---
_id: '64985'
abstract:
- lang: eng
text: Modern industrial development has necessitated a wide range of joining technologies.
Self-pierce riveting has become a prevalent technique for sheet metal assembly,
especially in automotive applications. Achieving proper joint geometry and adequate
load-bearing capacity depends on appropriate tool selection and precise process
control. Material properties and condition also play a significant role in process
performance. To accommodate the inevitable variations in component characteristics
during production, a robust and stable joining process is essential. The study
focuses on investigating the influence of preformed joining partners on the joining
process and the joint's load capacity. An EN AW-6014 in T4 condition, as well
as an HCT590X, are used as materials for this study. For this purpose, an exemplary
process chain consisting of the steps of performing, joining, and shear load testing
is studied. Each process step is implemented using an FE model to predict the
outcome of subsequent steps. For analysis of the influence of pre-strain, an optimisation
software is used to plan and execute variations of the process. These variations
are used to create a meta-model that can describe the relationships between pre-forming
and characteristic parameters of subsequent process steps. The resulting model
is validated by comparing simulation and experimental data. Finally, in a novel
approach, the robustness of the presented process chain is analyzed in terms of
a tolerable performance level for the joining partners.
article_number: '100391'
author:
- first_name: Jean-Patrick
full_name: Ludwig, Jean-Patrick
id: '76631'
last_name: Ludwig
- first_name: Emil
full_name: Tolke, Emil
last_name: Tolke
- first_name: Malte Christian
full_name: Schlichter, Malte Christian
id: '61977'
last_name: Schlichter
- first_name: Mathias
full_name: Bobbert, Mathias
id: '7850'
last_name: Bobbert
- first_name: Gerson
full_name: Meschut, Gerson
id: '32056'
last_name: Meschut
orcid: 0000-0002-2763-1246
citation:
ama: Ludwig J-P, Tolke E, Schlichter MC, Bobbert M, Meschut G. Numerical analysis
of the robustness of self-pierce riveting with pre-formed joining partners. Journal
of Advanced Joining Processes. 2026;13. doi:10.1016/j.jajp.2026.100391
apa: Ludwig, J.-P., Tolke, E., Schlichter, M. C., Bobbert, M., & Meschut, G.
(2026). Numerical analysis of the robustness of self-pierce riveting with pre-formed
joining partners. Journal of Advanced Joining Processes, 13, Article
100391. https://doi.org/10.1016/j.jajp.2026.100391
bibtex: '@article{Ludwig_Tolke_Schlichter_Bobbert_Meschut_2026, title={Numerical
analysis of the robustness of self-pierce riveting with pre-formed joining partners},
volume={13}, DOI={10.1016/j.jajp.2026.100391},
number={100391}, journal={Journal of Advanced Joining Processes}, publisher={Elsevier
BV}, author={Ludwig, Jean-Patrick and Tolke, Emil and Schlichter, Malte Christian
and Bobbert, Mathias and Meschut, Gerson}, year={2026} }'
chicago: Ludwig, Jean-Patrick, Emil Tolke, Malte Christian Schlichter, Mathias Bobbert,
and Gerson Meschut. “Numerical Analysis of the Robustness of Self-Pierce Riveting
with Pre-Formed Joining Partners.” Journal of Advanced Joining Processes
13 (2026). https://doi.org/10.1016/j.jajp.2026.100391.
ieee: 'J.-P. Ludwig, E. Tolke, M. C. Schlichter, M. Bobbert, and G. Meschut, “Numerical
analysis of the robustness of self-pierce riveting with pre-formed joining partners,”
Journal of Advanced Joining Processes, vol. 13, Art. no. 100391, 2026,
doi: 10.1016/j.jajp.2026.100391.'
mla: Ludwig, Jean-Patrick, et al. “Numerical Analysis of the Robustness of Self-Pierce
Riveting with Pre-Formed Joining Partners.” Journal of Advanced Joining Processes,
vol. 13, 100391, Elsevier BV, 2026, doi:10.1016/j.jajp.2026.100391.
short: J.-P. Ludwig, E. Tolke, M.C. Schlichter, M. Bobbert, G. Meschut, Journal
of Advanced Joining Processes 13 (2026).
date_created: 2026-03-16T12:30:39Z
date_updated: 2026-03-16T12:38:13Z
department:
- _id: '9'
doi: 10.1016/j.jajp.2026.100391
intvolume: ' 13'
keyword:
- Self-pierce riveting
- FE modelling
- Plastic pre-deformation
- Meta modelling
language:
- iso: eng
project:
- _id: '131'
name: TRR 285 - Project Area A
- _id: '135'
name: TRR 285 - Subproject A01
- _id: '130'
name: 'TRR 285: Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen
Prozessketten'
publication: Journal of Advanced Joining Processes
publication_identifier:
issn:
- 2666-3309
publication_status: published
publisher: Elsevier BV
quality_controlled: '1'
status: public
title: Numerical analysis of the robustness of self-pierce riveting with pre-formed
joining partners
type: journal_article
user_id: '76631'
volume: 13
year: '2026'
...
---
_id: '22930'
abstract:
- lang: eng
text: Self-piercing riveting is an established technique for joining multi-material
structures in car body manufacturing. Rivets for self-piercing riveting differ
in their geometry, the material used, the condition of the material and their
surface condition. To shorten the manufacturing process by omitting the heat treatment
and the coating process, the authors have elaborated a concept for the use of
stainless steel with high strain hardening as a rivet material. The focus of the
present investigation is on the evaluation of the influences of the rivet’s geometry
and material on its deformation behaviour. Conventional rivets of types P and
HD2, a rivet with an improved geometry made of treatable steel 38B2, and rivets
made of the stainless steels 1.3815 and 1.4541 are examined. The analysis is conducted
by means of multi-step joining tests for two material combinations comprising
high-strength steel HCT70X and aluminium EN AW-5083. The joints are cut to provide
a cross-section and the deformation behaviour of the different rivets is analysed
on the basis of the measured changes in geometry and hardness. In parallel, an
examination of the force-stroke curves provides further insights. It can be demonstrated
that, besides the geometry, the material strength, in particular, has a significant
influence on the deformation behaviour of the rivet. The strength of steel 1.4541
is seen to be too low for the joining task, while the strength of steel 1.3815
is sufficient, and hence the investigation confirms the capability of rivets made
of 1.3815 for joining even challenging material combinations.
author:
- first_name: Benedikt
full_name: Uhe, Benedikt
id: '38131'
last_name: Uhe
- first_name: Clara-Maria
full_name: Kuball, Clara-Maria
last_name: Kuball
- first_name: Marion
full_name: Merklein, Marion
last_name: Merklein
- first_name: Gerson
full_name: Meschut, Gerson
id: '32056'
last_name: Meschut
orcid: 0000-0002-2763-1246
citation:
ama: 'Uhe B, Kuball C-M, Merklein M, Meschut G. Self-Piercing Riveting Using Rivets
Made of Stainless Steel with High Strain Hardening. In: Daehn G, Cao J, Kinsey
B, Tekkaya E, Vivek A, Yoshida Y, eds. Forming the Future - Proceedings of
the 13th International Conference on the Technology of Plasticity. The Minerals,
Metals & Materials Series. Springer; 2021:1495-1506. doi:10.1007/978-3-030-75381-8_124'
apa: Uhe, B., Kuball, C.-M., Merklein, M., & Meschut, G. (2021). Self-Piercing
Riveting Using Rivets Made of Stainless Steel with High Strain Hardening. In G.
Daehn, J. Cao, B. Kinsey, E. Tekkaya, A. Vivek, & Y. Yoshida (Eds.), Forming
the Future - Proceedings of the 13th International Conference on the Technology
of Plasticity. The Minerals, Metals & Materials Series. (pp. 1495–1506).
Springer. https://doi.org/10.1007/978-3-030-75381-8_124
bibtex: '@inbook{Uhe_Kuball_Merklein_Meschut_2021, place={Cham}, title={Self-Piercing
Riveting Using Rivets Made of Stainless Steel with High Strain Hardening}, DOI={10.1007/978-3-030-75381-8_124},
booktitle={Forming the Future - Proceedings of the 13th International Conference
on the Technology of Plasticity. The Minerals, Metals & Materials Series.},
publisher={Springer}, author={Uhe, Benedikt and Kuball, Clara-Maria and Merklein,
Marion and Meschut, Gerson}, editor={Daehn, Glenn and Cao, Jian and Kinsey, Brad
and Tekkaya, Erman and Vivek, Anupam and Yoshida, Yoshinori}, year={2021}, pages={1495–1506}
}'
chicago: 'Uhe, Benedikt, Clara-Maria Kuball, Marion Merklein, and Gerson Meschut.
“Self-Piercing Riveting Using Rivets Made of Stainless Steel with High Strain
Hardening.” In Forming the Future - Proceedings of the 13th International Conference
on the Technology of Plasticity. The Minerals, Metals & Materials Series.,
edited by Glenn Daehn, Jian Cao, Brad Kinsey, Erman Tekkaya, Anupam Vivek, and
Yoshinori Yoshida, 1495–1506. Cham: Springer, 2021. https://doi.org/10.1007/978-3-030-75381-8_124.'
ieee: 'B. Uhe, C.-M. Kuball, M. Merklein, and G. Meschut, “Self-Piercing Riveting
Using Rivets Made of Stainless Steel with High Strain Hardening,” in Forming
the Future - Proceedings of the 13th International Conference on the Technology
of Plasticity. The Minerals, Metals & Materials Series., G. Daehn, J.
Cao, B. Kinsey, E. Tekkaya, A. Vivek, and Y. Yoshida, Eds. Cham: Springer, 2021,
pp. 1495–1506.'
mla: Uhe, Benedikt, et al. “Self-Piercing Riveting Using Rivets Made of Stainless
Steel with High Strain Hardening.” Forming the Future - Proceedings of the
13th International Conference on the Technology of Plasticity. The Minerals, Metals
& Materials Series., edited by Glenn Daehn et al., Springer, 2021, pp.
1495–506, doi:10.1007/978-3-030-75381-8_124.
short: 'B. Uhe, C.-M. Kuball, M. Merklein, G. Meschut, in: G. Daehn, J. Cao, B.
Kinsey, E. Tekkaya, A. Vivek, Y. Yoshida (Eds.), Forming the Future - Proceedings
of the 13th International Conference on the Technology of Plasticity. The Minerals,
Metals & Materials Series., Springer, Cham, 2021, pp. 1495–1506.'
date_created: 2021-08-04T14:02:32Z
date_updated: 2026-02-27T10:40:39Z
department:
- _id: '157'
doi: 10.1007/978-3-030-75381-8_124
editor:
- first_name: Glenn
full_name: Daehn, Glenn
last_name: Daehn
- first_name: Jian
full_name: Cao, Jian
last_name: Cao
- first_name: Brad
full_name: Kinsey, Brad
last_name: Kinsey
- first_name: Erman
full_name: Tekkaya, Erman
last_name: Tekkaya
- first_name: Anupam
full_name: Vivek, Anupam
last_name: Vivek
- first_name: Yoshinori
full_name: Yoshida, Yoshinori
last_name: Yoshida
keyword:
- Self-piercing riveting
- Lightweight design
- Deformation behaviour
- Stainless steel
- High nitrogen steel
language:
- iso: eng
page: 1495-1506
place: Cham
publication: Forming the Future - Proceedings of the 13th International Conference
on the Technology of Plasticity. The Minerals, Metals & Materials Series.
publication_status: published
publisher: Springer
quality_controlled: '1'
status: public
title: Self-Piercing Riveting Using Rivets Made of Stainless Steel with High Strain
Hardening
type: book_chapter
user_id: '53912'
year: '2021'
...
---
_id: '34441'
abstract:
- lang: eng
text: The state of the art industrial manufacturing process to produce shafts as
counter surfaces for radial shaft seal rings is plunge grinding. This process
consists of three major steps. The blank is turned to a slight diameter-oversize
followed by the heat treatment and the hard-finishing by plunge grinding. The
geometric surface structures of the resulting shafts in general exhibit a stochastic
distribution. These surface characteristics contribute to a reliable and stable
sealing functionality. And the surface and subsurface hardness generally leads
to a higher wear resistance of the shaft. Motivated by economic benefits and in
order to achieve a compact production process for at least ten years, turning
is investigated as an alternative manufacturing process. However due to the resulting
lead structure on the shaft surface and the associated risk of leakage it has
not become prevalent yet. In this paper turned shafts of the metastable austenitic
steel AISI 347 (1.4550, X6CrNiNb1810) are investigated as alternative material
for counter surfaces of radial shaft seal rings and compared to turned shafts
of carburized AISI 5115 (1.7131, 16MnCr5). In addition to surfaces dry turned
at room-temperature, cryogenic turned AISI 347 counter surfaces are analyzed.
By applying cryogenic cooling, the formation of deformation-induced α′-martensite
in the surface layer is possible during the turning process. Endurance tests in
radial shaft seal ring test rigs are performed and complemented with detailed
investigations of microstructure, micro-hardness and surface topography. The results
are compared to results of state of the art ground AISI 5115 shafts.
author:
- first_name: D.
full_name: Frölich, D.
last_name: Frölich
- first_name: Balázs
full_name: Magyar, Balázs
id: '97759'
last_name: Magyar
- first_name: B.
full_name: Sauer, B.
last_name: Sauer
- first_name: P.
full_name: Mayer, P.
last_name: Mayer
- first_name: B.
full_name: Kirsch, B.
last_name: Kirsch
- first_name: J.C.
full_name: Aurich, J.C.
last_name: Aurich
- first_name: R.
full_name: Skorupski, R.
last_name: Skorupski
- first_name: M.
full_name: Smaga, M.
last_name: Smaga
- first_name: T.
full_name: Beck, T.
last_name: Beck
- first_name: D.
full_name: Eifler, D.
last_name: Eifler
citation:
ama: Frölich D, Magyar B, Sauer B, et al. Investigation of wear resistance of dry
and cryogenic turned metastable austenitic steel shafts and dry turned and ground
carburized steel shafts in the radial shaft seal ring system. Wear. 2015;328-329:123-131.
doi:https://doi.org/10.1016/j.wear.2015.02.004
apa: Frölich, D., Magyar, B., Sauer, B., Mayer, P., Kirsch, B., Aurich, J. C., Skorupski,
R., Smaga, M., Beck, T., & Eifler, D. (2015). Investigation of wear resistance
of dry and cryogenic turned metastable austenitic steel shafts and dry turned
and ground carburized steel shafts in the radial shaft seal ring system. Wear,
328–329, 123–131. https://doi.org/10.1016/j.wear.2015.02.004
bibtex: '@article{Frölich_Magyar_Sauer_Mayer_Kirsch_Aurich_Skorupski_Smaga_Beck_Eifler_2015,
title={Investigation of wear resistance of dry and cryogenic turned metastable
austenitic steel shafts and dry turned and ground carburized steel shafts in the
radial shaft seal ring system}, volume={328–329}, DOI={https://doi.org/10.1016/j.wear.2015.02.004},
journal={Wear}, author={Frölich, D. and Magyar, Balázs and Sauer, B. and Mayer,
P. and Kirsch, B. and Aurich, J.C. and Skorupski, R. and Smaga, M. and Beck, T.
and Eifler, D.}, year={2015}, pages={123–131} }'
chicago: 'Frölich, D., Balázs Magyar, B. Sauer, P. Mayer, B. Kirsch, J.C. Aurich,
R. Skorupski, M. Smaga, T. Beck, and D. Eifler. “Investigation of Wear Resistance
of Dry and Cryogenic Turned Metastable Austenitic Steel Shafts and Dry Turned
and Ground Carburized Steel Shafts in the Radial Shaft Seal Ring System.” Wear
328–329 (2015): 123–31. https://doi.org/10.1016/j.wear.2015.02.004.'
ieee: 'D. Frölich et al., “Investigation of wear resistance of dry and cryogenic
turned metastable austenitic steel shafts and dry turned and ground carburized
steel shafts in the radial shaft seal ring system,” Wear, vol. 328–329,
pp. 123–131, 2015, doi: https://doi.org/10.1016/j.wear.2015.02.004.'
mla: Frölich, D., et al. “Investigation of Wear Resistance of Dry and Cryogenic
Turned Metastable Austenitic Steel Shafts and Dry Turned and Ground Carburized
Steel Shafts in the Radial Shaft Seal Ring System.” Wear, vol. 328–329,
2015, pp. 123–31, doi:https://doi.org/10.1016/j.wear.2015.02.004.
short: D. Frölich, B. Magyar, B. Sauer, P. Mayer, B. Kirsch, J.C. Aurich, R. Skorupski,
M. Smaga, T. Beck, D. Eifler, Wear 328–329 (2015) 123–131.
date_created: 2022-12-15T10:17:23Z
date_updated: 2022-12-15T10:18:54Z
department:
- _id: '146'
doi: https://doi.org/10.1016/j.wear.2015.02.004
extern: '1'
keyword:
- Radial shaft seal ring
- Shaft surface
- Cryogenic turning
- Metastable austenitic steel
- Deformation-induced martensite formation
language:
- iso: eng
page: 123-131
publication: Wear
publication_identifier:
issn:
- 0043-1648
status: public
title: Investigation of wear resistance of dry and cryogenic turned metastable austenitic
steel shafts and dry turned and ground carburized steel shafts in the radial shaft
seal ring system
type: journal_article
user_id: '38077'
volume: 328-329
year: '2015'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9895'
abstract:
- lang: eng
text: Power semiconductor modules are used to control and switch high electrical
currents and voltages. Within the power module package wire bonding is used as
an interconnection technology. In recent years, aluminum wire has been used preferably,
but an ever-growing market of powerful and efficient power modules requires a
material with better mechanical and electrical properties. For this reason, a
technology change from aluminum to copper is indispensable. However, the copper
wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
reliable copper bond connections a challenging task. The aim of the BMBF funded
project Itsowl-InCuB is the development of self-optimizing techniques to enable
the reliable production of copper bond connections under varying conditions. A
model of the process is essential to achieve this aim. This model needs to include
the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
process. In the touchdown phase, the wire is pressed into the V-groove of the
tool and a small initial contact area between wire and substrate arise. The local
characteristics of the material change abruptly because of the cold forming. Consequently,
the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
effect during the touchdown process of aluminum wires by cracking of oxide layers
was presented. These interactions of the process parameters are still largely
unknown for copper. In a first step, this paper validates the importance of modeling
the pre-deformation by showing its impact on the wire deformation characteristic
experimentally. Creating cross-section views of pre-deformed copper wires has
shown a low deformation degree compared to aluminum. By using a digital microscope
and a scanning confocal microscope an analysis about the contact areas and penetration
depths after touchdown has been made. Additionally, it has to be taken into account
that the dynamical touchdown force depends on the touchdown speed and the touchdown
force set in the bonding machine. In order to measure the overshoot in the force
signals, a strain gauge sensor has been used. Subsequently, the affecting factors
have been interpreted independently Furthermore, the material properties of copper
wire have been investigated with tensile tests and hardness measurements. In a
second step, the paper presents finite element models of the touchdown process
for source and destination bonds. These models take the measured overshoot in
the touchdown forces into account. A multi-linear, isotropic material model has
been selected to map the material properties of the copper. A validation of the
model with the experimental determined contact areas, normal pressures and penetration
depths reveals the high model quality. Thus, the simulation is able to calculate
and visualize the three dimensional pre-deformation with an integrated material
parameter of the wire if the touchdown parameters of the bonding machine are known.
Based on the calculated deformation degrees of wire and substrate, it is probably
possible to investigate the effect of the pre-deformation on the pre-cleaning
phase in the copper wire bonding.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the
47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US;
2014:289-294.'
apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &
Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium
on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the
47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego,
CA, US, 2014.
ieee: A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–294.
mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–94.
short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...