@article{56089, abstract = {{Additive manufacturing (AM) technologies enable near-net-shape designs and demand-oriented material usage, which significantly minimizes waste. This points to a substantial opportunity for further optimization in material savings and process design. The current study delves into the advancement of sustainable manufacturing practices in the automotive industry, emphasizing the crucial role of lightweight construction concepts and AM technologies in enhancing resource efficiency and reducing greenhouse gas emissions. By exploring the integration of novel AM techniques such as selective laser melting (SLM) and laser metal deposition (LMD), the study aims to overcome existing limitations like slow build-up rates and limited component resolution. The study’s core objective revolves around the development and validation of a continuous process chain that synergizes different AM routes. In the current study, the continuous process chain for DMG MORI Lasertec 65 3D’s LMD system and the DMG MORI Lasertec 30 3D’s was demonstrated using 316L and 1.2709 steel materials. This integrated approach is designed to significantly curtail process times and minimize component costs, thus suggesting an industry-oriented process chain for future manufacturing paradigms. Additionally, the research investigates the production and material behavior of components under varying manufacturing processes, material combinations, and boundary layer materials. The culmination of this study is the validation of the proposed process route through a technology demonstrator, assessing its scalability and setting a benchmark for resource-efficient manufacturing in the automotive sector.}}, author = {{Chalicheemalapalli Jayasankar, Deviprasad and Gnaase, Stefan and Kaiser, Maximilian Alexander and Lehnert, Dennis and Tröster, Thomas}}, issn = {{2075-4701}}, journal = {{Metals}}, keywords = {{additive manufacturing (AM), selective laser melting (SLM), laser metal deposition (LMD), hybrid manufacturing, process optimization, 316L, 1.2709}}, number = {{7}}, publisher = {{MDPI AG}}, title = {{{Advancements in Hybrid Additive Manufacturing: Integrating SLM and LMD for High-Performance Applications}}}, doi = {{10.3390/met14070772}}, volume = {{14}}, year = {{2024}}, } @article{21436, abstract = {{Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.}}, author = {{Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}}, issn = {{0026-2714}}, journal = {{Microelectronics Reliability}}, keywords = {{Ultrasonic heavy wire bonding, Co-simulation, ANSYS, MATLAB, Process optimization, Friction coefficient, Copper-copper, Aluminium-copper}}, pages = {{114077}}, title = {{{Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}}}, doi = {{https://doi.org/10.1016/j.microrel.2021.114077}}, volume = {{119}}, year = {{2021}}, } @inproceedings{23858, abstract = {{A large proportion of plastics today is compounded, which means the process from refining a raw material to the processable material. For this process compounding extruders are used which mostly involve tightly intermeshing, co-rotating twin screw extruders. These extruders consist of two closely spaced screws which rotate in the same direction and convey the raw material to the screw tip. These screws are surrounded by several barrel modules which heat or cool the material. As the whole design of the machine is modularly arranged the process behavior of a twin screw extruder depends for the main part on the arrangement of the screw and the barrel elements. Until today this arrangement and process optimization is conducted by experienced engineers and with the help of trial-and-error methods. Furthermore, theoretical models are used with which the behavior of the extruder is estimated. As these models are mostly very complex they are only made available with the realization in different software projects. One of the tools is called SIGMA. Within this paper SIGMA is introduced as a software to optimize a twin screw extruder. SIGMA supports the engineer already in the early stages of the extruder arrangement.}}, author = {{Kretzschmar, Nils and Schöppner, Volker}}, booktitle = {{Proceedings of the 2010 Summer Computer Simulation Conference}}, keywords = {{process optimization, polymer engineering, compounding, twin screw extruder, simulation}}, pages = {{133–140}}, publisher = {{Society for Computer Simulation International}}, title = {{{Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA}}}, year = {{2010}}, }