[{"status":"public","type":"dissertation","extern":"1","_id":"41971","user_id":"55222","series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","department":[{"_id":"151"}],"citation":{"ama":"Althoff S. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Vol 15. Shaker; 2023.","ieee":"S. Althoff, <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</i>, vol. 15. Shaker, 2023.","chicago":"Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.","apa":"Althoff, S. (2023). <i>Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</i> (Vol. 15). Shaker.","short":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.","mla":"Althoff, Simon. <i>Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach</i>. Shaker, 2023.","bibtex":"@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }"},"page":"192","intvolume":"        15","publication_status":"published","publication_identifier":{"isbn":["978-3-8440-8903-5"]},"related_material":{"link":[{"relation":"confirmation","url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes"}]},"main_file_link":[{"url":"https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff"}],"date_updated":"2023-02-10T13:05:42Z","supervisor":[{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"author":[{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"}],"volume":15,"abstract":[{"text":"Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden.","lang":"ger"}],"keyword":["heavy copper bonding","wire bonding","quality prediction","friction model","point-contact-element"],"language":[{"iso":"eng"}],"year":"2023","title":"Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach","publisher":"Shaker","date_created":"2023-02-10T13:05:19Z"},{"status":"public","type":"journal_article","article_number":"40","_id":"43045","department":[{"_id":"156"}],"user_id":"82645","intvolume":"         7","citation":{"ieee":"M. Knyazyev, M. Holzmüller, and W. Homberg, “Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires,” <i>Journal of Manufacturing and Materials Processing</i>, vol. 7, no. 1, Art. no. 40, 2023, doi: <a href=\"https://doi.org/10.3390/jmmp7010040\">10.3390/jmmp7010040</a>.","chicago":"Knyazyev, Mykhaylo, Maik Holzmüller, and Werner Homberg. “Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires.” <i>Journal of Manufacturing and Materials Processing</i> 7, no. 1 (2023). <a href=\"https://doi.org/10.3390/jmmp7010040\">https://doi.org/10.3390/jmmp7010040</a>.","ama":"Knyazyev M, Holzmüller M, Homberg W. Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires. <i>Journal of Manufacturing and Materials Processing</i>. 2023;7(1). doi:<a href=\"https://doi.org/10.3390/jmmp7010040\">10.3390/jmmp7010040</a>","apa":"Knyazyev, M., Holzmüller, M., &#38; Homberg, W. (2023). Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires. <i>Journal of Manufacturing and Materials Processing</i>, <i>7</i>(1), Article 40. <a href=\"https://doi.org/10.3390/jmmp7010040\">https://doi.org/10.3390/jmmp7010040</a>","bibtex":"@article{Knyazyev_Holzmüller_Homberg_2023, title={Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires}, volume={7}, DOI={<a href=\"https://doi.org/10.3390/jmmp7010040\">10.3390/jmmp7010040</a>}, number={140}, journal={Journal of Manufacturing and Materials Processing}, publisher={MDPI AG}, author={Knyazyev, Mykhaylo and Holzmüller, Maik and Homberg, Werner}, year={2023} }","short":"M. Knyazyev, M. Holzmüller, W. Homberg, Journal of Manufacturing and Materials Processing 7 (2023).","mla":"Knyazyev, Mykhaylo, et al. “Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires.” <i>Journal of Manufacturing and Materials Processing</i>, vol. 7, no. 1, 40, MDPI AG, 2023, doi:<a href=\"https://doi.org/10.3390/jmmp7010040\">10.3390/jmmp7010040</a>."},"publication_identifier":{"issn":["2504-4494"]},"publication_status":"published","doi":"10.3390/jmmp7010040","date_updated":"2023-05-02T11:40:35Z","volume":7,"author":[{"last_name":"Knyazyev","full_name":"Knyazyev, Mykhaylo","first_name":"Mykhaylo"},{"last_name":"Holzmüller","full_name":"Holzmüller, Maik","id":"82645","first_name":"Maik"},{"first_name":"Werner","full_name":"Homberg, Werner","id":"233","last_name":"Homberg"}],"abstract":[{"text":"<jats:p>The pressure fields generated by two simultaneous discharges have not been investigated on any notable scale for the electrohydraulic impulse forming method. In this study, the synchronicity of two discharges is ensured by the sequential connection of two wires mounted in two spark gaps in a common volume of liquid. The objective is to experimentally confirm the equilibrium of the energies evolved in two spark gaps by means of pressure measurements. In addition, multipoint membrane pressure gauges demonstrated the feasibility of easily recording detailed pressure maps. Based on the membrane deformation mechanism and material strengthening under static and impulse conditions, the processing procedure is further developed so as to achieve better accuracy in the determination of pressure field parameters. The practical equality of the pressure fields on the left and right halves of the flat-loaded area confirms the equality of energies evolved in the two spark gaps. The direct shock waves create zones with the most intensive loading. These results provide a basis for the development of new electrohydraulic technologies involving the application of two simultaneous discharges with equal energy and pressure parameters.</jats:p>","lang":"eng"}],"publication":"Journal of Manufacturing and Materials Processing","keyword":["impulse","forming","electrohydraulic","discharge","wire","pressure gauge","pressure field"],"language":[{"iso":"eng"}],"year":"2023","quality_controlled":"1","issue":"1","title":"Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires","publisher":"MDPI AG","date_created":"2023-03-17T10:31:23Z"},{"abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process used to form electrical interconnections in micro and\r\npower electronics and batteries. A high frequency oscillation causes a metallurgical bond deformation in\r\nthe contact area. Due to the numerous physical influencing factors, it is very difficult to accurately capture\r\nthis process in a model. Therefore, our goal is to determine a suitable feed-forward control strategy for the\r\nbonding process even without detailed model knowledge. We propose the use of batch constrained Bayesian\r\noptimization for the control design. Hence, Bayesian optimization is precisely adapted to the application of\r\nbonding: the constraint is used to check one quality feature of the process and the use of batches leads to\r\nmore efficient experiments. Our approach is suitable to determine a feed-forward control for the bonding\r\nprocess that provides very high quality bonds without using a physical model. We also show that the quality\r\nof the Bayesian optimization based control outperforms random search as well as manual search by a user.\r\nUsing a simple prior knowledge model derived from data further improves the quality of the connection.\r\nThe Bayesian optimization approach offers the possibility to perform a sensitivity analysis of the control\r\nparameters, which allows to evaluate the influence of each control parameter on the bond quality. In summary,\r\nBayesian optimization applied to the bonding process provides an excellent opportunity to develop a feedforward\r\ncontrol without full modeling of the underlying physical processes.","lang":"eng"}],"status":"public","publication":"Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)","type":"conference","keyword":["Bayesian optimization","Wire bonding","Feed-forward control","model-free design"],"language":[{"iso":"eng"}],"_id":"29803","department":[{"_id":"153"},{"_id":"880"}],"user_id":"82875","year":"2022","page":"383-394","citation":{"ieee":"M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,” in <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, Online, 2022, pp. 383–394.","chicago":"Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” In <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 383–94, 2022.","ama":"Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>. ; 2022:383-394.","apa":"Hesse, M., Hunstig, M., Timmermann, J., &#38; Trächtler, A. (2022). Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 383–394.","mla":"Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” <i>Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)</i>, 2022, pp. 383–94.","bibtex":"@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design}, booktitle={Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }","short":"M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394."},"quality_controlled":"1","publication_identifier":{"isbn":["978-989-758-549-4"]},"title":"Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design","conference":{"location":"Online","end_date":"2022-02-05","start_date":"2022-02-03","name":"11th International Conference on Pattern Recognition Applications and Methods"},"date_updated":"2024-11-13T08:44:17Z","date_created":"2022-02-09T12:50:25Z","author":[{"first_name":"Michael","last_name":"Hesse","full_name":"Hesse, Michael","id":"29222"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Timmermann, Julia","id":"15402","last_name":"Timmermann","first_name":"Julia"},{"full_name":"Trächtler, Ansgar","id":"552","last_name":"Trächtler","first_name":"Ansgar"}]},{"user_id":"66","department":[{"_id":"52"}],"_id":"29849","language":[{"iso":"eng"}],"keyword":["Three-phase four-wire","OBC","Y2G","PFC","CM","EY charger","balancing circuit"],"type":"conference","publication":"2021 IEEE Applied Power Electronics Conference and Exposition (APEC)","status":"public","abstract":[{"text":"DC-DC converters for on-board chargers (OBC) of electrical vehicles are usually galvanically isolated allowing modular single-phase PFC front-end solutions, but require transformers which are more bulky, costly and lossy than inductors of non-isolated DC-DCs. Furthermore, for vehicle-to-grid applications, bidirectional converters with transformers are generally more complex and have a higher count on semiconductor switches than transformerless solutions. However, when using non-isolated DC-DC converters within an OBC, the large common-mode (CM) capacitance comprising capacitive parasitics of the traction battery as well as explicit Y-capacitors connecting the high-voltage DC-system (HV-system) within specific HV-loads to ground has to be considered. For the PFC front-end stage, when supplied from the three-phase mains this means that generation of high-frequency and high-amplitude CM voltages, as it is common e.g. with the conventional six-switch full-bridge converter, has to be strictly avoided. For this reason, a modified topology is suggested leading to a different mode of operation and to a very low common-mode noise behaviour: The three-phase four-wire full-bridge PFC with split DC-link, whose midpoint is connected to the mains neutral provides very stable potentials at the DC-link rails and therefore it can be classified as Zero-CM-topology.For dedicated single-phase operation, as required for most OBC, an additional balancing leg may be added to the topology to reduce the required DC-link capacitance and allow non-electrolytic capacitors.The function of the bidirectional Zero-CM three-phase four-wire full-bridge PFC was verified by simulation and on an 11 kW-laboratory sample. The power factor is above 0.999 and an efficiency of 98 % is measured.","lang":"eng"}],"date_created":"2022-02-15T09:14:56Z","author":[{"last_name":"Strothmann","id":"22556","full_name":"Strothmann, Benjamin","first_name":"Benjamin"},{"id":"71291","full_name":"Schafmeister, Frank","last_name":"Schafmeister","first_name":"Frank"},{"orcid":"0000-0002-8480-7295","last_name":"Böcker","full_name":"Böcker, Joachim","id":"66","first_name":"Joachim"}],"date_updated":"2022-02-21T19:25:17Z","publisher":"IEEE","doi":"10.1109/apec42165.2021.9487462","title":"Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger","publication_status":"published","citation":{"chicago":"Strothmann, Benjamin, Frank Schafmeister, and Joachim Böcker. “Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger.” In <i>2021 IEEE Applied Power Electronics Conference and Exposition (APEC)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/apec42165.2021.9487462\">https://doi.org/10.1109/apec42165.2021.9487462</a>.","ieee":"B. Strothmann, F. Schafmeister, and J. Böcker, “Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger,” 2021, doi: <a href=\"https://doi.org/10.1109/apec42165.2021.9487462\">10.1109/apec42165.2021.9487462</a>.","ama":"Strothmann B, Schafmeister F, Böcker J. Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger. In: <i>2021 IEEE Applied Power Electronics Conference and Exposition (APEC)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/apec42165.2021.9487462\">10.1109/apec42165.2021.9487462</a>","mla":"Strothmann, Benjamin, et al. “Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger.” <i>2021 IEEE Applied Power Electronics Conference and Exposition (APEC)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/apec42165.2021.9487462\">10.1109/apec42165.2021.9487462</a>.","short":"B. Strothmann, F. Schafmeister, J. Böcker, in: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), IEEE, 2021.","bibtex":"@inproceedings{Strothmann_Schafmeister_Böcker_2021, title={Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger}, DOI={<a href=\"https://doi.org/10.1109/apec42165.2021.9487462\">10.1109/apec42165.2021.9487462</a>}, booktitle={2021 IEEE Applied Power Electronics Conference and Exposition (APEC)}, publisher={IEEE}, author={Strothmann, Benjamin and Schafmeister, Frank and Böcker, Joachim}, year={2021} }","apa":"Strothmann, B., Schafmeister, F., &#38; Böcker, J. (2021). Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger. <i>2021 IEEE Applied Power Electronics Conference and Exposition (APEC)</i>. <a href=\"https://doi.org/10.1109/apec42165.2021.9487462\">https://doi.org/10.1109/apec42165.2021.9487462</a>"},"year":"2021"},{"year":"2021","page":"114077","intvolume":"       119","citation":{"chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>. 2021;119:114077. doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol. 119, 2021, p. 114077, doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>, <i>119</i>, 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>"},"quality_controlled":"1","publication_identifier":{"issn":["0026-2714"]},"publication_status":"published","title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","doi":"https://doi.org/10.1016/j.microrel.2021.114077","date_updated":"2023-09-21T14:15:33Z","volume":119,"date_created":"2021-03-10T09:37:02Z","author":[{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"last_name":"Krieger","full_name":"Krieger, Viktor","first_name":"Viktor"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.","lang":"eng"}],"status":"public","publication":"Microelectronics Reliability","type":"journal_article","keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"language":[{"iso":"eng"}],"_id":"21436","department":[{"_id":"151"}],"user_id":"210"},{"project":[{"name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93","grant_number":"MP-1-1-015"}],"_id":"9992","user_id":"210","department":[{"_id":"151"}],"keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"language":[{"iso":"eng"}],"type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","abstract":[{"text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.","lang":"eng"}],"status":"public","date_updated":"2020-05-07T05:33:56Z","date_created":"2019-05-27T10:18:10Z","author":[{"last_name":"Dymel","id":"66833","full_name":"Dymel, Collin","first_name":"Collin"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"first_name":"Reinhard","id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel"},{"first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","quality_controlled":"1","year":"2018","citation":{"bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6).","ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6.","ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018."},"page":"1-6"},{"abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives."}],"status":"public","type":"conference","publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"language":[{"iso":"eng"}],"project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"_id":"9999","user_id":"210","department":[{"_id":"151"}],"year":"2018","citation":{"apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.","ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>"},"quality_controlled":"1","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","doi":"10.4071/2380-4505-2018.1.000572","date_updated":"2020-05-07T05:33:56Z","author":[{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"date_created":"2019-05-27T10:27:45Z","volume":"Vol. 2018, No. 1, pp. 000572-000577."},{"date_updated":"2019-05-27T09:49:49Z","author":[{"first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"date_created":"2019-05-27T09:48:10Z","title":"MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall","place":"Kiel 2017","year":"2017","page":"611-614","citation":{"chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In <i>43. Deutsche Jahrestagung Für Akustik</i>, 611–14. Kiel 2017, 2017.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in <i>43. Deutsche Jahrestagung für Akustik</i>, 2017, pp. 611–614.","ama":"Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: <i>43. Deutsche Jahrestagung Für Akustik</i>. Kiel 2017; 2017:611-614.","mla":"Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” <i>43. Deutsche Jahrestagung Für Akustik</i>, 2017, pp. 611–14.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.","apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In <i>43. Deutsche Jahrestagung für Akustik</i> (pp. 611–614). Kiel 2017."},"_id":"9982","department":[{"_id":"151"}],"user_id":"55222","keyword":["wire bonding","dynamic behavior","modeling"],"language":[{"iso":"eng"}],"publication":"43. Deutsche Jahrestagung für Akustik","type":"conference","abstract":[{"lang":"ger","text":"ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren."}],"status":"public"},{"citation":{"bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }","short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>","chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110.","ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>"},"page":"2103-2110","year":"2016","quality_controlled":"1","doi":"10.1109/ECTC.2016.234","title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","date_created":"2019-05-27T08:47:52Z","author":[{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"}],"date_updated":"2020-05-07T05:33:52Z","status":"public","abstract":[{"lang":"eng","text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect."}],"type":"conference","publication":"IEEE 66th Electronic Components and Technology Conference","language":[{"iso":"eng"}],"keyword":["finite element simulation","wire bonding","tool geometry"],"user_id":"210","department":[{"_id":"151"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"_id":"9955"},{"title":"Effect of different oxide layers on the ultrasonic copper wire bond process","doi":"10.1109/ECTC.2016.91","date_updated":"2019-09-16T10:38:59Z","author":[{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Olexandr","full_name":"Grydin, Olexandr","last_name":"Grydin"},{"full_name":"Hengsbach, Florian","last_name":"Hengsbach","first_name":"Florian"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Mirko","full_name":"Schaper, Mirko","last_name":"Schaper"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"date_created":"2019-05-27T09:00:50Z","year":"2016","citation":{"bibtex":"@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }","mla":"Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–18, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>.","short":"F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.","apa":"Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2111–2118). <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>","ama":"Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2111-2118. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>","ieee":"F. Eacock <i>et al.</i>, “Effect of different oxide layers on the ultrasonic copper wire bond process,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–2118.","chicago":"Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2111–18, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>."},"page":"2111-2118","quality_controlled":"1","keyword":["Ultrasonic copper wire bonding","Al-oxide","Cuoxide","oxide-free","roughness","morphology"],"language":[{"iso":"eng"}],"_id":"9959","user_id":"55222","department":[{"_id":"151"}],"abstract":[{"text":"Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties.","lang":"eng"}],"status":"public","type":"conference","publication":"IEEE 66th Electronic Components and Technology Conference"},{"keyword":["Self-optimization","adaptive system","bond process","copper wire"],"language":[{"iso":"eng"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"_id":"9966","user_id":"210","department":[{"_id":"151"}],"abstract":[{"text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented.","lang":"eng"}],"status":"public","type":"conference","publication":"IEEE 66th Electronic Components and Technology Conference","title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","doi":"10.1109/ECTC.2016.215","date_updated":"2020-05-07T05:33:53Z","date_created":"2019-05-27T09:17:26Z","author":[{"first_name":"Tobias","last_name":"Meyer ","full_name":"Meyer , Tobias"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"year":"2016","citation":{"ama":"Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:622-628. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 622–28, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>.","ieee":"T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–628.","apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 622–628). <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>","bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–28, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>.","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628."},"page":"622-628","quality_controlled":"1"},{"place":"IEEE CPMT Symposium Japan","year":"2016","citation":{"ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan."},"page":"251-254","quality_controlled":"1","title":"Validated Simulation of the Ultrasonic Wire Bonding Process","date_updated":"2020-05-07T05:33:53Z","author":[{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"date_created":"2019-05-27T09:20:10Z","abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"status":"public","type":"conference","publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","keyword":["the Ultrasonic Wire Bonding Process"],"language":[{"iso":"eng"}],"project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"_id":"9968","user_id":"210","department":[{"_id":"151"}]},{"year":"2014","page":"1549-1555","citation":{"ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>."},"quality_controlled":"1","title":"Improving the bond quality of copper wire bonds using a friction model approach","doi":"10.1109/ECTC.2014.6897500","date_updated":"2019-09-16T10:57:58Z","date_created":"2019-05-20T12:11:44Z","author":[{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Jan","full_name":"Neuhaus, Jan","last_name":"Neuhaus"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"abstract":[{"text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool.","lang":"eng"}],"status":"public","publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","type":"conference","keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"language":[{"iso":"eng"}],"_id":"9868","department":[{"_id":"151"}],"user_id":"55222"},{"abstract":[{"lang":"eng","text":"Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the fields of renewable energies. One of the main cost factors in the manufacturing process is the consumables like bonding tools. The technological transition to copper as wire material causes significant wear on the millimeter large effective contact area of the bonding tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections which can be produced by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently a better understanding of wear and recognition of wear pattern is required. Therefore, the paper presents an analyzing method of the tool topography change of a heavy wire bonding tool by using a confocal microscope. Furthermore, the paper discusses the identification of the main wear indicators by the help of the named topography change for different bond parameters, like ultrasonic power and tool geometry. Reference topography has been carried out by choosing typical parameters of the production line. To judge whether the quality requirement of the bond connections made by a single tool cannot be fulfilled shear test of the source bond have been carried out after a defined number of produced bond connections. Main steps of analysis: (I)Topography of the tool surface is sampled after a defined number of bonds by means of a confocal microscope to detect the wear progress.(II)The recorded data is filtered using Matlab. So, measurement errors can be eliminated and the topography can be overlaid more easy to identify differences between diverse tools or differences in wear stages of the same tool.(III)The subsequent discretization of the topography into sub volumes allows to (IV)describe the loss of volume depending on the position in the groove. Thereby, intermediate status of wear of one tool can be used to obtain a persistent description of the topography change over the number of produced bonds by interpolating the confocal data. Afterwards the persistent change of the groove flank has been analyzed for the named test series to identify the main wear indicators and their effect on shear forces. All worn tools show dominant areas for volume loss especially for plastic deformation and accordingly abrasion. These wear mechanism can be referred to the change of main parts of the groove geometry like the rounding of the front and back radius. The most volume loss was identified in the upper part of the tool flanks or rather at the transition from the groove flank to the front or back radius. Furthermore the observation of the center of the groove flank shows just a little change in volume. All in all, the identification of the wear indicators will be discussed with the objective of increasing the tool lifetime by optimizing the tool geometry without losses in bond quality and reliability."}],"status":"public","publication":"Proceedings of the 47th International Symposium on Microelectronics","type":"conference","keyword":["wedge/wedge bonding","copper wire","tool wear"],"language":[{"iso":"eng"}],"_id":"9871","project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"department":[{"_id":"151"}],"user_id":"210","year":"2014","page":"856-861","citation":{"bibtex":"@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }","mla":"Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–61, doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>.","short":"P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.","apa":"Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &#38; Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In <i>Proceedings of the 47th International Symposium on Microelectronics</i> (pp. 856–861). <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>","ama":"Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>. ; 2014:856-861. doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>","ieee":"P. Eichwald <i>et al.</i>, “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–861.","chicago":"Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 856–61, 2014. <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>."},"title":"Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding","doi":"10.4071/isom-THP34","date_updated":"2020-05-07T05:33:45Z","author":[{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"first_name":"Simon","full_name":"Althof, Simon","last_name":"Althof"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}],"date_created":"2019-05-20T12:18:55Z"},{"citation":{"chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego, CA, US, 2014.","ieee":"A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.","ama":"Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US; 2014:289-294.","apa":"Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38; Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.","short":"A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }","mla":"Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–94."},"page":"289-294","place":"San Diego, CA, US","year":"2014","author":[{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}],"date_created":"2019-05-20T13:35:09Z","date_updated":"2020-05-07T05:33:47Z","title":"Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds","type":"conference","publication":"Proceedings of the 47th International Symposium on Microelectronics (IMAPS)","status":"public","abstract":[{"lang":"eng","text":"Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding."}],"user_id":"210","department":[{"_id":"151"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"_id":"9895","language":[{"iso":"eng"}],"keyword":["pre-deformation","copper wire bonding","finite element model"]},{"citation":{"ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013.","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>.","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA; 2013. doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }","mla":"Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>.","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013."},"place":"Orlando (Florida), USA","year":"2013","date_created":"2019-05-13T13:55:36Z","author":[{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"full_name":"Neuhaus, Jan","last_name":"Neuhaus","first_name":"Jan"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"date_updated":"2022-01-06T07:04:20Z","doi":"10.4071/isom-2013-TA67","title":"A friction based approach for modeling wire bonding","type":"conference","publication":"IMAPS 2013, 46th International Symposium on Microelectronics","status":"public","abstract":[{"lang":"eng","text":"A model approach for wedge/wedge bonding copper wire is presented. The connection between wire and substrate is based on a variety of physical effects, but the dominant one is the friction based welding while applying ultrasound. Consequently, a friction model was used to investigate the welding process. This model is built up universal and can be used to describe the formation of micro welds in the time variant contact area between wire and substrate. Aim of the model is to identify the interactions between touchdown, bond normal force, ultrasonic power and bonding time. To do so, the contact area is discretized into partial areas where a Point Contact Model is applied. Based on this approach it is possible to simulate micro and macro slip inside the contact area between wire and substrate. The work done by friction force is a main criterion to define occurring micro joints which influence the subsequent welding."}],"user_id":"55222","department":[{"_id":"151"}],"_id":"9797","language":[{"iso":"eng"}],"keyword":["Wire bonding","friction modeling","wire bond quality","contact element modeling"]}]