---
_id: '9955'
abstract:
- lang: eng
  text: Wire bonding has been an established packaging technology for decades. When
    introducing copper as wire material for high power applications, adaptations to
    the bonding process and to machines became necessary. Here, challenges occur due
    to the stiffer wire material and changing oxide layers on the contact partners.
    To achieve sufficient process stability, a clean bond area is required, which
    can only be achieved with high shear stresses in the contact partners surfaces.
    These necessitate high normal forces to plastically deform the wire and substrate.
    To achieve such high stresses in the contact area, the bonding tool needs to be
    able to transmit the needed tangential forces to the top side of the wire. The
    wire itself performs a shear movement and transmits the force into the contact
    area to clean the contaminant and oxide layers and to level the desired bond surfaces.
    The main function of the tool is to transmit these forces. If the bond tool can
    only transmit low forces in the direction of excitation, the parameter space for
    a stable bond process is severely restricted. Here, a modeling approach to estimate
    how well different tool shapes meet the demand of transmitting high tangential
    forces is presented. The model depends on wire deformation and thus on the ultrasonic
    softening effect.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
citation:
  ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
    Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and
    Technology Conference</i>. ; 2016:2103-2110. doi:<a href="https://doi.org/10.1109/ECTC.2016.234">10.1109/ECTC.2016.234</a>'
  apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent
    Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic
    Components and Technology Conference</i> (pp. 2103–2110). <a href="https://doi.org/10.1109/ECTC.2016.234">https://doi.org/10.1109/ECTC.2016.234</a>
  bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
    Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href="https://doi.org/10.1109/ECTC.2016.234">10.1109/ECTC.2016.234</a>},
    booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
    Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
    year={2016}, pages={2103–2110} }'
  chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
    Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
    <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016.
    <a href="https://doi.org/10.1109/ECTC.2016.234">https://doi.org/10.1109/ECTC.2016.234</a>.
  ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
    Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic
    Components and Technology Conference</i>, 2016, pp. 2103–2110.
  mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
    Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>,
    2016, pp. 2103–10, doi:<a href="https://doi.org/10.1109/ECTC.2016.234">10.1109/ECTC.2016.234</a>.
  short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
    Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...