---
_id: '65316'
abstract:
- lang: eng
  text: Metasurfaces are powerful tools for manipulating light using small structures
    on the nanoscale. In most metasurfaces, near-field couplings are treated as being
    unfavorable perturbations. Here, we experimentally investigate a structure consisting
    of sinusoidally modulated silicon waveguides where near-field coupling of local
    resonances leads to negative coupling, i.e., a negative coupling constant. This
    gives rise to wave-vector-dependent eigenstates of elliptical, linear, and circular
    polarizations. In particular, fully circular polarization states are not only
    present at a single point in momentum space (k-space) but also along a line. This
    circular polarization line, as well as a linear polarization line, emanates from
    a polarization degeneracy at the Dirac point. We experimentally validate the existence
    of these eigenstates and demonstrate the energy-, polarization-, and wave vector
    dependence of this metasurface as well as its sensitivity to fabrication tolerances.
    By tuning the incident k-vector, certain polarization-energy eigenstates are strongly
    reflected, allowing for uses in angle-tunable polarization filters and light sources.
author:
- first_name: Helene
  full_name: Wetter, Helene
  last_name: Wetter
- first_name: Jan
  full_name: Wingenbach, Jan
  id: '69187'
  last_name: Wingenbach
- first_name: Falk
  full_name: Rehberg, Falk
  last_name: Rehberg
- first_name: Wenlong
  full_name: Gao, Wenlong
  last_name: Gao
- first_name: Stefan
  full_name: Schumacher, Stefan
  id: '27271'
  last_name: Schumacher
  orcid: 0000-0003-4042-4951
- first_name: Thomas
  full_name: Zentgraf, Thomas
  id: '30525'
  last_name: Zentgraf
  orcid: 0000-0002-8662-1101
citation:
  ama: Wetter H, Wingenbach J, Rehberg F, Gao W, Schumacher S, Zentgraf T. Polarization-
    and Wave-Vector Selective Optical Metasurface with Near-Field Coupling. <i>ACS
    Photonics</i>. 2026;13:2128-2133. doi:<a href="https://doi.org/10.1021/acsphotonics.5c02865">10.1021/acsphotonics.5c02865</a>
  apa: Wetter, H., Wingenbach, J., Rehberg, F., Gao, W., Schumacher, S., &#38; Zentgraf,
    T. (2026). Polarization- and Wave-Vector Selective Optical Metasurface with Near-Field
    Coupling. <i>ACS Photonics</i>, <i>13</i>, 2128–2133. <a href="https://doi.org/10.1021/acsphotonics.5c02865">https://doi.org/10.1021/acsphotonics.5c02865</a>
  bibtex: '@article{Wetter_Wingenbach_Rehberg_Gao_Schumacher_Zentgraf_2026, title={Polarization-
    and Wave-Vector Selective Optical Metasurface with Near-Field Coupling}, volume={13},
    DOI={<a href="https://doi.org/10.1021/acsphotonics.5c02865">10.1021/acsphotonics.5c02865</a>},
    journal={ACS Photonics}, publisher={American Chemical Society (ACS)}, author={Wetter,
    Helene and Wingenbach, Jan and Rehberg, Falk and Gao, Wenlong and Schumacher,
    Stefan and Zentgraf, Thomas}, year={2026}, pages={2128–2133} }'
  chicago: 'Wetter, Helene, Jan Wingenbach, Falk Rehberg, Wenlong Gao, Stefan Schumacher,
    and Thomas Zentgraf. “Polarization- and Wave-Vector Selective Optical Metasurface
    with Near-Field Coupling.” <i>ACS Photonics</i> 13 (2026): 2128–33. <a href="https://doi.org/10.1021/acsphotonics.5c02865">https://doi.org/10.1021/acsphotonics.5c02865</a>.'
  ieee: 'H. Wetter, J. Wingenbach, F. Rehberg, W. Gao, S. Schumacher, and T. Zentgraf,
    “Polarization- and Wave-Vector Selective Optical Metasurface with Near-Field Coupling,”
    <i>ACS Photonics</i>, vol. 13, pp. 2128–2133, 2026, doi: <a href="https://doi.org/10.1021/acsphotonics.5c02865">10.1021/acsphotonics.5c02865</a>.'
  mla: Wetter, Helene, et al. “Polarization- and Wave-Vector Selective Optical Metasurface
    with Near-Field Coupling.” <i>ACS Photonics</i>, vol. 13, American Chemical Society
    (ACS), 2026, pp. 2128–33, doi:<a href="https://doi.org/10.1021/acsphotonics.5c02865">10.1021/acsphotonics.5c02865</a>.
  short: H. Wetter, J. Wingenbach, F. Rehberg, W. Gao, S. Schumacher, T. Zentgraf,
    ACS Photonics 13 (2026) 2128–2133.
date_created: 2026-04-02T07:25:30Z
date_updated: 2026-04-20T05:09:57Z
department:
- _id: '15'
- _id: '230'
- _id: '289'
- _id: '623'
doi: 10.1021/acsphotonics.5c02865
external_id:
  arxiv:
  - '2512.14452'
intvolume: '        13'
keyword:
- metasurface
- waveguides
- Dirac point
- polarization
- negative coupling
language:
- iso: eng
main_file_link:
- url: https://pubs.acs.org/doi/10.1021/acsphotonics.5c02865
page: 2128-2133
publication: ACS Photonics
publication_identifier:
  issn:
  - 2330-4022
  - 2330-4022
publication_status: published
publisher: American Chemical Society (ACS)
quality_controlled: '1'
status: public
title: Polarization- and Wave-Vector Selective Optical Metasurface with Near-Field
  Coupling
type: journal_article
user_id: '30525'
volume: 13
year: '2026'
...
---
_id: '62079'
abstract:
- lang: eng
  text: This paper investigates two modeling approaches for the simulation of the
    deformation and decomposition behavior of preconsolidated rovings above the thermoplastic
    matrix{\textquoteright} melting temperature. This is crucial for capturing the
    local material structure after processes introducing highly localized deformation
    such as mechanical joining processes between metal and fiber reinforced thermoplastics
    (FRTP). A generic finite element (FE) model is developed, incorporating interfaces
    discretized through either cohesive zone (CZ) elements or Coulomb friction-based
    contacts. The material parameters for the FE elements are derived from the initial
    stiffness of a statistical volume element (SVE) at micro scale modelled with an
    Arbitrary-Lagrange-Eulerian method for three load cases. The CZ properties calculated
    are based on the shear viscosity of the composite. The CZ and contact modelling
    approaches are evaluated using three load cases of the SVE, comparing force-displacement
    curves. Under simple loading conditions, such as normal pressure tension and bending,
    both methods produce similar results; however, in complex load cases, the CZ approach
    shows clear advantages in handling interface interactions and shows robust simulations.
    The CZ approach thus presents a promising method for simulating roving decomposition
    in FRTP-metal joining applications above the matrix{\textquoteright} melting temperature.
author:
- first_name: Benjamin
  full_name: Gröger, Benjamin
  last_name: Gröger
- first_name: Johannes
  full_name: Gerritzen, Johannes
  id: '105344'
  last_name: Gerritzen
  orcid: 0000-0002-0169-8602
- first_name: Andreas
  full_name: Hornig, Andreas
  last_name: Hornig
- first_name: Maik
  full_name: Gude, Maik
  last_name: Gude
citation:
  ama: 'Gröger B, Gerritzen J, Hornig A, Gude M. Modeling approaches for the decomposition
    behavior of preconsolidated rovings throughout local deformation processes. In:
    Meschut G, Bobbert M, Duflou J, et al., eds. <i>Sheet Metal 2025</i>. Materials
    Research Proceedings. Materials Research Forum LLC, Materials Research Foundations;
    2025:268–275. doi:<a href="https://doi.org/10.21741/9781644903551-33">10.21741/9781644903551-33</a>'
  apa: Gröger, B., Gerritzen, J., Hornig, A., &#38; Gude, M. (2025). Modeling approaches
    for the decomposition behavior of preconsolidated rovings throughout local deformation
    processes. In G. Meschut, M. Bobbert, J. Duflou, L. Fratini, H. Hagenah, P. Martins,
    M. Merklein, &#38; F. Micari (Eds.), <i>Sheet Metal 2025</i> (pp. 268–275). Materials
    Research Forum LLC, Materials Research Foundations. <a href="https://doi.org/10.21741/9781644903551-33">https://doi.org/10.21741/9781644903551-33</a>
  bibtex: '@inproceedings{Gröger_Gerritzen_Hornig_Gude_2025, series={Materials Research
    Proceedings}, title={Modeling approaches for the decomposition behavior of preconsolidated
    rovings throughout local deformation processes}, DOI={<a href="https://doi.org/10.21741/9781644903551-33">10.21741/9781644903551-33</a>},
    booktitle={Sheet Metal 2025}, publisher={Materials Research Forum LLC, Materials
    Research Foundations}, author={Gröger, Benjamin and Gerritzen, Johannes and Hornig,
    Andreas and Gude, Maik}, editor={Meschut, G. and Bobbert, M. and Duflou, J. and
    Fratini, L. and Hagenah, H. and Martins, P. and Merklein, M. and Micari, F.},
    year={2025}, pages={268–275}, collection={Materials Research Proceedings} }'
  chicago: Gröger, Benjamin, Johannes Gerritzen, Andreas Hornig, and Maik Gude. “Modeling
    Approaches for the Decomposition Behavior of Preconsolidated Rovings throughout
    Local Deformation Processes.” In <i>Sheet Metal 2025</i>, edited by G. Meschut,
    M. Bobbert, J. Duflou, L. Fratini, H. Hagenah, P. Martins, M. Merklein, and F.
    Micari, 268–275. Materials Research Proceedings. Materials Research Forum LLC,
    Materials Research Foundations, 2025. <a href="https://doi.org/10.21741/9781644903551-33">https://doi.org/10.21741/9781644903551-33</a>.
  ieee: 'B. Gröger, J. Gerritzen, A. Hornig, and M. Gude, “Modeling approaches for
    the decomposition behavior of preconsolidated rovings throughout local deformation
    processes,” in <i>Sheet Metal 2025</i>, 2025, pp. 268–275, doi: <a href="https://doi.org/10.21741/9781644903551-33">10.21741/9781644903551-33</a>.'
  mla: Gröger, Benjamin, et al. “Modeling Approaches for the Decomposition Behavior
    of Preconsolidated Rovings throughout Local Deformation Processes.” <i>Sheet Metal
    2025</i>, edited by G. Meschut et al., Materials Research Forum LLC, Materials
    Research Foundations, 2025, pp. 268–275, doi:<a href="https://doi.org/10.21741/9781644903551-33">10.21741/9781644903551-33</a>.
  short: 'B. Gröger, J. Gerritzen, A. Hornig, M. Gude, in: G. Meschut, M. Bobbert,
    J. Duflou, L. Fratini, H. Hagenah, P. Martins, M. Merklein, F. Micari (Eds.),
    Sheet Metal 2025, Materials Research Forum LLC, Materials Research Foundations,
    2025, pp. 268–275.'
date_created: 2025-11-04T12:48:21Z
date_updated: 2026-02-27T06:43:19Z
doi: 10.21741/9781644903551-33
editor:
- first_name: G.
  full_name: Meschut, G.
  last_name: Meschut
- first_name: M.
  full_name: Bobbert, M.
  last_name: Bobbert
- first_name: J.
  full_name: Duflou, J.
  last_name: Duflou
- first_name: L.
  full_name: Fratini, L.
  last_name: Fratini
- first_name: H.
  full_name: Hagenah, H.
  last_name: Hagenah
- first_name: P.
  full_name: Martins, P.
  last_name: Martins
- first_name: M.
  full_name: Merklein, M.
  last_name: Merklein
- first_name: F.
  full_name: Micari, F.
  last_name: Micari
keyword:
- Finite Element Method (FEM)
- Process
- Thermoplastic Fiber Reinforced Plastic
language:
- iso: eng
page: 268–275
project:
- _id: '130'
  name: 'TRR 285:  Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen
    Prozessketten'
- _id: '137'
  name: TRR 285 - Subproject A03
- _id: '131'
  name: TRR 285 - Project Area A
publication: Sheet Metal 2025
publication_identifier:
  isbn:
  - 978-1-64490-354-4
publisher: Materials Research Forum LLC, Materials Research Foundations
series_title: Materials Research Proceedings
status: public
title: Modeling approaches for the decomposition behavior of preconsolidated rovings
  throughout local deformation processes
type: conference
user_id: '105344'
year: '2025'
...
---
_id: '54847'
abstract:
- lang: eng
  text: The widespread adoption of ultra-high strength steels, due to their high bulk
    resistivity, intensifies expulsion issues in resistance spot welding (RSW), deteriorating
    both the spot weld and surface quality. This study presents a novel approach to
    prevent expulsion by employing a preheating current. Through characteristic analysis
    of joint formation under critical welding current, the importance of plastic material
    encapsulation around the weld nugget (plastic shell) at high temperatures in preventing
    expulsion is highlighted. To evaluate the effect of preheating on the plastic
    shell and understand its mechanism in expulsion prevention, a two-dimensional
    welding simulation model for dissimilar ultra-high strength steel joints was established.
    The results showed that optimal preheating enhances the thickness of the plastic
    shell, improving its ability to encapsulate the weld nugget during the primary
    welding phase, thereby diminishing expulsion risks. Experimental validation confirmed
    that by employing the optimal preheating current, the maximum nugget diameter
    was enhanced to 9.42 mm, marking an increase of 13.4 % and extending the weldable
    current range by 27.5 %. Under quasi-static cross-tensile loading, joints with
    preheating demonstrated a 7.9 % enhancement in maximum load-bearing capacity compared
    to joints without preheating, showing a reproducible and complete pull-out failure
    mode within the heat-affected zone. This study offers a prevention method based
    on underlying mechanisms, providing a new perspective for future research on welding
    parameter optimization with the aim of expulsion prevention.
article_type: original
author:
- first_name: Keke
  full_name: Yang, Keke
  id: '65085'
  last_name: Yang
  orcid: 0000-0001-9201-9304
- first_name: Bassel
  full_name: El-Sari, Bassel
  last_name: El-Sari
- first_name: Viktoria
  full_name: Olfert, Viktoria
  id: '5974'
  last_name: Olfert
- first_name: Zhuoqun
  full_name: Wang, Zhuoqun
  last_name: Wang
- first_name: Max
  full_name: Biegler, Max
  last_name: Biegler
- first_name: Michael
  full_name: Rethmeier, Michael
  last_name: Rethmeier
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Yang K, El-Sari B, Olfert V, et al. Expulsion prevention in resistance spot
    welding of dissimilar joints with ultra-high strength steel: An analysis of the
    mechanism and effect of preheating current. <i>Journal of Manufacturing Processes</i>.
    2024;124:489-502. doi:<a href="https://doi.org/10.1016/j.jmapro.2024.06.034">10.1016/j.jmapro.2024.06.034</a>'
  apa: 'Yang, K., El-Sari, B., Olfert, V., Wang, Z., Biegler, M., Rethmeier, M., &#38;
    Meschut, G. (2024). Expulsion prevention in resistance spot welding of dissimilar
    joints with ultra-high strength steel: An analysis of the mechanism and effect
    of preheating current. <i>Journal of Manufacturing Processes</i>, <i>124</i>,
    489–502. <a href="https://doi.org/10.1016/j.jmapro.2024.06.034">https://doi.org/10.1016/j.jmapro.2024.06.034</a>'
  bibtex: '@article{Yang_El-Sari_Olfert_Wang_Biegler_Rethmeier_Meschut_2024, title={Expulsion
    prevention in resistance spot welding of dissimilar joints with ultra-high strength
    steel: An analysis of the mechanism and effect of preheating current}, volume={124},
    DOI={<a href="https://doi.org/10.1016/j.jmapro.2024.06.034">10.1016/j.jmapro.2024.06.034</a>},
    journal={Journal of Manufacturing Processes}, publisher={Elsevier BV}, author={Yang,
    Keke and El-Sari, Bassel and Olfert, Viktoria and Wang, Zhuoqun and Biegler, Max
    and Rethmeier, Michael and Meschut, Gerson}, year={2024}, pages={489–502} }'
  chicago: 'Yang, Keke, Bassel El-Sari, Viktoria Olfert, Zhuoqun Wang, Max Biegler,
    Michael Rethmeier, and Gerson Meschut. “Expulsion Prevention in Resistance Spot
    Welding of Dissimilar Joints with Ultra-High Strength Steel: An Analysis of the
    Mechanism and Effect of Preheating Current.” <i>Journal of Manufacturing Processes</i>
    124 (2024): 489–502. <a href="https://doi.org/10.1016/j.jmapro.2024.06.034">https://doi.org/10.1016/j.jmapro.2024.06.034</a>.'
  ieee: 'K. Yang <i>et al.</i>, “Expulsion prevention in resistance spot welding of
    dissimilar joints with ultra-high strength steel: An analysis of the mechanism
    and effect of preheating current,” <i>Journal of Manufacturing Processes</i>,
    vol. 124, pp. 489–502, 2024, doi: <a href="https://doi.org/10.1016/j.jmapro.2024.06.034">10.1016/j.jmapro.2024.06.034</a>.'
  mla: 'Yang, Keke, et al. “Expulsion Prevention in Resistance Spot Welding of Dissimilar
    Joints with Ultra-High Strength Steel: An Analysis of the Mechanism and Effect
    of Preheating Current.” <i>Journal of Manufacturing Processes</i>, vol. 124, Elsevier
    BV, 2024, pp. 489–502, doi:<a href="https://doi.org/10.1016/j.jmapro.2024.06.034">10.1016/j.jmapro.2024.06.034</a>.'
  short: K. Yang, B. El-Sari, V. Olfert, Z. Wang, M. Biegler, M. Rethmeier, G. Meschut,
    Journal of Manufacturing Processes 124 (2024) 489–502.
date_created: 2024-06-23T21:58:29Z
date_updated: 2024-10-18T06:59:27Z
ddc:
- '670'
department:
- _id: '157'
doi: 10.1016/j.jmapro.2024.06.034
file:
- access_level: closed
  content_type: application/pdf
  creator: kekeyang
  date_created: 2024-06-23T21:59:20Z
  date_updated: 2024-06-23T21:59:20Z
  file_id: '54848'
  file_name: 1-s2.0-S1526612524006145-main.pdf
  file_size: 12432409
  relation: main_file
  success: 1
file_date_updated: 2024-06-23T21:59:20Z
has_accepted_license: '1'
intvolume: '       124'
keyword:
- Expulsion Resistance spot welding Finite element modelling Preheating Weldable current
  range Ultra-high strength steel
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: https://www.sciencedirect.com/science/article/pii/S1526612524006145
oa: '1'
page: 489-502
publication: Journal of Manufacturing Processes
publication_identifier:
  issn:
  - 1526-6125
publication_status: published
publisher: Elsevier BV
quality_controlled: '1'
status: public
title: 'Expulsion prevention in resistance spot welding of dissimilar joints with
  ultra-high strength steel: An analysis of the mechanism and effect of preheating
  current'
type: journal_article
user_id: '65085'
volume: 124
year: '2024'
...
---
_id: '61900'
abstract:
- lang: eng
  text: Background Anti-Muslim and anti-Islam attitudes are widespread in contemporary
    western societies. A grassroots movement of mosques tries to reduce prejudice
    by organizing guided mosque tours for non-Muslims. While this is an opportunity
    for intergroup contact in a social psychological sense, contact occurs under sometimes
    difficult conditions. As yet, its effects have not been investigated empirically.
    Objective We examine (a) whether visits have an immediate and medium-term effect
    on prejudice toward Islam and (b) how they change the visitors’ subjective images
    of Muslims. Methods (a) We survey N = 324 secondary school students in a three-wave
    panel study in 6 guided mosque tours in different parts of Germany, including
    a control sample. The tour programme was in line with common practice in the mosques.
    Standardized measurements were taken immediately before and after the tour and
    again several months later. (b) We asked about subjective images of Muslims and
    had subjects report their spontaneous associations with the term Muslim. Results
    (a) Most, but not all, mosque visits significantly alleviate anti-Islam prejudice
    in the short term. The effects fall off after several months. (b) After the visit,
    the image of Muslims possessed more concrete religious content, while negative
    and menacing associations, such as oppression of women, threat, or so-called Islamic
    State have decreased. Conclusions Outgroup contact in a mosque works as predicted
    by the intergroup contact research, even under less than optimal conditions. However,
    there is potential for improvement of the setup of tours in the interest of a
    more sustainable impact.
author:
- first_name: Olga
  full_name: Janzen, Olga
  last_name: Janzen
- first_name: Isabell
  full_name: Diekmann, Isabell
  id: '119325'
  last_name: Diekmann
- first_name: Dorian
  full_name: Tsolak, Dorian
  last_name: Tsolak
- first_name: Kurt
  full_name: Salentin, Kurt
  last_name: Salentin
citation:
  ama: Janzen O, Diekmann I, Tsolak D, Salentin K. Do Guided Mosque Tours Alleviate
    the Prejudice of Non-Muslims against Islam and Muslims? Evidence from a Quasi-Experimental
    Panel Study from Germany. <i>Zeitschrift für Religion, Gesellschaft und Politik</i>.
    2024;8(1):129–159. doi:<a href="https://doi.org/10.1007/s41682-023-00161-4">10.1007/s41682-023-00161-4</a>
  apa: Janzen, O., Diekmann, I., Tsolak, D., &#38; Salentin, K. (2024). Do Guided
    Mosque Tours Alleviate the Prejudice of Non-Muslims against Islam and Muslims?
    Evidence from a Quasi-Experimental Panel Study from Germany. <i>Zeitschrift Für
    Religion, Gesellschaft Und Politik</i>, <i>8</i>(1), 129–159. <a href="https://doi.org/10.1007/s41682-023-00161-4">https://doi.org/10.1007/s41682-023-00161-4</a>
  bibtex: '@article{Janzen_Diekmann_Tsolak_Salentin_2024, title={Do Guided Mosque
    Tours Alleviate the Prejudice of Non-Muslims against Islam and Muslims? Evidence
    from a Quasi-Experimental Panel Study from Germany}, volume={8}, DOI={<a href="https://doi.org/10.1007/s41682-023-00161-4">10.1007/s41682-023-00161-4</a>},
    number={1}, journal={Zeitschrift für Religion, Gesellschaft und Politik}, publisher={Springer
    VS}, author={Janzen, Olga and Diekmann, Isabell and Tsolak, Dorian and Salentin,
    Kurt}, year={2024}, pages={129–159} }'
  chicago: 'Janzen, Olga, Isabell Diekmann, Dorian Tsolak, and Kurt Salentin. “Do
    Guided Mosque Tours Alleviate the Prejudice of Non-Muslims against Islam and Muslims?
    Evidence from a Quasi-Experimental Panel Study from Germany.” <i>Zeitschrift Für
    Religion, Gesellschaft Und Politik</i> 8, no. 1 (2024): 129–159. <a href="https://doi.org/10.1007/s41682-023-00161-4">https://doi.org/10.1007/s41682-023-00161-4</a>.'
  ieee: 'O. Janzen, I. Diekmann, D. Tsolak, and K. Salentin, “Do Guided Mosque Tours
    Alleviate the Prejudice of Non-Muslims against Islam and Muslims? Evidence from
    a Quasi-Experimental Panel Study from Germany,” <i>Zeitschrift für Religion, Gesellschaft
    und Politik</i>, vol. 8, no. 1, pp. 129–159, 2024, doi: <a href="https://doi.org/10.1007/s41682-023-00161-4">10.1007/s41682-023-00161-4</a>.'
  mla: Janzen, Olga, et al. “Do Guided Mosque Tours Alleviate the Prejudice of Non-Muslims
    against Islam and Muslims? Evidence from a Quasi-Experimental Panel Study from
    Germany.” <i>Zeitschrift Für Religion, Gesellschaft Und Politik</i>, vol. 8, no.
    1, Springer VS, 2024, pp. 129–159, doi:<a href="https://doi.org/10.1007/s41682-023-00161-4">10.1007/s41682-023-00161-4</a>.
  short: O. Janzen, I. Diekmann, D. Tsolak, K. Salentin, Zeitschrift Für Religion,
    Gesellschaft Und Politik 8 (2024) 129–159.
date_created: 2025-10-21T11:21:41Z
date_updated: 2025-10-21T12:09:06Z
doi: 10.1007/s41682-023-00161-4
extern: '1'
intvolume: '         8'
issue: '1'
keyword:
- Intergroup contact
- Anti-Islam attitudes
- Anti-Muslim attitudes
- Prejudice
- Youth
language:
- iso: eng
page: ' 129–159'
publication: Zeitschrift für Religion, Gesellschaft und Politik
publication_identifier:
  issn:
  - 2510-1226
publisher: Springer VS
status: public
title: Do Guided Mosque Tours Alleviate the Prejudice of Non-Muslims against Islam
  and Muslims? Evidence from a Quasi-Experimental Panel Study from Germany
type: journal_article
user_id: '119325'
volume: 8
year: '2024'
...
---
_id: '50479'
abstract:
- lang: eng
  text: Verifying assertions is an essential part of creating and maintaining knowledge
    graphs. Most often, this task cannot be carried out manually due to the sheer
    size of modern knowledge graphs. Hence, automatic fact-checking approaches have
    been proposed over the last decade. These approaches aim to compute automatically
    whether a given assertion is correct or incorrect. However, most fact-checking
    approaches are binary classifiers that fail to consider the volatility of some
    assertions, i.e., the fact that such assertions are only valid at certain times
    or for specific time intervals. Moreover, the few approaches able to predict when
    an assertion was valid (i.e., time-point prediction approaches) rely on manual
    feature engineering. This paper presents TEMPORALFC, a temporal fact-checking
    approach that uses multiple sources of background knowledge to assess the veracity
    and temporal validity of a given assertion. We evaluate TEMPORALFC on two datasets
    and compare it to the state of the art in fact-checking and time-point prediction.
    Our results suggest that TEMPORALFC outperforms the state of the art on the fact-checking
    task by 0.13 to 0.15 in terms of Area Under the Receiver Operating Characteristic
    curve and on the time-point prediction task by 0.25 to 0.27 in terms of Mean Reciprocal
    Rank. Our code is open-source and can be found at https://github.com/dice-group/TemporalFC.
author:
- first_name: Umair
  full_name: Qudus, Umair
  last_name: Qudus
- first_name: Michael
  full_name: Röder, Michael
  last_name: Röder
- first_name: Sabrina
  full_name: Kirrane, Sabrina
  last_name: Kirrane
- first_name: Axel-Cyrille Ngonga
  full_name: Ngomo, Axel-Cyrille Ngonga
  last_name: Ngomo
citation:
  ama: 'Qudus U, Röder M, Kirrane S, Ngomo A-CN. TemporalFC: A Temporal Fact Checking
    Approach over Knowledge Graphs. In: R. Payne T, Presutti V, Qi G, et al., eds.
    <i>The Semantic Web – ISWC 2023</i>. Vol 14265.  Lecture Notes in Computer Science.
    Springer, Cham; 2023:465–483. doi:<a href="https://doi.org/10.1007/978-3-031-47240-4_25">10.1007/978-3-031-47240-4_25</a>'
  apa: 'Qudus, U., Röder, M., Kirrane, S., &#38; Ngomo, A.-C. N. (2023). TemporalFC:
    A Temporal Fact Checking Approach over Knowledge Graphs. In T. R. Payne, V. Presutti,
    G. Qi, M. Poveda-Villalón, G. Stoilos, L. Hollink, Z. Kaoudi, G. Cheng, &#38;
    J. Li (Eds.), <i>The Semantic Web – ISWC 2023</i> (Vol. 14265, pp. 465–483). Springer,
    Cham. <a href="https://doi.org/10.1007/978-3-031-47240-4_25">https://doi.org/10.1007/978-3-031-47240-4_25</a>'
  bibtex: '@inproceedings{Qudus_Röder_Kirrane_Ngomo_2023, place={Cham}, series={ Lecture
    Notes in Computer Science}, title={TemporalFC: A Temporal Fact Checking Approach
    over Knowledge Graphs}, volume={14265}, DOI={<a href="https://doi.org/10.1007/978-3-031-47240-4_25">10.1007/978-3-031-47240-4_25</a>},
    booktitle={The Semantic Web – ISWC 2023}, publisher={Springer, Cham}, author={Qudus,
    Umair and Röder, Michael and Kirrane, Sabrina and Ngomo, Axel-Cyrille Ngonga},
    editor={R. Payne, Terry and Presutti, Valentina and Qi, Guilin and Poveda-Villalón,
    María and Stoilos, Giorgos and Hollink, Laura and Kaoudi, Zoi and Cheng, Gong
    and Li, Juanzi}, year={2023}, pages={465–483}, collection={ Lecture Notes in Computer
    Science} }'
  chicago: 'Qudus, Umair, Michael Röder, Sabrina Kirrane, and Axel-Cyrille Ngonga
    Ngomo. “TemporalFC: A Temporal Fact Checking Approach over Knowledge Graphs.”
    In <i>The Semantic Web – ISWC 2023</i>, edited by Terry R. Payne, Valentina Presutti,
    Guilin Qi, María Poveda-Villalón, Giorgos Stoilos, Laura Hollink, Zoi Kaoudi,
    Gong Cheng, and Juanzi Li, 14265:465–483.  Lecture Notes in Computer Science.
    Cham: Springer, Cham, 2023. <a href="https://doi.org/10.1007/978-3-031-47240-4_25">https://doi.org/10.1007/978-3-031-47240-4_25</a>.'
  ieee: 'U. Qudus, M. Röder, S. Kirrane, and A.-C. N. Ngomo, “TemporalFC: A Temporal
    Fact Checking Approach over Knowledge Graphs,” in <i>The Semantic Web – ISWC 2023</i>,
    Athens, Greece, 2023, vol. 14265, pp. 465–483, doi: <a href="https://doi.org/10.1007/978-3-031-47240-4_25">10.1007/978-3-031-47240-4_25</a>.'
  mla: 'Qudus, Umair, et al. “TemporalFC: A Temporal Fact Checking Approach over Knowledge
    Graphs.” <i>The Semantic Web – ISWC 2023</i>, edited by Terry R. Payne et al.,
    vol. 14265, Springer, Cham, 2023, pp. 465–483, doi:<a href="https://doi.org/10.1007/978-3-031-47240-4_25">10.1007/978-3-031-47240-4_25</a>.'
  short: 'U. Qudus, M. Röder, S. Kirrane, A.-C.N. Ngomo, in: T. R. Payne, V. Presutti,
    G. Qi, M. Poveda-Villalón, G. Stoilos, L. Hollink, Z. Kaoudi, G. Cheng, J. Li
    (Eds.), The Semantic Web – ISWC 2023, Springer, Cham, Cham, 2023, pp. 465–483.'
conference:
  end_date: 2023-11-10
  location: Athens, Greece
  name: The Semantic Web – ISWC 2023
  start_date: 2023-11-06
date_created: 2024-01-13T11:22:15Z
date_updated: 2024-01-13T11:48:28Z
ddc:
- '006'
department:
- _id: '34'
doi: 10.1007/978-3-031-47240-4_25
editor:
- first_name: Terry
  full_name: R. Payne, Terry
  last_name: R. Payne
- first_name: Valentina
  full_name: Presutti, Valentina
  last_name: Presutti
- first_name: Guilin
  full_name: Qi, Guilin
  last_name: Qi
- first_name: María
  full_name: Poveda-Villalón, María
  last_name: Poveda-Villalón
- first_name: Giorgos
  full_name: Stoilos, Giorgos
  last_name: Stoilos
- first_name: Laura
  full_name: Hollink, Laura
  last_name: Hollink
- first_name: Zoi
  full_name: Kaoudi, Zoi
  last_name: Kaoudi
- first_name: Gong
  full_name: Cheng, Gong
  last_name: Cheng
- first_name: Juanzi
  full_name: Li, Juanzi
  last_name: Li
file:
- access_level: closed
  content_type: application/pdf
  creator: uqudus
  date_created: 2024-01-13T11:25:48Z
  date_updated: 2024-01-13T11:25:48Z
  file_id: '50480'
  file_name: ISWC 2023 TemporalFC-A Temporal Fact Checking approach over Knowledge
    Graphs.pdf
  file_size: 1944818
  relation: main_file
  success: 1
file_date_updated: 2024-01-13T11:25:48Z
has_accepted_license: '1'
intvolume: '     14265'
jel:
- C
keyword:
- temporal fact checking · ensemble learning · transfer learning · time-point prediction
  · temporal knowledge graphs
language:
- iso: eng
page: 465–483
place: Cham
project:
- _id: '410'
  grant_number: '860801'
  name: 'KnowGraphs: KnowGraphs: Knowledge Graphs at Scale'
publication: The Semantic Web – ISWC 2023
publication_identifier:
  isbn:
  - '9783031472398'
  - '9783031472404'
  issn:
  - 0302-9743
  - 1611-3349
publication_status: published
publisher: Springer, Cham
series_title: ' Lecture Notes in Computer Science'
status: public
title: 'TemporalFC: A Temporal Fact Checking Approach over Knowledge Graphs'
type: conference
user_id: '83392'
volume: 14265
year: '2023'
...
---
_id: '41971'
abstract:
- lang: ger
  text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau-
    und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und
    damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter
    auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen
    verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern
    in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität.
    In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand
    von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst
    wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen
    von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten
    die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität.
    Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich
    unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden
    hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen
    zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu
    einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte
    Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren
    Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers
    modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle
    ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten
    Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker
    im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert
    werden."
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
citation:
  ama: Althoff S. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using
    a Friction Model Approach</i>. Vol 15. Shaker; 2023.
  apa: Althoff, S. (2023). <i>Predicting the Bond Quality of Heavy Copper Wire Bonds
    using a Friction Model Approach</i> (Vol. 15). Shaker.
  bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
    title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction
    Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023},
    collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }'
  chicago: Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds
    Using a Friction Model Approach</i>. Vol. 15. Schriften Des Lehrstuhls Für Dynamik
    Und Mechatronik. Shaker, 2023.
  ieee: S. Althoff, <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using
    a Friction Model Approach</i>, vol. 15. Shaker, 2023.
  mla: Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using
    a Friction Model Approach</i>. Shaker, 2023.
  short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using
    a Friction Model Approach, Shaker, 2023.
date_created: 2023-02-10T13:05:19Z
date_updated: 2023-02-10T13:05:42Z
department:
- _id: '151'
extern: '1'
intvolume: '        15'
keyword:
- heavy copper bonding
- wire bonding
- quality prediction
- friction model
- point-contact-element
language:
- iso: eng
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff
page: '192'
publication_identifier:
  isbn:
  - 978-3-8440-8903-5
publication_status: published
publisher: Shaker
related_material:
  link:
  - relation: confirmation
    url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model
  Approach
type: dissertation
user_id: '55222'
volume: 15
year: '2023'
...
---
_id: '33509'
abstract:
- lang: eng
  text: In this publication a novel method for far-field prediction from magnetic
    Huygens box data based on the boundary element method (BEM) is presented. Two
    examples are considered for the validation of this method. The first example represents
    an electric dipole so that the obtained calculations can be compared to an analytical
    solution. As a second example, a printed circuit board is considered and the calculated
    far-field is compared to a fullwave simulation. In both cases, the calculations
    for different field integral equations are under comparison, and the results indicate
    that the presented method performs very well with a combined field integral equation,
    for the specified problem, when only magnetic Huygens box data is given.
author:
- first_name: Christoph
  full_name: Marschalt, Christoph
  last_name: Marschalt
- first_name: Dominik
  full_name: Schroder, Dominik
  last_name: Schroder
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  id: '20179'
  last_name: Hilleringmann
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Denis
  full_name: Sievers, Denis
  last_name: Sievers
- first_name: Jens
  full_name: Förstner, Jens
  id: '158'
  last_name: Förstner
  orcid: 0000-0001-7059-9862
citation:
  ama: 'Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic
    Huygens Box Data using the Boundary Element Method. In: <i>2022 Smart Systems
    Integration (SSI)</i>. IEEE; 2022. doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>'
  apa: Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn,
    H., Sievers, D., &#38; Förstner, J. (2022). Far-field Calculation from magnetic
    Huygens Box Data using the Boundary Element Method. <i>2022 Smart Systems Integration
    (SSI)</i>. 2022 Smart Systems Integration (SSI), Grenoble, France. <a href="https://doi.org/10.1109/ssi56489.2022.9901431">https://doi.org/10.1109/ssi56489.2022.9901431</a>
  bibtex: '@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Förstner_2022,
    place={Grenoble, France}, title={Far-field Calculation from magnetic Huygens Box
    Data using the Boundary Element Method}, DOI={<a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>},
    booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt,
    Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and
    Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Förstner, Jens}, year={2022}
    }'
  chicago: 'Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann,
    Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Förstner. “Far-Field Calculation
    from Magnetic Huygens Box Data Using the Boundary Element Method.” In <i>2022
    Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href="https://doi.org/10.1109/ssi56489.2022.9901431">https://doi.org/10.1109/ssi56489.2022.9901431</a>.'
  ieee: 'C. Marschalt <i>et al.</i>, “Far-field Calculation from magnetic Huygens
    Box Data using the Boundary Element Method,” presented at the 2022 Smart Systems
    Integration (SSI), Grenoble, France, 2022, doi: <a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>.'
  mla: Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box
    Data Using the Boundary Element Method.” <i>2022 Smart Systems Integration (SSI)</i>,
    IEEE, 2022, doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>.
  short: 'C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn,
    D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble,
    France, 2022.'
conference:
  end_date: 2022-04-28
  location: Grenoble, France
  name: 2022 Smart Systems Integration (SSI)
  start_date: 2022-04-27
date_created: 2022-10-04T11:31:43Z
date_updated: 2024-11-30T19:32:14Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901431
keyword:
- Near-Field Scanning
- Huygens Box
- Boundary Element Method
- Method of Moments
- tet_topic_hf
- tet_enas
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901431
place: Grenoble, France
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_identifier:
  eisbn:
  - 978-1-6654-8849-5
publication_status: published
publisher: IEEE
status: public
title: Far-field Calculation from magnetic Huygens Box Data using the Boundary Element
  Method
type: conference
user_id: '158'
year: '2022'
...
---
_id: '27652'
abstract:
- lang: ger
  text: "Aufgrund der Fortschritte der Digitalisierung finden Systeme zur Zustandsüberwachung
    vermehrt Einsatz in der Industrie, um durch eine zustandsbasierte oder eine prädiktive
    Instandhaltung Vorteile, wie eine verbesserte Zuverlässigkeit und geringere Kosten
    zu erzielen. Dabei beruhen Zustandsüberwachungssysteme auf den folgenden Bausteinen:
    Sensorik, Datenvorverarbeitung, Merkmalsextraktion und -auswahl, Diagnose bzw.
    Prognose sowie einer Entscheidungsfindung basierend auf den Ergebnissen. Jeder
    dieser Bausteine erfordert individuelle Einstellungen, um ein geeignetes Zustandsüberwachungssystem
    für die jeweilige Anwendung zu entwickeln. Eine offene Fragestellung im Bereich
    der Zustandsüberwachung ergibt sich aufgrund der Unsicherheit der Zukunft, die
    sich in den zukünftigen Betriebs- und Umgebungsbedingungen zeigt. Diese Unsicherheit
    gilt es in allen Bausteinen zu berücksichtigen.\r\nDieser Beitrag konzentriert
    sich auf den Baustein Merkmalsextraktion und -selektion, mit dem Ziel anhand geeigneter
    Merkmale eine Prognose der nutzbaren Restlebensdauer mit hoher Genauigkeit realisieren
    zu können. Daher werden geeignete Merkmale aus dem Zeitbereich und daraus abgeleitete
    Zustandsindikatoren für die Restlebensdauerprognose von technischen Systemen vorgestellt.
    Dabei sind Zustandsindikatoren Kenngrößen zur Beobachtung des Zustands der kritischen
    Systemkomponenten. Anhand dreier Anwendungsbeispiele wird ihre Eignung evaluiert.
    Dabei werden Daten aus Lebensdauerversuchen unter instationären Betriebs- und
    Umgebungsbedingungen ausgewertet. Die auftretenden Unsicherheiten der Zukunft
    werden somit berücksichtigt. Die Beispielsysteme beruhen auf Gummi-Metall-Elementen
    und Wälzlagern. Aus den generierten Ergebnissen lässt sich schließen, dass die
    Zustandsindikatoren aus der betrachteten Zeitreihen-Toolbox auch unter unbekannten
    Betriebs- und Umgebungsbedingungen robust sind.\r\n"
- lang: eng
  text: "Due to the advances in digitalization, condition monitoring systems have
    found numerous applications in the industry due to benefits such as improved reliability
    and lowered costs through condition-based or predictive maintenance. Condition
    monitoring systems typically involve elements, such as data acquisition via suitable
    sensors, data preprocessing, feature extraction and selection, diagnostics, prognostics
    and (maintenance) decisions based on diagnosis or prognosis. For the application-specific
    development of a suitable condition monitoring system, each of these elements
    requires individual settings. Due to the uncertainty of the future, an open question
    arises in the condition monitoring field, which is reflected in unknown future
    operating and environmental conditions. This uncertainty needs consideration in
    all elements of a condition monitoring system.\r\nThis article focuses on feature
    extraction and selection, building on the hypothesis that the remaining useful
    life of a technical system can be predicted with high accuracy utilizing suitable
    features. In this article, health indicators derived from time-domain features
    that permit the monitoring of the health of critical system components are presented
    for predicting the remaining useful life of technical systems. Three distinct
    application examples based on rubber-metal elements and rolling-element bearings
    are evaluated to validate the suitability of the presented methods. Experimental
    data from accelerated lifetime tests conducted under non-stationary operating
    and environmental conditions are considered to take possible future uncertainties
    into account. It can be concluded from the acquired results that health indicators
    derived from the presented time series toolbox are robust to varying operating
    and environmental conditions.\r\n"
author:
- first_name: Osarenren Kennedy
  full_name: Aimiyekagbon, Osarenren Kennedy
  id: '9557'
  last_name: Aimiyekagbon
- first_name: Amelie
  full_name: Bender, Amelie
  id: '54290'
  last_name: Bender
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Aimiyekagbon OK, Bender A, Sextro W. Extraktion und Selektion geeigneter Merkmale
    für die Restlebensdauerprognose von technischen Systemen trotz aleatorischen Unsicherheiten
    . In: <i>VDI-Berichte 2391</i>. VDI Verlag GmbH; 2021:197-210.'
  apa: Aimiyekagbon, O. K., Bender, A., &#38; Sextro, W. (2021). Extraktion und Selektion
    geeigneter Merkmale für die Restlebensdauerprognose von technischen Systemen trotz
    aleatorischen Unsicherheiten . <i>VDI-Berichte 2391</i>, 197–210.
  bibtex: '@inproceedings{Aimiyekagbon_Bender_Sextro_2021, place={Düsseldorf}, title={Extraktion
    und Selektion geeigneter Merkmale für die Restlebensdauerprognose von technischen
    Systemen trotz aleatorischen Unsicherheiten }, booktitle={VDI-Berichte 2391},
    publisher={VDI Verlag GmbH}, author={Aimiyekagbon, Osarenren Kennedy and Bender,
    Amelie and Sextro, Walter}, year={2021}, pages={197–210} }'
  chicago: 'Aimiyekagbon, Osarenren Kennedy, Amelie Bender, and Walter Sextro. “Extraktion
    und Selektion geeigneter Merkmale für die Restlebensdauerprognose von technischen
    Systemen trotz aleatorischen Unsicherheiten .” In <i>VDI-Berichte 2391</i>, 197–210.
    Düsseldorf: VDI Verlag GmbH, 2021.'
  ieee: O. K. Aimiyekagbon, A. Bender, and W. Sextro, “Extraktion und Selektion geeigneter
    Merkmale für die Restlebensdauerprognose von technischen Systemen trotz aleatorischen
    Unsicherheiten ,” in <i>VDI-Berichte 2391</i>, Würzburg, 2021, pp. 197–210.
  mla: Aimiyekagbon, Osarenren Kennedy, et al. “Extraktion und Selektion geeigneter
    Merkmale für die Restlebensdauerprognose von technischen Systemen trotz aleatorischen
    Unsicherheiten .” <i>VDI-Berichte 2391</i>, VDI Verlag GmbH, 2021, pp. 197–210.
  short: 'O.K. Aimiyekagbon, A. Bender, W. Sextro, in: VDI-Berichte 2391, VDI Verlag
    GmbH, Düsseldorf, 2021, pp. 197–210.'
conference:
  end_date: 2021-11-17
  location: Würzburg
  name: '3. VDI-Fachtagung  '
  start_date: 2021-11-16
date_created: 2021-11-22T07:42:44Z
date_updated: 2022-01-06T06:57:43Z
department:
- _id: '151'
keyword:
- run-to-failure
- rubber-metal element
- bearing prognostics
- non-stationary operating conditions
- varying operating conditions
- feature extraction
- feature selection
language:
- iso: ger
page: 197 - 210
place: Düsseldorf
publication: VDI-Berichte 2391
publication_identifier:
  isbn:
  - 978-3-18-092391-8
  issn:
  - '0083-5560 '
publication_status: published
publisher: VDI Verlag GmbH
status: public
title: 'Extraktion und Selektion geeigneter Merkmale für die Restlebensdauerprognose
  von technischen Systemen trotz aleatorischen Unsicherheiten '
type: conference
user_id: '9557'
year: '2021'
...
---
_id: '32559'
abstract:
- lang: eng
  text: This investigation concentrates on value similarity between parents and their
    children during adulthood. The interplay between gender, age, relationship quality,
    and frequency of contact on value similarity was analyzed. A total of 600 adult
    German children (53.8% women) and their parents took part in a questionnaire study.
    Value orientation was measured with a short version of Schwartz’s Portrait Values
    Questionnaire, and relationship quality with the Network of Relationships Inventory
    (Furman &amp; Buhrmeister, 1992).Value similarity was higher in mother–daughter
    dyads compared to mother–son dyads, but in the other dyads, no significant differences
    were found. Regarding relationship quality, verbal intimacy was not related to
    value similarity. Parental satisfaction was associated with value similarity in
    the father–child dyads. Satisfaction, as perceived by adult children, was linked
    to value similarity in mother–child and father–son dyads. Furthermore, the frequency
    of contact related to value similarity between mothers and sons.
author:
- first_name: Christian
  full_name: Hoellger, Christian
  last_name: Hoellger
- first_name: Sabrina
  full_name: Sommer, Sabrina
  last_name: Sommer
- first_name: Isabelle
  full_name: Albert, Isabelle
  last_name: Albert
- first_name: Heike M.
  full_name: Buhl, Heike M.
  id: '27152'
  last_name: Buhl
citation:
  ama: Hoellger C, Sommer S, Albert I, Buhl HM. Intergenerational Value Similarity
    in Adulthood. <i>Journal of Family Issues</i>. 2020;42(6):1234-1257. doi:<a href="https://doi.org/10.1177/0192513x20943914">10.1177/0192513x20943914</a>
  apa: Hoellger, C., Sommer, S., Albert, I., &#38; Buhl, H. M. (2020). Intergenerational
    Value Similarity in Adulthood. <i>Journal of Family Issues</i>, <i>42</i>(6),
    1234–1257. <a href="https://doi.org/10.1177/0192513x20943914">https://doi.org/10.1177/0192513x20943914</a>
  bibtex: '@article{Hoellger_Sommer_Albert_Buhl_2020, title={Intergenerational Value
    Similarity in Adulthood}, volume={42}, DOI={<a href="https://doi.org/10.1177/0192513x20943914">10.1177/0192513x20943914</a>},
    number={6}, journal={Journal of Family Issues}, publisher={SAGE Publications},
    author={Hoellger, Christian and Sommer, Sabrina and Albert, Isabelle and Buhl,
    Heike M.}, year={2020}, pages={1234–1257} }'
  chicago: 'Hoellger, Christian, Sabrina Sommer, Isabelle Albert, and Heike M. Buhl.
    “Intergenerational Value Similarity in Adulthood.” <i>Journal of Family Issues</i>
    42, no. 6 (2020): 1234–57. <a href="https://doi.org/10.1177/0192513x20943914">https://doi.org/10.1177/0192513x20943914</a>.'
  ieee: 'C. Hoellger, S. Sommer, I. Albert, and H. M. Buhl, “Intergenerational Value
    Similarity in Adulthood,” <i>Journal of Family Issues</i>, vol. 42, no. 6, pp.
    1234–1257, 2020, doi: <a href="https://doi.org/10.1177/0192513x20943914">10.1177/0192513x20943914</a>.'
  mla: Hoellger, Christian, et al. “Intergenerational Value Similarity in Adulthood.”
    <i>Journal of Family Issues</i>, vol. 42, no. 6, SAGE Publications, 2020, pp.
    1234–57, doi:<a href="https://doi.org/10.1177/0192513x20943914">10.1177/0192513x20943914</a>.
  short: C. Hoellger, S. Sommer, I. Albert, H.M. Buhl, Journal of Family Issues 42
    (2020) 1234–1257.
date_created: 2022-08-03T05:56:45Z
date_updated: 2022-08-29T06:34:26Z
department:
- _id: '427'
doi: 10.1177/0192513x20943914
intvolume: '        42'
issue: '6'
keyword:
- Adult child–parent dyads
- value similarity
- relationship quality
- frequency of contact
- parent-child-relationship
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: https://journals.sagepub.com/doi/pdf/10.1177/0192513X20943914
oa: '1'
page: 1234-1257
publication: Journal of Family Issues
publication_identifier:
  issn:
  - 0192-513X
  - 1552-5481
publication_status: published
publisher: SAGE Publications
status: public
title: Intergenerational Value Similarity in Adulthood
type: journal_article
user_id: '42165'
volume: 42
year: '2020'
...
---
_id: '9972'
abstract:
- lang: eng
  text: The transportation of dry fine powders is an emerging technologic task, as
    in biotechnology, pharmaceu-tical and coatings industry the particle sizes of
    processed powders get smaller and smaller. Fine powdersare primarily defined by
    the fact that adhesive and cohesive forces outweigh the weight forces, leadingto
    mostly unwanted agglomeration (clumping) and adhesion to surfaces. Thereby it
    gets more difficult touse conventional conveyor systems (e.g. pneumatic or vibratory
    conveyors) for transport. A rather newmethod for transporting these fine powders
    is based on ultrasonic vibrations, which are used to reducefriction between powder
    and substrate. Within this contribution an experimental set-up consisting of apipe,
    a solenoid actuator for axial vibration and an annular piezoelectric actuator
    for the high frequencyradial vibration of the pipe is described. Since amplitudes
    of the radial pipe vibration should be as large aspossible to get high effects
    of friction reduction, the pipe is excited to vibrate in resonance. To determinethe
    optimum excitation frequency and actuator position the vibration modes and resonance
    frequenciesof the pipe are calculated and measured. Results are in good accordance.
author:
- first_name: Paul
  full_name: Dunst, Paul
  id: '22130'
  last_name: Dunst
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: Dunst P, Hemsel T, Sextro W. Analysis of pipe vibration in an ultrasonic powder
    transportationsystem. <i>elsevier</i>. 2017;Sensors and Actuators A 263:733-736.
  apa: Dunst, P., Hemsel, T., &#38; Sextro, W. (2017). Analysis of pipe vibration
    in an ultrasonic powder transportationsystem. <i>Elsevier</i>, <i>Sensors and
    Actuators A 263</i>, 733–736.
  bibtex: '@article{Dunst_Hemsel_Sextro_2017, title={Analysis of pipe vibration in
    an ultrasonic powder transportationsystem}, volume={Sensors and Actuators A 263},
    journal={elsevier}, author={Dunst, Paul and Hemsel, Tobias and Sextro, Walter},
    year={2017}, pages={733–736} }'
  chicago: 'Dunst, Paul, Tobias Hemsel, and Walter Sextro. “Analysis of Pipe Vibration
    in an Ultrasonic Powder Transportationsystem.” <i>Elsevier</i> Sensors and Actuators
    A 263 (2017): 733–36.'
  ieee: P. Dunst, T. Hemsel, and W. Sextro, “Analysis of pipe vibration in an ultrasonic
    powder transportationsystem,” <i>elsevier</i>, vol. Sensors and Actuators A 263,
    pp. 733–736, 2017.
  mla: Dunst, Paul, et al. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.”
    <i>Elsevier</i>, vol. Sensors and Actuators A 263, 2017, pp. 733–36.
  short: P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017)
    733–736.
date_created: 2019-05-27T09:31:13Z
date_updated: 2019-09-16T10:23:40Z
department:
- _id: '151'
keyword:
- Powder transport Piezoelectrics Ultrasonics Pipe vibration Finite element simulation
  Fine powder
language:
- iso: eng
page: 733-736
publication: elsevier
quality_controlled: '1'
status: public
title: Analysis of pipe vibration in an ultrasonic powder transportationsystem
type: journal_article
user_id: '55222'
volume: Sensors and Actuators A 263
year: '2017'
...
---
_id: '9955'
abstract:
- lang: eng
  text: Wire bonding has been an established packaging technology for decades. When
    introducing copper as wire material for high power applications, adaptations to
    the bonding process and to machines became necessary. Here, challenges occur due
    to the stiffer wire material and changing oxide layers on the contact partners.
    To achieve sufficient process stability, a clean bond area is required, which
    can only be achieved with high shear stresses in the contact partners surfaces.
    These necessitate high normal forces to plastically deform the wire and substrate.
    To achieve such high stresses in the contact area, the bonding tool needs to be
    able to transmit the needed tangential forces to the top side of the wire. The
    wire itself performs a shear movement and transmits the force into the contact
    area to clean the contaminant and oxide layers and to level the desired bond surfaces.
    The main function of the tool is to transmit these forces. If the bond tool can
    only transmit low forces in the direction of excitation, the parameter space for
    a stable bond process is severely restricted. Here, a modeling approach to estimate
    how well different tool shapes meet the demand of transmitting high tangential
    forces is presented. The model depends on wire deformation and thus on the ultrasonic
    softening effect.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
citation:
  ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
    Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and
    Technology Conference</i>. ; 2016:2103-2110. doi:<a href="https://doi.org/10.1109/ECTC.2016.234">10.1109/ECTC.2016.234</a>'
  apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent
    Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic
    Components and Technology Conference</i> (pp. 2103–2110). <a href="https://doi.org/10.1109/ECTC.2016.234">https://doi.org/10.1109/ECTC.2016.234</a>
  bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
    Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href="https://doi.org/10.1109/ECTC.2016.234">10.1109/ECTC.2016.234</a>},
    booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
    Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
    year={2016}, pages={2103–2110} }'
  chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
    Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
    <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016.
    <a href="https://doi.org/10.1109/ECTC.2016.234">https://doi.org/10.1109/ECTC.2016.234</a>.
  ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
    Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic
    Components and Technology Conference</i>, 2016, pp. 2103–2110.
  mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
    Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>,
    2016, pp. 2103–10, doi:<a href="https://doi.org/10.1109/ECTC.2016.234">10.1109/ECTC.2016.234</a>.
  short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
    Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9963'
abstract:
- lang: eng
  text: Tire-wheel assembly is the only connection between road and vehicle. Contacting
    directly with road within postcard size of contact area, it is mounted and guided
    by the suspension system. Therefore kinematics and compliances of suspension system
    greatly influence the frictional coupling of tire tread elements and road surface
    asperities by affecting pressure and sliding velocity distribution in the contact
    zone. This study emphasizes the development of a numerical methodology for frictional
    rolling contact analysis with focus on interaction of suspension system dynamics
    and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody
    system of the multi-link rear suspension is established, where both flexible and
    rigid bodies are modeled to allow large displacements with included elastic effects.
    To meet accuracy requirements for the high frequency applications, such as road
    excitations, the amplitude- and frequency-dependency of rubber-metal bushings
    is included. Furthermore the proposed flexible viscoelastic suspension model is
    enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic
    response and covers any road excitations by tread submodel connected to road surface
    model. Concerning the verification and validation procedure numerous experiments
    are carried out to confirm the validity and the accuracy of both the developed
    submodels and the entire model. The devised approach makes it possible to investigate
    the influence of suspension system design on dynamical rolling contact and to
    evaluate tire tread wear. Therefore it can be a useful tool to predict frictional
    power distribution within the contact area under more realistic conditions.
author:
- first_name: Sergej
  full_name: Kohl, Sergej
  last_name: Kohl
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Sebastian
  full_name: Schulze, Sebastian
  last_name: Schulze
citation:
  ama: 'Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling
    for Frictional Rolling Contact Analysis using ADAMS. In: <i>The 2nd International
    Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
    Malaysia, 2016.</i> Cyberjaya, Malaysia, 2016; 2016:1-12.'
  apa: Kohl, S., Sextro, W., &#38; Schulze, S. (2016). Aspects of Flexible Viscoelastic
    Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In <i>The
    2nd International Conference on Automotive Innovation and Green Energy Vehicle
    (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i> (pp. 1–12). Cyberjaya, Malaysia,
    2016.
  bibtex: '@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016},
    title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
    Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on
    Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
    2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016},
    pages={1–12} }'
  chicago: Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible
    Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using
    ADAMS.” In <i>The 2nd International Conference on Automotive Innovation and Green
    Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 1–12. Cyberjaya,
    Malaysia, 2016, 2016.
  ieee: S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension
    Modeling for Frictional Rolling Contact Analysis using ADAMS,” in <i>The 2nd International
    Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
    Malaysia, 2016.</i>, 2016, pp. 1–12.
  mla: Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling
    for Frictional Rolling Contact Analysis Using ADAMS.” <i>The 2nd International
    Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
    Malaysia, 2016.</i>, 2016, pp. 1–12.
  short: 'S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on
    Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
    2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.'
date_created: 2019-05-27T09:13:14Z
date_updated: 2019-05-27T09:13:54Z
department:
- _id: '151'
keyword:
- Kinematics and compliances
- flexible viscoelastic suspension model
- frictional rolling contact analysis
- frictional power distribution.
language:
- iso: eng
page: 1-12
place: Cyberjaya, Malaysia, 2016
publication: The 2nd International Conference on Automotive Innovation and Green Energy
  Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.
status: public
title: Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
  Contact Analysis using ADAMS
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9952'
abstract:
- lang: eng
  text: The contact between viscoelastic materials e.g. elastomers and a rough surface
    leads to a special friction characteristic, which differs greatly in its properties
    comparing to other materials like metals. In practice, this friction combination
    occurs for example in the tire-road contact, or in the use of rubber gaskets.
    Due to the frictional forces a system is significantly influenced in its vibrational
    properties. The friction force is composed of two main components adhesion and
    hysteresis. The adhesion results from molecular bounds between the contact partners,
    while the deformation of the viscoelastic material by the roughness of the counter
    body leads to power loss. This internal friction results in an additional frictional
    force, which is described by the hysteresis. To simulate the frictional behaviour
    of elastomers on rough surfaces and thus to determine the energy dissipation in
    contact, it is necessary to develop a mechanical model which considers the roughness
    of the contact partners, as well as dynamic effects and the dependence on normal
    pressure and sliding speed. The viscoelastic material behaviour must also be considered.
    The contact between two rough surfaces is modelled as a rough rigid layer contacting
    a rough elas- tic layer. The elastic layer is modelled by point masses connected
    by Maxwell-elements. This allows the viscoelastic properties of the elastomer
    to be considered. The behaviour of whole system can be described by equations
    of motion with integrated constraints. The degrees of freedom of the model depends
    on the varying contact conditions. A point mass not in contact has two degrees
    of freedom. A point mass in contact moving along the roughness path can be described
    by only one degree of freedom. For each Maxwell-Element also an inner coordinate
    and thus a further degree of freedom is needed. Because of varying contact conditions
    dur- ing the simulation, the simulation interrupts in case the contact conditions
    change. Then the equations of motions are adapted with respect to the contact
    constraints. As a result of the simulation one obtain the energy dissipation and
    thus the friction char- acteristic during the friction process. It is possible
    to use these results in three dimensional point-contact elements in order to model
    contact surfaces on lager length scales.
author:
- first_name: Frank
  full_name: Schulte, Frank
  last_name: Schulte
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact
    of Elastic Rough Bodies with Viscoelastic Properties. In: <i>Proceedings of ICoEV
    2015 International Conference on Engineering Vibration</i>. ; 2015:1109-1117.'
  apa: Schulte, F., Neuhaus, J., &#38; Sextro, W. (2015). A Mechanical Model for the
    Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In <i>Proceedings
    of ICoEV 2015 International Conference on Engineering Vibration</i> (pp. 1109–1117).
  bibtex: '@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for
    the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings
    of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte,
    Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }'
  chicago: Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for
    the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In
    <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>,
    1109–17, 2015.
  ieee: F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical
    Contact of Elastic Rough Bodies with Viscoelastic Properties,” in <i>Proceedings
    of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp.
    1109–1117.
  mla: Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic
    Rough Bodies with Viscoelastic Properties.” <i>Proceedings of ICoEV 2015 International
    Conference on Engineering Vibration</i>, 2015, pp. 1109–17.
  short: 'F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International
    Conference on Engineering Vibration, 2015, pp. 1109–1117.'
date_created: 2019-05-27T08:37:22Z
date_updated: 2019-09-16T10:47:53Z
department:
- _id: '151'
keyword:
- Contact Mechanics
- Viscoelastic Material
- Adhesive Friction
- Hysteresis Friction
- Energy Dissipation
- Vibration
language:
- iso: eng
page: 1109-1117
publication: Proceedings of ICoEV 2015 International Conference on Engineering Vibration
quality_controlled: '1'
status: public
title: A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic
  Properties
type: conference
user_id: '55222'
year: '2015'
...
---
_id: '13893'
abstract:
- lang: eng
  text: In this contribution, we present an efficient approach for the transient and
    time-causal modeling of guided waves in viscoelastic cylindrical waveguides in
    the context of ultrasonic material characterization. We use the scaled boundary
    finite element method (SBFEM) for efficient computation of the phase velocity
    dispersion. Regarding the viscoelastic behavior of the materials under consideration,
    we propose a decomposition approach that considers the real-valued frequency dependence
    of the (visco-)elastic moduli and, separately, of their attenuation. The modal
    expansion approach is utilized to take the transmitting and receiving transducers
    into account and to propagate the excited waveguide modes through a waveguide
    of finite length. The effectiveness of the proposed simulation model is shown
    by comparison with a standard transient FEM simulation as well as simulation results
    based on the exact solution of the complex-valued viscoelastic guided wave problem.
    Two material models are discussed, namely the fractional Zener model and the anti-Zener
    model; we re-interpret the latter in terms of the Rayleigh damping model. Measurements
    are taken on a polypropylene sample and the proposed transient simulation model
    is used for inverse material characterization. The extracted material properties
    may then be used in computer-aided design of ultrasonic systems.
author:
- first_name: Fabian
  full_name: Bause, Fabian
  last_name: Bause
- first_name: Hauke
  full_name: Gravenkamp, Hauke
  last_name: Gravenkamp
- first_name: Jens
  full_name: Rautenberg, Jens
  last_name: Rautenberg
- first_name: Bernd
  full_name: Henning, Bernd
  last_name: Henning
citation:
  ama: Bause F, Gravenkamp H, Rautenberg J, Henning B. Transient modeling of ultrasonic
    guided waves in circular viscoelastic waveguides for inverse material characterization.
    <i>Measurement Science and Technology</i>. 2015;26(095602 (17pp)). doi:<a href="https://doi.org/10.1088/0957-0233/26/9/095602">10.1088/0957-0233/26/9/095602</a>
  apa: Bause, F., Gravenkamp, H., Rautenberg, J., &#38; Henning, B. (2015). Transient
    modeling of ultrasonic guided waves in circular viscoelastic waveguides for inverse
    material characterization. <i>Measurement Science and Technology</i>, <i>26</i>(095602
    (17pp)). <a href="https://doi.org/10.1088/0957-0233/26/9/095602">https://doi.org/10.1088/0957-0233/26/9/095602</a>
  bibtex: '@article{Bause_Gravenkamp_Rautenberg_Henning_2015, title={Transient modeling
    of ultrasonic guided waves in circular viscoelastic waveguides for inverse material
    characterization}, volume={26}, DOI={<a href="https://doi.org/10.1088/0957-0233/26/9/095602">10.1088/0957-0233/26/9/095602</a>},
    number={095602 (17pp)}, journal={Measurement Science and Technology}, author={Bause,
    Fabian and Gravenkamp, Hauke and Rautenberg, Jens and Henning, Bernd}, year={2015}
    }'
  chicago: Bause, Fabian, Hauke Gravenkamp, Jens Rautenberg, and Bernd Henning. “Transient
    Modeling of Ultrasonic Guided Waves in Circular Viscoelastic Waveguides for Inverse
    Material Characterization.” <i>Measurement Science and Technology</i> 26, no.
    095602 (17pp) (2015). <a href="https://doi.org/10.1088/0957-0233/26/9/095602">https://doi.org/10.1088/0957-0233/26/9/095602</a>.
  ieee: F. Bause, H. Gravenkamp, J. Rautenberg, and B. Henning, “Transient modeling
    of ultrasonic guided waves in circular viscoelastic waveguides for inverse material
    characterization,” <i>Measurement Science and Technology</i>, vol. 26, no. 095602
    (17pp), 2015.
  mla: Bause, Fabian, et al. “Transient Modeling of Ultrasonic Guided Waves in Circular
    Viscoelastic Waveguides for Inverse Material Characterization.” <i>Measurement
    Science and Technology</i>, vol. 26, no. 095602 (17pp), 2015, doi:<a href="https://doi.org/10.1088/0957-0233/26/9/095602">10.1088/0957-0233/26/9/095602</a>.
  short: F. Bause, H. Gravenkamp, J. Rautenberg, B. Henning, Measurement Science and
    Technology 26 (2015).
date_created: 2019-10-16T14:24:43Z
date_updated: 2022-01-06T06:51:46Z
department:
- _id: '49'
doi: 10.1088/0957-0233/26/9/095602
intvolume: '        26'
issue: 095602 (17pp)
keyword:
- viscoelasticity
- ultrasonics
- guided waves
- inverse problem
- scaled boundary finite element method
language:
- iso: eng
publication: Measurement Science and Technology
publication_identifier:
  issn:
  - 0957-0233
status: public
title: Transient modeling of ultrasonic guided waves in circular viscoelastic waveguides
  for inverse material characterization
type: journal_article
user_id: '15911'
volume: 26
year: '2015'
...
---
_id: '9868'
abstract:
- lang: eng
  text: In order to increase mechanical strength, heat dissipation and ampacity and
    to decrease failure through fatigue fracture, wedge copper wire bonding is being
    introduced as a standard interconnection method for mass production. To achieve
    the same process stability when using copper wire instead of aluminum wire a profound
    understanding of the bonding process is needed. Due to the higher hardness of
    copper compared to aluminum wire it is more difficult to approach the surfaces
    of wire and substrate to a level where van der Waals forces are able to arise
    between atoms. Also, enough friction energy referred to the total contact area
    has to be generated to activate the surfaces. Therefore, a friction model is used
    to simulate the joining process. This model calculates the resulting energy of
    partial areas in the contact surface and provides information about the adhesion
    process of each area. The focus here is on the arising of micro joints in the
    contact area depending on the location in the contact and time. To validate the
    model, different touchdown forces are used to vary the initial contact areas of
    wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
    up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
    for the real bonding process to map with the model. Test substrates as DBC and
    copper plate are used to show the different formations of a wedge bond connection
    due to hardness and reaction propensity. The experiments were done by using 500
    $\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
    wire bonds using a friction model approach. In: <i>Electronic Components and Technology
    Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the
    bond quality of copper wire bonds using a friction model approach. In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555).
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
    bond quality of copper wire bonds using a friction model approach}, DOI={<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>},
    booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
    author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
    year={2014}, pages={1549–1555} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
    the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014.
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
    of copper wire bonds using a friction model approach,” in <i>Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.
  mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
    a Friction Model Approach.” <i>Electronic Components and Technology Conference
    (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9887'
abstract:
- lang: eng
  text: A model to calculate the locally resolved tangential contact forces of the
    wheel rail contact with respect to contact kinematics, material and surface properties
    as well as temperature is introduced. The elasticity of wheel and rail is modeled
    as an elastic layer consisting of point contact elements connected by springs
    to each other and to the wheel. Each element has two degrees of freedom in tangential
    directions. The resulting total stiffness matrix is reduced to calculate only
    the position of the elements in contact. Friction forces as well as contact stiffnesses
    are incorporated by a nonlinear force-displacement characteristic, which originates
    from a detailed contact model. The contact elements are transported through the
    contact zone in discrete time steps. After each time step an equilibrium is calculated.
    For all elements, their temperature and its influence on local friction are regarded
    by calculating friction power and temperature each time step.
author:
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Neuhaus J, Sextro W. Thermo-Mechanical Model for Wheel Rail Contact using
    Coupled Point Contact Elements. In: Liu GR, Guan ZW, eds. <i>Proceedings of the
    5th International Conference on Computational Methods</i>. ScienTech Publisher;
    2014.'
  apa: Neuhaus, J., &#38; Sextro, W. (2014). Thermo-Mechanical Model for Wheel Rail
    Contact using Coupled Point Contact Elements. In G. R. Liu &#38; Z. W. Guan (Eds.),
    <i>Proceedings of the 5th International Conference on Computational Methods</i>.
    ScienTech Publisher.
  bibtex: '@inproceedings{Neuhaus_Sextro_2014, title={Thermo-Mechanical Model for
    Wheel Rail Contact using Coupled Point Contact Elements}, booktitle={Proceedings
    of the 5th International Conference on Computational Methods}, publisher={ScienTech
    Publisher}, author={Neuhaus, Jan and Sextro, Walter}, editor={Liu, G.R. and Guan,
    Z.W.Editors}, year={2014} }'
  chicago: Neuhaus, Jan, and Walter Sextro. “Thermo-Mechanical Model for Wheel Rail
    Contact Using Coupled Point Contact Elements.” In <i>Proceedings of the 5th International
    Conference on Computational Methods</i>, edited by G.R. Liu and Z.W. Guan. ScienTech
    Publisher, 2014.
  ieee: J. Neuhaus and W. Sextro, “Thermo-Mechanical Model for Wheel Rail Contact
    using Coupled Point Contact Elements,” in <i>Proceedings of the 5th International
    Conference on Computational Methods</i>, 2014.
  mla: Neuhaus, Jan, and Walter Sextro. “Thermo-Mechanical Model for Wheel Rail Contact
    Using Coupled Point Contact Elements.” <i>Proceedings of the 5th International
    Conference on Computational Methods</i>, edited by G.R. Liu and Z.W. Guan, ScienTech
    Publisher, 2014.
  short: 'J. Neuhaus, W. Sextro, in: G.R. Liu, Z.W. Guan (Eds.), Proceedings of the
    5th International Conference on Computational Methods, ScienTech Publisher, 2014.'
date_created: 2019-05-20T13:23:02Z
date_updated: 2019-09-16T10:59:46Z
department:
- _id: '151'
editor:
- first_name: G.R.
  full_name: Liu, G.R.
  last_name: Liu
- first_name: Z.W.
  full_name: Guan, Z.W.
  last_name: Guan
keyword:
- Rolling Contact
- Discrete Elements
- Contact Stiffness
- Temperature
language:
- iso: eng
publication: Proceedings of the 5th International Conference on Computational Methods
publisher: ScienTech Publisher
quality_controlled: '1'
status: public
title: Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact
  Elements
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9895'
abstract:
- lang: eng
  text: Power semiconductor modules are used to control and switch high electrical
    currents and voltages. Within the power module package wire bonding is used as
    an interconnection technology. In recent years, aluminum wire has been used preferably,
    but an ever-growing market of powerful and efficient power modules requires a
    material with better mechanical and electrical properties. For this reason, a
    technology change from aluminum to copper is indispensable. However, the copper
    wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
    reliable copper bond connections a challenging task. The aim of the BMBF funded
    project Itsowl-InCuB is the development of self-optimizing techniques to enable
    the reliable production of copper bond connections under varying conditions. A
    model of the process is essential to achieve this aim. This model needs to include
    the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
    proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
    process. In the touchdown phase, the wire is pressed into the V-groove of the
    tool and a small initial contact area between wire and substrate arise. The local
    characteristics of the material change abruptly because of the cold forming. Consequently,
    the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
    effect during the touchdown process of aluminum wires by cracking of oxide layers
    was presented. These interactions of the process parameters are still largely
    unknown for copper. In a first step, this paper validates the importance of modeling
    the pre-deformation by showing its impact on the wire deformation characteristic
    experimentally. Creating cross-section views of pre-deformed copper wires has
    shown a low deformation degree compared to aluminum. By using a digital microscope
    and a scanning confocal microscope an analysis about the contact areas and penetration
    depths after touchdown has been made. Additionally, it has to be taken into account
    that the dynamical touchdown force depends on the touchdown speed and the touchdown
    force set in the bonding machine. In order to measure the overshoot in the force
    signals, a strain gauge sensor has been used. Subsequently, the affecting factors
    have been interpreted independently Furthermore, the material properties of copper
    wire have been investigated with tensile tests and hardness measurements. In a
    second step, the paper presents finite element models of the touchdown process
    for source and destination bonds. These models take the measured overshoot in
    the touchdown forces into account. A multi-linear, isotropic material model has
    been selected to map the material properties of the copper. A validation of the
    model with the experimental determined contact areas, normal pressures and penetration
    depths reveals the high model quality. Thus, the simulation is able to calculate
    and visualize the three dimensional pre-deformation with an integrated material
    parameter of the wire if the touchdown parameters of the bonding machine are known.
    Based on the calculated deformation degrees of wire and substrate, it is probably
    possible to investigate the effect of the pre-deformation on the pre-cleaning
    phase in the copper wire bonding.
author:
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
citation:
  ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
    Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US;
    2014:289-294.'
  apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38;
    Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.
  bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
    place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
    of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
    and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
    Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
  chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
    Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
    Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego,
    CA, US, 2014.
  ieee: A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.
  mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.
  short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
    in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
    San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
  Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...
---
_id: '34442'
abstract:
- lang: eng
  text: Radial shaft seals are used in a variety of applications, where rotating shafts
    in steady housings have to be sealed. Typical examples are crankshafts, camshafts,
    differential gear or hydraulic pumps. In the operating state the elastomeric seal
    ring and the shaft are separated by a lubrication film of just a few micrometers.
    Due to shear strain and fluid friction the contact area is subject to a higher
    temperature than the rest of the seal ring. The stiffness of the elastomeric material
    is intensely influenced by this temperature and thus contact pressure, friction
    and wear also strongly depend on the contact temperature. In order to simulate
    the contact behavior of elastomer seal rings it is essential to use a comprehensive
    approach which takes into consideration the interaction of temperature, friction
    and wear. Based on this idea a macroscopic simulation model has been developed
    at the MEGT. It combines a finite element approach for the simulation of contact
    pressure at different wear states, a semi-analytical approach for the calculation
    of contact temperature and an empirical approach for the calculation of friction.
    In this paper the model setup is presented, as well as simulation and experimental
    results.
author:
- first_name: D.
  full_name: Frölich, D.
  last_name: Frölich
- first_name: Balázs
  full_name: Magyar, Balázs
  id: '97759'
  last_name: Magyar
- first_name: B.
  full_name: Sauer, B.
  last_name: Sauer
citation:
  ama: Frölich D, Magyar B, Sauer B. A comprehensive model of wear, friction and contact
    temperature in radial shaft seals. <i>Wear</i>. 2014;311(1):71-80. doi:<a href="https://doi.org/10.1016/j.wear.2013.12.030">https://doi.org/10.1016/j.wear.2013.12.030</a>
  apa: Frölich, D., Magyar, B., &#38; Sauer, B. (2014). A comprehensive model of wear,
    friction and contact temperature in radial shaft seals. <i>Wear</i>, <i>311</i>(1),
    71–80. <a href="https://doi.org/10.1016/j.wear.2013.12.030">https://doi.org/10.1016/j.wear.2013.12.030</a>
  bibtex: '@article{Frölich_Magyar_Sauer_2014, title={A comprehensive model of wear,
    friction and contact temperature in radial shaft seals}, volume={311}, DOI={<a
    href="https://doi.org/10.1016/j.wear.2013.12.030">https://doi.org/10.1016/j.wear.2013.12.030</a>},
    number={1}, journal={Wear}, author={Frölich, D. and Magyar, Balázs and Sauer,
    B.}, year={2014}, pages={71–80} }'
  chicago: 'Frölich, D., Balázs Magyar, and B. Sauer. “A Comprehensive Model of Wear,
    Friction and Contact Temperature in Radial Shaft Seals.” <i>Wear</i> 311, no.
    1 (2014): 71–80. <a href="https://doi.org/10.1016/j.wear.2013.12.030">https://doi.org/10.1016/j.wear.2013.12.030</a>.'
  ieee: 'D. Frölich, B. Magyar, and B. Sauer, “A comprehensive model of wear, friction
    and contact temperature in radial shaft seals,” <i>Wear</i>, vol. 311, no. 1,
    pp. 71–80, 2014, doi: <a href="https://doi.org/10.1016/j.wear.2013.12.030">https://doi.org/10.1016/j.wear.2013.12.030</a>.'
  mla: Frölich, D., et al. “A Comprehensive Model of Wear, Friction and Contact Temperature
    in Radial Shaft Seals.” <i>Wear</i>, vol. 311, no. 1, 2014, pp. 71–80, doi:<a
    href="https://doi.org/10.1016/j.wear.2013.12.030">https://doi.org/10.1016/j.wear.2013.12.030</a>.
  short: D. Frölich, B. Magyar, B. Sauer, Wear 311 (2014) 71–80.
date_created: 2022-12-15T10:19:37Z
date_updated: 2022-12-15T10:20:39Z
department:
- _id: '146'
doi: https://doi.org/10.1016/j.wear.2013.12.030
extern: '1'
intvolume: '       311'
issue: '1'
keyword:
- Radial shaft seal ring
- Contact temperature
- Wear
- Friction torque
- Finite element simulation
language:
- iso: eng
page: 71-80
publication: Wear
publication_identifier:
  issn:
  - 0043-1648
status: public
title: A comprehensive model of wear, friction and contact temperature in radial shaft
  seals
type: journal_article
user_id: '38077'
volume: 311
year: '2014'
...
---
_id: '36918'
abstract:
- lang: eng
  text: This paper presents an advanced eight levels spanning SystemC based virtual
    platform methodology and framework - referred to as HeroeS 3 - providing smooth
    application to platform mapping and continuous co-refinement of a virtual prototype
    with its physical environment model. For heterogeneity support, various SystemC
    extensions are combined covering continuous/discrete models of computation and
    different communication abstractions, such as analog mixed-signal models, abstract
    RTOS/HAL/middleware models, TLM bus models, and QEMU wrappers. We enable dependability
    assessment by Fault Effect Modeling (FEM) at the virtual prototype in order to
    avoid risking physical injury or damage. Also, simulation results are deterministic
    and can be evaluated interactively or offline. We apply FEM to both the physical
    environment model and the different abstractions of the virtual prototype. Currently,
    we focus on sensor failures and application control flow errors.
author:
- first_name: Markus
  full_name: Becker, Markus
  last_name: Becker
- first_name: Christoph
  full_name: Kuznik, Christoph
  last_name: Kuznik
- first_name: Wolfgang
  full_name: Müller, Wolfgang
  id: '16243'
  last_name: Müller
citation:
  ama: 'Becker M, Kuznik C, Müller W. Fault Effect Modeling in a Heterogeneous SystemC
    Based Virtual Platform Framework for Cyber Physical Systems. In: IEEE; 2014. doi:<a
    href="https://doi.org/10.1109/ICCPS.2014.6843726">10.1109/ICCPS.2014.6843726</a>'
  apa: Becker, M., Kuznik, C., &#38; Müller, W. (2014). <i>Fault Effect Modeling in
    a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems</i>.
    ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS), Berlin. <a
    href="https://doi.org/10.1109/ICCPS.2014.6843726">https://doi.org/10.1109/ICCPS.2014.6843726</a>
  bibtex: '@inproceedings{Becker_Kuznik_Müller_2014, place={Berlin}, title={Fault
    Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for
    Cyber Physical Systems}, DOI={<a href="https://doi.org/10.1109/ICCPS.2014.6843726">10.1109/ICCPS.2014.6843726</a>},
    publisher={IEEE}, author={Becker, Markus and Kuznik, Christoph and Müller, Wolfgang},
    year={2014} }'
  chicago: 'Becker, Markus, Christoph Kuznik, and Wolfgang Müller. “Fault Effect Modeling
    in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical
    Systems.” Berlin: IEEE, 2014. <a href="https://doi.org/10.1109/ICCPS.2014.6843726">https://doi.org/10.1109/ICCPS.2014.6843726</a>.'
  ieee: 'M. Becker, C. Kuznik, and W. Müller, “Fault Effect Modeling in a Heterogeneous
    SystemC Based Virtual Platform Framework for Cyber Physical Systems,” presented
    at the ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS), Berlin,
    2014, doi: <a href="https://doi.org/10.1109/ICCPS.2014.6843726">10.1109/ICCPS.2014.6843726</a>.'
  mla: Becker, Markus, et al. <i>Fault Effect Modeling in a Heterogeneous SystemC
    Based Virtual Platform Framework for Cyber Physical Systems</i>. IEEE, 2014, doi:<a
    href="https://doi.org/10.1109/ICCPS.2014.6843726">10.1109/ICCPS.2014.6843726</a>.
  short: 'M. Becker, C. Kuznik, W. Müller, in: IEEE, Berlin, 2014.'
conference:
  location: Berlin
  name: ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS)
date_created: 2023-01-16T11:57:08Z
date_updated: 2023-01-16T11:57:22Z
department:
- _id: '58'
doi: 10.1109/ICCPS.2014.6843726
keyword:
- Computational modeling
- Finite element analysis
- Prototypes
- Abstracts
- Software
- Fault tolerance
- Fault tolerant systems
language:
- iso: eng
place: Berlin
publisher: IEEE
status: public
title: Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework
  for Cyber Physical Systems
type: conference
user_id: '5786'
year: '2014'
...
---
_id: '9797'
abstract:
- lang: eng
  text: A model approach for wedge/wedge bonding copper wire is presented. The connection
    between wire and substrate is based on a variety of physical effects, but the
    dominant one is the friction based welding while applying ultrasound. Consequently,
    a friction model was used to investigate the welding process. This model is built
    up universal and can be used to describe the formation of micro welds in the time
    variant contact area between wire and substrate. Aim of the model is to identify
    the interactions between touchdown, bond normal force, ultrasonic power and bonding
    time. To do so, the contact area is discretized into partial areas where a Point
    Contact Model is applied. Based on this approach it is possible to simulate micro
    and macro slip inside the contact area between wire and substrate. The work done
    by friction force is a main criterion to define occurring micro joints which influence
    the subsequent welding.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling
    wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>.
    Orlando (Florida), USA; 2013. doi:<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based
    approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium
    on Microelectronics</i>. Orlando (Florida), USA. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida),
    USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>},
    booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff,
    Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction
    Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International
    Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach
    for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on
    Microelectronics</i>, 2013.
  mla: Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.”
    <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a
    href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International
    Symposium on Microelectronics, Orlando (Florida), USA, 2013.'
date_created: 2019-05-13T13:55:36Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.4071/isom-2013-TA67
keyword:
- Wire bonding
- friction modeling
- wire bond quality
- contact element modeling
language:
- iso: eng
place: Orlando (Florida), USA
publication: IMAPS 2013, 46th International Symposium on Microelectronics
status: public
title: A friction based approach for modeling wire bonding
type: conference
user_id: '55222'
year: '2013'
...
