---
_id: '9797'
abstract:
- lang: eng
  text: A model approach for wedge/wedge bonding copper wire is presented. The connection
    between wire and substrate is based on a variety of physical effects, but the
    dominant one is the friction based welding while applying ultrasound. Consequently,
    a friction model was used to investigate the welding process. This model is built
    up universal and can be used to describe the formation of micro welds in the time
    variant contact area between wire and substrate. Aim of the model is to identify
    the interactions between touchdown, bond normal force, ultrasonic power and bonding
    time. To do so, the contact area is discretized into partial areas where a Point
    Contact Model is applied. Based on this approach it is possible to simulate micro
    and macro slip inside the contact area between wire and substrate. The work done
    by friction force is a main criterion to define occurring micro joints which influence
    the subsequent welding.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling
    wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>.
    Orlando (Florida), USA; 2013. doi:<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based
    approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium
    on Microelectronics</i>. Orlando (Florida), USA. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida),
    USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>},
    booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff,
    Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction
    Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International
    Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach
    for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on
    Microelectronics</i>, 2013.
  mla: Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.”
    <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a
    href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International
    Symposium on Microelectronics, Orlando (Florida), USA, 2013.'
date_created: 2019-05-13T13:55:36Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.4071/isom-2013-TA67
keyword:
- Wire bonding
- friction modeling
- wire bond quality
- contact element modeling
language:
- iso: eng
place: Orlando (Florida), USA
publication: IMAPS 2013, 46th International Symposium on Microelectronics
status: public
title: A friction based approach for modeling wire bonding
type: conference
user_id: '55222'
year: '2013'
...