@phdthesis{41971,
  abstract     = {{Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.

Zunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.

Experimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden.}},
  author       = {{Althoff, Simon}},
  isbn         = {{978-3-8440-8903-5}},
  keywords     = {{heavy copper bonding, wire bonding, quality prediction, friction model, point-contact-element}},
  pages        = {{192}},
  publisher    = {{Shaker}},
  title        = {{{Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}}},
  volume       = {{15}},
  year         = {{2023}},
}

@article{10334,
  abstract     = {{Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.}},
  author       = {{Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}},
  issn         = {{0924-4247}},
  journal      = {{Sensors and Actuators A: Physical}},
  keywords     = {{Ultrasonic bonding, Ultrasonic welding, Multi-dimensional bonding, Complex vibration, Multi-frequent, Two-dimensional friction model}},
  pages        = {{653 -- 662}},
  title        = {{{Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}}},
  doi          = {{10.1016/j.sna.2019.04.025}},
  volume       = {{295}},
  year         = {{2019}},
}

@inproceedings{9868,
  abstract     = {{In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\mu$m copper wire and a standard V-groove tool.}},
  author       = {{Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}},
  keywords     = {{adhesion, circuit reliability, deformation, diffusion, fatigue cracks, friction, interconnections, lead bonding, van der Waals forces, Cu, adhering process, adhesion process, ampacity improvement, bond quality improvement, cleaning process, diffusing process, fatigue fracture failure, friction energy, friction model, heat dissipation, mechanical strength, piezoelectric triaxial force sensor, predeforming process, size 500 mum, total contact area, van der Waals forces, wedge copper wire bonding, Bonding, Copper, Finite element analysis, Force, Friction, Substrates, Wires}},
  pages        = {{1549--1555}},
  title        = {{{Improving the bond quality of copper wire bonds using a friction model approach}}},
  doi          = {{10.1109/ECTC.2014.6897500}},
  year         = {{2014}},
}

@inproceedings{9784,
  abstract     = {{Piezoelectric inertia motors use the inertia of a body to drive it by means of a friction contact in a series of small steps. These motors can operate in ``stick-slip'' or ``slip-slip'' mode, with the fundamental frequency of the driving signal ranging from several Hertz to more than 100 kHz. To predict the motor characteristics, a Coulomb friction model is sufficient in many cases, but numerical simulation requires microscopic time steps. This contribution proposes a much faster simulation technique using one evaluation per period of the excitation signal. The proposed technique produces results very close to those of timestep simulation for ultrasonics inertia motors and allows direct determination of the steady-state velocity of an inertia motor from the motion profile of the driving part. Thus it is a useful simulation technique which can be applied in both analysis and design of inertia motors, especially for parameter studies and optimisation.}},
  author       = {{Hunstig, Matthias and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{Ultrasonics Symposium (IUS), 2012 IEEE International}},
  issn         = {{1948-5719}},
  keywords     = {{friction, ultrasonic motors, Coulomb friction model, efficient simulation technique, friction contact, high-frequency piezoelectric inertia motor, motor characteristics prediction, numerical simulation, slip-slip mode, stick-slip mode, time-step simulation, ultrasonic inertia motor, Acceleration, Acoustics, Actuators, Computational modeling, Friction, Numerical models, Steady-state}},
  pages        = {{277--280}},
  title        = {{{An efficient simulation technique for high-frequency piezoelectric inertia motors}}},
  doi          = {{10.1109/ULTSYM.2012.0068}},
  year         = {{2012}},
}