---
_id: '62641'
author:
- first_name: Stephan
full_name: Kruse, Stephan
id: '38254'
last_name: Kruse
- first_name: Jabil
full_name: Diri, Jabil
last_name: Diri
- first_name: Thomas
full_name: Mager, Thomas
last_name: Mager
- first_name: Christian
full_name: Kress, Christian
id: '13256'
last_name: Kress
orcid: 0000-0002-4403-2237
- first_name: J. Christoph
full_name: Scheytt, J. Christoph
id: '37144'
last_name: Scheytt
orcid: '0000-0002-5950-6618 '
citation:
ama: 'Kruse S, Diri J, Mager T, Kress C, Scheytt JC. Electrooptical Integration
of an Electronic Photonic Integrated Circuit Into Plastic Substrates Using Mid-Technology.
In: 2025 55th European Microwave Conference (EuMC). ; 2025:127-130. doi:10.23919/EuMC65286.2025.11235121'
apa: Kruse, S., Diri, J., Mager, T., Kress, C., & Scheytt, J. C. (2025). Electrooptical
Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates
Using Mid-Technology. 2025 55th European Microwave Conference (EuMC), 127–130.
https://doi.org/10.23919/EuMC65286.2025.11235121
bibtex: '@inproceedings{Kruse_Diri_Mager_Kress_Scheytt_2025, title={Electrooptical
Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates
Using Mid-Technology}, DOI={10.23919/EuMC65286.2025.11235121},
booktitle={2025 55th European Microwave Conference (EuMC)}, author={Kruse, Stephan
and Diri, Jabil and Mager, Thomas and Kress, Christian and Scheytt, J. Christoph},
year={2025}, pages={127–130} }'
chicago: Kruse, Stephan, Jabil Diri, Thomas Mager, Christian Kress, and J. Christoph
Scheytt. “Electrooptical Integration of an Electronic Photonic Integrated Circuit
Into Plastic Substrates Using Mid-Technology.” In 2025 55th European Microwave
Conference (EuMC), 127–30, 2025. https://doi.org/10.23919/EuMC65286.2025.11235121.
ieee: 'S. Kruse, J. Diri, T. Mager, C. Kress, and J. C. Scheytt, “Electrooptical
Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates
Using Mid-Technology,” in 2025 55th European Microwave Conference (EuMC),
2025, pp. 127–130, doi: 10.23919/EuMC65286.2025.11235121.'
mla: Kruse, Stephan, et al. “Electrooptical Integration of an Electronic Photonic
Integrated Circuit Into Plastic Substrates Using Mid-Technology.” 2025 55th
European Microwave Conference (EuMC), 2025, pp. 127–30, doi:10.23919/EuMC65286.2025.11235121.
short: 'S. Kruse, J. Diri, T. Mager, C. Kress, J.C. Scheytt, in: 2025 55th European
Microwave Conference (EuMC), 2025, pp. 127–130.'
date_created: 2025-11-27T07:10:33Z
date_updated: 2025-11-27T07:12:30Z
department:
- _id: '58'
- _id: '241'
doi: 10.23919/EuMC65286.2025.11235121
keyword:
- Optical fibers
- Integrated optics
- Semiconductor device measurement
- Laser radar
- Optical device fabrication
- Photonic integrated circuits
- Microwave theory and techniques
- Optical fiber devices
- Plastics
- Substrates
- Microwave photonics
- photonic radar
- optical LO distribution
- mechatronic integrated device (MID)
language:
- iso: eng
page: 127-130
publication: 2025 55th European Microwave Conference (EuMC)
status: public
title: Electrooptical Integration of an Electronic Photonic Integrated Circuit Into
Plastic Substrates Using Mid-Technology
type: conference
user_id: '38254'
year: '2025'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...