---
_id: '9993'
abstract:
- lang: eng
  text: Ultrasonic bonding and welding are common friction based approaches in the
    assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
    up to 12 mm² made from copper are well suited in high power applications. For
    increasing friction energy, which is responsible for bond formation, a two-dimensional
    vibration approach is applied to newly developed interconnection pins. Using two-dimensional
    vibration for bonding requires identification of suitable bonding parameters.
    Even though simulation models of wire bonding processes exist, parameters for
    the two-dimensional pin-bonding process cannot be derived accurately yet. Within
    this contribution, a methodology and workflow for experimental studies identifying
    a suitable bond parameter space are presented. The results of a pre-study are
    used to set up an extensive statistical parameter study, which gives insights
    about the bond strength change due to bond process parameter variation. By evaluation
    of electrical data captured during bonding, errors biasing the resulting shear
    forces are identified. All data obtained during the experimental study is used
    to build a statistical regression model suitable for predicting shear forces.
    The accuracy of the regression model’s predictions is determined and the applicability
    to predict process parameters or validate simulation models is assessed. Finally,
    the influence of the tool trajectory on the bond formation is determined, comparing
    one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
    investigations on the impact of bond process parameters in two-dimensional ultrasonic
    copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan
    (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.'
  apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig,
    M. (2018). Experimental investigations on the impact of bond process parameters
    in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics
    IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44).
  bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
    investigations on the impact of bond process parameters in two-dimensional ultrasonic
    copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
    Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
    and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
    year={2018}, pages={41–44} }'
  chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
    Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
    Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings
    of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44,
    2018.
  ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
    “Experimental investigations on the impact of bond process parameters in two-dimensional
    ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium
    Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.
  mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
    Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th
    Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp.
    41–44.
  short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
    in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
    Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
  Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
  ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...