---
_id: '9868'
abstract:
- lang: eng
  text: In order to increase mechanical strength, heat dissipation and ampacity and
    to decrease failure through fatigue fracture, wedge copper wire bonding is being
    introduced as a standard interconnection method for mass production. To achieve
    the same process stability when using copper wire instead of aluminum wire a profound
    understanding of the bonding process is needed. Due to the higher hardness of
    copper compared to aluminum wire it is more difficult to approach the surfaces
    of wire and substrate to a level where van der Waals forces are able to arise
    between atoms. Also, enough friction energy referred to the total contact area
    has to be generated to activate the surfaces. Therefore, a friction model is used
    to simulate the joining process. This model calculates the resulting energy of
    partial areas in the contact surface and provides information about the adhesion
    process of each area. The focus here is on the arising of micro joints in the
    contact area depending on the location in the contact and time. To validate the
    model, different touchdown forces are used to vary the initial contact areas of
    wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
    up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
    for the real bonding process to map with the model. Test substrates as DBC and
    copper plate are used to show the different formations of a wedge bond connection
    due to hardness and reaction propensity. The experiments were done by using 500
    $\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
    wire bonds using a friction model approach. In: <i>Electronic Components and Technology
    Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the
    bond quality of copper wire bonds using a friction model approach. In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555).
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
    bond quality of copper wire bonds using a friction model approach}, DOI={<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>},
    booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
    author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
    year={2014}, pages={1549–1555} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
    the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014.
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
    of copper wire bonds using a friction model approach,” in <i>Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.
  mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
    a Friction Model Approach.” <i>Electronic Components and Technology Conference
    (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...