---
_id: '9959'
abstract:
- lang: eng
  text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical
    devices in power electronics. In order to facilitate powerful solutions combined
    with an increased efficiency, involving a material change from aluminum to copper
    wire as conductor material takes place in recent years. Due to the material related
    properties, copper wire bonding requires significant higher bond processing parameters
    such as bond force and ultrasonic power compared to aluminum which can lead to
    damages or a failure of the bonded component. Therefore, a profound knowledge
    of the processes prevailing during wire bonding is essential to optimize the application
    of the copper wires and consequently to achieve the demands on quality and reliability.
    The behavior of different natural surface oxides of aluminum and copper are assumed
    to be one reason for the deviation in the required bond parameters. Accordingly,
    the impact of differently pre-treated substrates surfaces on which the bonding
    is applied were investigated in this study. First, all conditions investigated
    (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning
    electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy
    and atomic force microscopy. In addition, hardness tests were performed as well
    as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded
    on the generated surfaces investigated. In consideration of the roughness, shear
    test of various bond times and microscopic images were evaluated. Finally, the
    results were compared and discussed. Overall, the current study indicates that
    an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the
    contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining
    parts. Based on the obtained results, it can be expected that due to an ideal
    set of Al-oxide layers, lower optimal bond parameters can used to reach high bond
    strength with good reliability properties.
author:
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Olexandr
  full_name: Grydin, Olexandr
  last_name: Grydin
- first_name: Florian
  full_name: Hengsbach, Florian
  last_name: Hengsbach
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Mirko
  full_name: Schaper, Mirko
  last_name: Schaper
- first_name: Karsten
  full_name: Guth, Karsten
  last_name: Guth
citation:
  ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on
    the ultrasonic copper wire bond process. In: <i>IEEE 66th Electronic Components
    and Technology Conference</i>. ; 2016:2111-2118. doi:<a href="https://doi.org/10.1109/ECTC.2016.91">10.1109/ECTC.2016.91</a>'
  apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,
    … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire
    bond process. In <i>IEEE 66th Electronic Components and Technology Conference</i>
    (pp. 2111–2118). <a href="https://doi.org/10.1109/ECTC.2016.91">https://doi.org/10.1109/ECTC.2016.91</a>
  bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016,
    title={Effect of different oxide layers on the ultrasonic copper wire bond process},
    DOI={<a href="https://doi.org/10.1109/ECTC.2016.91">10.1109/ECTC.2016.91</a>},
    booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock,
    Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach,
    Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016},
    pages={2111–2118} }'
  chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian
    Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different
    Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In <i>IEEE 66th Electronic
    Components and Technology Conference</i>, 2111–18, 2016. <a href="https://doi.org/10.1109/ECTC.2016.91">https://doi.org/10.1109/ECTC.2016.91</a>.
  ieee: F. Eacock <i>et al.</i>, “Effect of different oxide layers on the ultrasonic
    copper wire bond process,” in <i>IEEE 66th Electronic Components and Technology
    Conference</i>, 2016, pp. 2111–2118.
  mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic
    Copper Wire Bond Process.” <i>IEEE 66th Electronic Components and Technology Conference</i>,
    2016, pp. 2111–18, doi:<a href="https://doi.org/10.1109/ECTC.2016.91">10.1109/ECTC.2016.91</a>.
  short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M.
    Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference,
    2016, pp. 2111–2118.'
date_created: 2019-05-27T09:00:50Z
date_updated: 2019-09-16T10:38:59Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.91
keyword:
- Ultrasonic copper wire bonding
- Al-oxide
- Cuoxide
- oxide-free
- roughness
- morphology
language:
- iso: eng
page: 2111-2118
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Effect of different oxide layers on the ultrasonic copper wire bond process
type: conference
user_id: '55222'
year: '2016'
...