[{"abstract":[{"text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.","lang":"eng"}],"status":"public","type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"language":[{"iso":"eng"}],"project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"_id":"9992","user_id":"210","department":[{"_id":"151"}],"year":"2018","citation":{"ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6.","ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018.","bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6)."},"page":"1-6","quality_controlled":"1","title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","date_updated":"2020-05-07T05:33:56Z","date_created":"2019-05-27T10:18:10Z","author":[{"id":"66833","full_name":"Dymel, Collin","last_name":"Dymel","first_name":"Collin"},{"first_name":"Paul","full_name":"Eichwald, Paul","last_name":"Eichwald"},{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}]},{"citation":{"apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan.","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254."},"page":"251-254","place":"IEEE CPMT Symposium Japan","year":"2016","quality_controlled":"1","title":"Validated Simulation of the Ultrasonic Wire Bonding Process","date_created":"2019-05-27T09:20:10Z","author":[{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"}],"date_updated":"2020-05-07T05:33:53Z","status":"public","abstract":[{"lang":"eng","text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage."}],"type":"conference","publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","language":[{"iso":"eng"}],"keyword":["the Ultrasonic Wire Bonding Process"],"user_id":"210","department":[{"_id":"151"}],"project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"_id":"9968"}]