---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '47586'
author:
- first_name: Stefan
full_name: Lier, Stefan
last_name: Lier
- first_name: Julia
full_name: Riese, Julia
id: '101499'
last_name: Riese
orcid: 0000-0002-3053-0534
- first_name: Gordana
full_name: Cvetanoska, Gordana
last_name: Cvetanoska
- first_name: Anna Katharina
full_name: Lesniak, Anna Katharina
last_name: Lesniak
- first_name: Stephan
full_name: Müller, Stephan
last_name: Müller
- first_name: Sarah
full_name: Paul, Sarah
last_name: Paul
- first_name: Laura
full_name: Sengen, Laura
last_name: Sengen
- first_name: Marcus
full_name: Grünewald, Marcus
last_name: Grünewald
citation:
ama: Lier S, Riese J, Cvetanoska G, et al. Innovative scaling strategies for a fast
development of apparatuses by modular process engineering. Chemical Engineering
and Processing - Process Intensification. 2017;123:111-125. doi:10.1016/j.cep.2017.10.026
apa: Lier, S., Riese, J., Cvetanoska, G., Lesniak, A. K., Müller, S., Paul, S.,
Sengen, L., & Grünewald, M. (2017). Innovative scaling strategies for a fast
development of apparatuses by modular process engineering. Chemical Engineering
and Processing - Process Intensification, 123, 111–125. https://doi.org/10.1016/j.cep.2017.10.026
bibtex: '@article{Lier_Riese_Cvetanoska_Lesniak_Müller_Paul_Sengen_Grünewald_2017,
title={Innovative scaling strategies for a fast development of apparatuses by
modular process engineering}, volume={123}, DOI={10.1016/j.cep.2017.10.026},
journal={Chemical Engineering and Processing - Process Intensification}, publisher={Elsevier
BV}, author={Lier, Stefan and Riese, Julia and Cvetanoska, Gordana and Lesniak,
Anna Katharina and Müller, Stephan and Paul, Sarah and Sengen, Laura and Grünewald,
Marcus}, year={2017}, pages={111–125} }'
chicago: 'Lier, Stefan, Julia Riese, Gordana Cvetanoska, Anna Katharina Lesniak,
Stephan Müller, Sarah Paul, Laura Sengen, and Marcus Grünewald. “Innovative Scaling
Strategies for a Fast Development of Apparatuses by Modular Process Engineering.”
Chemical Engineering and Processing - Process Intensification 123 (2017):
111–25. https://doi.org/10.1016/j.cep.2017.10.026.'
ieee: 'S. Lier et al., “Innovative scaling strategies for a fast development
of apparatuses by modular process engineering,” Chemical Engineering and Processing
- Process Intensification, vol. 123, pp. 111–125, 2017, doi: 10.1016/j.cep.2017.10.026.'
mla: Lier, Stefan, et al. “Innovative Scaling Strategies for a Fast Development
of Apparatuses by Modular Process Engineering.” Chemical Engineering and Processing
- Process Intensification, vol. 123, Elsevier BV, 2017, pp. 111–25, doi:10.1016/j.cep.2017.10.026.
short: S. Lier, J. Riese, G. Cvetanoska, A.K. Lesniak, S. Müller, S. Paul, L. Sengen,
M. Grünewald, Chemical Engineering and Processing - Process Intensification 123
(2017) 111–125.
date_created: 2023-10-04T14:19:52Z
date_updated: 2024-03-08T11:32:13Z
doi: 10.1016/j.cep.2017.10.026
extern: '1'
intvolume: ' 123'
keyword:
- Industrial and Manufacturing Engineering
- Process Chemistry and Technology
- Energy Engineering and Power Technology
- General Chemical Engineering
- General Chemistry
language:
- iso: eng
page: 111-125
publication: Chemical Engineering and Processing - Process Intensification
publication_identifier:
issn:
- 0255-2701
publication_status: published
publisher: Elsevier BV
quality_controlled: '1'
status: public
title: Innovative scaling strategies for a fast development of apparatuses by modular
process engineering
type: journal_article
user_id: '101499'
volume: 123
year: '2017'
...
---
_id: '4690'
author:
- first_name: Elena
full_name: Gorbacheva, Elena
last_name: Gorbacheva
- first_name: Armin
full_name: Stein, Armin
last_name: Stein
- first_name: Theresa
full_name: Schmiedel, Theresa
last_name: Schmiedel
- first_name: Oliver
full_name: Müller, Oliver
id: '72849'
last_name: Müller
citation:
ama: Gorbacheva E, Stein A, Schmiedel T, Müller O. The Role of Gender in Business
Process Management Competence Supply. Business and Information Systems Engineering.
2016;(3):213--231. doi:10.1007/s12599-016-0428-2
apa: Gorbacheva, E., Stein, A., Schmiedel, T., & Müller, O. (2016). The Role
of Gender in Business Process Management Competence Supply. Business and Information
Systems Engineering, (3), 213--231. https://doi.org/10.1007/s12599-016-0428-2
bibtex: '@article{Gorbacheva_Stein_Schmiedel_Müller_2016, title={The Role of Gender
in Business Process Management Competence Supply}, DOI={10.1007/s12599-016-0428-2},
number={3}, journal={Business and Information Systems Engineering}, author={Gorbacheva,
Elena and Stein, Armin and Schmiedel, Theresa and Müller, Oliver}, year={2016},
pages={213--231} }'
chicago: 'Gorbacheva, Elena, Armin Stein, Theresa Schmiedel, and Oliver Müller.
“The Role of Gender in Business Process Management Competence Supply.” Business
and Information Systems Engineering, no. 3 (2016): 213--231. https://doi.org/10.1007/s12599-016-0428-2.'
ieee: E. Gorbacheva, A. Stein, T. Schmiedel, and O. Müller, “The Role of Gender
in Business Process Management Competence Supply,” Business and Information
Systems Engineering, no. 3, pp. 213--231, 2016.
mla: Gorbacheva, Elena, et al. “The Role of Gender in Business Process Management
Competence Supply.” Business and Information Systems Engineering, no. 3,
2016, pp. 213--231, doi:10.1007/s12599-016-0428-2.
short: E. Gorbacheva, A. Stein, T. Schmiedel, O. Müller, Business and Information
Systems Engineering (2016) 213--231.
date_created: 2018-10-12T08:29:58Z
date_updated: 2022-01-06T07:01:18Z
doi: 10.1007/s12599-016-0428-2
extern: '1'
issue: '3'
keyword:
- BPM workforce
- Business process management
- Competences
- Gender diversity
- Latent semantic analysis
- Skills
- Text mining
language:
- iso: eng
page: 213--231
publication: Business and Information Systems Engineering
publication_identifier:
issn:
- '18670202'
status: public
title: The Role of Gender in Business Process Management Competence Supply
type: journal_article
user_id: '72849'
year: '2016'
...
---
_id: '4692'
author:
- first_name: Oliver
full_name: Müller, Oliver
id: '72849'
last_name: Müller
- first_name: Theresa
full_name: Schmiedel, Theresa
last_name: Schmiedel
- first_name: Elena
full_name: Gorbacheva, Elena
last_name: Gorbacheva
- first_name: Jan
full_name: vom Brocke, Jan
last_name: vom Brocke
citation:
ama: 'Müller O, Schmiedel T, Gorbacheva E, vom Brocke J. Towards a typology of business
process management professionals: identifying patterns of competences through
latent semantic analysis. Enterprise Information Systems. 2016;(1):50--80.
doi:10.1080/17517575.2014.923514'
apa: 'Müller, O., Schmiedel, T., Gorbacheva, E., & vom Brocke, J. (2016). Towards
a typology of business process management professionals: identifying patterns
of competences through latent semantic analysis. Enterprise Information Systems,
(1), 50--80. https://doi.org/10.1080/17517575.2014.923514'
bibtex: '@article{Müller_Schmiedel_Gorbacheva_vom Brocke_2016, title={Towards a
typology of business process management professionals: identifying patterns of
competences through latent semantic analysis}, DOI={10.1080/17517575.2014.923514},
number={1}, journal={Enterprise Information Systems}, author={Müller, Oliver and
Schmiedel, Theresa and Gorbacheva, Elena and vom Brocke, Jan}, year={2016}, pages={50--80}
}'
chicago: 'Müller, Oliver, Theresa Schmiedel, Elena Gorbacheva, and Jan vom Brocke.
“Towards a Typology of Business Process Management Professionals: Identifying
Patterns of Competences through Latent Semantic Analysis.” Enterprise Information
Systems, no. 1 (2016): 50--80. https://doi.org/10.1080/17517575.2014.923514.'
ieee: 'O. Müller, T. Schmiedel, E. Gorbacheva, and J. vom Brocke, “Towards a typology
of business process management professionals: identifying patterns of competences
through latent semantic analysis,” Enterprise Information Systems, no.
1, pp. 50--80, 2016.'
mla: 'Müller, Oliver, et al. “Towards a Typology of Business Process Management
Professionals: Identifying Patterns of Competences through Latent Semantic Analysis.”
Enterprise Information Systems, no. 1, 2016, pp. 50--80, doi:10.1080/17517575.2014.923514.'
short: O. Müller, T. Schmiedel, E. Gorbacheva, J. vom Brocke, Enterprise Information
Systems (2016) 50--80.
date_created: 2018-10-12T08:30:10Z
date_updated: 2022-01-06T07:01:18Z
doi: 10.1080/17517575.2014.923514
extern: '1'
issue: '1'
keyword:
- abilities
- business process management
- competences
- knowledge
- latent semantic analysis
- professionals
- skills
- typology
language:
- iso: eng
page: 50--80
publication: Enterprise Information Systems
publication_identifier:
issn:
- '17517583'
status: public
title: 'Towards a typology of business process management professionals: identifying
patterns of competences through latent semantic analysis'
type: journal_article
user_id: '72849'
year: '2016'
...
---
_id: '8836'
abstract:
- lang: eng
text: While Islamic State is the most present example, it is a fact that in many
places around the globe, throughout history initially small groups have tried
to challenge and destabilize or even overthrow governments by means of terrorist
and guerrilla strategies. Therefore, we answer two questions. Why does a small
group of insurgents believe it can overthrow the government by turning violent,
even if the government is clearly superior? And how does a conflict develop into
terrorism, a guerilla war, or a major conventional civil war, or is resolved peacefully?
We develop a formal model for rebels and government and derive optimal choices.
Further, we focus on three elements as important ingredients of a "destabilization
war". All three of these - large random events, time preference (which we relate
to ideology), and choice of duration of fight - are rarely considered in formal
conflict theory. We can answer the above two questions using game theory analysis.
First, insurgents rise up because they hope to destabilize through permanent challenging
attacks. In this context, large randomness is an important ally of rebels. While
each individual attack may have a low impact, at some point a large random event
could lead to success. Hence, the duration of activities is a constitutive element
of this kind of armed conflict. Patience (low time preference), which may reflect
rebels' degree of ideological motivation, is crucial. Second, the mode of warfare
or the conflict resolutions that develop are generally path-dependent and conditioned
on the full set of options (including compromise). Various conditions (level of
funding, ease of recruitment, access to weapons) influence different modes of
warfare or a peaceful compromise in a complex way.
author:
- first_name: Thomas
full_name: Gries, Thomas
id: '186'
last_name: Gries
- first_name: Claus-Jochen
full_name: Haake, Claus-Jochen
id: '20801'
last_name: Haake
citation:
ama: Gries T, Haake C-J. An Economic Theory of “Destabilization War.” Vol
95.; 2016.
apa: Gries, T., & Haake, C.-J. (2016). An Economic Theory of “Destabilization
War” (Vol. 95).
bibtex: '@book{Gries_Haake_2016, series={Working Papers CIE}, title={An Economic
Theory of “Destabilization War”}, volume={95}, author={Gries, Thomas and Haake,
Claus-Jochen}, year={2016}, collection={Working Papers CIE} }'
chicago: Gries, Thomas, and Claus-Jochen Haake. An Economic Theory of “Destabilization
War.” Vol. 95. Working Papers CIE, 2016.
ieee: T. Gries and C.-J. Haake, An Economic Theory of “Destabilization War,”
vol. 95. 2016.
mla: Gries, Thomas, and Claus-Jochen Haake. An Economic Theory of “Destabilization
War.” Vol. 95, 2016.
short: T. Gries, C.-J. Haake, An Economic Theory of “Destabilization War,” 2016.
date_created: 2019-04-08T06:45:02Z
date_updated: 2022-01-06T07:04:03Z
ddc:
- '040'
department:
- _id: '205'
- _id: '475'
file:
- access_level: closed
content_type: application/pdf
creator: cjhaake
date_created: 2019-04-08T06:49:16Z
date_updated: 2019-04-08T06:49:16Z
file_id: '8838'
file_name: WP - An Economic Theory of ’Destabilization War'.pdf
file_size: 516125
relation: main_file
success: 1
file_date_updated: 2019-04-08T06:49:16Z
has_accepted_license: '1'
intvolume: ' 95'
jel:
- H56
- O10
- D84
- C72
- D74
keyword:
- terrorism
- civil war
- conflict duration
- game theory
- stochastic process
- ideology
language:
- iso: eng
series_title: Working Papers CIE
status: public
title: An Economic Theory of 'Destabilization War'
type: working_paper
user_id: '20801'
volume: 95
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '32478'
citation:
ama: Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame.
Физика горения и взрыва. 2016;(3). doi:10.15372/fgv20160302
apa: Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame.
(2016). Физика Горения и Взрыва, 3. https://doi.org/10.15372/fgv20160302
bibtex: '@article{Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow
Flame_2016, DOI={10.15372/fgv20160302},
number={3}, journal={Физика горения и взрыва}, publisher={Publishing House SB
RAS}, year={2016} }'
chicago: “Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame.”
Физика Горения и Взрыва, no. 3 (2016). https://doi.org/10.15372/fgv20160302.
ieee: '“Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame,”
Физика горения и взрыва, no. 3, 2016, doi: 10.15372/fgv20160302.'
mla: “Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame.”
Физика Горения и Взрыва, no. 3, Publishing House SB RAS, 2016, doi:10.15372/fgv20160302.
short: Физика Горения и Взрыва (2016).
date_created: 2022-08-02T10:19:27Z
date_updated: 2022-08-15T13:54:41Z
doi: 10.15372/fgv20160302
issue: '3'
keyword:
- Process Chemistry and Technology
- Mechanical Engineering
publication: Физика горения и взрыва
publication_identifier:
issn:
- 0430-6228
publication_status: published
publisher: Publishing House SB RAS
status: public
title: Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame
type: journal_article
user_id: '94996'
year: '2016'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '4699'
author:
- first_name: Jörg
full_name: Becker, Jörg
last_name: Becker
- first_name: Daniel
full_name: Beverungen, Daniel
id: '59677'
last_name: Beverungen
- first_name: Ralf
full_name: Knackstedt, Ralf
last_name: Knackstedt
- first_name: Martin
full_name: Matzner, Martin
last_name: Matzner
- first_name: Oliver
full_name: Müller, Oliver
id: '72849'
last_name: Müller
- first_name: Jens
full_name: Pöppelbuss, Jens
last_name: Pöppelbuss
citation:
ama: 'Becker J, Beverungen D, Knackstedt R, Matzner M, Müller O, Pöppelbuss J. Designing
interaction routines in service networks: A modularity and social construction-based
approach. Scandinavian Journal of Information Systems. 2013;(1):17--47.'
apa: 'Becker, J., Beverungen, D., Knackstedt, R., Matzner, M., Müller, O., &
Pöppelbuss, J. (2013). Designing interaction routines in service networks: A modularity
and social construction-based approach. Scandinavian Journal of Information
Systems, (1), 17--47.'
bibtex: '@article{Becker_Beverungen_Knackstedt_Matzner_Müller_Pöppelbuss_2013, title={Designing
interaction routines in service networks: A modularity and social construction-based
approach}, number={1}, journal={Scandinavian Journal of Information Systems},
author={Becker, Jörg and Beverungen, Daniel and Knackstedt, Ralf and Matzner,
Martin and Müller, Oliver and Pöppelbuss, Jens}, year={2013}, pages={17--47} }'
chicago: 'Becker, Jörg, Daniel Beverungen, Ralf Knackstedt, Martin Matzner, Oliver
Müller, and Jens Pöppelbuss. “Designing Interaction Routines in Service Networks:
A Modularity and Social Construction-Based Approach.” Scandinavian Journal
of Information Systems, no. 1 (2013): 17--47.'
ieee: 'J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, and J. Pöppelbuss,
“Designing interaction routines in service networks: A modularity and social construction-based
approach,” Scandinavian Journal of Information Systems, no. 1, pp. 17--47,
2013.'
mla: 'Becker, Jörg, et al. “Designing Interaction Routines in Service Networks:
A Modularity and Social Construction-Based Approach.” Scandinavian Journal
of Information Systems, no. 1, 2013, pp. 17--47.'
short: J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, J. Pöppelbuss,
Scandinavian Journal of Information Systems (2013) 17--47.
date_created: 2018-10-12T08:30:56Z
date_updated: 2022-01-06T07:01:18Z
extern: '1'
issue: '1'
keyword:
- Business process management
- Conceptual modeling
- Interaction routines
- Modular design
- Service networks
- Social construction
language:
- iso: eng
main_file_link:
- url: https://aisel.aisnet.org/sjis/vol25/iss1/2/
page: 17--47
publication: Scandinavian Journal of Information Systems
publication_identifier:
issn:
- '09050167'
status: public
title: 'Designing interaction routines in service networks: A modularity and social
construction-based approach'
type: journal_article
user_id: '72849'
year: '2013'
...
---
_id: '4700'
author:
- first_name: Jorg
full_name: Becker, Jorg
last_name: Becker
- first_name: Daniel
full_name: Beverungen, Daniel
id: '59677'
last_name: Beverungen
- first_name: Ralf
full_name: Knackstedt, Ralf
last_name: Knackstedt
- first_name: Martin
full_name: Matzner, Martin
last_name: Matzner
- first_name: Oliver
full_name: Müller, Oliver
id: '72849'
last_name: Müller
- first_name: Jens
full_name: Pöppelbuss, Jens
last_name: Pöppelbuss
citation:
ama: Becker J, Beverungen D, Knackstedt R, Matzner M, Müller O, Pöppelbuss J. Bridging
the gap between manufacturing and service through IT-based boundary objects. IEEE
Transactions on Engineering Management. 2013;(3):468--482. doi:10.1109/TEM.2012.2214770
apa: Becker, J., Beverungen, D., Knackstedt, R., Matzner, M., Müller, O., &
Pöppelbuss, J. (2013). Bridging the gap between manufacturing and service through
IT-based boundary objects. IEEE Transactions on Engineering Management,
(3), 468--482. https://doi.org/10.1109/TEM.2012.2214770
bibtex: '@article{Becker_Beverungen_Knackstedt_Matzner_Müller_Pöppelbuss_2013, title={Bridging
the gap between manufacturing and service through IT-based boundary objects},
DOI={10.1109/TEM.2012.2214770},
number={3}, journal={IEEE Transactions on Engineering Management}, author={Becker,
Jorg and Beverungen, Daniel and Knackstedt, Ralf and Matzner, Martin and Müller,
Oliver and Pöppelbuss, Jens}, year={2013}, pages={468--482} }'
chicago: 'Becker, Jorg, Daniel Beverungen, Ralf Knackstedt, Martin Matzner, Oliver
Müller, and Jens Pöppelbuss. “Bridging the Gap between Manufacturing and Service
through IT-Based Boundary Objects.” IEEE Transactions on Engineering Management,
no. 3 (2013): 468--482. https://doi.org/10.1109/TEM.2012.2214770.'
ieee: J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, and J. Pöppelbuss,
“Bridging the gap between manufacturing and service through IT-based boundary
objects,” IEEE Transactions on Engineering Management, no. 3, pp. 468--482,
2013.
mla: Becker, Jorg, et al. “Bridging the Gap between Manufacturing and Service through
IT-Based Boundary Objects.” IEEE Transactions on Engineering Management,
no. 3, 2013, pp. 468--482, doi:10.1109/TEM.2012.2214770.
short: J. Becker, D. Beverungen, R. Knackstedt, M. Matzner, O. Müller, J. Pöppelbuss,
IEEE Transactions on Engineering Management (2013) 468--482.
date_created: 2018-10-12T08:31:02Z
date_updated: 2022-01-06T07:01:19Z
doi: 10.1109/TEM.2012.2214770
extern: '1'
issue: '3'
keyword:
- Action research
- boundary spanning
- business process management (BPM)
- service blueprinting
- service networks
language:
- iso: eng
page: 468--482
publication: IEEE Transactions on Engineering Management
publication_identifier:
isbn:
- 0018-9391
issn:
- '00189391'
status: public
title: Bridging the gap between manufacturing and service through IT-based boundary
objects
type: journal_article
user_id: '72849'
year: '2013'
...
---
_id: '41234'
abstract:
- lang: eng
text: AbstractNanoparticles (NP) have specific
catalytic properties, which are influenced by parameters like their size, shape,
or composition. Bimetallic NPs, composed of two metal elements can show an improved
catalytic activity compared to the monometallic NPs. We, herein, report on the
selective aerobic oxidation of benzyl alcohol catalyzed by unsupported Pd/Au and
Pd NPs at atmospheric pressure. NPs of varying compositions were synthesized and
characterized by UV/Vis spectroscopy, transmission electron microscopy (TEM),
and small-angle X-ray scattering (SAXS). The NPs were tested in the model reaction
regarding their catalytic activity, stability, and recyclability in batch and
continuous procedure. Additionally, in situ extended
X-ray absorption fine structure (EXAFS) measurements were performed in order to
get insight in the process during NP catalysis.
author:
- first_name: Hannes
full_name: Alex, Hannes
last_name: Alex
- first_name: Norbert
full_name: Steinfeldt, Norbert
last_name: Steinfeldt
- first_name: Klaus
full_name: Jähnisch, Klaus
last_name: Jähnisch
- first_name: Matthias
full_name: Bauer, Matthias
id: '47241'
last_name: Bauer
orcid: 0000-0002-9294-6076
- first_name: Sandra
full_name: Hübner, Sandra
last_name: Hübner
citation:
ama: Alex H, Steinfeldt N, Jähnisch K, Bauer M, Hübner S. On the selective aerobic
oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow. Nanotechnology
Reviews. 2013;3(1):99-110. doi:10.1515/ntrev-2012-0085
apa: Alex, H., Steinfeldt, N., Jähnisch, K., Bauer, M., & Hübner, S. (2013).
On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles
in batch and flow. Nanotechnology Reviews, 3(1), 99–110. https://doi.org/10.1515/ntrev-2012-0085
bibtex: '@article{Alex_Steinfeldt_Jähnisch_Bauer_Hübner_2013, title={On the selective
aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow},
volume={3}, DOI={10.1515/ntrev-2012-0085},
number={1}, journal={Nanotechnology Reviews}, publisher={Walter de Gruyter GmbH},
author={Alex, Hannes and Steinfeldt, Norbert and Jähnisch, Klaus and Bauer, Matthias
and Hübner, Sandra}, year={2013}, pages={99–110} }'
chicago: 'Alex, Hannes, Norbert Steinfeldt, Klaus Jähnisch, Matthias Bauer, and
Sandra Hübner. “On the Selective Aerobic Oxidation of Benzyl Alcohol with Pd/Au-Nanoparticles
in Batch and Flow.” Nanotechnology Reviews 3, no. 1 (2013): 99–110. https://doi.org/10.1515/ntrev-2012-0085.'
ieee: 'H. Alex, N. Steinfeldt, K. Jähnisch, M. Bauer, and S. Hübner, “On the selective
aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow,”
Nanotechnology Reviews, vol. 3, no. 1, pp. 99–110, 2013, doi: 10.1515/ntrev-2012-0085.'
mla: Alex, Hannes, et al. “On the Selective Aerobic Oxidation of Benzyl Alcohol
with Pd/Au-Nanoparticles in Batch and Flow.” Nanotechnology Reviews, vol.
3, no. 1, Walter de Gruyter GmbH, 2013, pp. 99–110, doi:10.1515/ntrev-2012-0085.
short: H. Alex, N. Steinfeldt, K. Jähnisch, M. Bauer, S. Hübner, Nanotechnology
Reviews 3 (2013) 99–110.
date_created: 2023-01-31T14:50:22Z
date_updated: 2023-01-31T14:52:30Z
department:
- _id: '306'
doi: 10.1515/ntrev-2012-0085
intvolume: ' 3'
issue: '1'
keyword:
- Surfaces
- Coatings and Films
- Process Chemistry and Technology
- Energy Engineering and Power Technology
- Biomaterials
- Medicine (miscellaneous)
- Biotechnology
language:
- iso: eng
page: 99-110
publication: Nanotechnology Reviews
publication_identifier:
issn:
- 2191-9097
- 2191-9089
publication_status: published
publisher: Walter de Gruyter GmbH
status: public
title: On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles
in batch and flow
type: journal_article
user_id: '48467'
volume: 3
year: '2013'
...
---
_id: '4443'
abstract:
- lang: ger
text: "\t\r\nMit welchen Erwartungen und Anforderungen sehen sich Studierende im
Hochschulalltag konfrontiert? Wie muss nach Ansicht der Studierenden gehandelt
werden, um das Studium \"erfolgreich\" zu bewältigen? Wie laufen die Auswahl unterschiedlicher
Lernaktivitäten im Studium sowie die Allokation von Ressourcen im Detail ab? Diese
und weitere Fragen sind vor allem im Zusammenhang mit der Debatte um die Bologna-Reform
stärker in den Mittelpunkt gerückt. Denn während modularisierte Curricula und
Credit-Point-Systeme oft nach administrativ-organisatorischen Gesichtspunkten
eingeführt wurden, hat die Gestaltung der Studienstrukturen auf Programmebene
zwangsweise Auswirkungen auf das Studienhandeln - und damit auch auf das Lernen
der Studierenden. Es gibt viele Vermutungen über die \"Wirkungen\" von Bologna
auf das Studieren: Die Rede ist von Verschulung, Entwissenschaftlichung und Arbeitsüberlastung
und Studierende stehen im Verdacht, ihren Studienpfad eher im Sinne einer Credit-Point-Jagd
denn interessengeleitet zu gestalten. In der Regel bleibt es dabei jedoch bei
anekdotischen Beobachtungen - es fehlt bislang an gesicherten Erkenntnissen über
Zusammenhänge zwischen Bologna-konformen Studienkontexten und dem Handeln Studierender.
Denn obschon Studierende seit langem Gegenstand der Forschung sind, ist bislang
wenig darüber bekannt, wie sie den langfristigen Bildungsprozess eines ganzen
Studiums gestalten. Stattdessen wurde vorwiegend das Lernen im engeren Sinne,
das so genannte \"Classroom Learning\" untersucht.\r\n\r\nDiejenigen, die Studienprogramme
nach didaktischen Gesichtspunkten gestalten wollen müssen wissen, wie Studierende
mit unterschiedlichen Studienstrukturen umgehen. Denn nur so ist eine planvolle
Programmgestaltung im Sinne pädagogischer Zielsetzungen und didaktischer Prinzipien
möglich. Die vorliegende Arbeit nimmt diese Problemstellung auf und untersucht,
welche Zielvorstellungen und Handlungsstrategien Studierende bei der Bewältigung
ihres Studienalltags in unterschiedlichen Bologna-konformen Studienprogrammen
entwickeln. Im Einzelnen wird gefragt, (1) welche Vorstellungen, Wahrnehmungen
und Handlungslogiken das Handeln Studierender in unterschiedlichen Studienprogrammen
prägen und (2) welche programmspezifischen Kontextbedingungen die Herausbildung
dieser handlungsleitenden Charakteristika beeinflussen. Ausgehend von diesen beiden
Fragestellungen wird zunächst ein theoretisch fundierter Analyserahmen für Studienprogramme
entwickelt. Darauf aufbauend werden verschiedene Studienprogramme empirisch untersucht,
um schliesslich Design-Prinzipien für die Gestaltung von Studienprogrammen zu
formulieren.\r\n\r\nEs wird nicht davon ausgegangen, dass Studienstrukturen das
Handeln Studierender im Sinne eines kausalen Wirkungszusammenhangs bestimmen.
Vielmehr wird gefragt, was die Studierenden mit den Strukturen, auf die sie treffen,
machen. Studienprogramme werden als kulturelle Einheiten verstanden, innerhalb
derer sich spezifische handlungsleitende Vorstellungen und Normen entwickeln.
Diese impliziten Regeln des Studienhandelns - das so genannte \"Hidden Curriculum\"
- und vor allem auch die dahinterliegenden Konstruktionsprozesse aufzudecken,
ist Ziel dieser Arbeit."
author:
- first_name: Tobias
full_name: Jenert, Tobias
last_name: Jenert
citation:
ama: 'Jenert T. Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit:
Theoretische Grundlegung Und Empirische Analyse. Universität St. Gallen; 2012.'
apa: 'Jenert, T. (2012). Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit:
Theoretische Grundlegung und empirische Analyse. Universität St. Gallen.'
bibtex: '@book{Jenert_2012, title={Studienprogramme als didaktische Gestaltungs-und
Untersuchungseinheit: Theoretische Grundlegung und empirische Analyse}, publisher={Universität
St. Gallen}, author={Jenert, Tobias}, year={2012} }'
chicago: 'Jenert, Tobias. Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit:
Theoretische Grundlegung Und Empirische Analyse. Universität St. Gallen, 2012.'
ieee: 'T. Jenert, Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit:
Theoretische Grundlegung und empirische Analyse. Universität St. Gallen, 2012.'
mla: 'Jenert, Tobias. Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit:
Theoretische Grundlegung Und Empirische Analyse. Universität St. Gallen, 2012.'
short: 'T. Jenert, Studienprogramme Als Didaktische Gestaltungs-Und Untersuchungseinheit:
Theoretische Grundlegung Und Empirische Analyse, Universität St. Gallen, 2012.'
date_created: 2018-09-18T11:38:39Z
date_updated: 2022-01-06T07:01:04Z
department:
- _id: '208'
- _id: '282'
extern: '1'
keyword:
- Studierverhalten
- Hochschuldidaktik
- Lernpsychologie
- Kulturpsychologie
- Bologna-Prozess
- Curriculumentwicklung
- Hochschulbildung
- Study programme
- Bologna-process
- educational development
- cultural psychology
- higher education
- curriculum development
publisher: Universität St. Gallen
status: public
title: 'Studienprogramme als didaktische Gestaltungs-und Untersuchungseinheit: Theoretische
Grundlegung und empirische Analyse'
type: dissertation
user_id: '51057'
year: '2012'
...
---
_id: '4706'
abstract:
- lang: eng
text: Purpose – The purpose of this paper is to show how to employ complex event
processing (CEP) for the observation and management of business processes. It
proposes a conceptual architecture of BPM event producer, processor, and consumer
and describes technical implications for the application with standard software
in a perfect order scenario. Design/methodology/approach – The authors discuss
business process analytics as the technological background. The capabilities of
CEP in a BPM context are outlined an architecture design is proposed. A sophisticated
proof-of-concept demonstrates its applicability. Findings – The results overcome
the separation and data latency issues of process controlling, monitoring, and
simulation. Distinct analyses of past, present, and future blur into a holistic
real-time approach. The authors highlight the necessity for configurable event
producer in BPM engines, process event support in CEP engines, a common process
event format, connectors to visualizers, notifiers and return channels to the
BPM engine. Research limitations/implications – Further research will thoroughly
evaluate the approach in a variety of business settings. New concepts and standards
for the architecture's building blocks will be needed to improve maintainability
and operability. Practical implications – Managers learn how CEP can yield insights
into business processes' operations. The paper illustrates a path to overcome
inflexibility, latency, and missing feedback mechanisms of current process modeling
and control solutions. Software vendors might be interested in the conceptualization
and the described needs for further development. Originality/value – So far, there
is no commercial CEP-based BPM solution which facilitates a round trip from insight
to action as outlines. As major software vendors have begun developing solutions
(BPM/BPA solutions), this paper will stimulate a debate between research and practice
on suitable design and technology.
author:
- first_name: Christian
full_name: Janiesch, Christian
last_name: Janiesch
- first_name: Martin
full_name: Matzner, Martin
last_name: Matzner
- first_name: Oliver
full_name: Müller, Oliver
id: '72849'
last_name: Müller
citation:
ama: 'Janiesch C, Matzner M, Müller O. Beyond process monitoring: A proof-of-concept
of event-driven business activity management. Business Process Management Journal.
2012;(4):625--643. doi:10.1108/14637151211253765'
apa: 'Janiesch, C., Matzner, M., & Müller, O. (2012). Beyond process monitoring:
A proof-of-concept of event-driven business activity management. Business Process
Management Journal, (4), 625--643. https://doi.org/10.1108/14637151211253765'
bibtex: '@article{Janiesch_Matzner_Müller_2012, title={Beyond process monitoring:
A proof-of-concept of event-driven business activity management}, DOI={10.1108/14637151211253765},
number={4}, journal={Business Process Management Journal}, author={Janiesch, Christian
and Matzner, Martin and Müller, Oliver}, year={2012}, pages={625--643} }'
chicago: 'Janiesch, Christian, Martin Matzner, and Oliver Müller. “Beyond Process
Monitoring: A Proof-of-Concept of Event-Driven Business Activity Management.”
Business Process Management Journal, no. 4 (2012): 625--643. https://doi.org/10.1108/14637151211253765.'
ieee: 'C. Janiesch, M. Matzner, and O. Müller, “Beyond process monitoring: A proof-of-concept
of event-driven business activity management,” Business Process Management
Journal, no. 4, pp. 625--643, 2012.'
mla: 'Janiesch, Christian, et al. “Beyond Process Monitoring: A Proof-of-Concept
of Event-Driven Business Activity Management.” Business Process Management
Journal, no. 4, 2012, pp. 625--643, doi:10.1108/14637151211253765.'
short: C. Janiesch, M. Matzner, O. Müller, Business Process Management Journal (2012)
625--643.
date_created: 2018-10-12T08:36:51Z
date_updated: 2022-01-06T07:01:19Z
doi: 10.1108/14637151211253765
extern: '1'
issue: '4'
keyword:
- Architecture
- Business activity monitoring
- Business process management
- Business process re-engineering
- Complex event processing
- Computer software
- Standard software
page: 625--643
publication: Business Process Management Journal
publication_identifier:
isbn:
- '1020120096'
issn:
- '14637154'
status: public
title: 'Beyond process monitoring: A proof-of-concept of event-driven business activity
management'
type: journal_article
user_id: '72849'
year: '2012'
...
---
_id: '9783'
abstract:
- lang: eng
text: To optimize the ultrasound irradiation for cavitation based ultrasound applications
like sonochemistry or ultrasound cleaning, the correlation between cavitation
intensity and the resulting effect on the process is of interest. Furthermore,
changing conditions like temperature and pressure result in varying acoustic properties
of the liquid. That might necessitate an adaption of the ultrasound irradiation.
To detect such changes during operation, process monitoring is desired. Labor
intensive processes, that might be carried out for several hours, also require
process monitoring to increase their reliability by detection of changes or malfunctions
during operation. In some applications cavitation detection and monitoring can
be achieved by the application of sensors in the sound field. Though the application
of sensors is possible, this necessitates modifications on the system and the
sensor might disturb the sound field. In other applications harsh, process conditions
prohibit the application of sensors in the sound field. Therefore alternative
techniques for cavitation detection and monitoring are desired. The applicability
of an external microphone and a self-sensing ultrasound transducer for cavitation
detection were experimentally investigated. Both methods were found to be suitable
and easily applicable.
author:
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Takafumi
full_name: Maeda, Takafumi
last_name: Maeda
- first_name: Takeshi
full_name: Morita, Takeshi
last_name: Morita
citation:
ama: 'Bornmann P, Hemsel T, Sextro W, Maeda T, Morita T. Non-perturbing cavitation
detection / monitoring in sonochemical reactors. In: Ultrasonics Symposium
(IUS), 2012 IEEE International. ; 2012:1141-1144. doi:10.1109/ULTSYM.2012.0284'
apa: Bornmann, P., Hemsel, T., Sextro, W., Maeda, T., & Morita, T. (2012). Non-perturbing
cavitation detection / monitoring in sonochemical reactors. In Ultrasonics
Symposium (IUS), 2012 IEEE International (pp. 1141–1144). https://doi.org/10.1109/ULTSYM.2012.0284
bibtex: '@inproceedings{Bornmann_Hemsel_Sextro_Maeda_Morita_2012, title={Non-perturbing
cavitation detection / monitoring in sonochemical reactors}, DOI={10.1109/ULTSYM.2012.0284},
booktitle={Ultrasonics Symposium (IUS), 2012 IEEE International}, author={Bornmann,
Peter and Hemsel, Tobias and Sextro, Walter and Maeda, Takafumi and Morita, Takeshi},
year={2012}, pages={1141–1144} }'
chicago: Bornmann, Peter, Tobias Hemsel, Walter Sextro, Takafumi Maeda, and Takeshi
Morita. “Non-Perturbing Cavitation Detection / Monitoring in Sonochemical Reactors.”
In Ultrasonics Symposium (IUS), 2012 IEEE International, 1141–44, 2012.
https://doi.org/10.1109/ULTSYM.2012.0284.
ieee: P. Bornmann, T. Hemsel, W. Sextro, T. Maeda, and T. Morita, “Non-perturbing
cavitation detection / monitoring in sonochemical reactors,” in Ultrasonics
Symposium (IUS), 2012 IEEE International, 2012, pp. 1141–1144.
mla: Bornmann, Peter, et al. “Non-Perturbing Cavitation Detection / Monitoring in
Sonochemical Reactors.” Ultrasonics Symposium (IUS), 2012 IEEE International,
2012, pp. 1141–44, doi:10.1109/ULTSYM.2012.0284.
short: 'P. Bornmann, T. Hemsel, W. Sextro, T. Maeda, T. Morita, in: Ultrasonics
Symposium (IUS), 2012 IEEE International, 2012, pp. 1141–1144.'
date_created: 2019-05-13T13:18:49Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.1109/ULTSYM.2012.0284
keyword:
- cavitation
- chemical reactors
- microphones
- process monitoring
- reliability
- ultrasonic applications
- ultrasonic waves
- acoustic properties
- cavitation based ultrasound applications
- cavitation intensity
- change detection reliability
- external microphone
- malfunction detection reliability
- nonperturbing cavitation detection
- nonperturbing cavitation monitoring
- process monitoring
- self-sensing ultrasound transducer
- sonochemical reactors
- sonochemistry
- ultrasound cleaning
- ultrasound irradiation
- Acoustics
- Liquids
- Monitoring
- Sensors
- Sonar equipment
- Transducers
- Ultrasonic imaging
language:
- iso: eng
page: 1141-1144
publication: Ultrasonics Symposium (IUS), 2012 IEEE International
publication_identifier:
issn:
- 1948-5719
quality_controlled: '1'
status: public
title: Non-perturbing cavitation detection / monitoring in sonochemical reactors
type: conference
user_id: '55222'
year: '2012'
...
---
_id: '4707'
author:
- first_name: Christian
full_name: Janiesch, Christian
last_name: Janiesch
- first_name: Martin
full_name: Matzner, Martin
last_name: Matzner
- first_name: Oliver
full_name: Müller, Oliver
id: '72849'
last_name: Müller
citation:
ama: 'Janiesch C, Matzner M, Müller O. A blueprint for event-driven business activity
management. In: Lecture Notes in Computer Science. ; 2011. doi:10.1007/978-3-642-23059-2_4'
apa: Janiesch, C., Matzner, M., & Müller, O. (2011). A blueprint for event-driven
business activity management. In Lecture Notes in Computer Science. https://doi.org/10.1007/978-3-642-23059-2_4
bibtex: '@inproceedings{Janiesch_Matzner_Müller_2011, title={A blueprint for event-driven
business activity management}, DOI={10.1007/978-3-642-23059-2_4},
booktitle={Lecture Notes in Computer Science}, author={Janiesch, Christian and
Matzner, Martin and Müller, Oliver}, year={2011} }'
chicago: Janiesch, Christian, Martin Matzner, and Oliver Müller. “A Blueprint for
Event-Driven Business Activity Management.” In Lecture Notes in Computer Science,
2011. https://doi.org/10.1007/978-3-642-23059-2_4.
ieee: C. Janiesch, M. Matzner, and O. Müller, “A blueprint for event-driven business
activity management,” in Lecture Notes in Computer Science, 2011.
mla: Janiesch, Christian, et al. “A Blueprint for Event-Driven Business Activity
Management.” Lecture Notes in Computer Science, 2011, doi:10.1007/978-3-642-23059-2_4.
short: 'C. Janiesch, M. Matzner, O. Müller, in: Lecture Notes in Computer Science,
2011.'
date_created: 2018-10-12T08:36:57Z
date_updated: 2022-01-06T07:01:19Z
doi: 10.1007/978-3-642-23059-2_4
keyword:
- Reference architecture
- business activity management
- business process analytics
- business process management
- complex event processing
language:
- iso: eng
publication: Lecture Notes in Computer Science
publication_identifier:
isbn:
- '9783642230585'
issn:
- '03029743'
status: public
title: A blueprint for event-driven business activity management
type: conference
user_id: '72849'
year: '2011'
...
---
_id: '23858'
abstract:
- lang: eng
text: A large proportion of plastics today is compounded, which means the process
from refining a raw material to the processable material. For this process compounding
extruders are used which mostly involve tightly intermeshing, co-rotating twin
screw extruders. These extruders consist of two closely spaced screws which rotate
in the same direction and convey the raw material to the screw tip. These screws
are surrounded by several barrel modules which heat or cool the material. As the
whole design of the machine is modularly arranged the process behavior of a twin
screw extruder depends for the main part on the arrangement of the screw and the
barrel elements. Until today this arrangement and process optimization is conducted
by experienced engineers and with the help of trial-and-error methods. Furthermore,
theoretical models are used with which the behavior of the extruder is estimated.
As these models are mostly very complex they are only made available with the
realization in different software projects. One of the tools is called SIGMA.
Within this paper SIGMA is introduced as a software to optimize a twin screw extruder.
SIGMA supports the engineer already in the early stages of the extruder arrangement.
author:
- first_name: Nils
full_name: Kretzschmar, Nils
id: '15387'
last_name: Kretzschmar
- first_name: Volker
full_name: Schöppner, Volker
id: '20530'
last_name: Schöppner
citation:
ama: 'Kretzschmar N, Schöppner V. Simulating Tightly Intermeshing, Co-Rotating Twin
Screw Extruders with SIGMA. In: Proceedings of the 2010 Summer Computer Simulation
Conference. SCSC ’10. San Diego, CA, USA: Society for Computer Simulation
International; 2010:133–140.'
apa: 'Kretzschmar, N., & Schöppner, V. (2010). Simulating Tightly Intermeshing,
Co-Rotating Twin Screw Extruders with SIGMA. In Proceedings of the 2010 Summer
Computer Simulation Conference (pp. 133–140). San Diego, CA, USA: Society
for Computer Simulation International.'
bibtex: '@inproceedings{Kretzschmar_Schöppner_2010, place={San Diego, CA, USA},
series={SCSC ’10}, title={Simulating Tightly Intermeshing, Co-Rotating Twin Screw
Extruders with SIGMA}, booktitle={Proceedings of the 2010 Summer Computer Simulation
Conference}, publisher={Society for Computer Simulation International}, author={Kretzschmar,
Nils and Schöppner, Volker}, year={2010}, pages={133–140}, collection={SCSC ’10}
}'
chicago: 'Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing,
Co-Rotating Twin Screw Extruders with SIGMA.” In Proceedings of the 2010 Summer
Computer Simulation Conference, 133–140. SCSC ’10. San Diego, CA, USA: Society
for Computer Simulation International, 2010.'
ieee: N. Kretzschmar and V. Schöppner, “Simulating Tightly Intermeshing, Co-Rotating
Twin Screw Extruders with SIGMA,” in Proceedings of the 2010 Summer Computer
Simulation Conference, 2010, pp. 133–140.
mla: Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing,
Co-Rotating Twin Screw Extruders with SIGMA.” Proceedings of the 2010 Summer
Computer Simulation Conference, Society for Computer Simulation International,
2010, pp. 133–140.
short: 'N. Kretzschmar, V. Schöppner, in: Proceedings of the 2010 Summer Computer
Simulation Conference, Society for Computer Simulation International, San Diego,
CA, USA, 2010, pp. 133–140.'
date_created: 2021-09-07T10:31:48Z
date_updated: 2022-01-06T06:56:02Z
department:
- _id: '367'
keyword:
- process optimization
- polymer engineering
- compounding
- twin screw extruder
- simulation
language:
- iso: eng
page: 133–140
place: San Diego, CA, USA
publication: Proceedings of the 2010 Summer Computer Simulation Conference
publisher: Society for Computer Simulation International
series_title: SCSC '10
status: public
title: Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA
type: conference
user_id: '15387'
year: '2010'
...
---
_id: '37040'
abstract:
- lang: eng
text: Refinement of untimed TLM models into a timed HW/SW platform is a step by
step design process which is a trade-off between timing accuracy of the used models
and correct estimation of the final timing performance. The use of an RTOS on
the target platform is mandatory in the case real-time properties must be guaranteed.
Thus, the question is when the RTOS must be introduced in this step by step refinement
process. This paper proposes a four-level RTOS-aware refinement methodology that,
starting from an untimed TLM SystemC description of the whole system, progressively
introduce HW/SW partitioning, timing, device driver and RTOS functionalities,
till to obtain an accurate model of the final platform, where SW tasks run upon
an RTOS hosted by QEMU and HW components are modeled by cycle accurate TLM descriptions.
Each refinement level allows the designer to estimate more and more accurate timing
properties, thus anticipating design decisions without being constrained to leave
timing analysis to the final step of the refinement. The effectiveness of the
methodology has been evaluated in the design of two complex platforms.
author:
- first_name: Markus
full_name: Becker, Markus
last_name: Becker
- first_name: Giuseppe
full_name: Di Guglielmo, Giuseppe
last_name: Di Guglielmo
- first_name: Franco
full_name: Fummi, Franco
last_name: Fummi
- first_name: Wolfgang
full_name: Müller, Wolfgang
id: '16243'
last_name: Müller
- first_name: Graziano
full_name: Pravadelli, Graziano
last_name: Pravadelli
- first_name: Tao
full_name: Xie, Tao
last_name: Xie
citation:
ama: 'Becker M, Di Guglielmo G, Fummi F, Müller W, Pravadelli G, Xie T. RTOS-Aware
Refinement for TLM2.0-based HW/SW Design. In: Proceedings of DATE’10. IEEE;
2010. doi:10.1109/DATE.2010.5456965'
apa: Becker, M., Di Guglielmo, G., Fummi, F., Müller, W., Pravadelli, G., &
Xie, T. (2010). RTOS-Aware Refinement for TLM2.0-based HW/SW Design. Proceedings
of DATE’10. Design, Automation & Test in Europe Conference & Exhibition
(DATE 2010), Dresden. https://doi.org/10.1109/DATE.2010.5456965
bibtex: '@inproceedings{Becker_Di Guglielmo_Fummi_Müller_Pravadelli_Xie_2010, place={Dresden},
title={RTOS-Aware Refinement for TLM2.0-based HW/SW Design}, DOI={10.1109/DATE.2010.5456965},
booktitle={Proceedings of DATE’10}, publisher={IEEE}, author={Becker, Markus and
Di Guglielmo, Giuseppe and Fummi, Franco and Müller, Wolfgang and Pravadelli,
Graziano and Xie, Tao}, year={2010} }'
chicago: 'Becker, Markus, Giuseppe Di Guglielmo, Franco Fummi, Wolfgang Müller,
Graziano Pravadelli, and Tao Xie. “RTOS-Aware Refinement for TLM2.0-Based HW/SW
Design.” In Proceedings of DATE’10. Dresden: IEEE, 2010. https://doi.org/10.1109/DATE.2010.5456965.'
ieee: 'M. Becker, G. Di Guglielmo, F. Fummi, W. Müller, G. Pravadelli, and T. Xie,
“RTOS-Aware Refinement for TLM2.0-based HW/SW Design,” presented at the Design,
Automation & Test in Europe Conference & Exhibition (DATE 2010), Dresden,
2010, doi: 10.1109/DATE.2010.5456965.'
mla: Becker, Markus, et al. “RTOS-Aware Refinement for TLM2.0-Based HW/SW Design.”
Proceedings of DATE’10, IEEE, 2010, doi:10.1109/DATE.2010.5456965.
short: 'M. Becker, G. Di Guglielmo, F. Fummi, W. Müller, G. Pravadelli, T. Xie,
in: Proceedings of DATE’10, IEEE, Dresden, 2010.'
conference:
location: Dresden
name: Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)
date_created: 2023-01-17T10:47:29Z
date_updated: 2023-01-17T10:47:37Z
department:
- _id: '672'
doi: 10.1109/DATE.2010.5456965
keyword:
- Timing
- Hardware
- Operating systems
- Process design
- Accuracy
- Standards development
- Context modeling
- Real time systems
- Communication channels
- Microprogramming
language:
- iso: eng
place: Dresden
publication: Proceedings of DATE’10
publication_identifier:
eisbn:
- 978-3-9810801-6-2
publisher: IEEE
status: public
title: RTOS-Aware Refinement for TLM2.0-based HW/SW Design
type: conference
user_id: '5786'
year: '2010'
...
---
_id: '37050'
abstract:
- lang: eng
text: The main obstacle for the wide acceptance of UML and SysML in the design of
electronic systems is due to a major gap in the design flow between UML-based
modeling and SystemC-based verification. To overcome this gap, we present an approach
developed in the SATURN project which introduces UML profiles for the co-modeling
of SystemC and C with code generation support in the context of the SysML tool
suite ARTiSAN Studio®. We finally discuss the evaluation of the approach by two
case studies.
author:
- first_name: Wolfgang
full_name: Müller, Wolfgang
id: '16243'
last_name: Müller
- first_name: Da
full_name: He, Da
last_name: He
- first_name: Fabian
full_name: Mischkalla, Fabian
last_name: Mischkalla
- first_name: Arthur
full_name: Wegele, Arthur
last_name: Wegele
- first_name: Adrian
full_name: Larkham, Adrian
last_name: Larkham
- first_name: Paul
full_name: Whiston, Paul
last_name: Whiston
- first_name: Pablo
full_name: Penil, Pablo
last_name: Penil
- first_name: Eugenio
full_name: Villar, Eugenio
last_name: Villar
- first_name: Nikolaos
full_name: Mitas, Nikolaos
last_name: Mitas
- first_name: Dimitros
full_name: Kritharidis, Dimitros
last_name: Kritharidis
- first_name: Florent
full_name: Azcarate, Florent
last_name: Azcarate
- first_name: Manuel
full_name: Carballeda, Manuel
last_name: Carballeda
citation:
ama: 'Müller W, He D, Mischkalla F, et al. The SATURN Approach to SysML-based HW/SW
Codesign. In: Proceedings of the IEEE Computer Society Annual Symposium on
VLSI. Lecture Notes in Electrical Engineering. ; 2010. doi:10.1007/978-94-007-1488-5_9'
apa: Müller, W., He, D., Mischkalla, F., Wegele, A., Larkham, A., Whiston, P., Penil,
P., Villar, E., Mitas, N., Kritharidis, D., Azcarate, F., & Carballeda, M.
(2010). The SATURN Approach to SysML-based HW/SW Codesign. Proceedings of the
IEEE Computer Society Annual Symposium on VLSI. https://doi.org/10.1007/978-94-007-1488-5_9
bibtex: '@inproceedings{Müller_He_Mischkalla_Wegele_Larkham_Whiston_Penil_Villar_Mitas_Kritharidis_et
al._2010, series={Lecture Notes in Electrical Engineering}, title={The SATURN
Approach to SysML-based HW/SW Codesign}, DOI={10.1007/978-94-007-1488-5_9},
booktitle={Proceedings of the IEEE Computer Society Annual Symposium on VLSI},
author={Müller, Wolfgang and He, Da and Mischkalla, Fabian and Wegele, Arthur
and Larkham, Adrian and Whiston, Paul and Penil, Pablo and Villar, Eugenio and
Mitas, Nikolaos and Kritharidis, Dimitros and et al.}, year={2010}, collection={Lecture
Notes in Electrical Engineering} }'
chicago: Müller, Wolfgang, Da He, Fabian Mischkalla, Arthur Wegele, Adrian Larkham,
Paul Whiston, Pablo Penil, et al. “The SATURN Approach to SysML-Based HW/SW Codesign.”
In Proceedings of the IEEE Computer Society Annual Symposium on VLSI. Lecture
Notes in Electrical Engineering, 2010. https://doi.org/10.1007/978-94-007-1488-5_9.
ieee: 'W. Müller et al., “The SATURN Approach to SysML-based HW/SW Codesign,”
2010, doi: 10.1007/978-94-007-1488-5_9.'
mla: Müller, Wolfgang, et al. “The SATURN Approach to SysML-Based HW/SW Codesign.”
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2010,
doi:10.1007/978-94-007-1488-5_9.
short: 'W. Müller, D. He, F. Mischkalla, A. Wegele, A. Larkham, P. Whiston, P. Penil,
E. Villar, N. Mitas, D. Kritharidis, F. Azcarate, M. Carballeda, in: Proceedings
of the IEEE Computer Society Annual Symposium on VLSI, 2010.'
date_created: 2023-01-17T11:19:45Z
date_updated: 2023-01-17T11:19:53Z
department:
- _id: '672'
doi: 10.1007/978-94-007-1488-5_9
keyword:
- Communicate Sequential Process Virtual Platform Smart Camera Synchronous
Data Flow Artisan Studio
language:
- iso: eng
publication: Proceedings of the IEEE Computer Society Annual Symposium on VLSI
publication_identifier:
eisbn:
- 978-94-007-1488-5
series_title: Lecture Notes in Electrical Engineering
status: public
title: The SATURN Approach to SysML-based HW/SW Codesign
type: conference
user_id: '5786'
year: '2010'
...