifier":{"issn":["0430-6228"]},"publication_status":"published","keyword":["Process Chemistry and Technology","Mechanical Engineering"],"user_id":"94996","_id":"32478","status":"public","publication":"Физика горения и взрыва","type":"journal_article"},{"language":[{"iso":"eng"}],"keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"user_id":"55222","department":[{"_id":"151"}],"_id":"9868","status":"public","abstract":[{"lang":"eng","text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool."}],"type":"conference","publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","doi":"10.1109/ECTC.2014.6897500","title":"Improving the bond quality of copper wire bonds using a friction model approach","date_created":"2019-05-20T12:11:44Z","author":[{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Jan","full_name":"Neuhaus, Jan","last_name":"Neuhaus"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_updated":"2019-09-16T10:57:58Z","citation":{"bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>.","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555."},"page":"1549-1555","year":"2014","quality_controlled":"1"},{"keyword":["Business process management","Conceptual modeling","Interaction routines","Modular design","Service networks","Social construction"],"language":[{"iso":"eng"}],"extern":"1","_id":"4699","user_id":"72849","status":"public","publication":"Scandinavian Journal of Information Systems","type":"journal_article","title":"Designing interaction routines in service networks: A modularity and social construction-based approach","main_file_link":[{"url":"https://aisel.aisnet.org/sjis/vol25/iss1/2/"}],"date_updated":"2022-01-06T07:01:18Z","date_created":"2018-10-12T08:30:56Z","author":[{"last_name":"Becker","full_name":"Becker, Jörg","first_name":"Jörg"},{"full_name":"Beverungen, Daniel","id":"59677","last_name":"Beverungen","first_name":"Daniel"},{"full_name":"Knackstedt, Ralf","last_name":"Knackstedt","first_name":"Ralf"},{"full_name":"Matzner, Martin","last_name":"Matzner","first_name":"Martin"},{"first_name":"Oliver","last_name":"Müller","full_name":"Müller, Oliver","id":"72849"},{"full_name":"Pöppelbuss, Jens","last_name":"Pöppelbuss","first_name":"Jens"}],"year":"2013","page":"17--47","citation":{"apa":"Becker, J., Beverungen, D., Knackstedt, R., Matzner, M., Müller, O., &#38; Pöppelbuss, J. (2013). Designing interaction routines in service networks: A modularity and social construction-based approach. <i>Scandinavian Journal of Information Systems</i>, (1), 17--47.","short":"J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, J. Pöppelbuss, Scandinavian Journal of Information Systems (2013) 17--47.","bibtex":"@article{Becker_Beverungen_Knackstedt_Matzner_Müller_Pöppelbuss_2013, title={Designing interaction routines in service networks: A modularity and social construction-based approach}, number={1}, journal={Scandinavian Journal of Information Systems}, author={Becker, Jörg and Beverungen, Daniel and Knackstedt, Ralf and Matzner, Martin and Müller, Oliver and Pöppelbuss, Jens}, year={2013}, pages={17--47} }","mla":"Becker, Jörg, et al. “Designing Interaction Routines in Service Networks: A Modularity and Social Construction-Based Approach.” <i>Scandinavian Journal of Information Systems</i>, no. 1, 2013, pp. 17--47.","ama":"Becker J, Beverungen D, Knackstedt R, Matzner M, Müller O, Pöppelbuss J. Designing interaction routines in service networks: A modularity and social construction-based approach. <i>Scandinavian Journal of Information Systems</i>. 2013;(1):17--47.","chicago":"Becker, Jörg, Daniel Beverungen, Ralf Knackstedt, Martin Matzner, Oliver Müller, and Jens Pöppelbuss. “Designing Interaction Routines in Service Networks: A Modularity and Social Construction-Based Approach.” <i>Scandinavian Journal of Information Systems</i>, no. 1 (2013): 17--47.","ieee":"J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, and J. Pöppelbuss, “Designing interaction routines in service networks: A modularity and social construction-based approach,” <i>Scandinavian Journal of Information Systems</i>, no. 1, pp. 17--47, 2013."},"publication_identifier":{"issn":["09050167"]},"issue":"1"},{"date_updated":"2022-01-06T07:01:19Z","author":[{"first_name":"Jorg","full_name":"Becker, Jorg","last_name":"Becker"},{"id":"59677","full_name":"Beverungen, Daniel","last_name":"Beverungen","first_name":"Daniel"},{"full_name":"Knackstedt, Ralf","last_name":"Knackstedt","first_name":"Ralf"},{"last_name":"Matzner","full_name":"Matzner, Martin","first_name":"Martin"},{"first_name":"Oliver","full_name":"Müller, Oliver","id":"72849","last_name":"Müller"},{"last_name":"Pöppelbuss","full_name":"Pöppelbuss, Jens","first_name":"Jens"}],"date_created":"2018-10-12T08:31:02Z","title":"Bridging the gap between manufacturing and service through IT-based boundary objects","doi":"10.1109/TEM.2012.2214770","publication_identifier":{"issn":["00189391"],"isbn":["0018-9391"]},"issue":"3","year":"2013","citation":{"apa":"Becker, J., Beverungen, D., Knackstedt, R., Matzner, M., Müller, O., &#38; Pöppelbuss, J. (2013). Bridging the gap between manufacturing and service through IT-based boundary objects. <i>IEEE Transactions on Engineering Management</i>, (3), 468--482. <a href=\"https://doi.org/10.1109/TEM.2012.2214770\">https://doi.org/10.1109/TEM.2012.2214770</a>","short":"J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, J. Pöppelbuss, IEEE Transactions on Engineering Management (2013) 468--482.","bibtex":"@article{Becker_Beverungen_Knackstedt_Matzner_Müller_Pöppelbuss_2013, title={Bridging the gap between manufacturing and service through IT-based boundary objects}, DOI={<a href=\"https://doi.org/10.1109/TEM.2012.2214770\">10.1109/TEM.2012.2214770</a>}, number={3}, journal={IEEE Transactions on Engineering Management}, author={Becker, Jorg and Beverungen, Daniel and Knackstedt, Ralf and Matzner, Martin and Müller, Oliver and Pöppelbuss, Jens}, year={2013}, pages={468--482} }","mla":"Becker, Jorg, et al. “Bridging the Gap between Manufacturing and Service through IT-Based Boundary Objects.” <i>IEEE Transactions on Engineering Management</i>, no. 3, 2013, pp. 468--482, doi:<a href=\"https://doi.org/10.1109/TEM.2012.2214770\">10.1109/TEM.2012.2214770</a>.","ama":"Becker J, Beverungen D, Knackstedt R, Matzner M, Müller O, Pöppelbuss J. Bridging the gap between manufacturing and service through IT-based boundary objects. <i>IEEE Transactions on Engineering Management</i>. 2013;(3):468--482. doi:<a href=\"https://doi.org/10.1109/TEM.2012.2214770\">10.1109/TEM.2012.2214770</a>","chicago":"Becker, Jorg, Daniel Beverungen, Ralf Knackstedt, Martin Matzner, Oliver Müller, and Jens Pöppelbuss. “Bridging the Gap between Manufacturing and Service through IT-Based Boundary Objects.” <i>IEEE Transactions on Engineering Management</i>, no. 3 (2013): 468--482. <a href=\"https://doi.org/10.1109/TEM.2012.2214770\">https://doi.org/10.1109/TEM.2012.2214770</a>.","ieee":"J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, and J. Pöppelbuss, “Bridging the gap between manufacturing and service through IT-based boundary objects,” <i>IEEE Transactions on Engineering Management</i>, no. 3, pp. 468--482, 2013."},"page":"468--482","_id":"4700","user_id":"72849","keyword":["Action research","boundary spanning","business process management (BPM)","service blueprinting","service networks"],"extern":"1","language":[{"iso":"eng"}],"type":"journal_article","publication":"IEEE Transactions on Engineering Management","status":"public"},{"publication":"Nanotechnology Reviews","abstract":[{"lang":"eng","text":"<jats:title>Abstract</jats:title><jats:p>Nanoparticles (NP) have specific catalytic properties, which are influenced by parameters like their size, shape, or composition. Bimetallic NPs, composed of two metal elements can show an improved catalytic activity compared to the monometallic NPs. We, herein, report on the selective aerobic oxidation of benzyl alcohol catalyzed by unsupported Pd/Au and Pd NPs at atmospheric pressure. NPs of varying compositions were synthesized and characterized by UV/Vis spectroscopy, transmission electron microscopy (TEM), and small-angle X-ray scattering (SAXS). The NPs were tested in the model reaction regarding their catalytic activity, stability, and recyclability in batch and continuous procedure. Additionally, <jats:italic>in situ</jats:italic> extended X-ray absorption fine structure (EXAFS) measurements were performed in order to get insight in the process during NP catalysis.</jats:p>"}],"language":[{"iso":"eng"}],"keyword":["Surfaces","Coatings and Films","Process Chemistry and Technology","Energy Engineering and Power Technology","Biomaterials","Medicine (miscellaneous)","Biotechnology"],"issue":"1","year":"2013","date_created":"2023-01-31T14:50:22Z","publisher":"Walter de Gruyter GmbH","title":"On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow","type":"journal_article","status":"public","user_id":"48467","department":[{"_id":"306"}],"_id":"41234","publication_status":"published","publication_identifier":{"issn":["2191-9097","2191-9089"]},"citation":{"apa":"Alex, H., Steinfeldt, N., Jähnisch, K., Bauer, M., &#38; Hübner, S. (2013). On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow. <i>Nanotechnology Reviews</i>, <i>3</i>(1), 99–110. <a href=\"https://doi.org/10.1515/ntrev-2012-0085\">https://doi.org/10.1515/ntrev-2012-0085</a>","short":"H. Alex, N. Steinfeldt, K. Jähnisch, M. Bauer, S. Hübner, Nanotechnology Reviews 3 (2013) 99–110.","mla":"Alex, Hannes, et al. “On the Selective Aerobic Oxidation of Benzyl Alcohol with Pd/Au-Nanoparticles in Batch and Flow.” <i>Nanotechnology Reviews</i>, vol. 3, no. 1, Walter de Gruyter GmbH, 2013, pp. 99–110, doi:<a href=\"https://doi.org/10.1515/ntrev-2012-0085\">10.1515/ntrev-2012-0085</a>.","bibtex":"@article{Alex_Steinfeldt_Jähnisch_Bauer_Hübner_2013, title={On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow}, volume={3}, DOI={<a href=\"https://doi.org/10.1515/ntrev-2012-0085\">10.1515/ntrev-2012-0085</a>}, number={1}, journal={Nanotechnology Reviews}, publisher={Walter de Gruyter GmbH}, author={Alex, Hannes and Steinfeldt, Norbert and Jähnisch, Klaus and Bauer, Matthias and Hübner, Sandra}, year={2013}, pages={99–110} }","ama":"Alex H, Steinfeldt N, Jähnisch K, Bauer M, Hübner S. On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow. <i>Nanotechnology Reviews</i>. 2013;3(1):99-110. doi:<a href=\"https://doi.org/10.1515/ntrev-2012-0085\">10.1515/ntrev-2012-0085</a>","ieee":"H. Alex, N. Steinfeldt, K. Jähnisch, M. Bauer, and S. Hübner, “On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow,” <i>Nanotechnology Reviews</i>, vol. 3, no. 1, pp. 99–110, 2013, doi: <a href=\"https://doi.org/10.1515/ntrev-2012-0085\">10.1515/ntrev-2012-0085</a>.","chicago":"Alex, Hannes, Norbert Steinfeldt, Klaus Jähnisch, Matthias Bauer, and Sandra Hübner. “On the Selective Aerobic Oxidation of Benzyl Alcohol with Pd/Au-Nanoparticles in Batch and Flow.” <i>Nanotechnology Reviews</i> 3, no. 1 (2013): 99–110. <a href=\"https://doi.org/10.1515/ntrev-2012-0085\">https://doi.org/10.1515/ntrev-2012-0085</a>."},"intvolume":"         3","page":"99-110","author":[{"last_name":"Alex","full_name":"Alex, Hannes","first_name":"Hannes"},{"last_name":"Steinfeldt","full_name":"Steinfeldt, Norbert","first_name":"Norbert"},{"full_name":"Jähnisch, Klaus","last_name":"Jähnisch","first_name":"Klaus"},{"first_name":"Matthias","full_name":"Bauer, Matthias","id":"47241","last_name":"Bauer","orcid":"0000-0002-9294-6076"},{"first_name":"Sandra","last_name":"Hübner","full_name":"Hübner, Sandra"}],"volume":3,"date_updated":"2023-01-31T14:52:30Z","doi":"10.1515/ntrev-2012-0085"},{"year":"2012","citation":{"apa":"Jenert, T. (2012). <i>Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit: Theoretische Grundlegung und empirische Analyse</i>. Universität St. Gallen.","mla":"Jenert, Tobias. <i>Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit: Theoretische Grundlegung Und Empirische Analyse</i>. Universität St. Gallen, 2012.","bibtex":"@book{Jenert_2012, title={Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit: Theoretische Grundlegung und empirische Analyse}, publisher={Universität St. Gallen}, author={Jenert, Tobias}, year={2012} }","short":"T. Jenert, Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit: Theoretische Grundlegung Und Empirische Analyse, Universität St. Gallen, 2012.","ama":"Jenert T. <i>Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit: Theoretische Grundlegung Und Empirische Analyse</i>. Universität St. Gallen; 2012.","ieee":"T. Jenert, <i>Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit: Theoretische Grundlegung und empirische Analyse</i>. Universität St. Gallen, 2012.","chicago":"Jenert, Tobias. <i>Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit: Theoretische Grundlegung Und Empirische Analyse</i>. Universität St. Gallen, 2012."},"title":"Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit: Theoretische Grundlegung und empirische Analyse","publisher":"Universität St. Gallen","date_updated":"2022-01-06T07:01:04Z","date_created":"2018-09-18T11:38:39Z","author":[{"first_name":"Tobias","last_name":"Jenert","full_name":"Jenert, Tobias"}],"abstract":[{"text":"\t\r\nMit welchen Erwartungen und Anforderungen sehen sich Studierende im Hochschulalltag konfrontiert? Wie muss nach Ansicht der Studierenden gehandelt werden, um das Studium \"erfolgreich\" zu bewältigen? Wie laufen die Auswahl unterschiedlicher Lernaktivitäten im Studium sowie die Allokation von Ressourcen im Detail ab? Diese und weitere Fragen sind vor allem im Zusammenhang mit der Debatte um die Bologna-Reform stärker in den Mittelpunkt gerückt. Denn während modularisierte Curricula und Credit-Point-Systeme oft nach administrativ-organisatorischen Gesichtspunkten eingeführt wurden, hat die Gestaltung der Studienstrukturen auf Programmebene zwangsweise Auswirkungen auf das Studienhandeln - und damit auch auf das Lernen der Studierenden. Es gibt viele Vermutungen über die \"Wirkungen\" von Bologna auf das Studieren: Die Rede ist von Verschulung, Entwissenschaftlichung und Arbeitsüberlastung und Studierende stehen im Verdacht, ihren Studienpfad eher im Sinne einer Credit-Point-Jagd denn interessengeleitet zu gestalten. In der Regel bleibt es dabei jedoch bei anekdotischen Beobachtungen - es fehlt bislang an gesicherten Erkenntnissen über Zusammenhänge zwischen Bologna-konformen Studienkontexten und dem Handeln Studierender. Denn obschon Studierende seit langem Gegenstand der Forschung sind, ist bislang wenig darüber bekannt, wie sie den langfristigen Bildungsprozess eines ganzen Studiums gestalten. Stattdessen wurde vorwiegend das Lernen im engeren Sinne, das so genannte \"Classroom Learning\" untersucht.\r\n\r\nDiejenigen, die Studienprogramme nach didaktischen Gesichtspunkten gestalten wollen müssen wissen, wie Studierende mit unterschiedlichen Studienstrukturen umgehen. Denn nur so ist eine planvolle Programmgestaltung im Sinne pädagogischer Zielsetzungen und didaktischer Prinzipien möglich. Die vorliegende Arbeit nimmt diese Problemstellung auf und untersucht, welche Zielvorstellungen und Handlungsstrategien Studierende bei der Bewältigung ihres Studienalltags in unterschiedlichen Bologna-konformen Studienprogrammen entwickeln. Im Einzelnen wird gefragt, (1) welche Vorstellungen, Wahrnehmungen und Handlungslogiken das Handeln Studierender in unterschiedlichen Studienprogrammen prägen und (2) welche programmspezifischen Kontextbedingungen die Herausbildung dieser handlungsleitenden Charakteristika beeinflussen. Ausgehend von diesen beiden Fragestellungen wird zunächst ein theoretisch fundierter Analyserahmen für Studienprogramme entwickelt. Darauf aufbauend werden verschiedene Studienprogramme empirisch untersucht, um schliesslich Design-Prinzipien für die Gestaltung von Studienprogrammen zu formulieren.\r\n\r\nEs wird nicht davon ausgegangen, dass Studienstrukturen das Handeln Studierender im Sinne eines kausalen Wirkungszusammenhangs bestimmen. Vielmehr wird gefragt, was die Studierenden mit den Strukturen, auf die sie treffen, machen. Studienprogramme werden als kulturelle Einheiten verstanden, innerhalb derer sich spezifische handlungsleitende Vorstellungen und Normen entwickeln. Diese impliziten Regeln des Studienhandelns - das so genannte \"Hidden Curriculum\" - und vor allem auch die dahinterliegenden Konstruktionsprozesse aufzudecken, ist Ziel dieser Arbeit.","lang":"ger"}],"status":"public","type":"dissertation","keyword":["Studierverhalten","Hochschuldidaktik","Lernpsychologie","Kulturpsychologie","Bologna-Prozess","Curriculumentwicklung","Hochschulbildung","Study programme","Bologna-process","educational development","cultural psychology","higher education","curriculum development"],"extern":"1","_id":"4443","user_id":"51057","department":[{"_id":"208"},{"_id":"282"}]},{"year":"2012","page":"625--643","citation":{"chicago":"Janiesch, Christian, Martin Matzner, and Oliver Müller. “Beyond Process Monitoring: A Proof-of-Concept of Event-Driven Business Activity Management.” <i>Business Process Management Journal</i>, no. 4 (2012): 625--643. <a href=\"https://doi.org/10.1108/14637151211253765\">https://doi.org/10.1108/14637151211253765</a>.","ieee":"C. Janiesch, M. Matzner, and O. Müller, “Beyond process monitoring: A proof-of-concept of event-driven business activity management,” <i>Business Process Management Journal</i>, no. 4, pp. 625--643, 2012.","ama":"Janiesch C, Matzner M, Müller O. Beyond process monitoring: A proof-of-concept of event-driven business activity management. <i>Business Process Management Journal</i>. 2012;(4):625--643. doi:<a href=\"https://doi.org/10.1108/14637151211253765\">10.1108/14637151211253765</a>","apa":"Janiesch, C., Matzner, M., &#38; Müller, O. (2012). Beyond process monitoring: A proof-of-concept of event-driven business activity management. <i>Business Process Management Journal</i>, (4), 625--643. <a href=\"https://doi.org/10.1108/14637151211253765\">https://doi.org/10.1108/14637151211253765</a>","bibtex":"@article{Janiesch_Matzner_Müller_2012, title={Beyond process monitoring: A proof-of-concept of event-driven business activity management}, DOI={<a href=\"https://doi.org/10.1108/14637151211253765\">10.1108/14637151211253765</a>}, number={4}, journal={Business Process Management Journal}, author={Janiesch, Christian and Matzner, Martin and Müller, Oliver}, year={2012}, pages={625--643} }","short":"C. Janiesch, M. Matzner, O. Müller, Business Process Management Journal (2012) 625--643.","mla":"Janiesch, Christian, et al. “Beyond Process Monitoring: A Proof-of-Concept of Event-Driven Business Activity Management.” <i>Business Process Management Journal</i>, no. 4, 2012, pp. 625--643, doi:<a href=\"https://doi.org/10.1108/14637151211253765\">10.1108/14637151211253765</a>."},"publication_identifier":{"isbn":["1020120096"],"issn":["14637154"]},"issue":"4","title":"Beyond process monitoring: A proof-of-concept of event-driven business activity management","doi":"10.1108/14637151211253765","date_updated":"2022-01-06T07:01:19Z","author":[{"first_name":"Christian","full_name":"Janiesch, Christian","last_name":"Janiesch"},{"last_name":"Matzner","full_name":"Matzner, Martin","first_name":"Martin"},{"first_name":"Oliver","full_name":"Müller, Oliver","id":"72849","last_name":"Müller"}],"date_created":"2018-10-12T08:36:51Z","abstract":[{"text":"Purpose – The purpose of this paper is to show how to employ complex event processing (CEP) for the observation and management of business processes. It proposes a conceptual architecture of BPM event producer, processor, and consumer and describes technical implications for the application with standard software in a perfect order scenario. Design/methodology/approach – The authors discuss business process analytics as the technological background. The capabilities of CEP in a BPM context are outlined an architecture design is proposed. A sophisticated proof-of-concept demonstrates its applicability. Findings – The results overcome the separation and data latency issues of process controlling, monitoring, and simulation. Distinct analyses of past, present, and future blur into a holistic real-time approach. The authors highlight the necessity for configurable event producer in BPM engines, process event support in CEP engines, a common process event format, connectors to visualizers, notifiers and return channels to the BPM engine. Research limitations/implications – Further research will thoroughly evaluate the approach in a variety of business settings. New concepts and standards for the architecture's building blocks will be needed to improve maintainability and operability. Practical implications – Managers learn how CEP can yield insights into business processes' operations. The paper illustrates a path to overcome inflexibility, latency, and missing feedback mechanisms of current process modeling and control solutions. Software vendors might be interested in the conceptualization and the described needs for further development. Originality/value – So far, there is no commercial CEP-based BPM solution which facilitates a round trip from insight to action as outlines. As major software vendors have begun developing solutions (BPM/BPA solutions), this paper will stimulate a debate between research and practice on suitable design and technology.","lang":"eng"}],"status":"public","publication":"Business Process Management Journal","type":"journal_article","keyword":["Architecture","Business activity monitoring","Business process management","Business process re-engineering","Complex event processing","Computer software","Standard software"],"extern":"1","_id":"4706","user_id":"72849"},{"user_id":"55222","department":[{"_id":"151"}],"_id":"9783","language":[{"iso":"eng"}],"keyword":["cavitation","chemical reactors","microphones","process monitoring","reliability","ultrasonic applications","ultrasonic waves","acoustic properties","cavitation based ultrasound applications","cavitation intensity","change detection reliability","external microphone","malfunction detection reliability","nonperturbing cavitation detection","nonperturbing cavitation monitoring","process monitoring","self-sensing ultrasound transducer","sonochemical reactors","sonochemistry","ultrasound cleaning","ultrasound irradiation","Acoustics","Liquids","Monitoring","Sensors","Sonar equipment","Transducers","Ultrasonic imaging"],"type":"conference","publication":"Ultrasonics Symposium (IUS), 2012 IEEE International","status":"public","abstract":[{"lang":"eng","text":"To optimize the ultrasound irradiation for cavitation based ultrasound applications like sonochemistry or ultrasound cleaning, the correlation between cavitation intensity and the resulting effect on the process is of interest. Furthermore, changing conditions like temperature and pressure result in varying acoustic properties of the liquid. That might necessitate an adaption of the ultrasound irradiation. To detect such changes during operation, process monitoring is desired. Labor intensive processes, that might be carried out for several hours, also require process monitoring to increase their reliability by detection of changes or malfunctions during operation. In some applications cavitation detection and monitoring can be achieved by the application of sensors in the sound field. Though the application of sensors is possible, this necessitates modifications on the system and the sensor might disturb the sound field. In other applications harsh, process conditions prohibit the application of sensors in the sound field. Therefore alternative techniques for cavitation detection and monitoring are desired. The applicability of an external microphone and a self-sensing ultrasound transducer for cavitation detection were experimentally investigated. Both methods were found to be suitable and easily applicable."}],"author":[{"first_name":"Peter","full_name":"Bornmann, Peter","last_name":"Bornmann"},{"first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"},{"first_name":"Takafumi","full_name":"Maeda, Takafumi","last_name":"Maeda"},{"first_name":"Takeshi","last_name":"Morita","full_name":"Morita, Takeshi"}],"date_created":"2019-05-13T13:18:49Z","date_updated":"2022-01-06T07:04:20Z","doi":"10.1109/ULTSYM.2012.0284","title":"Non-perturbing cavitation detection / monitoring in sonochemical reactors","publication_identifier":{"issn":["1948-5719"]},"quality_controlled":"1","citation":{"chicago":"Bornmann, Peter, Tobias Hemsel, Walter Sextro, Takafumi Maeda, and Takeshi Morita. “Non-Perturbing Cavitation Detection / Monitoring in Sonochemical Reactors.” In <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i>, 1141–44, 2012. <a href=\"https://doi.org/10.1109/ULTSYM.2012.0284\">https://doi.org/10.1109/ULTSYM.2012.0284</a>.","ieee":"P. Bornmann, T. Hemsel, W. Sextro, T. Maeda, and T. Morita, “Non-perturbing cavitation detection / monitoring in sonochemical reactors,” in <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i>, 2012, pp. 1141–1144.","ama":"Bornmann P, Hemsel T, Sextro W, Maeda T, Morita T. Non-perturbing cavitation detection / monitoring in sonochemical reactors. In: <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i>. ; 2012:1141-1144. doi:<a href=\"https://doi.org/10.1109/ULTSYM.2012.0284\">10.1109/ULTSYM.2012.0284</a>","mla":"Bornmann, Peter, et al. “Non-Perturbing Cavitation Detection / Monitoring in Sonochemical Reactors.” <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i>, 2012, pp. 1141–44, doi:<a href=\"https://doi.org/10.1109/ULTSYM.2012.0284\">10.1109/ULTSYM.2012.0284</a>.","bibtex":"@inproceedings{Bornmann_Hemsel_Sextro_Maeda_Morita_2012, title={Non-perturbing cavitation detection / monitoring in sonochemical reactors}, DOI={<a href=\"https://doi.org/10.1109/ULTSYM.2012.0284\">10.1109/ULTSYM.2012.0284</a>}, booktitle={Ultrasonics Symposium (IUS), 2012 IEEE International}, author={Bornmann, Peter and Hemsel, Tobias and Sextro, Walter and Maeda, Takafumi and Morita, Takeshi}, year={2012}, pages={1141–1144} }","short":"P. Bornmann, T. Hemsel, W. Sextro, T. Maeda, T. Morita, in: Ultrasonics Symposium (IUS), 2012 IEEE International, 2012, pp. 1141–1144.","apa":"Bornmann, P., Hemsel, T., Sextro, W., Maeda, T., &#38; Morita, T. (2012). Non-perturbing cavitation detection / monitoring in sonochemical reactors. In <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i> (pp. 1141–1144). <a href=\"https://doi.org/10.1109/ULTSYM.2012.0284\">https://doi.org/10.1109/ULTSYM.2012.0284</a>"},"page":"1141-1144","year":"2012"},{"publication_identifier":{"issn":["03029743"],"isbn":["9783642230585"]},"citation":{"ama":"Janiesch C, Matzner M, Müller O. A blueprint for event-driven business activity management. In: <i>Lecture Notes in Computer Science</i>. ; 2011. doi:<a href=\"https://doi.org/10.1007/978-3-642-23059-2_4\">10.1007/978-3-642-23059-2_4</a>","ieee":"C. Janiesch, M. Matzner, and O. Müller, “A blueprint for event-driven business activity management,” in <i>Lecture Notes in Computer Science</i>, 2011.","chicago":"Janiesch, Christian, Martin Matzner, and Oliver Müller. “A Blueprint for Event-Driven Business Activity Management.” In <i>Lecture Notes in Computer Science</i>, 2011. <a href=\"https://doi.org/10.1007/978-3-642-23059-2_4\">https://doi.org/10.1007/978-3-642-23059-2_4</a>.","apa":"Janiesch, C., Matzner, M., &#38; Müller, O. (2011). A blueprint for event-driven business activity management. In <i>Lecture Notes in Computer Science</i>. <a href=\"https://doi.org/10.1007/978-3-642-23059-2_4\">https://doi.org/10.1007/978-3-642-23059-2_4</a>","bibtex":"@inproceedings{Janiesch_Matzner_Müller_2011, title={A blueprint for event-driven business activity management}, DOI={<a href=\"https://doi.org/10.1007/978-3-642-23059-2_4\">10.1007/978-3-642-23059-2_4</a>}, booktitle={Lecture Notes in Computer Science}, author={Janiesch, Christian and Matzner, Martin and Müller, Oliver}, year={2011} }","short":"C. Janiesch, M. Matzner, O. Müller, in: Lecture Notes in Computer Science, 2011.","mla":"Janiesch, Christian, et al. “A Blueprint for Event-Driven Business Activity Management.” <i>Lecture Notes in Computer Science</i>, 2011, doi:<a href=\"https://doi.org/10.1007/978-3-642-23059-2_4\">10.1007/978-3-642-23059-2_4</a>."},"year":"2011","author":[{"first_name":"Christian","full_name":"Janiesch, Christian","last_name":"Janiesch"},{"last_name":"Matzner","full_name":"Matzner, Martin","first_name":"Martin"},{"id":"72849","full_name":"Müller, Oliver","last_name":"Müller","first_name":"Oliver"}],"date_created":"2018-10-12T08:36:57Z","date_updated":"2022-01-06T07:01:19Z","doi":"10.1007/978-3-642-23059-2_4","title":"A blueprint for event-driven business activity management","type":"conference","publication":"Lecture Notes in Computer Science","status":"public","user_id":"72849","_id":"4707","language":[{"iso":"eng"}],"keyword":["Reference architecture","business activity management","business process analytics","business process management","complex event processing"]},{"author":[{"id":"15387","full_name":"Kretzschmar, Nils","last_name":"Kretzschmar","first_name":"Nils"},{"first_name":"Volker","id":"20530","full_name":"Schöppner, Volker","last_name":"Schöppner"}],"date_created":"2021-09-07T10:31:48Z","publisher":"Society for Computer Simulation International","date_updated":"2022-01-06T06:56:02Z","title":"Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA","page":"133–140","citation":{"apa":"Kretzschmar, N., &#38; Schöppner, V. (2010). Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA. In <i>Proceedings of the 2010 Summer Computer Simulation Conference</i> (pp. 133–140). San Diego, CA, USA: Society for Computer Simulation International.","short":"N. Kretzschmar, V. Schöppner, in: Proceedings of the 2010 Summer Computer Simulation Conference, Society for Computer Simulation International, San Diego, CA, USA, 2010, pp. 133–140.","bibtex":"@inproceedings{Kretzschmar_Schöppner_2010, place={San Diego, CA, USA}, series={SCSC ’10}, title={Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA}, booktitle={Proceedings of the 2010 Summer Computer Simulation Conference}, publisher={Society for Computer Simulation International}, author={Kretzschmar, Nils and Schöppner, Volker}, year={2010}, pages={133–140}, collection={SCSC ’10} }","mla":"Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA.” <i>Proceedings of the 2010 Summer Computer Simulation Conference</i>, Society for Computer Simulation International, 2010, pp. 133–140.","ama":"Kretzschmar N, Schöppner V. Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA. In: <i>Proceedings of the 2010 Summer Computer Simulation Conference</i>. SCSC ’10. San Diego, CA, USA: Society for Computer Simulation International; 2010:133–140.","ieee":"N. Kretzschmar and V. Schöppner, “Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA,” in <i>Proceedings of the 2010 Summer Computer Simulation Conference</i>, 2010, pp. 133–140.","chicago":"Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA.” In <i>Proceedings of the 2010 Summer Computer Simulation Conference</i>, 133–140. SCSC ’10. San Diego, CA, USA: Society for Computer Simulation International, 2010."},"place":"San Diego, CA, USA","year":"2010","department":[{"_id":"367"}],"user_id":"15387","series_title":"SCSC '10","_id":"23858","language":[{"iso":"eng"}],"keyword":["process optimization","polymer engineering","compounding","twin screw extruder","simulation"],"publication":"Proceedings of the 2010 Summer Computer Simulation Conference","type":"conference","status":"public","abstract":[{"lang":"eng","text":"A large proportion of plastics today is compounded, which means the process from refining a raw material to the processable material. For this process compounding extruders are used which mostly involve tightly intermeshing, co-rotating twin screw extruders. These extruders consist of two closely spaced screws which rotate in the same direction and convey the raw material to the screw tip. These screws are surrounded by several barrel modules which heat or cool the material. As the whole design of the machine is modularly arranged the process behavior of a twin screw extruder depends for the main part on the arrangement of the screw and the barrel elements. Until today this arrangement and process optimization is conducted by experienced engineers and with the help of trial-and-error methods. Furthermore, theoretical models are used with which the behavior of the extruder is estimated. As these models are mostly very complex they are only made available with the realization in different software projects. One of the tools is called SIGMA. Within this paper SIGMA is introduced as a software to optimize a twin screw extruder. SIGMA supports the engineer already in the early stages of the extruder arrangement."}]},{"abstract":[{"text":"Refinement of untimed TLM models into a timed HW/SW platform is a step by step design process which is a trade-off between timing accuracy of the used models and correct estimation of the final timing performance. The use of an RTOS on the target platform is mandatory in the case real-time properties must be guaranteed. Thus, the question is when the RTOS must be introduced in this step by step refinement process. This paper proposes a four-level RTOS-aware refinement methodology that, starting from an untimed TLM SystemC description of the whole system, progressively introduce HW/SW partitioning, timing, device driver and RTOS functionalities, till to obtain an accurate model of the final platform, where SW tasks run upon an RTOS hosted by QEMU and HW components are modeled by cycle accurate TLM descriptions. Each refinement level allows the designer to estimate more and more accurate timing properties, thus anticipating design decisions without being constrained to leave timing analysis to the final step of the refinement. The effectiveness of the methodology has been evaluated in the design of two complex platforms.","lang":"eng"}],"status":"public","type":"conference","publication":"Proceedings of DATE’10","keyword":["Timing","Hardware","Operating systems","Process design","Accuracy","Standards development","Context modeling","Real time systems","Communication channels","Microprogramming"],"language":[{"iso":"eng"}],"_id":"37040","user_id":"5786","department":[{"_id":"672"}],"place":"Dresden","year":"2010","citation":{"apa":"Becker, M., Di Guglielmo, G., Fummi, F., Müller, W., Pravadelli, G., &#38; Xie, T. (2010). RTOS-Aware Refinement for TLM2.0-based HW/SW Design. <i>Proceedings of DATE’10</i>. Design, Automation &#38; Test in Europe Conference &#38; Exhibition (DATE 2010), Dresden. <a href=\"https://doi.org/10.1109/DATE.2010.5456965\">https://doi.org/10.1109/DATE.2010.5456965</a>","mla":"Becker, Markus, et al. “RTOS-Aware Refinement for TLM2.0-Based HW/SW Design.” <i>Proceedings of DATE’10</i>, IEEE, 2010, doi:<a href=\"https://doi.org/10.1109/DATE.2010.5456965\">10.1109/DATE.2010.5456965</a>.","bibtex":"@inproceedings{Becker_Di Guglielmo_Fummi_Müller_Pravadelli_Xie_2010, place={Dresden}, title={RTOS-Aware Refinement for TLM2.0-based HW/SW Design}, DOI={<a href=\"https://doi.org/10.1109/DATE.2010.5456965\">10.1109/DATE.2010.5456965</a>}, booktitle={Proceedings of DATE’10}, publisher={IEEE}, author={Becker, Markus and Di Guglielmo, Giuseppe and Fummi, Franco and Müller, Wolfgang and Pravadelli, Graziano and Xie, Tao}, year={2010} }","short":"M. Becker, G. Di Guglielmo, F. Fummi, W. Müller, G. Pravadelli, T. Xie, in: Proceedings of DATE’10, IEEE, Dresden, 2010.","ama":"Becker M, Di Guglielmo G, Fummi F, Müller W, Pravadelli G, Xie T. RTOS-Aware Refinement for TLM2.0-based HW/SW Design. In: <i>Proceedings of DATE’10</i>. IEEE; 2010. doi:<a href=\"https://doi.org/10.1109/DATE.2010.5456965\">10.1109/DATE.2010.5456965</a>","chicago":"Becker, Markus, Giuseppe Di Guglielmo, Franco Fummi, Wolfgang Müller, Graziano Pravadelli, and Tao Xie. “RTOS-Aware Refinement for TLM2.0-Based HW/SW Design.” In <i>Proceedings of DATE’10</i>. Dresden: IEEE, 2010. <a href=\"https://doi.org/10.1109/DATE.2010.5456965\">https://doi.org/10.1109/DATE.2010.5456965</a>.","ieee":"M. Becker, G. Di Guglielmo, F. Fummi, W. Müller, G. Pravadelli, and T. Xie, “RTOS-Aware Refinement for TLM2.0-based HW/SW Design,” presented at the Design, Automation &#38; Test in Europe Conference &#38; Exhibition (DATE 2010), Dresden, 2010, doi: <a href=\"https://doi.org/10.1109/DATE.2010.5456965\">10.1109/DATE.2010.5456965</a>."},"publication_identifier":{"eisbn":["978-3-9810801-6-2"]},"title":"RTOS-Aware Refinement for TLM2.0-based HW/SW Design","conference":{"name":"Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)","location":"Dresden"},"doi":"10.1109/DATE.2010.5456965","date_updated":"2023-01-17T10:47:37Z","publisher":"IEEE","date_created":"2023-01-17T10:47:29Z","author":[{"last_name":"Becker","full_name":"Becker, Markus","first_name":"Markus"},{"last_name":"Di Guglielmo","full_name":"Di Guglielmo, Giuseppe","first_name":"Giuseppe"},{"first_name":"Franco","last_name":"Fummi","full_name":"Fummi, Franco"},{"full_name":"Müller, Wolfgang","id":"16243","last_name":"Müller","first_name":"Wolfgang"},{"first_name":"Graziano","full_name":"Pravadelli, Graziano","last_name":"Pravadelli"},{"first_name":"Tao","last_name":"Xie","full_name":"Xie, Tao"}]},{"doi":"10.1007/978-94-007-1488-5_9","title":"The SATURN Approach to SysML-based HW/SW Codesign","author":[{"full_name":"Müller, Wolfgang","id":"16243","last_name":"Müller","first_name":"Wolfgang"},{"first_name":"Da","last_name":"He","full_name":"He, Da"},{"full_name":"Mischkalla, Fabian","last_name":"Mischkalla","first_name":"Fabian"},{"full_name":"Wegele, Arthur","last_name":"Wegele","first_name":"Arthur"},{"last_name":"Larkham","full_name":"Larkham, Adrian","first_name":"Adrian"},{"first_name":"Paul","full_name":"Whiston, Paul","last_name":"Whiston"},{"first_name":"Pablo","full_name":"Penil, Pablo","last_name":"Penil"},{"first_name":"Eugenio","last_name":"Villar","full_name":"Villar, Eugenio"},{"last_name":"Mitas","full_name":"Mitas, Nikolaos","first_name":"Nikolaos"},{"last_name":"Kritharidis","full_name":"Kritharidis, Dimitros","first_name":"Dimitros"},{"first_name":"Florent","full_name":"Azcarate, Florent","last_name":"Azcarate"},{"last_name":"Carballeda","full_name":"Carballeda, Manuel","first_name":"Manuel"}],"date_created":"2023-01-17T11:19:45Z","date_updated":"2023-01-17T11:19:53Z","citation":{"mla":"Müller, Wolfgang, et al. “The SATURN Approach to SysML-Based HW/SW Codesign.” <i>Proceedings of the IEEE Computer Society Annual Symposium on VLSI</i>, 2010, doi:<a href=\"https://doi.org/10.1007/978-94-007-1488-5_9\">10.1007/978-94-007-1488-5_9</a>.","bibtex":"@inproceedings{Müller_He_Mischkalla_Wegele_Larkham_Whiston_Penil_Villar_Mitas_Kritharidis_et al._2010, series={Lecture Notes in Electrical Engineering}, title={The SATURN Approach to SysML-based HW/SW Codesign}, DOI={<a href=\"https://doi.org/10.1007/978-94-007-1488-5_9\">10.1007/978-94-007-1488-5_9</a>}, booktitle={Proceedings of the IEEE Computer Society Annual Symposium on VLSI}, author={Müller, Wolfgang and He, Da and Mischkalla, Fabian and Wegele, Arthur and Larkham, Adrian and Whiston, Paul and Penil, Pablo and Villar, Eugenio and Mitas, Nikolaos and Kritharidis, Dimitros and et al.}, year={2010}, collection={Lecture Notes in Electrical Engineering} }","short":"W. Müller, D. He, F. Mischkalla, A. Wegele, A. Larkham, P. Whiston, P. Penil, E. Villar, N. Mitas, D. Kritharidis, F. Azcarate, M. Carballeda, in: Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2010.","apa":"Müller, W., He, D., Mischkalla, F., Wegele, A., Larkham, A., Whiston, P., Penil, P., Villar, E., Mitas, N., Kritharidis, D., Azcarate, F., &#38; Carballeda, M. (2010). The SATURN Approach to SysML-based HW/SW Codesign. <i>Proceedings of the IEEE Computer Society Annual Symposium on VLSI</i>. <a href=\"https://doi.org/10.1007/978-94-007-1488-5_9\">https://doi.org/10.1007/978-94-007-1488-5_9</a>","ama":"Müller W, He D, Mischkalla F, et al. The SATURN Approach to SysML-based HW/SW Codesign. In: <i>Proceedings of the IEEE Computer Society Annual Symposium on VLSI</i>. Lecture Notes in Electrical Engineering. ; 2010. doi:<a href=\"https://doi.org/10.1007/978-94-007-1488-5_9\">10.1007/978-94-007-1488-5_9</a>","ieee":"W. Müller <i>et al.</i>, “The SATURN Approach to SysML-based HW/SW Codesign,” 2010, doi: <a href=\"https://doi.org/10.1007/978-94-007-1488-5_9\">10.1007/978-94-007-1488-5_9</a>.","chicago":"Müller, Wolfgang, Da He, Fabian Mischkalla, Arthur Wegele, Adrian Larkham, Paul Whiston, Pablo Penil, et al. “The SATURN Approach to SysML-Based HW/SW Codesign.” In <i>Proceedings of the IEEE Computer Society Annual Symposium on VLSI</i>. Lecture Notes in Electrical Engineering, 2010. <a href=\"https://doi.org/10.1007/978-94-007-1488-5_9\">https://doi.org/10.1007/978-94-007-1488-5_9</a>."},"year":"2010","publication_identifier":{"eisbn":["978-94-007-1488-5"]},"language":[{"iso":"eng"}],"keyword":["Communicate Sequential Process     Virtual Platform     Smart Camera     Synchronous Data Flow     Artisan Studio"],"department":[{"_id":"672"}],"series_title":"Lecture Notes in Electrical Engineering","user_id":"5786","_id":"37050","status":"public","abstract":[{"lang":"eng","text":"The main obstacle for the wide acceptance of UML and SysML in the design of electronic systems is due to a major gap in the design flow between UML-based modeling and SystemC-based verification. To overcome this gap, we present an approach developed in the SATURN project which introduces UML profiles for the co-modeling of SystemC and C with code generation support in the context of the SysML tool suite ARTiSAN Studio®. We finally discuss the evaluation of the approach by two case studies."}],"publication":"Proceedings of the IEEE Computer Society Annual Symposium on VLSI","type":"conference"}]