---
_id: '10334'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. In the electronics industry
it is used to form electrical connections, including those of dissimilar materials.
Multiple influencing factors in ultrasonic joining are known and extensively investigated;
process parameters like ultrasonic power, bond force, and bonding frequency of
the ultrasonic vibration are known to have a high impact on a reliable joining
process and need to be adapted for each new application with different geometry
or materials. This contribution is focused on increasing ultrasonic power transmitted
to the interface and keeping mechanical stresses during ultrasonic bonding low
by using a multi-dimensional ultrasonic transducer concept. Bonding results for
a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
bonding are discussed.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors
and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025'
apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro,
W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.
https://doi.org/10.1016/j.sna.2019.04.025'
bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
volume={295}, DOI={10.1016/j.sna.2019.04.025},
journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
Walter}, year={2019}, pages={653–662} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295
(2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.'
ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
“Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662,
2019, doi: 10.1016/j.sna.2019.04.025.'
mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical,
vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.'
short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: ' 295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...