[{"status":"public","editor":[{"first_name":"Clara-Maria","last_name":"Kuball","full_name":"Kuball, Clara-Maria"},{"first_name":"Benedikt","id":"38131","full_name":"Uhe, Benedikt","last_name":"Uhe"},{"id":"32056","full_name":"Meschut, Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"first_name":"Marion","last_name":"Merklein","full_name":"Merklein, Marion"}],"abstract":[{"text":"The aim to reduce pollutant emission has led to a trend towards lightweight construction in car body development during the last years. As a consequence of the resulting need for multi-material design, mechanical joining technologies become increasingly important. Mechanical joining allows for the combination of dissimilar materials, while thermic joining techniques reach their limits. Self-piercing riveting enables the joining of dissimilar materials by using semi-tubular rivets as mechanical fasteners. The rivet production, however, is costly and time-consuming, as the rivets generally have to be hardened, tempered and coated after forming, in order to achieve an adequate strength and corrosion resistance. A promising approach to improve the efficiency of the rivet manufacturing is the use of high-strength high nitrogen steel as rivet material because these additional process steps would not be necessary anymore. As a result of the comparatively high nitrogen content, such steels have various beneficial properties like higher strength, good ductility and improved corrosion resistance. By cold bulk forming of high nitrogen steels high-strength parts can be manufactured due to the strengthening which is caused by the high strain hardening. However, high tool loads thereby have to be expected and are a major challenge during the production process. Consequently, there is a need for appropriate forming strategies. This paper presents key aspects concerning the process design for the manufacturing of semi-tubular self-piercing rivets made of high-strength steel. The aim is to produce the rivets in several forming stages without intermediate heat treatment between the single stages. Due to the high strain hardening of the material, a two stage forming concept will be investigated. Cup-backward extrusion is chosen as the first process step in order to form the rivet shank without forming the rivet foot. Thus, the strain hardening effects in the area of the rivet foot are minimized and the tool loads during the following process step can be reduced. During the second and final forming stage the detailed geometry of the rivet foot and the rivet head is formed. In this context, the effect of different variations, for example concerning the final geometry of the rivet foot, on the tool load is investigated using multistage numerical analysis. Furthermore, the influence of the process temperature on occurring stresses is analysed. Based on the results of the investigations, an adequate forming strategy and a tool concept for the manufacturing of semi-tubular self-piercing rivets made of high-strength steel are presented.","lang":"eng"}],"type":"conference_editor","language":[{"iso":"eng"}],"keyword":["high nitrogen steel","self-piercing riveting","joining by forming","bulk forming","tool design"],"series_title":"Procedia Manufacturing","user_id":"53912","department":[{"_id":"157"}],"_id":"19976","citation":{"ieee":"C.-M. Kuball, B. Uhe, G. Meschut, and M. Merklein, Eds., <i>Process design for the forming of semi-tubular self-piercing rivets made of high nitrogen steel</i>, vol. 50. 2020, pp. 280–285.","chicago":"Kuball, Clara-Maria, Benedikt Uhe, Gerson Meschut, and Marion Merklein, eds. <i>Process Design for the Forming of Semi-Tubular Self-Piercing Rivets Made of High Nitrogen Steel</i>. Vol. 50. Procedia Manufacturing, 2020. <a href=\"https://doi.org/10.1016/j.promfg.2020.08.052\">https://doi.org/10.1016/j.promfg.2020.08.052</a>.","ama":"Kuball C-M, Uhe B, Meschut G, Merklein M, eds. <i>Process Design for the Forming of Semi-Tubular Self-Piercing Rivets Made of High Nitrogen Steel</i>. Vol 50.; 2020:280-285. doi:<a href=\"https://doi.org/10.1016/j.promfg.2020.08.052\">10.1016/j.promfg.2020.08.052</a>","apa":"Kuball, C.-M., Uhe, B., Meschut, G., &#38; Merklein, M. (Eds.). (2020). <i>Process design for the forming of semi-tubular self-piercing rivets made of high nitrogen steel</i> (Vol. 50, pp. 280–285). <a href=\"https://doi.org/10.1016/j.promfg.2020.08.052\">https://doi.org/10.1016/j.promfg.2020.08.052</a>","short":"C.-M. Kuball, B. Uhe, G. Meschut, M. Merklein, eds., Process Design for the Forming of Semi-Tubular Self-Piercing Rivets Made of High Nitrogen Steel, 2020.","bibtex":"@book{Kuball_Uhe_Meschut_Merklein_2020, series={Procedia Manufacturing}, title={Process design for the forming of semi-tubular self-piercing rivets made of high nitrogen steel}, volume={50}, DOI={<a href=\"https://doi.org/10.1016/j.promfg.2020.08.052\">10.1016/j.promfg.2020.08.052</a>}, year={2020}, pages={280–285}, collection={Procedia Manufacturing} }","mla":"Kuball, Clara-Maria, et al., editors. <i>Process Design for the Forming of Semi-Tubular Self-Piercing Rivets Made of High Nitrogen Steel</i>. 2020, pp. 280–85, doi:<a href=\"https://doi.org/10.1016/j.promfg.2020.08.052\">10.1016/j.promfg.2020.08.052</a>."},"page":"280-285","intvolume":"        50","year":"2020","publication_status":"published","quality_controlled":"1","doi":"10.1016/j.promfg.2020.08.052","title":"Process design for the forming of semi-tubular self-piercing rivets made of high nitrogen steel","date_created":"2020-10-12T08:30:08Z","volume":50,"date_updated":"2026-02-27T10:43:48Z"},{"citation":{"bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6).","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018.","ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6."},"page":"1-6","year":"2018","quality_controlled":"1","title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","date_created":"2019-05-27T10:18:10Z","author":[{"first_name":"Collin","last_name":"Dymel","full_name":"Dymel, Collin","id":"66833"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_updated":"2020-05-07T05:33:56Z","status":"public","abstract":[{"text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.","lang":"eng"}],"type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","language":[{"iso":"eng"}],"keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"user_id":"210","department":[{"_id":"151"}],"project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"_id":"9992"}]