---
_id: '41971'
abstract:
- lang: ger
  text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau-
    und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und
    damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter
    auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen
    verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern
    in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität.
    In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand
    von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst
    wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen
    von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten
    die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität.
    Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich
    unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden
    hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen
    zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu
    einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte
    Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren
    Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers
    modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle
    ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten
    Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker
    im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert
    werden."
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
citation:
  ama: Althoff S. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using
    a Friction Model Approach</i>. Vol 15. Shaker; 2023.
  apa: Althoff, S. (2023). <i>Predicting the Bond Quality of Heavy Copper Wire Bonds
    using a Friction Model Approach</i> (Vol. 15). Shaker.
  bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
    title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction
    Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023},
    collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }'
  chicago: Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds
    Using a Friction Model Approach</i>. Vol. 15. Schriften Des Lehrstuhls Für Dynamik
    Und Mechatronik. Shaker, 2023.
  ieee: S. Althoff, <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using
    a Friction Model Approach</i>, vol. 15. Shaker, 2023.
  mla: Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using
    a Friction Model Approach</i>. Shaker, 2023.
  short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using
    a Friction Model Approach, Shaker, 2023.
date_created: 2023-02-10T13:05:19Z
date_updated: 2023-02-10T13:05:42Z
department:
- _id: '151'
extern: '1'
intvolume: '        15'
keyword:
- heavy copper bonding
- wire bonding
- quality prediction
- friction model
- point-contact-element
language:
- iso: eng
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff
page: '192'
publication_identifier:
  isbn:
  - 978-3-8440-8903-5
publication_status: published
publisher: Shaker
related_material:
  link:
  - relation: confirmation
    url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model
  Approach
type: dissertation
user_id: '55222'
volume: 15
year: '2023'
...
---
_id: '10334'
abstract:
- lang: eng
  text: Ultrasonic joining is a common industrial process. In the electronics industry
    it is used to form electrical connections, including those of dissimilar materials.
    Multiple influencing factors in ultrasonic joining are known and extensively investigated;
    process parameters like ultrasonic power, bond force, and bonding frequency of
    the ultrasonic vibration are known to have a high impact on a reliable joining
    process and need to be adapted for each new application with different geometry
    or materials. This contribution is focused on increasing ultrasonic power transmitted
    to the interface and keeping mechanical stresses during ultrasonic bonding low
    by using a multi-dimensional ultrasonic transducer concept. Bonding results for
    a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
    bonding are discussed.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
    multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors
    and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>'
  apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro,
    W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
    bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662.
    <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>'
  bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
    complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
    volume={295}, DOI={<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>},
    journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
    Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
    Walter}, year={2019}, pages={653–662} }'
  chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
    Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295
    (2019): 653–62. <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>.'
  ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
    “Using complex multi-dimensional vibration trajectories in ultrasonic bonding
    and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662,
    2019, doi: <a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>,
    vol. 295, 2019, pp. 653–62, doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
    Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: '       295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
  issn:
  - 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
  and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9868'
abstract:
- lang: eng
  text: In order to increase mechanical strength, heat dissipation and ampacity and
    to decrease failure through fatigue fracture, wedge copper wire bonding is being
    introduced as a standard interconnection method for mass production. To achieve
    the same process stability when using copper wire instead of aluminum wire a profound
    understanding of the bonding process is needed. Due to the higher hardness of
    copper compared to aluminum wire it is more difficult to approach the surfaces
    of wire and substrate to a level where van der Waals forces are able to arise
    between atoms. Also, enough friction energy referred to the total contact area
    has to be generated to activate the surfaces. Therefore, a friction model is used
    to simulate the joining process. This model calculates the resulting energy of
    partial areas in the contact surface and provides information about the adhesion
    process of each area. The focus here is on the arising of micro joints in the
    contact area depending on the location in the contact and time. To validate the
    model, different touchdown forces are used to vary the initial contact areas of
    wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
    up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
    for the real bonding process to map with the model. Test substrates as DBC and
    copper plate are used to show the different formations of a wedge bond connection
    due to hardness and reaction propensity. The experiments were done by using 500
    $\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
    wire bonds using a friction model approach. In: <i>Electronic Components and Technology
    Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the
    bond quality of copper wire bonds using a friction model approach. In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555).
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
    bond quality of copper wire bonds using a friction model approach}, DOI={<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>},
    booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
    author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
    year={2014}, pages={1549–1555} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
    the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014.
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
    of copper wire bonds using a friction model approach,” in <i>Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.
  mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
    a Friction Model Approach.” <i>Electronic Components and Technology Conference
    (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9784'
abstract:
- lang: eng
  text: Piezoelectric inertia motors use the inertia of a body to drive it by means
    of a friction contact in a series of small steps. These motors can operate in
    ``stick-slip'' or ``slip-slip'' mode, with the fundamental frequency of the driving
    signal ranging from several Hertz to more than 100 kHz. To predict the motor characteristics,
    a Coulomb friction model is sufficient in many cases, but numerical simulation
    requires microscopic time steps. This contribution proposes a much faster simulation
    technique using one evaluation per period of the excitation signal. The proposed
    technique produces results very close to those of timestep simulation for ultrasonics
    inertia motors and allows direct determination of the steady-state velocity of
    an inertia motor from the motion profile of the driving part. Thus it is a useful
    simulation technique which can be applied in both analysis and design of inertia
    motors, especially for parameter studies and optimisation.
author:
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Tobias
  full_name: Hemsel, Tobias
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  last_name: Sextro
citation:
  ama: 'Hunstig M, Hemsel T, Sextro W. An efficient simulation technique for high-frequency
    piezoelectric inertia motors. In: <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i>.
    ; 2012:277-280. doi:<a href="https://doi.org/10.1109/ULTSYM.2012.0068">10.1109/ULTSYM.2012.0068</a>'
  apa: Hunstig, M., Hemsel, T., &#38; Sextro, W. (2012). An efficient simulation technique
    for high-frequency piezoelectric inertia motors. In <i>Ultrasonics Symposium (IUS),
    2012 IEEE International</i> (pp. 277–280). <a href="https://doi.org/10.1109/ULTSYM.2012.0068">https://doi.org/10.1109/ULTSYM.2012.0068</a>
  bibtex: '@inproceedings{Hunstig_Hemsel_Sextro_2012, title={An efficient simulation
    technique for high-frequency piezoelectric inertia motors}, DOI={<a href="https://doi.org/10.1109/ULTSYM.2012.0068">10.1109/ULTSYM.2012.0068</a>},
    booktitle={Ultrasonics Symposium (IUS), 2012 IEEE International}, author={Hunstig,
    Matthias and Hemsel, Tobias and Sextro, Walter}, year={2012}, pages={277–280}
    }'
  chicago: Hunstig, Matthias, Tobias Hemsel, and Walter Sextro. “An Efficient Simulation
    Technique for High-Frequency Piezoelectric Inertia Motors.” In <i>Ultrasonics
    Symposium (IUS), 2012 IEEE International</i>, 277–80, 2012. <a href="https://doi.org/10.1109/ULTSYM.2012.0068">https://doi.org/10.1109/ULTSYM.2012.0068</a>.
  ieee: M. Hunstig, T. Hemsel, and W. Sextro, “An efficient simulation technique for
    high-frequency piezoelectric inertia motors,” in <i>Ultrasonics Symposium (IUS),
    2012 IEEE International</i>, 2012, pp. 277–280.
  mla: Hunstig, Matthias, et al. “An Efficient Simulation Technique for High-Frequency
    Piezoelectric Inertia Motors.” <i>Ultrasonics Symposium (IUS), 2012 IEEE International</i>,
    2012, pp. 277–80, doi:<a href="https://doi.org/10.1109/ULTSYM.2012.0068">10.1109/ULTSYM.2012.0068</a>.
  short: 'M. Hunstig, T. Hemsel, W. Sextro, in: Ultrasonics Symposium (IUS), 2012
    IEEE International, 2012, pp. 277–280.'
date_created: 2019-05-13T13:20:17Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.1109/ULTSYM.2012.0068
keyword:
- friction
- ultrasonic motors
- Coulomb friction model
- efficient simulation technique
- friction contact
- high-frequency piezoelectric inertia motor
- motor characteristics prediction
- numerical simulation
- slip-slip mode
- stick-slip mode
- time-step simulation
- ultrasonic inertia motor
- Acceleration
- Acoustics
- Actuators
- Computational modeling
- Friction
- Numerical models
- Steady-state
language:
- iso: eng
page: 277-280
publication: Ultrasonics Symposium (IUS), 2012 IEEE International
publication_identifier:
  issn:
  - 1948-5719
quality_controlled: '1'
status: public
title: An efficient simulation technique for high-frequency piezoelectric inertia
  motors
type: conference
user_id: '55222'
year: '2012'
...