---
_id: '9992'
abstract:
- lang: eng
  text: State-of-the-art industrial compact high power electronic packages require
    copper-copper interconnections with larger cross sections made by ultrasonic bonding.
    In comparison to aluminium-copper, copper-copper interconnections require increased
    normal forces and ultrasonic power, which might lead to substrate damage due to
    increased mechanical stresses. One option to raise friction energy without increasing
    vibration amplitude between wire and substrate or bonding force is the use of
    two-dimensional vibration. The first part of this contribution reports on the
    development of a novel bonding system that executes two-dimensional vibrations
    of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
    bonds only form properly when surfaces are clean, oxide free and activated, the
    geometries of tool-tip and pin were optimised using finite element analysis. To
    maximize the area of the bonded annulus the distribution of normal pressure was
    optimized by varying the convexity of the bottom side of the pin. Second, a statistical
    model obtained from an experimental parameter study shows the influence of different
    bonding parameters on the bond result. To find bonding parameters with the minimum
    number of tests, the experiments have been planned using a D-optimal experimental
    design approach.
author:
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
    of weld formation in a novel two-dimensional copper-copper bonding process. In:
    <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
    Germany)</i>. ; 2018:1-6.'
  apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
    M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation
    in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of
    7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>
    (pp. 1–6).
  bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
    title={Numerical and statistical investigation of weld formation in a novel two-dimensional
    copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
    Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
    Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
    Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
  chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
    Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
    of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
    <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
    Germany)</i>, 1–6, 2018.
  ieee: C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation
    in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings
    of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>,
    2018, pp. 1–6.
  mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
    in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of
    7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>,
    2018, pp. 1–6.
  short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
    W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
    Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
  Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
  copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...