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Quevedo, Holger Karl, and Ling Shi. “Deep Reinforcement Learning for Wireless Sensor Scheduling in Cyber–Physical Systems.” <i>Automatica</i> 113 (2019). <a href=\"https://doi.org/10.1016/j.automatica.2019.108759\">https://doi.org/10.1016/j.automatica.2019.108759</a>.","short":"A.S. Leong, A. Ramaswamy, D.E. Quevedo, H. Karl, L. Shi, Automatica 113 (2019).","ieee":"A. S. Leong, A. Ramaswamy, D. E. Quevedo, H. Karl, and L. Shi, “Deep reinforcement learning for wireless sensor scheduling in cyber–physical systems,” <i>Automatica</i>, vol. 113, Art. no. 108759, 2019, doi: <a href=\"https://doi.org/10.1016/j.automatica.2019.108759\">10.1016/j.automatica.2019.108759</a>.","apa":"Leong, A. S., Ramaswamy, A., Quevedo, D. E., Karl, H., &#38; Shi, L. (2019). Deep reinforcement learning for wireless sensor scheduling in cyber–physical systems. <i>Automatica</i>, <i>113</i>, Article 108759. <a href=\"https://doi.org/10.1016/j.automatica.2019.108759\">https://doi.org/10.1016/j.automatica.2019.108759</a>","bibtex":"@article{Leong_Ramaswamy_Quevedo_Karl_Shi_2019, title={Deep reinforcement learning for wireless sensor scheduling in cyber–physical systems}, volume={113}, DOI={<a href=\"https://doi.org/10.1016/j.automatica.2019.108759\">10.1016/j.automatica.2019.108759</a>}, number={108759}, journal={Automatica}, publisher={Elsevier BV}, author={Leong, Alex S. and Ramaswamy, Arunselvan and Quevedo, Daniel E. and Karl, Holger and Shi, Ling}, year={2019} }","ama":"Leong AS, Ramaswamy A, Quevedo DE, Karl H, Shi L. Deep reinforcement learning for wireless sensor scheduling in cyber–physical systems. <i>Automatica</i>. 2019;113. doi:<a href=\"https://doi.org/10.1016/j.automatica.2019.108759\">10.1016/j.automatica.2019.108759</a>","mla":"Leong, Alex S., et al. “Deep Reinforcement Learning for Wireless Sensor Scheduling in Cyber–Physical Systems.” <i>Automatica</i>, vol. 113, 108759, Elsevier BV, 2019, doi:<a href=\"https://doi.org/10.1016/j.automatica.2019.108759\">10.1016/j.automatica.2019.108759</a>."},"publisher":"Elsevier BV","_id":"35583","user_id":"158","volume":113,"status":"public"},{"department":[{"_id":"57"}],"type":"journal_article","keyword":["Electrical and Electronic Engineering","Control and Systems Engineering"],"date_created":"2023-01-09T16:45:46Z","publication":"Automatica","doi":"10.1016/j.automatica.2019.108680","language":[{"iso":"eng"}],"article_number":"108680","intvolume":"       113","publication_status":"published","date_updated":"2023-01-09T16:45:59Z","author":[{"full_name":"Ding, Kemi","first_name":"Kemi","last_name":"Ding"},{"full_name":"Ren, Xiaoqiang","last_name":"Ren","first_name":"Xiaoqiang"},{"full_name":"Quevedo, Daniel E.","last_name":"Quevedo","first_name":"Daniel E."},{"last_name":"Dey","first_name":"Subhrakanti","full_name":"Dey, Subhrakanti"},{"first_name":"Ling","last_name":"Shi","full_name":"Shi, Ling"}],"publication_identifier":{"issn":["0005-1098"]},"title":"Defensive deception against reactive jamming attacks in remote state estimation","year":"2019","citation":{"apa":"Ding, K., Ren, X., Quevedo, D. E., Dey, S., &#38; Shi, L. (2019). Defensive deception against reactive jamming attacks in remote state estimation. <i>Automatica</i>, <i>113</i>, Article 108680. <a href=\"https://doi.org/10.1016/j.automatica.2019.108680\">https://doi.org/10.1016/j.automatica.2019.108680</a>","ieee":"K. Ding, X. Ren, D. E. Quevedo, S. Dey, and L. Shi, “Defensive deception against reactive jamming attacks in remote state estimation,” <i>Automatica</i>, vol. 113, Art. no. 108680, 2019, doi: <a href=\"https://doi.org/10.1016/j.automatica.2019.108680\">10.1016/j.automatica.2019.108680</a>.","chicago":"Ding, Kemi, Xiaoqiang Ren, Daniel E. Quevedo, Subhrakanti Dey, and Ling Shi. “Defensive Deception against Reactive Jamming Attacks in Remote State Estimation.” <i>Automatica</i> 113 (2019). <a href=\"https://doi.org/10.1016/j.automatica.2019.108680\">https://doi.org/10.1016/j.automatica.2019.108680</a>.","short":"K. Ding, X. Ren, D.E. Quevedo, S. Dey, L. Shi, Automatica 113 (2019).","mla":"Ding, Kemi, et al. “Defensive Deception against Reactive Jamming Attacks in Remote State Estimation.” <i>Automatica</i>, vol. 113, 108680, Elsevier BV, 2019, doi:<a href=\"https://doi.org/10.1016/j.automatica.2019.108680\">10.1016/j.automatica.2019.108680</a>.","ama":"Ding K, Ren X, Quevedo DE, Dey S, Shi L. Defensive deception against reactive jamming attacks in remote state estimation. <i>Automatica</i>. 2019;113. doi:<a href=\"https://doi.org/10.1016/j.automatica.2019.108680\">10.1016/j.automatica.2019.108680</a>","bibtex":"@article{Ding_Ren_Quevedo_Dey_Shi_2019, title={Defensive deception against reactive jamming attacks in remote state estimation}, volume={113}, DOI={<a href=\"https://doi.org/10.1016/j.automatica.2019.108680\">10.1016/j.automatica.2019.108680</a>}, number={108680}, journal={Automatica}, publisher={Elsevier BV}, author={Ding, Kemi and Ren, Xiaoqiang and Quevedo, Daniel E. and Dey, Subhrakanti and Shi, Ling}, year={2019} }"},"volume":113,"user_id":"158","_id":"35584","publisher":"Elsevier BV","status":"public"},{"date_created":"2019-05-27T09:35:48Z","department":[{"_id":"151"}],"type":"conference","keyword":["Design for X (DfX)","Product modelling / models","Robust design","Systems Engineering (SE)","Reliability"],"citation":{"apa":"Hentze, J., Kaul, T., Grässler, I., &#38; Sextro, W. (2017). Integrated modeling og behavior and reliability in system development. In <i>ICED17, 21st International conference on enginieering design</i> (pp. 385–394).","ieee":"J. Hentze, T. Kaul, I. Grässler, and W. Sextro, “Integrated modeling og behavior and reliability in system development,” in <i>ICED17, 21st International conference on enginieering design</i>, 2017, pp. 385–394.","chicago":"Hentze, Julian, Thorben Kaul, Iris Grässler, and Walter Sextro. “Integrated Modeling Og Behavior and Reliability in System Development.” In <i>ICED17, 21st International Conference on Enginieering Design</i>, 385–94, 2017.","short":"J. Hentze, T. Kaul, I. Grässler, W. Sextro, in: ICED17, 21st International Conference on Enginieering Design, 2017, pp. 385–394.","mla":"Hentze, Julian, et al. “Integrated Modeling Og Behavior and Reliability in System Development.” <i>ICED17, 21st International Conference on Enginieering Design</i>, 2017, pp. 385–94.","ama":"Hentze J, Kaul T, Grässler I, Sextro W. Integrated modeling og behavior and reliability in system development. In: <i>ICED17, 21st International Conference on Enginieering Design</i>. ; 2017:385-394.","bibtex":"@inproceedings{Hentze_Kaul_Grässler_Sextro_2017, title={Integrated modeling og behavior and reliability in system development}, booktitle={ICED17, 21st International conference on enginieering design}, author={Hentze, Julian and Kaul, Thorben and Grässler, Iris and Sextro, Walter}, year={2017}, pages={385–394} }"},"publication":"ICED17, 21st International conference on enginieering design","abstract":[{"text":"The integrated modeling of behavior and reliability in system development delivers a model-based approach for reliability investigation by taking into account the dynamic system behavior as well as the system architecture at different phases of the development process. This approach features an automated synthesis of a reliability model out of a behavior model enabling for the closed loop modeling of degradation of the system and its (dynamic) behavior. The approach is integrated into the development process following Systems Engineering. It is based on standard models used in model-based development methodologies i.e. SysML or Matlab/Simulink. In addition to the theoretical description of the necessary steps the procedure is validated by an application example at two stages of the development process.","lang":"eng"}],"quality_controlled":"1","language":[{"iso":"eng"}],"_id":"9974","page":"385-394","user_id":"55222","author":[{"id":"13342","full_name":"Hentze, Julian","first_name":"Julian","last_name":"Hentze"},{"id":"14802","full_name":"Kaul, Thorben","first_name":"Thorben","last_name":"Kaul"},{"last_name":"Grässler","first_name":"Iris","full_name":"Grässler, Iris"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"}],"title":"Integrated modeling og behavior and reliability in system development","year":"2017","status":"public","date_updated":"2019-09-30T08:04:38Z"},{"page":"3995-4005","_id":"30601","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","user_id":"66","volume":51,"status":"public","citation":{"short":"J. Solanki, N. Fröhleke, J. Böcker, G. Duppe, A. 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Voltage-Sequence-Control-Based High-Current Rectifier System. <i>IEEE Transactions on Industry Applications</i>. 2015;51(5):3995-4005. doi:<a href=\"https://doi.org/10.1109/tia.2015.2422772\">10.1109/tia.2015.2422772</a>","mla":"Solanki, Jitendra, et al. “Voltage-Sequence-Control-Based High-Current Rectifier System.” <i>IEEE Transactions on Industry Applications</i>, vol. 51, no. 5, Institute of Electrical and Electronics Engineers (IEEE), 2015, pp. 3995–4005, doi:<a href=\"https://doi.org/10.1109/tia.2015.2422772\">10.1109/tia.2015.2422772</a>."},"language":[{"iso":"eng"}],"doi":"10.1109/tia.2015.2422772","title":"Voltage-Sequence-Control-Based High-Current Rectifier System","year":"2015","publication_identifier":{"issn":["0093-9994","1939-9367"]},"author":[{"first_name":"Jitendra","last_name":"Solanki","full_name":"Solanki, Jitendra"},{"full_name":"Fröhleke, Norbert","last_name":"Fröhleke","first_name":"Norbert"},{"full_name":"Böcker, Joachim","first_name":"Joachim","last_name":"Böcker","orcid":"0000-0002-8480-7295","id":"66"},{"last_name":"Duppe","first_name":"Gregor","full_name":"Duppe, Gregor"},{"full_name":"Averberg, Andreas","first_name":"Andreas","last_name":"Averberg"},{"last_name":"Wallmeier","first_name":"Peter","full_name":"Wallmeier, Peter"}],"date_updated":"2022-03-28T08:38:01Z","publication_status":"published","intvolume":"        51","date_created":"2022-03-28T07:40:12Z","type":"journal_article","keyword":["Electrical and Electronic Engineering","Industrial and Manufacturing Engineering","Control and Systems Engineering"],"department":[{"_id":"52"}],"publication":"IEEE Transactions on Industry Applications","issue":"5"},{"date_created":"2023-01-24T11:23:57Z","department":[{"_id":"59"}],"keyword":["Electrical and Electronic Engineering","Computer Networks and Communications","Hardware and Architecture","Signal Processing","Control and Systems Engineering"],"type":"journal_article","publication":"Electronics","issue":"3","language":[{"iso":"eng"}],"doi":"10.3390/electronics4030480","author":[{"first_name":"Fábio","last_name":"Vidor","full_name":"Vidor, Fábio"},{"first_name":"Thorsten","last_name":"Meyers","full_name":"Meyers, Thorsten"},{"id":"20179","first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"}],"publication_identifier":{"issn":["2079-9292"]},"title":"Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors","year":"2015","intvolume":"         4","publication_status":"published","date_updated":"2023-03-21T10:16:23Z","citation":{"mla":"Vidor, Fábio, et al. “Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors.” <i>Electronics</i>, vol. 4, no. 3, MDPI AG, 2015, pp. 480–506, doi:<a href=\"https://doi.org/10.3390/electronics4030480\">10.3390/electronics4030480</a>.","ama":"Vidor F, Meyers T, Hilleringmann U. Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors. <i>Electronics</i>. 2015;4(3):480-506. doi:<a href=\"https://doi.org/10.3390/electronics4030480\">10.3390/electronics4030480</a>","bibtex":"@article{Vidor_Meyers_Hilleringmann_2015, title={Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors}, volume={4}, DOI={<a href=\"https://doi.org/10.3390/electronics4030480\">10.3390/electronics4030480</a>}, number={3}, journal={Electronics}, publisher={MDPI AG}, author={Vidor, Fábio and Meyers, Thorsten and Hilleringmann, Ulrich}, year={2015}, pages={480–506} }","apa":"Vidor, F., Meyers, T., &#38; Hilleringmann, U. (2015). Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors. <i>Electronics</i>, <i>4</i>(3), 480–506. <a href=\"https://doi.org/10.3390/electronics4030480\">https://doi.org/10.3390/electronics4030480</a>","ieee":"F. Vidor, T. Meyers, and U. Hilleringmann, “Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors,” <i>Electronics</i>, vol. 4, no. 3, pp. 480–506, 2015, doi: <a href=\"https://doi.org/10.3390/electronics4030480\">10.3390/electronics4030480</a>.","chicago":"Vidor, Fábio, Thorsten Meyers, and Ulrich Hilleringmann. “Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors.” <i>Electronics</i> 4, no. 3 (2015): 480–506. <a href=\"https://doi.org/10.3390/electronics4030480\">https://doi.org/10.3390/electronics4030480</a>.","short":"F. Vidor, T. Meyers, U. Hilleringmann, Electronics 4 (2015) 480–506."},"_id":"39479","publisher":"MDPI AG","page":"480-506","volume":4,"user_id":"20179","status":"public"},{"citation":{"ieee":"S. Mathapati and J. Böcker, “Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM,” <i>IEEE Transactions on Industrial Electronics</i>, vol. 60, no. 3, pp. 885–895, 2012, doi: <a href=\"https://doi.org/10.1109/tie.2012.2189530\">10.1109/tie.2012.2189530</a>.","apa":"Mathapati, S., &#38; Böcker, J. (2012). Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM. <i>IEEE Transactions on Industrial Electronics</i>, <i>60</i>(3), 885–895. <a href=\"https://doi.org/10.1109/tie.2012.2189530\">https://doi.org/10.1109/tie.2012.2189530</a>","chicago":"Mathapati, Shashidhar, and Joachim Böcker. “Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM.” <i>IEEE Transactions on Industrial Electronics</i> 60, no. 3 (2012): 885–95. <a href=\"https://doi.org/10.1109/tie.2012.2189530\">https://doi.org/10.1109/tie.2012.2189530</a>.","short":"S. Mathapati, J. Böcker, IEEE Transactions on Industrial Electronics 60 (2012) 885–895.","mla":"Mathapati, Shashidhar, and Joachim Böcker. “Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM.” <i>IEEE Transactions on Industrial Electronics</i>, vol. 60, no. 3, Institute of Electrical and Electronics Engineers (IEEE), 2012, pp. 885–95, doi:<a href=\"https://doi.org/10.1109/tie.2012.2189530\">10.1109/tie.2012.2189530</a>.","bibtex":"@article{Mathapati_Böcker_2012, title={Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM}, volume={60}, DOI={<a href=\"https://doi.org/10.1109/tie.2012.2189530\">10.1109/tie.2012.2189530</a>}, number={3}, journal={IEEE Transactions on Industrial Electronics}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Mathapati, Shashidhar and Böcker, Joachim}, year={2012}, pages={885–895} }","ama":"Mathapati S, Böcker J. Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM. <i>IEEE Transactions on Industrial Electronics</i>. 2012;60(3):885-895. doi:<a href=\"https://doi.org/10.1109/tie.2012.2189530\">10.1109/tie.2012.2189530</a>"},"status":"public","page":"885-895","_id":"30554","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","user_id":"71353","volume":60,"publication":"IEEE Transactions on Industrial Electronics","issue":"3","date_created":"2022-03-28T06:45:11Z","type":"journal_article","keyword":["Electrical and Electronic Engineering","Control and Systems Engineering"],"department":[{"_id":"52"}],"title":"Analytical and Offline Approach to Select Optimal Hysteresis Bands of DTC for PMSM","year":"2012","publication_identifier":{"issn":["0278-0046","1557-9948"]},"author":[{"first_name":"Shashidhar","last_name":"Mathapati","full_name":"Mathapati, Shashidhar"},{"last_name":"Böcker","first_name":"Joachim","orcid":"0000-0002-8480-7295","full_name":"Böcker, Joachim","id":"66"}],"date_updated":"2022-03-28T06:45:17Z","publication_status":"published","intvolume":"        60","language":[{"iso":"eng"}],"doi":"10.1109/tie.2012.2189530"},{"citation":{"chicago":"Grotstollen, Horst. “Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product.” <i>IEEE Transactions on Industry Applications</i> 47, no. 1 (2010): 144–52. <a href=\"https://doi.org/10.1109/tia.2010.2091479\">https://doi.org/10.1109/tia.2010.2091479</a>.","short":"H. Grotstollen, IEEE Transactions on Industry Applications 47 (2010) 144–152.","apa":"Grotstollen, H. (2010). Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product. <i>IEEE Transactions on Industry Applications</i>, <i>47</i>(1), 144–152. <a href=\"https://doi.org/10.1109/tia.2010.2091479\">https://doi.org/10.1109/tia.2010.2091479</a>","ieee":"H. Grotstollen, “Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product,” <i>IEEE Transactions on Industry Applications</i>, vol. 47, no. 1, pp. 144–152, 2010, doi: <a href=\"https://doi.org/10.1109/tia.2010.2091479\">10.1109/tia.2010.2091479</a>.","ama":"Grotstollen H. Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product. <i>IEEE Transactions on Industry Applications</i>. 2010;47(1):144-152. doi:<a href=\"https://doi.org/10.1109/tia.2010.2091479\">10.1109/tia.2010.2091479</a>","bibtex":"@article{Grotstollen_2010, title={Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product}, volume={47}, DOI={<a href=\"https://doi.org/10.1109/tia.2010.2091479\">10.1109/tia.2010.2091479</a>}, number={1}, journal={IEEE Transactions on Industry Applications}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Grotstollen, Horst}, year={2010}, pages={144–152} }","mla":"Grotstollen, Horst. “Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product.” <i>IEEE Transactions on Industry Applications</i>, vol. 47, no. 1, Institute of Electrical and Electronics Engineers (IEEE), 2010, pp. 144–52, doi:<a href=\"https://doi.org/10.1109/tia.2010.2091479\">10.1109/tia.2010.2091479</a>."},"page":"144-152","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","_id":"30536","user_id":"71353","volume":47,"status":"public","date_created":"2022-03-25T12:13:08Z","keyword":["Electrical and Electronic Engineering","Industrial and Manufacturing Engineering","Control and Systems Engineering"],"type":"journal_article","department":[{"_id":"52"}],"publication":"IEEE Transactions on Industry Applications","issue":"1","language":[{"iso":"eng"}],"doi":"10.1109/tia.2010.2091479","title":"Optimal Design of Motor and Gear for Drives With High Acceleration by Consideration of Torque–Speed and Torque–Acceleration Product","year":"2010","publication_identifier":{"issn":["0093-9994"]},"author":[{"first_name":"Horst","last_name":"Grotstollen","full_name":"Grotstollen, Horst"}],"publication_status":"published","date_updated":"2022-03-25T12:13:12Z","intvolume":"        47"},{"issue":"10","publication":"at - Automatisierungstechnik","date_created":"2023-04-14T07:27:54Z","type":"journal_article","keyword":["Electrical and Electronic Engineering","Computer Science Applications","Control and Systems Engineering"],"department":[{"_id":"52"}],"title":"Elektromobilität — ein aktuelles Forschungsfeld insbesondere der Regelungstechnik","year":"2010","author":[{"first_name":"Claus","last_name":"Kröger","full_name":"Kröger, Claus"},{"id":"66","full_name":"Böcker, Joachim","last_name":"Böcker","first_name":"Joachim","orcid":"0000-0002-8480-7295"},{"first_name":"Konstantin","last_name":"Neiß","full_name":"Neiß, Konstantin"}],"publication_identifier":{"issn":["0178-2312"]},"publication_status":"published","date_updated":"2023-04-14T07:33:35Z","intvolume":"        58","language":[{"iso":"ger"}],"doi":"10.1524/auto.2010.9082","citation":{"short":"C. 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