---
_id: '56089'
abstract:
- lang: eng
  text: <jats:p>Additive manufacturing (AM) technologies enable near-net-shape designs
    and demand-oriented material usage, which significantly minimizes waste. This
    points to a substantial opportunity for further optimization in material savings
    and process design. The current study delves into the advancement of sustainable
    manufacturing practices in the automotive industry, emphasizing the crucial role
    of lightweight construction concepts and AM technologies in enhancing resource
    efficiency and reducing greenhouse gas emissions. By exploring the integration
    of novel AM techniques such as selective laser melting (SLM) and laser metal deposition
    (LMD), the study aims to overcome existing limitations like slow build-up rates
    and limited component resolution. The study’s core objective revolves around the
    development and validation of a continuous process chain that synergizes different
    AM routes. In the current study, the continuous process chain for DMG MORI Lasertec
    65 3D’s LMD system and the DMG MORI Lasertec 30 3D’s was demonstrated using 316L
    and 1.2709 steel materials. This integrated approach is designed to significantly
    curtail process times and minimize component costs, thus suggesting an industry-oriented
    process chain for future manufacturing paradigms. Additionally, the research investigates
    the production and material behavior of components under varying manufacturing
    processes, material combinations, and boundary layer materials. The culmination
    of this study is the validation of the proposed process route through a technology
    demonstrator, assessing its scalability and setting a benchmark for resource-efficient
    manufacturing in the automotive sector.</jats:p>
article_number: '772'
article_type: original
author:
- first_name: Deviprasad
  full_name: Chalicheemalapalli Jayasankar, Deviprasad
  id: '49504'
  last_name: Chalicheemalapalli Jayasankar
  orcid: https://orcid.org/ 0000-0002-3446-2444
- first_name: Stefan
  full_name: Gnaase, Stefan
  id: '25730'
  last_name: Gnaase
- first_name: Maximilian Alexander
  full_name: Kaiser, Maximilian Alexander
  id: '72351'
  last_name: Kaiser
  orcid: 0009-0008-1333-3396
- first_name: Dennis
  full_name: Lehnert, Dennis
  id: '90491'
  last_name: Lehnert
- first_name: Thomas
  full_name: Tröster, Thomas
  id: '553'
  last_name: Tröster
citation:
  ama: 'Chalicheemalapalli Jayasankar D, Gnaase S, Kaiser MA, Lehnert D, Tröster T.
    Advancements in Hybrid Additive Manufacturing: Integrating SLM and LMD for High-Performance
    Applications. <i>Metals</i>. 2024;14(7). doi:<a href="https://doi.org/10.3390/met14070772">10.3390/met14070772</a>'
  apa: 'Chalicheemalapalli Jayasankar, D., Gnaase, S., Kaiser, M. A., Lehnert, D.,
    &#38; Tröster, T. (2024). Advancements in Hybrid Additive Manufacturing: Integrating
    SLM and LMD for High-Performance Applications. <i>Metals</i>, <i>14</i>(7), Article
    772. <a href="https://doi.org/10.3390/met14070772">https://doi.org/10.3390/met14070772</a>'
  bibtex: '@article{Chalicheemalapalli Jayasankar_Gnaase_Kaiser_Lehnert_Tröster_2024,
    title={Advancements in Hybrid Additive Manufacturing: Integrating SLM and LMD
    for High-Performance Applications}, volume={14}, DOI={<a href="https://doi.org/10.3390/met14070772">10.3390/met14070772</a>},
    number={7772}, journal={Metals}, publisher={MDPI AG}, author={Chalicheemalapalli
    Jayasankar, Deviprasad and Gnaase, Stefan and Kaiser, Maximilian Alexander and
    Lehnert, Dennis and Tröster, Thomas}, year={2024} }'
  chicago: 'Chalicheemalapalli Jayasankar, Deviprasad, Stefan Gnaase, Maximilian Alexander
    Kaiser, Dennis Lehnert, and Thomas Tröster. “Advancements in Hybrid Additive Manufacturing:
    Integrating SLM and LMD for High-Performance Applications.” <i>Metals</i> 14,
    no. 7 (2024). <a href="https://doi.org/10.3390/met14070772">https://doi.org/10.3390/met14070772</a>.'
  ieee: 'D. Chalicheemalapalli Jayasankar, S. Gnaase, M. A. Kaiser, D. Lehnert, and
    T. Tröster, “Advancements in Hybrid Additive Manufacturing: Integrating SLM and
    LMD for High-Performance Applications,” <i>Metals</i>, vol. 14, no. 7, Art. no.
    772, 2024, doi: <a href="https://doi.org/10.3390/met14070772">10.3390/met14070772</a>.'
  mla: 'Chalicheemalapalli Jayasankar, Deviprasad, et al. “Advancements in Hybrid
    Additive Manufacturing: Integrating SLM and LMD for High-Performance Applications.”
    <i>Metals</i>, vol. 14, no. 7, 772, MDPI AG, 2024, doi:<a href="https://doi.org/10.3390/met14070772">10.3390/met14070772</a>.'
  short: D. Chalicheemalapalli Jayasankar, S. Gnaase, M.A. Kaiser, D. Lehnert, T.
    Tröster, Metals 14 (2024).
date_created: 2024-09-10T10:19:32Z
date_updated: 2026-03-20T08:44:23Z
department:
- _id: '9'
- _id: '321'
- _id: '149'
doi: 10.3390/met14070772
intvolume: '        14'
issue: '7'
keyword:
- additive manufacturing (AM)
- selective laser melting (SLM)
- laser metal deposition (LMD)
- hybrid manufacturing
- process optimization
- 316L
- '1.2709'
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: https://www.mdpi.com/2075-4701/14/7/772
oa: '1'
publication: Metals
publication_identifier:
  issn:
  - 2075-4701
publication_status: published
publisher: MDPI AG
quality_controlled: '1'
status: public
title: 'Advancements in Hybrid Additive Manufacturing: Integrating SLM and LMD for
  High-Performance Applications'
type: journal_article
user_id: '49504'
volume: 14
year: '2024'
...
---
_id: '21436'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
    industry to form electrical connections, e.g. to connect electrical terminals
    within semiconductor modules. Many process parameters affect the bond strength,
    such like the bond normal force, ultrasonic power, wire material and bonding frequency.
    Today, process design, development, and optimization is most likely based on the
    knowledge of process engineers and is mainly performed by experimental testing.
    In this contribution, a newly developed simulation tool is presented, to reduce
    time and costs and efficiently determine optimized process parameter. Based on
    a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
    bonding process are considered using finite element simulation for the complex
    plastic deformation of the wire and reduced order models for the transient dynamics
    of the transducer, wire, substrate and bond formation. The model parameters such
    as the coefficients of friction between bond tool and wire and between wire and
    substrate were determined for aluminium and copper wire in experiments with a
    test rig specially developed for the requirements of heavy wire bonding. To reduce
    simulation time, for the finite element simulation a restart analysis and high
    performance computing is utilized. Detailed analysis of the bond formation showed,
    that the normal pressure distribution in the contact between wire and substrate
    has high impact on bond formation and distribution of welded areas in the contact
    area.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Viktor
  full_name: Krieger, Viktor
  last_name: Krieger
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
    for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>.
    2021;119:114077. doi:<a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>
  apa: Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation
    of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics
    Reliability</i>, <i>119</i>, 114077. <a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>
  bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
    and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a
    href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>},
    journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
    Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
  chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
    “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
    <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>.'
  ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
    and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics
    Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>.'
  mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
    Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol.
    119, 2021, p. 114077, doi:<a href="https://doi.org/10.1016/j.microrel.2021.114077">https://doi.org/10.1016/j.microrel.2021.114077</a>.
  short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
    119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: '       119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
  issn:
  - 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '23858'
abstract:
- lang: eng
  text: A large proportion of plastics today is compounded, which means the process
    from refining a raw material to the processable material. For this process compounding
    extruders are used which mostly involve tightly intermeshing, co-rotating twin
    screw extruders. These extruders consist of two closely spaced screws which rotate
    in the same direction and convey the raw material to the screw tip. These screws
    are surrounded by several barrel modules which heat or cool the material. As the
    whole design of the machine is modularly arranged the process behavior of a twin
    screw extruder depends for the main part on the arrangement of the screw and the
    barrel elements. Until today this arrangement and process optimization is conducted
    by experienced engineers and with the help of trial-and-error methods. Furthermore,
    theoretical models are used with which the behavior of the extruder is estimated.
    As these models are mostly very complex they are only made available with the
    realization in different software projects. One of the tools is called SIGMA.
    Within this paper SIGMA is introduced as a software to optimize a twin screw extruder.
    SIGMA supports the engineer already in the early stages of the extruder arrangement.
author:
- first_name: Nils
  full_name: Kretzschmar, Nils
  id: '15387'
  last_name: Kretzschmar
- first_name: Volker
  full_name: Schöppner, Volker
  id: '20530'
  last_name: Schöppner
citation:
  ama: 'Kretzschmar N, Schöppner V. Simulating Tightly Intermeshing, Co-Rotating Twin
    Screw Extruders with SIGMA. In: <i>Proceedings of the 2010 Summer Computer Simulation
    Conference</i>. SCSC ’10. San Diego, CA, USA: Society for Computer Simulation
    International; 2010:133–140.'
  apa: 'Kretzschmar, N., &#38; Schöppner, V. (2010). Simulating Tightly Intermeshing,
    Co-Rotating Twin Screw Extruders with SIGMA. In <i>Proceedings of the 2010 Summer
    Computer Simulation Conference</i> (pp. 133–140). San Diego, CA, USA: Society
    for Computer Simulation International.'
  bibtex: '@inproceedings{Kretzschmar_Schöppner_2010, place={San Diego, CA, USA},
    series={SCSC ’10}, title={Simulating Tightly Intermeshing, Co-Rotating Twin Screw
    Extruders with SIGMA}, booktitle={Proceedings of the 2010 Summer Computer Simulation
    Conference}, publisher={Society for Computer Simulation International}, author={Kretzschmar,
    Nils and Schöppner, Volker}, year={2010}, pages={133–140}, collection={SCSC ’10}
    }'
  chicago: 'Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing,
    Co-Rotating Twin Screw Extruders with SIGMA.” In <i>Proceedings of the 2010 Summer
    Computer Simulation Conference</i>, 133–140. SCSC ’10. San Diego, CA, USA: Society
    for Computer Simulation International, 2010.'
  ieee: N. Kretzschmar and V. Schöppner, “Simulating Tightly Intermeshing, Co-Rotating
    Twin Screw Extruders with SIGMA,” in <i>Proceedings of the 2010 Summer Computer
    Simulation Conference</i>, 2010, pp. 133–140.
  mla: Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing,
    Co-Rotating Twin Screw Extruders with SIGMA.” <i>Proceedings of the 2010 Summer
    Computer Simulation Conference</i>, Society for Computer Simulation International,
    2010, pp. 133–140.
  short: 'N. Kretzschmar, V. Schöppner, in: Proceedings of the 2010 Summer Computer
    Simulation Conference, Society for Computer Simulation International, San Diego,
    CA, USA, 2010, pp. 133–140.'
date_created: 2021-09-07T10:31:48Z
date_updated: 2022-01-06T06:56:02Z
department:
- _id: '367'
keyword:
- process optimization
- polymer engineering
- compounding
- twin screw extruder
- simulation
language:
- iso: eng
page: 133–140
place: San Diego, CA, USA
publication: Proceedings of the 2010 Summer Computer Simulation Conference
publisher: Society for Computer Simulation International
series_title: SCSC '10
status: public
title: Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA
type: conference
user_id: '15387'
year: '2010'
...