[{"language":[{"iso":"eng"}],"keyword":["heavy copper bonding","wire bonding","quality prediction","friction model","point-contact-element"],"abstract":[{"lang":"ger","text":"Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden."}],"date_created":"2023-02-10T13:05:19Z","publisher":"Shaker","title":"Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach","year":"2023","series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","user_id":"55222","department":[{"_id":"151"}],"_id":"41971","extern":"1","type":"dissertation","status":"public","supervisor":[{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"author":[{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"}],"volume":15,"date_updated":"2023-02-10T13:05:42Z","main_file_link":[{"url":"https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff"}],"related_material":{"link":[{"url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes","relation":"confirmation"}]},"publication_status":"published","publication_identifier":{"isbn":["978-3-8440-8903-5"]},"citation":{"apa":"Althoff, S. (2023). <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</i> (Vol. 15). Shaker.","bibtex":"@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","mla":"Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Shaker, 2023.","short":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.","ama":"Althoff S. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Vol 15. Shaker; 2023.","ieee":"S. Althoff, <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</i>, vol. 15. Shaker, 2023.","chicago":"Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023."},"page":"192","intvolume":"        15"},{"main_file_link":[{"url":"https://www.sciencedirect.com/science/article/abs/pii/S1526612523002682?via%3Dihub"}],"doi":"/10.1016/j.jmapro.2023.03.056","title":"Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties","date_created":"2023-04-03T08:46:43Z","author":[{"first_name":"Dietrich","last_name":"Voswinkel","full_name":"Voswinkel, Dietrich","id":"52634"}],"volume":94,"date_updated":"2023-04-03T08:47:06Z","publisher":"Elsevier","citation":{"apa":"Voswinkel, D. (2023). Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. <i>Journal of Manufacturing Processes</i>, <i>94</i>, 10–19. <a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">https://doi.org//10.1016/j.jmapro.2023.03.056</a>","bibtex":"@article{Voswinkel_2023, title={Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties}, volume={94}, DOI={<a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>}, journal={Journal of Manufacturing Processes}, publisher={Elsevier}, author={Voswinkel, Dietrich}, year={2023}, pages={10–19} }","mla":"Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” <i>Journal of Manufacturing Processes</i>, vol. 94, Elsevier, 2023, pp. 10–19, doi:<a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>.","short":"D. Voswinkel, Journal of Manufacturing Processes 94 (2023) 10–19.","ama":"Voswinkel D. Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. <i>Journal of Manufacturing Processes</i>. 2023;94:10-19. doi:<a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>","chicago":"Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” <i>Journal of Manufacturing Processes</i> 94 (2023): 10–19. <a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">https://doi.org//10.1016/j.jmapro.2023.03.056</a>.","ieee":"D. Voswinkel, “Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties,” <i>Journal of Manufacturing Processes</i>, vol. 94, pp. 10–19, 2023, doi: <a href=\"https://doi.org//10.1016/j.jmapro.2023.03.056\">/10.1016/j.jmapro.2023.03.056</a>."},"intvolume":"        94","page":"10-19","year":"2023","language":[{"iso":"eng"}],"keyword":["Laser treatment Adhesive bonding Surface technology Hybrid materials"],"user_id":"52634","department":[{"_id":"9"},{"_id":"321"},{"_id":"158"}],"_id":"43371","status":"public","abstract":[{"text":"Laser structuring to improve the adhesion properties of steel substrates in fiber-metal laminates offers many advantages that are highly suitable for modern industrial requirements. Maintenance and energy costs are relatively low, it is easy to automate, and there are no by-products such as chemicals or abrasives to dispose of or recycle. This makes laser structuring a particularly environmentally friendly process, which is nowadays more important than ever. On the other hand, the process time for laser structuring is much higher than for chemical pre-treatment, for example. In past studies, the time and cost efficiency of the laser structuring process has tended to play a minor role. However, there are approaches in which laser structured surfaces are adapted to the shear stress peaks occurring within the adhesive layer, thus requiring only partial structuring of the area to be bonded, potentially saving process time. In this experimental study, electrolytically galvanized steel substrates were partially laser structured to match the shear stress distribution and then bonded to a carbon fiber-reinforced plastic. The adhesion properties achieved were characterized using shear tensile tests and compared with the properties of the fully structured ones. With the partial laser structuring, a saving of 66 % of the conventional process time was achieved while maintaining 95 % of the same shear strength.","lang":"eng"}],"type":"journal_article","publication":"Journal of Manufacturing Processes"},{"status":"public","type":"journal_article","article_type":"original","article_number":"2100396","_id":"33988","user_id":"38770","department":[{"_id":"9"},{"_id":"367"}],"citation":{"apa":"Moritzer, E., &#38; Driediger, C. (2022). Reactive Direct Bonding of Digital Light Process Components. <i>Macromolecular Symposia</i>, <i>404</i>(1), Article 2100396. <a href=\"https://doi.org/10.1002/masy.202100396\">https://doi.org/10.1002/masy.202100396</a>","short":"E. Moritzer, C. Driediger, Macromolecular Symposia 404 (2022).","bibtex":"@article{Moritzer_Driediger_2022, title={Reactive Direct Bonding of Digital Light Process Components}, volume={404}, DOI={<a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>}, number={12100396}, journal={Macromolecular Symposia}, publisher={Wiley}, author={Moritzer, Elmar and Driediger, Christine}, year={2022} }","mla":"Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” <i>Macromolecular Symposia</i>, vol. 404, no. 1, 2100396, Wiley, 2022, doi:<a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>.","chicago":"Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” <i>Macromolecular Symposia</i> 404, no. 1 (2022). <a href=\"https://doi.org/10.1002/masy.202100396\">https://doi.org/10.1002/masy.202100396</a>.","ieee":"E. Moritzer and C. Driediger, “Reactive Direct Bonding of Digital Light Process Components,” <i>Macromolecular Symposia</i>, vol. 404, no. 1, Art. no. 2100396, 2022, doi: <a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>.","ama":"Moritzer E, Driediger C. Reactive Direct Bonding of Digital Light Process Components. <i>Macromolecular Symposia</i>. 2022;404(1). doi:<a href=\"https://doi.org/10.1002/masy.202100396\">10.1002/masy.202100396</a>"},"intvolume":"       404","publication_status":"published","publication_identifier":{"issn":["1022-1360","1521-3900"]},"has_accepted_license":"1","doi":"10.1002/masy.202100396","date_updated":"2022-11-03T13:32:18Z","author":[{"first_name":"Elmar","full_name":"Moritzer, Elmar","last_name":"Moritzer"},{"first_name":"Christine","last_name":"Driediger","full_name":"Driediger, Christine"}],"volume":404,"publication":"Macromolecular Symposia","keyword":["digital light processing","material combination","reactive direct bonding","vat photopolymerization"],"language":[{"iso":"eng"}],"year":"2022","quality_controlled":"1","issue":"1","title":"Reactive Direct Bonding of Digital Light Process Components","publisher":"Wiley","date_created":"2022-11-03T13:21:13Z"},{"date_created":"2022-02-09T12:50:25Z","author":[{"last_name":"Hesse","id":"29222","full_name":"Hesse, Michael","first_name":"Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"last_name":"Timmermann","full_name":"Timmermann, Julia","id":"15402","first_name":"Julia"},{"last_name":"Trächtler","id":"552","full_name":"Trächtler, Ansgar","first_name":"Ansgar"}],"date_updated":"2024-11-13T08:44:17Z","conference":{"name":"11th International Conference on Pattern Recognition Applications and Methods","start_date":"2022-02-03","end_date":"2022-02-05","location":"Online"},"title":"Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design","quality_controlled":"1","publication_identifier":{"isbn":["978-989-758-549-4"]},"citation":{"chicago":"Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” In <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 383–94, 2022.","ieee":"M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,” in <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, Online, 2022, pp. 383–394.","ama":"Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>. ; 2022:383-394.","mla":"Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 2022, pp. 383–94.","bibtex":"@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design}, booktitle={Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }","short":"M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.","apa":"Hesse, M., Hunstig, M., Timmermann, J., &#38; Trächtler, A. (2022). Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 383–394."},"page":"383-394","year":"2022","user_id":"82875","department":[{"_id":"153"},{"_id":"880"}],"_id":"29803","language":[{"iso":"eng"}],"keyword":["Bayesian optimization","Wire bonding","Feed-forward control","model-free design"],"type":"conference","publication":"Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)","status":"public","abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process used to form electrical interconnections in micro and\r\npower electronics and batteries. A high frequency oscillation causes a metallurgical bond deformation in\r\nthe contact area. Due to the numerous physical influencing factors, it is very difficult to accurately capture\r\nthis process in a model. Therefore, our goal is to determine a suitable feed-forward control strategy for the\r\nbonding process even without detailed model knowledge. We propose the use of batch constrained Bayesian\r\noptimization for the control design. Hence, Bayesian optimization is precisely adapted to the application of\r\nbonding: the constraint is used to check one quality feature of the process and the use of batches leads to\r\nmore efficient experiments. Our approach is suitable to determine a feed-forward control for the bonding\r\nprocess that provides very high quality bonds without using a physical model. We also show that the quality\r\nof the Bayesian optimization based control outperforms random search as well as manual search by a user.\r\nUsing a simple prior knowledge model derived from data further improves the quality of the connection.\r\nThe Bayesian optimization approach offers the possibility to perform a sensitivity analysis of the control\r\nparameters, which allows to evaluate the influence of each control parameter on the bond quality. In summary,\r\nBayesian optimization applied to the bonding process provides an excellent opportunity to develop a feedforward\r\ncontrol without full modeling of the underlying physical processes.","lang":"eng"}]},{"type":"journal_article","publication":"Microelectronics Reliability","abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.","lang":"eng"}],"status":"public","_id":"21436","user_id":"210","department":[{"_id":"151"}],"keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"language":[{"iso":"eng"}],"publication_status":"published","quality_controlled":"1","publication_identifier":{"issn":["0026-2714"]},"year":"2021","citation":{"apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>, <i>119</i>, 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol. 119, 2021, p. 114077, doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>. 2021;119:114077. doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>."},"page":"114077","intvolume":"       119","date_updated":"2023-09-21T14:15:33Z","author":[{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Krieger, Viktor","last_name":"Krieger","first_name":"Viktor"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2021-03-10T09:37:02Z","volume":119,"title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","doi":"https://doi.org/10.1016/j.microrel.2021.114077"},{"keyword":["Leichtbau","Faserverbundkunststoffe","Nasspressverfahren","Hybridbauteile","Rheologie","Klebtechnik","Co-Bonding"],"language":[{"iso":"ger"}],"_id":"41958","department":[{"_id":"9"},{"_id":"149"},{"_id":"321"}],"series_title":"Schriftenreihe Institut für Leichtbau mit Hybridsystemen","user_id":"15952","abstract":[{"text":"Das Nasspressverfahren ist ein Serienherstellungsprozess für Bauteile aus duroplastischen Faserverbundkunststoffen (FVK) mit einer geringen Geometriekomplexität. Im Rahmen dieser Arbeit wurde ein modifiziertes Nasspressverfahren untersucht, welches die Herstellung von hybriden Blech-FVK-Strukturen ermöglicht. Die stoffschlüssige Verbindung zwischen dem metallischen Trägerbauteil und einem lokalen FVK-Verstärkungselement wird durch Co-Bonding im Nasspresswerkzeug aufgebaut. Epoxidbasierte Matrixharze und Klebstoffe wurden mit Methoden der Klebtechnik sowie thermischen und rheometrischen Prüfungen charakterisiert, um ein materialspezifisches Fertigungsprozessfenster einzugrenzen. Experimentelle Untersuchungen zum Nasspressen von GFK-Laminaten und Stahl-GFK-Hybridstrukturen fokussierten die Mikrostruktur und das strukturelle Verhalten von stoffschlüssigen Hybridverbindungen. Unter anderem wurden Einflüsse von zeit-, temperatur- und druckabhängigen Fertigungsparametern sowie der Einsatz von Strukturklebstofffilmen und internen Trennmitteln analysiert. Anhand von Fallturmtests an hybriden Demonstratorkomponenten konnte das modifizierte Nasspressverfahren für die Herstellung crashrelevanter Karosseriebauteile qualifiziert werden.","lang":"ger"}],"status":"public","type":"dissertation","title":"Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen","date_updated":"2023-02-10T11:24:47Z","publisher":"Shaker Verlag","volume":"2019,35","author":[{"full_name":"Opdemom, Hermann","last_name":"Opdemom","first_name":"Hermann"}],"date_created":"2023-02-10T11:24:40Z","supervisor":[{"id":"553","full_name":"Tröster, Thomas","last_name":"Tröster","first_name":"Thomas"}],"year":"2019","page":"178","citation":{"apa":"Opdemom, H. (2019). <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen: Vol. 2019,35</i>. Shaker Verlag.","short":"H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, Shaker Verlag, 2019.","bibtex":"@book{Opdemom_2019, series={Schriftenreihe Institut für Leichtbau mit Hybridsystemen}, title={Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen}, volume={2019,35}, publisher={Shaker Verlag}, author={Opdemom, Hermann}, year={2019}, collection={Schriftenreihe Institut für Leichtbau mit Hybridsystemen} }","mla":"Opdemom, Hermann. <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>. Shaker Verlag, 2019.","ieee":"H. Opdemom, <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>, vol. 2019,35. Shaker Verlag, 2019.","chicago":"Opdemom, Hermann. <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>. Vol. 2019,35. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker Verlag, 2019.","ama":"Opdemom H. <i>Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen</i>. Vol 2019,35. Shaker Verlag; 2019."},"publication_identifier":{"isbn":["978-3-8440-6428-5"]},"publication_status":"published"},{"language":[{"iso":"eng"}],"keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"],"user_id":"210","department":[{"_id":"151"}],"project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"_id":"10334","status":"public","abstract":[{"text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.","lang":"eng"}],"type":"journal_article","publication":"Sensors and Actuators A: Physical","doi":"10.1016/j.sna.2019.04.025","title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding","date_created":"2019-07-01T07:32:07Z","author":[{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"first_name":"Collin","last_name":"Dymel","full_name":"Dymel, Collin","id":"66833"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"volume":295,"date_updated":"2023-09-21T14:12:15Z","citation":{"apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>","short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>, vol. 295, 2019, pp. 653–62, doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>","chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295 (2019): 653–62. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>.","ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662, 2019, doi: <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>."},"intvolume":"       295","page":"653 - 662","year":"2019","quality_controlled":"1","publication_identifier":{"issn":["0924-4247"]}},{"year":"2018","page":"1-6","citation":{"apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6).","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6.","ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018."},"quality_controlled":"1","title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","date_updated":"2020-05-07T05:33:56Z","author":[{"id":"66833","full_name":"Dymel, Collin","last_name":"Dymel","first_name":"Collin"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"date_created":"2019-05-27T10:18:10Z","abstract":[{"lang":"eng","text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach."}],"status":"public","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","type":"conference","keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"language":[{"iso":"eng"}],"_id":"9992","project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"department":[{"_id":"151"}],"user_id":"210"},{"abstract":[{"text":"Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories.","lang":"eng"}],"status":"public","type":"conference","publication":"(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)","keyword":["ultrasonic two-dimensional bonding","electrical interconnection","process parameters"],"language":[{"iso":"eng"}],"project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"_id":"9993","user_id":"210","department":[{"_id":"151"}],"year":"2018","citation":{"ama":"Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.","ieee":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","chicago":"Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44, 2018.","short":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","bibtex":"@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }","mla":"Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","apa":"Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44)."},"page":"41-44","quality_controlled":"1","title":"Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding","date_updated":"2020-05-07T05:33:56Z","author":[{"full_name":"Dymel, Collin","id":"66833","last_name":"Dymel","first_name":"Collin"},{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"}],"date_created":"2019-05-27T10:19:18Z"},{"department":[{"_id":"151"}],"user_id":"210","_id":"9999","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"language":[{"iso":"eng"}],"keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives."}],"volume":"Vol. 2018, No. 1, pp. 000572-000577.","author":[{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"date_created":"2019-05-27T10:27:45Z","date_updated":"2020-05-07T05:33:56Z","doi":"10.4071/2380-4505-2018.1.000572","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","quality_controlled":"1","citation":{"bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>"},"year":"2018"},{"citation":{"ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in <i>43. Deutsche Jahrestagung für Akustik</i>, 2017, pp. 611–614.","chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In <i>43. Deutsche Jahrestagung Für Akustik</i>, 611–14. Kiel 2017, 2017.","ama":"Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: <i>43. Deutsche Jahrestagung Für Akustik</i>. Kiel 2017; 2017:611-614.","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }","mla":"Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” <i>43. Deutsche Jahrestagung Für Akustik</i>, 2017, pp. 611–14.","apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In <i>43. Deutsche Jahrestagung für Akustik</i> (pp. 611–614). Kiel 2017."},"page":"611-614","year":"2017","place":"Kiel 2017","author":[{"first_name":"Reinhard","id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"date_created":"2019-05-27T09:48:10Z","date_updated":"2019-05-27T09:49:49Z","title":"MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall","type":"conference","publication":"43. Deutsche Jahrestagung für Akustik","status":"public","abstract":[{"text":"ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.","lang":"ger"}],"user_id":"55222","department":[{"_id":"151"}],"_id":"9982","language":[{"iso":"eng"}],"keyword":["wire bonding","dynamic behavior","modeling"]},{"keyword":["density functional theory","bonding","crystal orbital Hamilton population","indium nanowires","phase transition"],"language":[{"iso":"eng"}],"_id":"13238","project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"department":[{"_id":"304"}],"user_id":"71692","abstract":[{"lang":"eng","text":"A numerically efficient yet highly accurate implementation of the crystal orbital Hamilton population (COHP) scheme for plane-wave calculations is presented. It is based on the projector-augmented wave (PAW) formalism in combination with norm-conserving pseudopotentials and allows to extract chemical interactions between atoms from band-structure calculations even for large and complex systems. The potential of the present COHP implementation is demonstrated by an in-depth analysis of the intensively investigated metal-insulator transition in atomic-scale indium wires self-assembled on the Si(111) surface. Thereby bond formation between In atoms of adjacent zigzag chains is found to be instrumental for the phase change. © 2017 Wiley Periodicals, Inc."}],"status":"public","publication":"Journal of Computational Chemistry","type":"journal_article","title":"Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition","doi":"10.1002/jcc.24878","date_updated":"2022-01-06T06:51:31Z","volume":38,"author":[{"first_name":"Andreas","full_name":"Lücke, Andreas","last_name":"Lücke"},{"first_name":"Uwe","full_name":"Gerstmann, Uwe","last_name":"Gerstmann"},{"first_name":"Thomas D.","last_name":"Kühne","full_name":"Kühne, Thomas D."},{"last_name":"Schmidt","full_name":"Schmidt, Wolf G.","first_name":"Wolf G."}],"date_created":"2019-09-16T12:39:15Z","year":"2017","page":"2276-2282","intvolume":"        38","citation":{"apa":"Lücke, A., Gerstmann, U., Kühne, T. D., &#38; Schmidt, W. G. (2017). Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. <i>Journal of Computational Chemistry</i>, <i>38</i>(26), 2276–2282. <a href=\"https://doi.org/10.1002/jcc.24878\">https://doi.org/10.1002/jcc.24878</a>","bibtex":"@article{Lücke_Gerstmann_Kühne_Schmidt_2017, title={Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition}, volume={38}, DOI={<a href=\"https://doi.org/10.1002/jcc.24878\">10.1002/jcc.24878</a>}, number={26}, journal={Journal of Computational Chemistry}, author={Lücke, Andreas and Gerstmann, Uwe and Kühne, Thomas D. and Schmidt, Wolf G.}, year={2017}, pages={2276–2282} }","short":"A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282.","mla":"Lücke, Andreas, et al. “Efficient PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” <i>Journal of Computational Chemistry</i>, vol. 38, no. 26, 2017, pp. 2276–82, doi:<a href=\"https://doi.org/10.1002/jcc.24878\">10.1002/jcc.24878</a>.","ama":"Lücke A, Gerstmann U, Kühne TD, Schmidt WG. Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. <i>Journal of Computational Chemistry</i>. 2017;38(26):2276-2282. doi:<a href=\"https://doi.org/10.1002/jcc.24878\">10.1002/jcc.24878</a>","ieee":"A. Lücke, U. Gerstmann, T. D. Kühne, and W. G. Schmidt, “Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition,” <i>Journal of Computational Chemistry</i>, vol. 38, no. 26, pp. 2276–2282, 2017.","chicago":"Lücke, Andreas, Uwe Gerstmann, Thomas D. Kühne, and Wolf G. Schmidt. “Efficient PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” <i>Journal of Computational Chemistry</i> 38, no. 26 (2017): 2276–82. <a href=\"https://doi.org/10.1002/jcc.24878\">https://doi.org/10.1002/jcc.24878</a>."},"publication_status":"published","issue":"26"},{"quality_controlled":"1","page":"2103-2110","citation":{"bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }","mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>.","short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>","chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110.","ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>"},"year":"2016","author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"}],"date_created":"2019-05-27T08:47:52Z","date_updated":"2020-05-07T05:33:52Z","doi":"10.1109/ECTC.2016.234","title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","publication":"IEEE 66th Electronic Components and Technology Conference","type":"conference","status":"public","abstract":[{"text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.","lang":"eng"}],"department":[{"_id":"151"}],"user_id":"210","_id":"9955","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"language":[{"iso":"eng"}],"keyword":["finite element simulation","wire bonding","tool geometry"]},{"quality_controlled":"1","page":"2111-2118","citation":{"short":"F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.","bibtex":"@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }","mla":"Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–18, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>.","apa":"Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2111–2118). <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>","ama":"Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2111-2118. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>","chicago":"Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2111–18, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>.","ieee":"F. Eacock <i>et al.</i>, “Effect of different oxide layers on the ultrasonic copper wire bond process,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–2118."},"year":"2016","date_created":"2019-05-27T09:00:50Z","author":[{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Olexandr","last_name":"Grydin","full_name":"Grydin, Olexandr"},{"last_name":"Hengsbach","full_name":"Hengsbach, Florian","first_name":"Florian"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"last_name":"Schaper","full_name":"Schaper, Mirko","first_name":"Mirko"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"date_updated":"2019-09-16T10:38:59Z","doi":"10.1109/ECTC.2016.91","title":"Effect of different oxide layers on the ultrasonic copper wire bond process","publication":"IEEE 66th Electronic Components and Technology Conference","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties."}],"department":[{"_id":"151"}],"user_id":"55222","_id":"9959","language":[{"iso":"eng"}],"keyword":["Ultrasonic copper wire bonding","Al-oxide","Cuoxide","oxide-free","roughness","morphology"]},{"date_created":"2019-05-27T09:20:10Z","author":[{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"date_updated":"2020-05-07T05:33:53Z","title":"Validated Simulation of the Ultrasonic Wire Bonding Process","quality_controlled":"1","citation":{"ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan."},"page":"251-254","place":"IEEE CPMT Symposium Japan","year":"2016","user_id":"210","department":[{"_id":"151"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"_id":"9968","language":[{"iso":"eng"}],"keyword":["the Ultrasonic Wire Bonding Process"],"type":"conference","publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","status":"public","abstract":[{"lang":"eng","text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage."}]},{"title":"Improving the bond quality of copper wire bonds using a friction model approach","doi":"10.1109/ECTC.2014.6897500","date_updated":"2019-09-16T10:57:58Z","date_created":"2019-05-20T12:11:44Z","author":[{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"first_name":"Jan","full_name":"Neuhaus, Jan","last_name":"Neuhaus"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"year":"2014","page":"1549-1555","citation":{"bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555."},"quality_controlled":"1","keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"language":[{"iso":"eng"}],"_id":"9868","department":[{"_id":"151"}],"user_id":"55222","abstract":[{"lang":"eng","text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool."}],"status":"public","publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","type":"conference"},{"doi":"10.4071/isom-THP32","title":"Microstructural investigations of aluminum and copper wire bonds","author":[{"first_name":"Florian","full_name":"Eacock , Florian","last_name":"Eacock "},{"full_name":"Schaper, Mirko","last_name":"Schaper","first_name":"Mirko"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"last_name":"Hengsbach","full_name":"Hengsbach, Florian","first_name":"Florian"},{"last_name":"Zinn","full_name":"Zinn, Carolin","first_name":"Carolin"},{"first_name":" Martin Joachim","full_name":"Holzweissig,  Martin Joachim","last_name":"Holzweissig"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"date_created":"2019-05-20T12:14:11Z","date_updated":"2019-09-16T10:58:50Z","citation":{"ama":"Eacock  F, Schaper M, Althoff S, et al. Microstructural investigations of aluminum and copper wire bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>. ; 2014. doi:<a href=\"https://doi.org/10.4071/isom-THP32\">10.4071/isom-THP32</a>","ieee":"F. Eacock  <i>et al.</i>, “Microstructural investigations of aluminum and copper wire bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014.","chicago":"Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn,  Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014. <a href=\"https://doi.org/10.4071/isom-THP32\">https://doi.org/10.4071/isom-THP32</a>.","apa":"Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics</i>. <a href=\"https://doi.org/10.4071/isom-THP32\">https://doi.org/10.4071/isom-THP32</a>","bibtex":"@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title={Microstructural investigations of aluminum and copper wire bonds}, DOI={<a href=\"https://doi.org/10.4071/isom-THP32\">10.4071/isom-THP32</a>}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig,  Martin Joachim and Guth, Karsten}, year={2014} }","mla":"Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, doi:<a href=\"https://doi.org/10.4071/isom-THP32\">10.4071/isom-THP32</a>.","short":"F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn,  Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014."},"year":"2014","quality_controlled":"1","language":[{"iso":"eng"}],"keyword":["Bonding","Copper","Microstructure evolution"],"department":[{"_id":"151"}],"user_id":"55222","_id":"9870","status":"public","abstract":[{"text":"Nowadays wire bonding is a widely-used technology for interconnecting chips in the packaging industry. Thereby, it is known that the bond quality massively depends upon the microstructure prevailing in the bond and consequently the materials used as well as the bonding parameters. However the actually used materials such as aluminum and gold are either characterized by comparibly poor conductivity or high costs, respectively. Due to its outstanding properties copper is a more attractive candidate. Still, a thorough investigation on the interrelationship between the material combinations, the processing parameters and the resulting microstructure for copper and aluminum wire bonding was not carried out yet. Depending on the aforementioned factors the microstructural evolution can be completely different during the bonding process. Therefore, this study focuses on the microstructural evolution of heavy copper and heavy aluminum wires bonded on copper substrates. The evolution of the wire microstructure as well as the wire-substrate-interface was investigated by scanning electron microscope in combination with electron backscatter diffraction and microhardness measurements. Various samples were extracted at different points of the bonding process, namely the as-received condition, after touchdown and after completed bonding. The results of the aluminum and copper wires were compared to each other in both longitudinal and transversal direction. It was found, that the two wire materials were completely different in the as-received condition regarding the grain size, the grain morphology, the texture and the microhardness. After touchdown the microstructure did not show significant changes in both materials, yet a strain-hardening was observed in the copper wire resulting from the touchdown force. When the bonding process was completed a different microstructure could be observed in both the wire as well as the layer for the materials investigated. Furthermore, a destinctive increase in the wire hardness could be found in case of copper, which was not observed for the aluminum wire. The ramifications between the two wire materials presented in this work will be discussed with the objective of optimizing the quality of the bonds.","lang":"eng"}],"publication":"Proceedings of the 47th International Symposium on Microelectronics","type":"conference"},{"citation":{"apa":"Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &#38; Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In <i>Proceedings of the 47th International Symposium on Microelectronics</i> (pp. 856–861). <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>","bibtex":"@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }","short":"P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.","mla":"Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–61, doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>.","ama":"Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>. ; 2014:856-861. doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>","chicago":"Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 856–61, 2014. <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>.","ieee":"P. Eichwald <i>et al.</i>, “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–861."},"page":"856-861","year":"2014","doi":"10.4071/isom-THP34","title":"Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding","author":[{"first_name":"Paul","full_name":"Eichwald, Paul","last_name":"Eichwald"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"},{"full_name":"Althof, Simon","last_name":"Althof","first_name":"Simon"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"date_created":"2019-05-20T12:18:55Z","date_updated":"2020-05-07T05:33:45Z","status":"public","abstract":[{"lang":"eng","text":"Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the fields of renewable energies. One of the main cost factors in the manufacturing process is the consumables like bonding tools. The technological transition to copper as wire material causes significant wear on the millimeter large effective contact area of the bonding tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections which can be produced by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently a better understanding of wear and recognition of wear pattern is required. Therefore, the paper presents an analyzing method of the tool topography change of a heavy wire bonding tool by using a confocal microscope. Furthermore, the paper discusses the identification of the main wear indicators by the help of the named topography change for different bond parameters, like ultrasonic power and tool geometry. Reference topography has been carried out by choosing typical parameters of the production line. To judge whether the quality requirement of the bond connections made by a single tool cannot be fulfilled shear test of the source bond have been carried out after a defined number of produced bond connections. Main steps of analysis: (I)Topography of the tool surface is sampled after a defined number of bonds by means of a confocal microscope to detect the wear progress.(II)The recorded data is filtered using Matlab. So, measurement errors can be eliminated and the topography can be overlaid more easy to identify differences between diverse tools or differences in wear stages of the same tool.(III)The subsequent discretization of the topography into sub volumes allows to (IV)describe the loss of volume depending on the position in the groove. Thereby, intermediate status of wear of one tool can be used to obtain a persistent description of the topography change over the number of produced bonds by interpolating the confocal data. Afterwards the persistent change of the groove flank has been analyzed for the named test series to identify the main wear indicators and their effect on shear forces. All worn tools show dominant areas for volume loss especially for plastic deformation and accordingly abrasion. These wear mechanism can be referred to the change of main parts of the groove geometry like the rounding of the front and back radius. The most volume loss was identified in the upper part of the tool flanks or rather at the transition from the groove flank to the front or back radius. Furthermore the observation of the center of the groove flank shows just a little change in volume. All in all, the identification of the wear indicators will be discussed with the objective of increasing the tool lifetime by optimizing the tool geometry without losses in bond quality and reliability."}],"type":"conference","publication":"Proceedings of the 47th International Symposium on Microelectronics","language":[{"iso":"eng"}],"keyword":["wedge/wedge bonding","copper wire","tool wear"],"user_id":"210","department":[{"_id":"151"}],"project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"_id":"9871"},{"language":[{"iso":"eng"}],"keyword":["pre-deformation","copper wire bonding","finite element model"],"user_id":"210","department":[{"_id":"151"}],"project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"_id":"9895","status":"public","abstract":[{"lang":"eng","text":"Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding."}],"type":"conference","publication":"Proceedings of the 47th International Symposium on Microelectronics (IMAPS)","title":"Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds","author":[{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}],"date_created":"2019-05-20T13:35:09Z","date_updated":"2020-05-07T05:33:47Z","citation":{"short":"A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }","mla":"Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.","apa":"Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38; Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.","ieee":"A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.","chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego, CA, US, 2014.","ama":"Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US; 2014:289-294."},"page":"289-294","place":"San Diego, CA, US","year":"2014"},{"citation":{"chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013.","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA; 2013. doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>","mla":"Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013."},"year":"2013","place":"Orlando (Florida), USA","doi":"10.4071/isom-2013-TA67","title":"A friction based approach for modeling wire bonding","author":[{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"first_name":"Jan","full_name":"Neuhaus, Jan","last_name":"Neuhaus"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-13T13:55:36Z","date_updated":"2022-01-06T07:04:20Z","status":"public","abstract":[{"lang":"eng","text":"A model approach for wedge/wedge bonding copper wire is presented. The connection between wire and substrate is based on a variety of physical effects, but the dominant one is the friction based welding while applying ultrasound. Consequently, a friction model was used to investigate the welding process. This model is built up universal and can be used to describe the formation of micro welds in the time variant contact area between wire and substrate. Aim of the model is to identify the interactions between touchdown, bond normal force, ultrasonic power and bonding time. To do so, the contact area is discretized into partial areas where a Point Contact Model is applied. Based on this approach it is possible to simulate micro and macro slip inside the contact area between wire and substrate. The work done by friction force is a main criterion to define occurring micro joints which influence the subsequent welding."}],"type":"conference","publication":"IMAPS 2013, 46th International Symposium on Microelectronics","language":[{"iso":"eng"}],"keyword":["Wire bonding","friction modeling","wire bond quality","contact element modeling"],"user_id":"55222","department":[{"_id":"151"}],"_id":"9797"}]