---
_id: '10334'
abstract:
- lang: eng
  text: Ultrasonic joining is a common industrial process. In the electronics industry
    it is used to form electrical connections, including those of dissimilar materials.
    Multiple influencing factors in ultrasonic joining are known and extensively investigated;
    process parameters like ultrasonic power, bond force, and bonding frequency of
    the ultrasonic vibration are known to have a high impact on a reliable joining
    process and need to be adapted for each new application with different geometry
    or materials. This contribution is focused on increasing ultrasonic power transmitted
    to the interface and keeping mechanical stresses during ultrasonic bonding low
    by using a multi-dimensional ultrasonic transducer concept. Bonding results for
    a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
    bonding are discussed.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
    multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors
    and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>'
  apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro,
    W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
    bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662.
    <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>'
  bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
    complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
    volume={295}, DOI={<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>},
    journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
    Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
    Walter}, year={2019}, pages={653–662} }'
  chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
    Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295
    (2019): 653–62. <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>.'
  ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
    “Using complex multi-dimensional vibration trajectories in ultrasonic bonding
    and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662,
    2019, doi: <a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>,
    vol. 295, 2019, pp. 653–62, doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
    Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: '       295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
  issn:
  - 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
  and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...