---
_id: '9994'
abstract:
- lang: eng
  text: Reliability-adaptive systems allow an adaptation of system behavior based
    on current system reliability. They can extend their lifetime at the cost of lowered
    performance or vice versa. This can be used to adapt failure behavior according
    to a maintenance plan, thus increasing availability while using up system capability
    fully. To facilitate setup, a control algorithm independent of a degradation model
    is desired. A closed loop control technique for reliability based on a health
    index, a measure for system degradation, is introduced. It uses self-optimization
    as means to implement behavior adaptation. This is based on selecting the priorities
    of objectives that the system pursues. Possible working points are computed beforehand
    using model-based multiobjective optimization techniques. The controller selects
    the priorities of objectives and this way balances reliability and performance.
    As exemplary application, an automatically actuated single plate dry clutch is
    introduced. The entire reliability control is setup and lifetime experiments are
    conducted. Results show that the variance of time to failure is reduced greatly,
    making the failure behavior more predictable. At the same time, the desired usable
    lifetime can be extended at the cost of system performance to allow for changed
    maintenance intervals. Together, these possibilities allow for greater system
    usage and better planning of maintenance.
author:
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
citation:
  ama: Meyer T. <i>Optimization-Based Reliability Control of Mechatronic Systems</i>.
    Shaker; 2018.
  apa: Meyer, T. (2018). <i>Optimization-based reliability control of mechatronic
    systems</i>. Shaker.
  bibtex: '@book{Meyer_2018, title={Optimization-based reliability control of mechatronic
    systems}, publisher={Shaker}, author={Meyer, Tobias}, year={2018} }'
  chicago: Meyer, Tobias. <i>Optimization-Based Reliability Control of Mechatronic
    Systems</i>. Shaker, 2018.
  ieee: T. Meyer, <i>Optimization-based reliability control of mechatronic systems</i>.
    Shaker, 2018.
  mla: Meyer, Tobias. <i>Optimization-Based Reliability Control of Mechatronic Systems</i>.
    Shaker, 2018.
  short: T. Meyer, Optimization-Based Reliability Control of Mechatronic Systems,
    Shaker, 2018.
date_created: 2019-05-27T10:21:17Z
date_updated: 2023-09-15T12:26:09Z
department:
- _id: '151'
keyword:
- dependability
- reliability
- behavior adaptation
- self-optimization
- multiobjective optimization
- optimal control
- automotive drivetrain
- clutch system
- reliability-adaptive system
language:
- iso: eng
publisher: Shaker
status: public
title: Optimization-based reliability control of mechatronic systems
type: dissertation
user_id: '210'
year: '2018'
...
---
_id: '9966'
abstract:
- lang: eng
  text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
    wire bonds. Copper allows higher electrical, thermal and mechanical loads than
    aluminum, which currently is the most commonly used material in heavy wire bonding.
    This is the main driving factor for increased usage of copper in high power applications
    such as wind turbines, locomotives or electric vehicles. At the same time, usage
    of copper also increases tool wear and reduces the range of parameter values for
    a stable process, making the process more challenging. To overcome these drawbacks,
    parameter adaptation at runtime using self-optimization is desired. A self-optimizing
    system is based on system objectives that evaluate and quantify system performance.
    System parameters can be changed at runtime such that pre-selected objective values
    are reached. For adaptation of bond process parameters, model-based self-optimization
    is employed. Since it is based on a model of the system, the bond process was
    modeled. In addition to static model parameters such as wire and substrate material
    properties and vibration characteristics of transducer and tool, variable model
    inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
    contact. This model is then used to find valid and optimal working points before
    operation. The working point is composed of normal force and ultrasonic voltage
    trajectories, which are usually determined experimentally. Instead, multiobjective
    optimalization is used to compute trajectories that simultaneously optimize bond
    quality, process duration, tool wear and probability of tool-substrate contacts.
    The values of these objectives are computed using the process model. At runtime,
    selection among pre-determined optimal working points is sufficient to prioritize
    individual objectives. This way, the computationally expensive process of numerically
    solving a multiobjective optimal control problem and the demanding high speed
    bonding process are separated. To evaluate to what extent the pre-defined goals
    of self-optimization are met, an offthe- shelf heavy wire bonding machine was
    modified to allow for parameter adaptation and for transmitting of measurement
    data at runtime. This data is received by an external computer system and evaluated
    to select a new working point. Then, new process parameters are sent to the modified
    bonding machine for use for subsequent bonds. With these components, a full self-optimizing
    system has been implemented.
author:
- first_name: Tobias
  full_name: Meyer , Tobias
  last_name: 'Meyer '
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Karsten
  full_name: Guth, Karsten
  last_name: Guth
citation:
  ama: 'Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
    Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components
    and Technology Conference</i>. ; 2016:622-628. doi:<a href="https://doi.org/10.1109/ECTC.2016.215">10.1109/ECTC.2016.215</a>'
  apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
    &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
    Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology
    Conference</i> (pp. 622–628). <a href="https://doi.org/10.1109/ECTC.2016.215">https://doi.org/10.1109/ECTC.2016.215</a>
  bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
    title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
    Adaptation}, DOI={<a href="https://doi.org/10.1109/ECTC.2016.215">10.1109/ECTC.2016.215</a>},
    booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
    , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
    Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
    }'
  chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
    Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
    Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components
    and Technology Conference</i>, 622–28, 2016. <a href="https://doi.org/10.1109/ECTC.2016.215">https://doi.org/10.1109/ECTC.2016.215</a>.
  ieee: T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds
    Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and
    Technology Conference</i>, 2016, pp. 622–628.
  mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
    Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology
    Conference</i>, 2016, pp. 622–28, doi:<a href="https://doi.org/10.1109/ECTC.2016.215">10.1109/ECTC.2016.215</a>.
  short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
    Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
    622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...