---
_id: '9999'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
    of semiconductor devices. Copper wire is increasingly replacing the well-established
    aluminium wire because of its superior electrical, thermal and mechanical properties.
    Copper wire processes differ significantly from aluminium processes and are more
    sensitive to disturbances, which reduces the range of parameter values suitable
    for a stable process. Disturbances can be compensated by an adaption of process
    parameters, but finding suitable parameters manually is difficult and time-consuming.
    This paper presents a physical model of the ultrasonic wire bonding process including
    the friction contact between tool and wire. This model yields novel insights into
    the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
    is presented. It uses multi-objective optimization, based on the complete process
    model, to automatically select the best operating point as a compromise of concurrent
    objectives.
author:
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
    of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
    Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
    Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a
    href="https://doi.org/10.4071/2380-4505-2018.1.000572">10.4071/2380-4505-2018.1.000572</a>'
  apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018).
    Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
    Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium
    on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
    <a href="https://doi.org/10.4071/2380-4505-2018.1.000572">https://doi.org/10.4071/2380-4505-2018.1.000572</a>
  bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
    Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
    and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href="https://doi.org/10.4071/2380-4505-2018.1.000572">10.4071/2380-4505-2018.1.000572</a>},
    booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
    Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
    and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
  chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
    Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
    – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018
    – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018,
    No. 1, pp. 000572-000577., 2018. <a href="https://doi.org/10.4071/2380-4505-2018.1.000572">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.
  ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
    Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
    and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
    Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
  mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
    Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS
    2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018,
    No. 1, pp. 000572-000577., 2018, doi:<a href="https://doi.org/10.4071/2380-4505-2018.1.000572">10.4071/2380-4505-2018.1.000572</a>.
  short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
    of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
  CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
  Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...