---
_id: '41971'
abstract:
- lang: ger
text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau-
und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und
damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter
auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen
verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern
in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität.
In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand
von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst
wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen
von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten
die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität.
Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich
unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden
hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen
zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu
einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte
Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren
Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers
modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle
ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten
Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker
im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert
werden."
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
citation:
ama: Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Vol 15. Shaker; 2023.
apa: Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds
using a Friction Model Approach (Vol. 15). Shaker.
bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction
Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023},
collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds
Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik
Und Mechatronik. Shaker, 2023.
ieee: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using
a Friction Model Approach, vol. 15. Shaker, 2023.
mla: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Shaker, 2023.
short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach, Shaker, 2023.
date_created: 2023-02-10T13:05:19Z
date_updated: 2023-02-10T13:05:42Z
department:
- _id: '151'
extern: '1'
intvolume: ' 15'
keyword:
- heavy copper bonding
- wire bonding
- quality prediction
- friction model
- point-contact-element
language:
- iso: eng
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff
page: '192'
publication_identifier:
isbn:
- 978-3-8440-8903-5
publication_status: published
publisher: Shaker
related_material:
link:
- relation: confirmation
url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model
Approach
type: dissertation
user_id: '55222'
volume: 15
year: '2023'
...
---
_id: '43371'
abstract:
- lang: eng
text: Laser structuring to improve the adhesion properties of steel substrates in
fiber-metal laminates offers many advantages that are highly suitable for modern
industrial requirements. Maintenance and energy costs are relatively low, it is
easy to automate, and there are no by-products such as chemicals or abrasives
to dispose of or recycle. This makes laser structuring a particularly environmentally
friendly process, which is nowadays more important than ever. On the other hand,
the process time for laser structuring is much higher than for chemical pre-treatment,
for example. In past studies, the time and cost efficiency of the laser structuring
process has tended to play a minor role. However, there are approaches in which
laser structured surfaces are adapted to the shear stress peaks occurring within
the adhesive layer, thus requiring only partial structuring of the area to be
bonded, potentially saving process time. In this experimental study, electrolytically
galvanized steel substrates were partially laser structured to match the shear
stress distribution and then bonded to a carbon fiber-reinforced plastic. The
adhesion properties achieved were characterized using shear tensile tests and
compared with the properties of the fully structured ones. With the partial laser
structuring, a saving of 66 % of the conventional process time was achieved while
maintaining 95 % of the same shear strength.
author:
- first_name: Dietrich
full_name: Voswinkel, Dietrich
id: '52634'
last_name: Voswinkel
citation:
ama: Voswinkel D. Application of a new strategy for time-efficient laser treatment
of galvanized steel substrates to improve the adhesion properties. Journal
of Manufacturing Processes. 2023;94:10-19. doi:/10.1016/j.jmapro.2023.03.056
apa: Voswinkel, D. (2023). Application of a new strategy for time-efficient laser
treatment of galvanized steel substrates to improve the adhesion properties. Journal
of Manufacturing Processes, 94, 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056
bibtex: '@article{Voswinkel_2023, title={Application of a new strategy for time-efficient
laser treatment of galvanized steel substrates to improve the adhesion properties},
volume={94}, DOI={/10.1016/j.jmapro.2023.03.056},
journal={Journal of Manufacturing Processes}, publisher={Elsevier}, author={Voswinkel,
Dietrich}, year={2023}, pages={10–19} }'
chicago: 'Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient
Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.”
Journal of Manufacturing Processes 94 (2023): 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056.'
ieee: 'D. Voswinkel, “Application of a new strategy for time-efficient laser treatment
of galvanized steel substrates to improve the adhesion properties,” Journal
of Manufacturing Processes, vol. 94, pp. 10–19, 2023, doi: /10.1016/j.jmapro.2023.03.056.'
mla: Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser
Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.”
Journal of Manufacturing Processes, vol. 94, Elsevier, 2023, pp. 10–19,
doi:/10.1016/j.jmapro.2023.03.056.
short: D. Voswinkel, Journal of Manufacturing Processes 94 (2023) 10–19.
date_created: 2023-04-03T08:46:43Z
date_updated: 2023-04-03T08:47:06Z
department:
- _id: '9'
- _id: '321'
- _id: '158'
doi: /10.1016/j.jmapro.2023.03.056
intvolume: ' 94'
keyword:
- Laser treatment Adhesive bonding Surface technology Hybrid materials
language:
- iso: eng
main_file_link:
- url: https://www.sciencedirect.com/science/article/abs/pii/S1526612523002682?via%3Dihub
page: 10-19
publication: Journal of Manufacturing Processes
publisher: Elsevier
status: public
title: Application of a new strategy for time-efficient laser treatment of galvanized
steel substrates to improve the adhesion properties
type: journal_article
user_id: '52634'
volume: 94
year: '2023'
...
---
_id: '33988'
article_number: '2100396'
article_type: original
author:
- first_name: Elmar
full_name: Moritzer, Elmar
last_name: Moritzer
- first_name: Christine
full_name: Driediger, Christine
last_name: Driediger
citation:
ama: Moritzer E, Driediger C. Reactive Direct Bonding of Digital Light Process Components.
Macromolecular Symposia. 2022;404(1). doi:10.1002/masy.202100396
apa: Moritzer, E., & Driediger, C. (2022). Reactive Direct Bonding of Digital
Light Process Components. Macromolecular Symposia, 404(1), Article
2100396. https://doi.org/10.1002/masy.202100396
bibtex: '@article{Moritzer_Driediger_2022, title={Reactive Direct Bonding of Digital
Light Process Components}, volume={404}, DOI={10.1002/masy.202100396},
number={12100396}, journal={Macromolecular Symposia}, publisher={Wiley}, author={Moritzer,
Elmar and Driediger, Christine}, year={2022} }'
chicago: Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital
Light Process Components.” Macromolecular Symposia 404, no. 1 (2022). https://doi.org/10.1002/masy.202100396.
ieee: 'E. Moritzer and C. Driediger, “Reactive Direct Bonding of Digital Light Process
Components,” Macromolecular Symposia, vol. 404, no. 1, Art. no. 2100396,
2022, doi: 10.1002/masy.202100396.'
mla: Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital
Light Process Components.” Macromolecular Symposia, vol. 404, no. 1, 2100396,
Wiley, 2022, doi:10.1002/masy.202100396.
short: E. Moritzer, C. Driediger, Macromolecular Symposia 404 (2022).
date_created: 2022-11-03T13:21:13Z
date_updated: 2022-11-03T13:32:18Z
department:
- _id: '9'
- _id: '367'
doi: 10.1002/masy.202100396
has_accepted_license: '1'
intvolume: ' 404'
issue: '1'
keyword:
- digital light processing
- material combination
- reactive direct bonding
- vat photopolymerization
language:
- iso: eng
publication: Macromolecular Symposia
publication_identifier:
issn:
- 1022-1360
- 1521-3900
publication_status: published
publisher: Wiley
quality_controlled: '1'
status: public
title: Reactive Direct Bonding of Digital Light Process Components
type: journal_article
user_id: '38770'
volume: 404
year: '2022'
...
---
_id: '29803'
abstract:
- lang: eng
text: "Ultrasonic wire bonding is a solid-state joining process used to form electrical
interconnections in micro and\r\npower electronics and batteries. A high frequency
oscillation causes a metallurgical bond deformation in\r\nthe contact area. Due
to the numerous physical influencing factors, it is very difficult to accurately
capture\r\nthis process in a model. Therefore, our goal is to determine a suitable
feed-forward control strategy for the\r\nbonding process even without detailed
model knowledge. We propose the use of batch constrained Bayesian\r\noptimization
for the control design. Hence, Bayesian optimization is precisely adapted to the
application of\r\nbonding: the constraint is used to check one quality feature
of the process and the use of batches leads to\r\nmore efficient experiments.
Our approach is suitable to determine a feed-forward control for the bonding\r\nprocess
that provides very high quality bonds without using a physical model. We also
show that the quality\r\nof the Bayesian optimization based control outperforms
random search as well as manual search by a user.\r\nUsing a simple prior knowledge
model derived from data further improves the quality of the connection.\r\nThe
Bayesian optimization approach offers the possibility to perform a sensitivity
analysis of the control\r\nparameters, which allows to evaluate the influence
of each control parameter on the bond quality. In summary,\r\nBayesian optimization
applied to the bonding process provides an excellent opportunity to develop a
feedforward\r\ncontrol without full modeling of the underlying physical processes."
author:
- first_name: Michael
full_name: Hesse, Michael
id: '29222'
last_name: Hesse
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Julia
full_name: Timmermann, Julia
id: '15402'
last_name: Timmermann
- first_name: Ansgar
full_name: Trächtler, Ansgar
id: '552'
last_name: Trächtler
citation:
ama: 'Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian
Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: Proceedings
of the 11th International Conference on Pattern Recognition Applications and Methods
(ICPRAM). ; 2022:383-394.'
apa: Hesse, M., Hunstig, M., Timmermann, J., & Trächtler, A. (2022). Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design.
Proceedings of the 11th International Conference on Pattern Recognition Applications
and Methods (ICPRAM), 383–394.
bibtex: '@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design},
booktitle={Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias
and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }'
chicago: Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler.
“Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward
Control Design.” In Proceedings of the 11th International Conference on Pattern
Recognition Applications and Methods (ICPRAM), 383–94, 2022.
ieee: M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,”
in Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM), Online, 2022, pp. 383–394.
mla: Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire
Bonding Feed-Forward Control Design.” Proceedings of the 11th International
Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022,
pp. 383–94.
short: 'M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the
11th International Conference on Pattern Recognition Applications and Methods
(ICPRAM), 2022, pp. 383–394.'
conference:
end_date: 2022-02-05
location: Online
name: 11th International Conference on Pattern Recognition Applications and Methods
start_date: 2022-02-03
date_created: 2022-02-09T12:50:25Z
date_updated: 2024-11-13T08:44:17Z
department:
- _id: '153'
- _id: '880'
keyword:
- Bayesian optimization
- Wire bonding
- Feed-forward control
- model-free design
language:
- iso: eng
page: 383-394
publication: Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM)
publication_identifier:
isbn:
- 978-989-758-549-4
quality_controlled: '1'
status: public
title: Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward
Control Design
type: conference
user_id: '82875'
year: '2022'
...
---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '41958'
abstract:
- lang: ger
text: Das Nasspressverfahren ist ein Serienherstellungsprozess für Bauteile aus
duroplastischen Faserverbundkunststoffen (FVK) mit einer geringen Geometriekomplexität.
Im Rahmen dieser Arbeit wurde ein modifiziertes Nasspressverfahren untersucht,
welches die Herstellung von hybriden Blech-FVK-Strukturen ermöglicht. Die stoffschlüssige
Verbindung zwischen dem metallischen Trägerbauteil und einem lokalen FVK-Verstärkungselement
wird durch Co-Bonding im Nasspresswerkzeug aufgebaut. Epoxidbasierte Matrixharze
und Klebstoffe wurden mit Methoden der Klebtechnik sowie thermischen und rheometrischen
Prüfungen charakterisiert, um ein materialspezifisches Fertigungsprozessfenster
einzugrenzen. Experimentelle Untersuchungen zum Nasspressen von GFK-Laminaten
und Stahl-GFK-Hybridstrukturen fokussierten die Mikrostruktur und das strukturelle
Verhalten von stoffschlüssigen Hybridverbindungen. Unter anderem wurden Einflüsse
von zeit-, temperatur- und druckabhängigen Fertigungsparametern sowie der Einsatz
von Strukturklebstofffilmen und internen Trennmitteln analysiert. Anhand von Fallturmtests
an hybriden Demonstratorkomponenten konnte das modifizierte Nasspressverfahren
für die Herstellung crashrelevanter Karosseriebauteile qualifiziert werden.
author:
- first_name: Hermann
full_name: Opdemom, Hermann
last_name: Opdemom
citation:
ama: Opdemom H. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen.
Vol 2019,35. Shaker Verlag; 2019.
apa: 'Opdemom, H. (2019). Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen: Vol.
2019,35. Shaker Verlag.'
bibtex: '@book{Opdemom_2019, series={Schriftenreihe Institut für Leichtbau mit Hybridsystemen},
title={Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für
die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen}, volume={2019,35},
publisher={Shaker Verlag}, author={Opdemom, Hermann}, year={2019}, collection={Schriftenreihe
Institut für Leichtbau mit Hybridsystemen} }'
chicago: Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen.
Vol. 2019,35. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker
Verlag, 2019.
ieee: H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen,
vol. 2019,35. Shaker Verlag, 2019.
mla: Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen.
Shaker Verlag, 2019.
short: H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens
für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, Shaker
Verlag, 2019.
date_created: 2023-02-10T11:24:40Z
date_updated: 2023-02-10T11:24:47Z
department:
- _id: '9'
- _id: '149'
- _id: '321'
keyword:
- Leichtbau
- Faserverbundkunststoffe
- Nasspressverfahren
- Hybridbauteile
- Rheologie
- Klebtechnik
- Co-Bonding
language:
- iso: ger
page: '178'
publication_identifier:
isbn:
- 978-3-8440-6428-5
publication_status: published
publisher: Shaker Verlag
series_title: Schriftenreihe Institut für Leichtbau mit Hybridsystemen
status: public
supervisor:
- first_name: Thomas
full_name: Tröster, Thomas
id: '553'
last_name: Tröster
title: Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die
Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen
type: dissertation
user_id: '15952'
volume: 2019,35
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. In the electronics industry
it is used to form electrical connections, including those of dissimilar materials.
Multiple influencing factors in ultrasonic joining are known and extensively investigated;
process parameters like ultrasonic power, bond force, and bonding frequency of
the ultrasonic vibration are known to have a high impact on a reliable joining
process and need to be adapted for each new application with different geometry
or materials. This contribution is focused on increasing ultrasonic power transmitted
to the interface and keeping mechanical stresses during ultrasonic bonding low
by using a multi-dimensional ultrasonic transducer concept. Bonding results for
a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
bonding are discussed.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors
and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025'
apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro,
W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.
https://doi.org/10.1016/j.sna.2019.04.025'
bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
volume={295}, DOI={10.1016/j.sna.2019.04.025},
journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
Walter}, year={2019}, pages={653–662} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295
(2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.'
ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
“Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662,
2019, doi: 10.1016/j.sna.2019.04.025.'
mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical,
vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.'
short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: ' 295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9992'
abstract:
- lang: eng
text: State-of-the-art industrial compact high power electronic packages require
copper-copper interconnections with larger cross sections made by ultrasonic bonding.
In comparison to aluminium-copper, copper-copper interconnections require increased
normal forces and ultrasonic power, which might lead to substrate damage due to
increased mechanical stresses. One option to raise friction energy without increasing
vibration amplitude between wire and substrate or bonding force is the use of
two-dimensional vibration. The first part of this contribution reports on the
development of a novel bonding system that executes two-dimensional vibrations
of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
bonds only form properly when surfaces are clean, oxide free and activated, the
geometries of tool-tip and pin were optimised using finite element analysis. To
maximize the area of the bonded annulus the distribution of normal pressure was
optimized by varying the convexity of the bottom side of the pin. Second, a statistical
model obtained from an experimental parameter study shows the influence of different
bonding parameters on the bond result. To find bonding parameters with the minimum
number of tests, the experiments have been planned using a D-optimal experimental
design approach.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
of weld formation in a novel two-dimensional copper-copper bonding process. In:
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany). ; 2018:1-6.'
apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process. In (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany)
(pp. 1–6).
bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
title={Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany), 1–6, 2018.
ieee: C. Dymel et al., “Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process,” in (Proceedings
of 7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '9982'
abstract:
- lang: ger
text: ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten
genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung
kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der
geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb
verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der
Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte
zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen
Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein
einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde
in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands
zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung
entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt
die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld
von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer
zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller
Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die
sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie
verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung
bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L
/2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude
und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren
Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend
Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten
basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel
2017; 2017:611-614.'
apa: 'Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für
Akustik (pp. 611–614). Kiel 2017.'
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS:
Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43.
Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias
and Sextro, Walter}, year={2017}, pages={611–614} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile
Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche
Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.'
ieee: 'R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für
Akustik, 2017, pp. 611–614.'
mla: 'Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten
Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017,
pp. 611–14.'
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik,
Kiel 2017, 2017, pp. 611–614.'
date_created: 2019-05-27T09:48:10Z
date_updated: 2019-05-27T09:49:49Z
department:
- _id: '151'
keyword:
- wire bonding
- dynamic behavior
- modeling
language:
- iso: eng
page: 611-614
place: Kiel 2017
publication: 43. Deutsche Jahrestagung für Akustik
status: public
title: 'MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall'
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '13238'
abstract:
- lang: eng
text: A numerically efficient yet highly accurate implementation of the crystal
orbital Hamilton population (COHP) scheme for plane-wave calculations is presented.
It is based on the projector-augmented wave (PAW) formalism in combination with
norm-conserving pseudopotentials and allows to extract chemical interactions between
atoms from band-structure calculations even for large and complex systems. The
potential of the present COHP implementation is demonstrated by an in-depth analysis
of the intensively investigated metal-insulator transition in atomic-scale indium
wires self-assembled on the Si(111) surface. Thereby bond formation between In
atoms of adjacent zigzag chains is found to be instrumental for the phase change.
© 2017 Wiley Periodicals, Inc.
author:
- first_name: Andreas
full_name: Lücke, Andreas
last_name: Lücke
- first_name: Uwe
full_name: Gerstmann, Uwe
last_name: Gerstmann
- first_name: Thomas D.
full_name: Kühne, Thomas D.
last_name: Kühne
- first_name: Wolf G.
full_name: Schmidt, Wolf G.
last_name: Schmidt
citation:
ama: Lücke A, Gerstmann U, Kühne TD, Schmidt WG. Efficient PAW-based bond strength
analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. Journal
of Computational Chemistry. 2017;38(26):2276-2282. doi:10.1002/jcc.24878
apa: Lücke, A., Gerstmann, U., Kühne, T. D., & Schmidt, W. G. (2017). Efficient
PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4
× 1) phase transition. Journal of Computational Chemistry, 38(26),
2276–2282. https://doi.org/10.1002/jcc.24878
bibtex: '@article{Lücke_Gerstmann_Kühne_Schmidt_2017, title={Efficient PAW-based
bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase
transition}, volume={38}, DOI={10.1002/jcc.24878},
number={26}, journal={Journal of Computational Chemistry}, author={Lücke, Andreas
and Gerstmann, Uwe and Kühne, Thomas D. and Schmidt, Wolf G.}, year={2017}, pages={2276–2282}
}'
chicago: 'Lücke, Andreas, Uwe Gerstmann, Thomas D. Kühne, and Wolf G. Schmidt. “Efficient
PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4
× 1) Phase Transition.” Journal of Computational Chemistry 38, no. 26 (2017):
2276–82. https://doi.org/10.1002/jcc.24878.'
ieee: A. Lücke, U. Gerstmann, T. D. Kühne, and W. G. Schmidt, “Efficient PAW-based
bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase
transition,” Journal of Computational Chemistry, vol. 38, no. 26, pp. 2276–2282,
2017.
mla: Lücke, Andreas, et al. “Efficient PAW-Based Bond Strength Analysis for Understanding
the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” Journal of Computational
Chemistry, vol. 38, no. 26, 2017, pp. 2276–82, doi:10.1002/jcc.24878.
short: A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational
Chemistry 38 (2017) 2276–2282.
date_created: 2019-09-16T12:39:15Z
date_updated: 2022-01-06T06:51:31Z
department:
- _id: '304'
doi: 10.1002/jcc.24878
intvolume: ' 38'
issue: '26'
keyword:
- density functional theory
- bonding
- crystal orbital Hamilton population
- indium nanowires
- phase transition
language:
- iso: eng
page: 2276-2282
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Journal of Computational Chemistry
publication_status: published
status: public
title: Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8
× 2) – (4 × 1) phase transition
type: journal_article
user_id: '71692'
volume: 38
year: '2017'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9959'
abstract:
- lang: eng
text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical
devices in power electronics. In order to facilitate powerful solutions combined
with an increased efficiency, involving a material change from aluminum to copper
wire as conductor material takes place in recent years. Due to the material related
properties, copper wire bonding requires significant higher bond processing parameters
such as bond force and ultrasonic power compared to aluminum which can lead to
damages or a failure of the bonded component. Therefore, a profound knowledge
of the processes prevailing during wire bonding is essential to optimize the application
of the copper wires and consequently to achieve the demands on quality and reliability.
The behavior of different natural surface oxides of aluminum and copper are assumed
to be one reason for the deviation in the required bond parameters. Accordingly,
the impact of differently pre-treated substrates surfaces on which the bonding
is applied were investigated in this study. First, all conditions investigated
(as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning
electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy
and atomic force microscopy. In addition, hardness tests were performed as well
as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded
on the generated surfaces investigated. In consideration of the roughness, shear
test of various bond times and microscopic images were evaluated. Finally, the
results were compared and discussed. Overall, the current study indicates that
an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the
contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining
parts. Based on the obtained results, it can be expected that due to an ideal
set of Al-oxide layers, lower optimal bond parameters can used to reach high bond
strength with good reliability properties.
author:
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Olexandr
full_name: Grydin, Olexandr
last_name: Grydin
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on
the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91'
apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,
… Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire
bond process. In IEEE 66th Electronic Components and Technology Conference
(pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016,
title={Effect of different oxide layers on the ultrasonic copper wire bond process},
DOI={10.1109/ECTC.2016.91},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock,
Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach,
Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016},
pages={2111–2118} }'
chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian
Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different
Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic
Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
ieee: F. Eacock et al., “Effect of different oxide layers on the ultrasonic
copper wire bond process,” in IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 2111–2118.
mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic
Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M.
Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–2118.'
date_created: 2019-05-27T09:00:50Z
date_updated: 2019-09-16T10:38:59Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.91
keyword:
- Ultrasonic copper wire bonding
- Al-oxide
- Cuoxide
- oxide-free
- roughness
- morphology
language:
- iso: eng
page: 2111-2118
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Effect of different oxide layers on the ultrasonic copper wire bond process
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9870'
abstract:
- lang: eng
text: Nowadays wire bonding is a widely-used technology for interconnecting chips
in the packaging industry. Thereby, it is known that the bond quality massively
depends upon the microstructure prevailing in the bond and consequently the materials
used as well as the bonding parameters. However the actually used materials such
as aluminum and gold are either characterized by comparibly poor conductivity
or high costs, respectively. Due to its outstanding properties copper is a more
attractive candidate. Still, a thorough investigation on the interrelationship
between the material combinations, the processing parameters and the resulting
microstructure for copper and aluminum wire bonding was not carried out yet. Depending
on the aforementioned factors the microstructural evolution can be completely
different during the bonding process. Therefore, this study focuses on the microstructural
evolution of heavy copper and heavy aluminum wires bonded on copper substrates.
The evolution of the wire microstructure as well as the wire-substrate-interface
was investigated by scanning electron microscope in combination with electron
backscatter diffraction and microhardness measurements. Various samples were extracted
at different points of the bonding process, namely the as-received condition,
after touchdown and after completed bonding. The results of the aluminum and copper
wires were compared to each other in both longitudinal and transversal direction.
It was found, that the two wire materials were completely different in the as-received
condition regarding the grain size, the grain morphology, the texture and the
microhardness. After touchdown the microstructure did not show significant changes
in both materials, yet a strain-hardening was observed in the copper wire resulting
from the touchdown force. When the bonding process was completed a different microstructure
could be observed in both the wire as well as the layer for the materials investigated.
Furthermore, a destinctive increase in the wire hardness could be found in case
of copper, which was not observed for the aluminum wire. The ramifications between
the two wire materials presented in this work will be discussed with the objective
of optimizing the quality of the bonds.
author:
- first_name: Florian
full_name: Eacock , Florian
last_name: 'Eacock '
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Carolin
full_name: Zinn, Carolin
last_name: Zinn
- first_name: ' Martin Joachim'
full_name: Holzweissig, Martin Joachim
last_name: Holzweissig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Schaper M, Althoff S, et al. Microstructural investigations of
aluminum and copper wire bonds. In: Proceedings of the 47th International Symposium
on Microelectronics. ; 2014. doi:10.4071/isom-THP32'
apa: Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach,
F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire
bonds. In Proceedings of the 47th International Symposium on Microelectronics.
https://doi.org/10.4071/isom-THP32
bibtex: '@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014,
title={Microstructural investigations of aluminum and copper wire bonds}, DOI={10.4071/isom-THP32}, booktitle={Proceedings
of the 47th International Symposium on Microelectronics}, author={Eacock , Florian
and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and
Hengsbach, Florian and Zinn, Carolin and Holzweissig, Martin Joachim and Guth,
Karsten}, year={2014} }'
chicago: Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald,
Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth.
“Microstructural Investigations of Aluminum and Copper Wire Bonds.” In Proceedings
of the 47th International Symposium on Microelectronics, 2014. https://doi.org/10.4071/isom-THP32.
ieee: F. Eacock et al., “Microstructural investigations of aluminum and
copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics,
2014.
mla: Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper
Wire Bonds.” Proceedings of the 47th International Symposium on Microelectronics,
2014, doi:10.4071/isom-THP32.
short: 'F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach,
C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International
Symposium on Microelectronics, 2014.'
date_created: 2019-05-20T12:14:11Z
date_updated: 2019-09-16T10:58:50Z
department:
- _id: '151'
doi: 10.4071/isom-THP32
keyword:
- Bonding
- Copper
- Microstructure evolution
language:
- iso: eng
publication: Proceedings of the 47th International Symposium on Microelectronics
quality_controlled: '1'
status: public
title: Microstructural investigations of aluminum and copper wire bonds
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9871'
abstract:
- lang: eng
text: 'Wire bonding is the most common technology for connecting electronic components.
Due to their efficiency bond interconnections made of copper wire are used for
example in the aerospace and medical technology as well as in the fields of renewable
energies. One of the main cost factors in the manufacturing process is the consumables
like bonding tools. The technological transition to copper as wire material causes
significant wear on the millimeter large effective contact area of the bonding
tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
which can be produced by a single tool. To reduce setting-up time in the production
and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
a better understanding of wear and recognition of wear pattern is required. Therefore,
the paper presents an analyzing method of the tool topography change of a heavy
wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
the identification of the main wear indicators by the help of the named topography
change for different bond parameters, like ultrasonic power and tool geometry.
Reference topography has been carried out by choosing typical parameters of the
production line. To judge whether the quality requirement of the bond connections
made by a single tool cannot be fulfilled shear test of the source bond have been
carried out after a defined number of produced bond connections. Main steps of
analysis: (I)Topography of the tool surface is sampled after a defined number
of bonds by means of a confocal microscope to detect the wear progress.(II)The
recorded data is filtered using Matlab. So, measurement errors can be eliminated
and the topography can be overlaid more easy to identify differences between diverse
tools or differences in wear stages of the same tool.(III)The subsequent discretization
of the topography into sub volumes allows to (IV)describe the loss of volume depending
on the position in the groove. Thereby, intermediate status of wear of one tool
can be used to obtain a persistent description of the topography change over the
number of produced bonds by interpolating the confocal data. Afterwards the persistent
change of the groove flank has been analyzed for the named test series to identify
the main wear indicators and their effect on shear forces. All worn tools show
dominant areas for volume loss especially for plastic deformation and accordingly
abrasion. These wear mechanism can be referred to the change of main parts of
the groove geometry like the rounding of the front and back radius. The most volume
loss was identified in the upper part of the tool flanks or rather at the transition
from the groove flank to the front or back radius. Furthermore the observation
of the center of the groove flank shows just a little change in volume. All in
all, the identification of the wear indicators will be discussed with the objective
of increasing the tool lifetime by optimizing the tool geometry without losses
in bond quality and reliability.'
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althof, Simon
last_name: Althof
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
In: Proceedings of the 47th International Symposium on Microelectronics.
; 2014:856-861. doi:10.4071/isom-THP34'
apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &
Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the
47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
Method of Tool Topography Change and Identification of Wear Indicators for Heavy
Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34},
booktitle={Proceedings of the 47th International Symposium on Microelectronics},
author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
}'
chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings
of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
ieee: P. Eichwald et al., “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings
of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the
47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9895'
abstract:
- lang: eng
text: Power semiconductor modules are used to control and switch high electrical
currents and voltages. Within the power module package wire bonding is used as
an interconnection technology. In recent years, aluminum wire has been used preferably,
but an ever-growing market of powerful and efficient power modules requires a
material with better mechanical and electrical properties. For this reason, a
technology change from aluminum to copper is indispensable. However, the copper
wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
reliable copper bond connections a challenging task. The aim of the BMBF funded
project Itsowl-InCuB is the development of self-optimizing techniques to enable
the reliable production of copper bond connections under varying conditions. A
model of the process is essential to achieve this aim. This model needs to include
the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
process. In the touchdown phase, the wire is pressed into the V-groove of the
tool and a small initial contact area between wire and substrate arise. The local
characteristics of the material change abruptly because of the cold forming. Consequently,
the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
effect during the touchdown process of aluminum wires by cracking of oxide layers
was presented. These interactions of the process parameters are still largely
unknown for copper. In a first step, this paper validates the importance of modeling
the pre-deformation by showing its impact on the wire deformation characteristic
experimentally. Creating cross-section views of pre-deformed copper wires has
shown a low deformation degree compared to aluminum. By using a digital microscope
and a scanning confocal microscope an analysis about the contact areas and penetration
depths after touchdown has been made. Additionally, it has to be taken into account
that the dynamical touchdown force depends on the touchdown speed and the touchdown
force set in the bonding machine. In order to measure the overshoot in the force
signals, a strain gauge sensor has been used. Subsequently, the affecting factors
have been interpreted independently Furthermore, the material properties of copper
wire have been investigated with tensile tests and hardness measurements. In a
second step, the paper presents finite element models of the touchdown process
for source and destination bonds. These models take the measured overshoot in
the touchdown forces into account. A multi-linear, isotropic material model has
been selected to map the material properties of the copper. A validation of the
model with the experimental determined contact areas, normal pressures and penetration
depths reveals the high model quality. Thus, the simulation is able to calculate
and visualize the three dimensional pre-deformation with an integrated material
parameter of the wire if the touchdown parameters of the bonding machine are known.
Based on the calculated deformation degrees of wire and substrate, it is probably
possible to investigate the effect of the pre-deformation on the pre-cleaning
phase in the copper wire bonding.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the
47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US;
2014:289-294.'
apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &
Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium
on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the
47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego,
CA, US, 2014.
ieee: A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–294.
mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–94.
short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9797'
abstract:
- lang: eng
text: A model approach for wedge/wedge bonding copper wire is presented. The connection
between wire and substrate is based on a variety of physical effects, but the
dominant one is the friction based welding while applying ultrasound. Consequently,
a friction model was used to investigate the welding process. This model is built
up universal and can be used to describe the formation of micro welds in the time
variant contact area between wire and substrate. Aim of the model is to identify
the interactions between touchdown, bond normal force, ultrasonic power and bonding
time. To do so, the contact area is discretized into partial areas where a Point
Contact Model is applied. Based on this approach it is possible to simulate micro
and macro slip inside the contact area between wire and substrate. The work done
by friction force is a main criterion to define occurring micro joints which influence
the subsequent welding.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling
wire bonding. In: IMAPS 2013, 46th International Symposium on Microelectronics.
Orlando (Florida), USA; 2013. doi:10.4071/isom-2013-TA67'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2013). A friction based
approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium
on Microelectronics. Orlando (Florida), USA. https://doi.org/10.4071/isom-2013-TA67
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida),
USA}, title={A friction based approach for modeling wire bonding}, DOI={10.4071/isom-2013-TA67},
booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff,
Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction
Based Approach for Modeling Wire Bonding.” In IMAPS 2013, 46th International
Symposium on Microelectronics. Orlando (Florida), USA, 2013. https://doi.org/10.4071/isom-2013-TA67.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach
for modeling wire bonding,” in IMAPS 2013, 46th International Symposium on
Microelectronics, 2013.
mla: Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.”
IMAPS 2013, 46th International Symposium on Microelectronics, 2013, doi:10.4071/isom-2013-TA67.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International
Symposium on Microelectronics, Orlando (Florida), USA, 2013.'
date_created: 2019-05-13T13:55:36Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.4071/isom-2013-TA67
keyword:
- Wire bonding
- friction modeling
- wire bond quality
- contact element modeling
language:
- iso: eng
place: Orlando (Florida), USA
publication: IMAPS 2013, 46th International Symposium on Microelectronics
status: public
title: A friction based approach for modeling wire bonding
type: conference
user_id: '55222'
year: '2013'
...