[{"user_id":"209","title":"Logic Fault Diagnosis of Hidden Delay Defects","place":"Virtual Conference - Originally Washington, DC, USA","date_created":"2020-09-15T13:56:08Z","status":"public","publication_status":"published","department":[{"_id":"48"}],"publication":"IEEE International Test Conference (ITC'20), November 2020","author":[{"last_name":"Holst","full_name":"Holst, Stefan","first_name":"Stefan"},{"first_name":"Matthias","full_name":"Kampmann, Matthias","last_name":"Kampmann","id":"10935"},{"last_name":"Sprenger","id":"22707","first_name":"Alexander","full_name":"Sprenger, Alexander"},{"id":"36703","last_name":"Reimer","full_name":"Reimer, Jan Dennis","first_name":"Jan Dennis"},{"id":"209","last_name":"Hellebrand","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","first_name":"Sybille"},{"first_name":"Hans-Joachim","full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich"},{"full_name":"Weng, Xiaoqing","first_name":"Xiaoqing","last_name":"Weng"}],"date_updated":"2022-05-11T17:08:20Z","_id":"19421","language":[{"iso":"eng"}],"year":"2020","type":"conference","citation":{"apa":"Holst, S., Kampmann, M., Sprenger, A., Reimer, J. D., Hellebrand, S., Wunderlich, H.-J., & Weng, X. (2020). Logic Fault Diagnosis of Hidden Delay Defects. IEEE International Test Conference (ITC’20), November 2020.","ama":"Holst S, Kampmann M, Sprenger A, et al. Logic Fault Diagnosis of Hidden Delay Defects. In: IEEE International Test Conference (ITC’20), November 2020. ; 2020.","chicago":"Holst, Stefan, Matthias Kampmann, Alexander Sprenger, Jan Dennis Reimer, Sybille Hellebrand, Hans-Joachim Wunderlich, and Xiaoqing Weng. “Logic Fault Diagnosis of Hidden Delay Defects.” In IEEE International Test Conference (ITC’20), November 2020. Virtual Conference - Originally Washington, DC, USA, 2020.","bibtex":"@inproceedings{Holst_Kampmann_Sprenger_Reimer_Hellebrand_Wunderlich_Weng_2020, place={Virtual Conference - Originally Washington, DC, USA}, title={Logic Fault Diagnosis of Hidden Delay Defects}, booktitle={IEEE International Test Conference (ITC’20), November 2020}, author={Holst, Stefan and Kampmann, Matthias and Sprenger, Alexander and Reimer, Jan Dennis and Hellebrand, Sybille and Wunderlich, Hans-Joachim and Weng, Xiaoqing}, year={2020} }","mla":"Holst, Stefan, et al. “Logic Fault Diagnosis of Hidden Delay Defects.” IEEE International Test Conference (ITC’20), November 2020, 2020.","short":"S. Holst, M. Kampmann, A. Sprenger, J.D. Reimer, S. Hellebrand, H.-J. Wunderlich, X. Weng, in: IEEE International Test Conference (ITC’20), November 2020, Virtual Conference - Originally Washington, DC, USA, 2020.","ieee":"S. Holst et al., “Logic Fault Diagnosis of Hidden Delay Defects,” 2020."}},{"publication":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)","publisher":"IEEE","author":[{"first_name":"Matthias","full_name":"Kampmann, Matthias","last_name":"Kampmann","id":"10935"},{"first_name":"Michael","full_name":"A. Kochte, Michael","last_name":"A. Kochte"},{"full_name":"Liu, Chang","first_name":"Chang","last_name":"Liu"},{"first_name":"Eric","full_name":"Schneider, Eric","last_name":"Schneider"},{"last_name":"Hellebrand","id":"209","first_name":"Sybille","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"volume":38,"date_created":"2019-08-28T11:44:25Z","status":"public","abstract":[{"lang":"eng","text":"Marginal hardware introduces severe reliability threats throughout the life cycle of a system. Although marginalities may not affect the functionality of a circuit immediately after manufacturing, they can degrade into hard failures and must be screened out during manufacturing test to prevent early life failures. Furthermore, their evolution in the field must be proactively monitored by periodic tests before actual failures occur. In recent years small delay faults have gained increasing attention as possible indicators of marginal hardware. However, small delay faults on short paths may be undetectable even with advanced timing aware ATPG. Faster-than-at-speed test (FAST) can detect such hidden delay faults, but so far FAST has mainly been restricted to manufacturing test."}],"user_id":"209","page":"1956 - 1968","type":"journal_article","year":"2019","citation":{"apa":"Kampmann, M., A. Kochte, M., Liu, C., Schneider, E., Hellebrand, S., & Wunderlich, H.-J. (2019). Built-in Test for Hidden Delay Faults. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 38(10), 1956–1968.","ama":"Kampmann M, A. Kochte M, Liu C, Schneider E, Hellebrand S, Wunderlich H-J. Built-in Test for Hidden Delay Faults. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD). 2019;38(10):1956-1968.","chicago":"Kampmann, Matthias, Michael A. Kochte, Chang Liu, Eric Schneider, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Built-in Test for Hidden Delay Faults.” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) 38, no. 10 (2019): 1956–68.","bibtex":"@article{Kampmann_A. Kochte_Liu_Schneider_Hellebrand_Wunderlich_2019, title={Built-in Test for Hidden Delay Faults}, volume={38}, number={10}, journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)}, publisher={IEEE}, author={Kampmann, Matthias and A. Kochte, Michael and Liu, Chang and Schneider, Eric and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2019}, pages={1956–1968} }","mla":"Kampmann, Matthias, et al. “Built-in Test for Hidden Delay Faults.” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 38, no. 10, IEEE, 2019, pp. 1956–68.","short":"M. Kampmann, M. A. Kochte, C. Liu, E. Schneider, S. Hellebrand, H.-J. Wunderlich, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) 38 (2019) 1956–1968.","ieee":"M. Kampmann, M. A. Kochte, C. Liu, E. Schneider, S. Hellebrand, and H.-J. Wunderlich, “Built-in Test for Hidden Delay Faults,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 38, no. 10, pp. 1956–1968, 2019."},"intvolume":" 38","_id":"13048","issue":"10","department":[{"_id":"48"}],"publication_identifier":{"eissn":["1937-4151"]},"publication_status":"published","title":"Built-in Test for Hidden Delay Faults","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:51:27Z"},{"volume":80,"status":"public","date_created":"2019-08-28T11:49:25Z","author":[{"full_name":"Kampmann, Matthias","first_name":"Matthias","id":"10935","last_name":"Kampmann"},{"first_name":"Sybille","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","last_name":"Hellebrand","id":"209"}],"department":[{"_id":"48"}],"publication":"Microelectronics Reliability","title":"Design For Small Delay Test - A Simulation Study","user_id":"659","type":"journal_article","year":"2018","citation":{"ieee":"M. Kampmann and S. Hellebrand, “Design For Small Delay Test - A Simulation Study,” Microelectronics Reliability, vol. 80, pp. 124–133, 2018.","short":"M. Kampmann, S. Hellebrand, Microelectronics Reliability 80 (2018) 124–133.","mla":"Kampmann, Matthias, and Sybille Hellebrand. “Design For Small Delay Test - A Simulation Study.” Microelectronics Reliability, vol. 80, 2018, pp. 124–33.","bibtex":"@article{Kampmann_Hellebrand_2018, title={Design For Small Delay Test - A Simulation Study}, volume={80}, journal={Microelectronics Reliability}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2018}, pages={124–133} }","chicago":"Kampmann, Matthias, and Sybille Hellebrand. “Design For Small Delay Test - A Simulation Study.” Microelectronics Reliability 80 (2018): 124–33.","ama":"Kampmann M, Hellebrand S. Design For Small Delay Test - A Simulation Study. Microelectronics Reliability. 2018;80:124-133.","apa":"Kampmann, M., & Hellebrand, S. (2018). Design For Small Delay Test - A Simulation Study. Microelectronics Reliability, 80, 124–133."},"page":"124-133","language":[{"iso":"eng"}],"_id":"13057","intvolume":" 80","date_updated":"2022-01-06T06:51:27Z"},{"language":[{"iso":"eng"}],"year":"2018","citation":{"chicago":"Kampmann, Matthias, and Sybille Hellebrand. Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test. 19th Workshop on RTL and High Level Testing (WRTLT’18), Hefei, Anhui, China, 2018.","apa":"Kampmann, M., & Hellebrand, S. (2018). Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test. 19th Workshop on RTL and High Level Testing (WRTLT’18), Hefei, Anhui, China.","ama":"Kampmann M, Hellebrand S. Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test. 19th Workshop on RTL and High Level Testing (WRTLT’18), Hefei, Anhui, China; 2018.","bibtex":"@book{Kampmann_Hellebrand_2018, place={19th Workshop on RTL and High Level Testing (WRTLT’18), Hefei, Anhui, China}, title={Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2018} }","mla":"Kampmann, Matthias, and Sybille Hellebrand. Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test. 2018.","short":"M. Kampmann, S. Hellebrand, Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test, 19th Workshop on RTL and High Level Testing (WRTLT’18), Hefei, Anhui, China, 2018.","ieee":"M. Kampmann and S. Hellebrand, Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test. 19th Workshop on RTL and High Level Testing (WRTLT’18), Hefei, Anhui, China, 2018."},"type":"misc","_id":"13072","date_updated":"2022-01-06T06:51:28Z","keyword":["WORKSHOP"],"department":[{"_id":"48"}],"author":[{"last_name":"Kampmann","id":"10935","first_name":"Matthias","full_name":"Kampmann, Matthias"},{"first_name":"Sybille","full_name":"Hellebrand, Sybille","last_name":"Hellebrand"}],"date_created":"2019-08-28T12:00:28Z","status":"public","place":"19th Workshop on RTL and High Level Testing (WRTLT'18), Hefei, Anhui, China","user_id":"659","title":"Optimized Constraints for Scan-Chain Insertion for Faster-than-at-Speed Test"},{"language":[{"iso":"eng"}],"type":"conference","citation":{"ieee":"C. Liu, E. Schneider, M. Kampmann, S. Hellebrand, and H.-J. Wunderlich, “Extending Aging Monitors for Early Life and Wear-Out Failure Prevention,” 2018, doi: 10.1109/ats.2018.00028.","short":"C. Liu, E. Schneider, M. Kampmann, S. Hellebrand, H.-J. Wunderlich, in: 27th IEEE Asian Test Symposium (ATS’18), 2018.","bibtex":"@inproceedings{Liu_Schneider_Kampmann_Hellebrand_Wunderlich_2018, title={Extending Aging Monitors for Early Life and Wear-Out Failure Prevention}, DOI={10.1109/ats.2018.00028}, booktitle={27th IEEE Asian Test Symposium (ATS’18)}, author={Liu, Chang and Schneider, Eric and Kampmann, Matthias and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2018} }","mla":"Liu, Chang, et al. “Extending Aging Monitors for Early Life and Wear-Out Failure Prevention.” 27th IEEE Asian Test Symposium (ATS’18), 2018, doi:10.1109/ats.2018.00028.","chicago":"Liu, Chang, Eric Schneider, Matthias Kampmann, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Extending Aging Monitors for Early Life and Wear-Out Failure Prevention.” In 27th IEEE Asian Test Symposium (ATS’18), 2018. https://doi.org/10.1109/ats.2018.00028.","apa":"Liu, C., Schneider, E., Kampmann, M., Hellebrand, S., & Wunderlich, H.-J. (2018). Extending Aging Monitors for Early Life and Wear-Out Failure Prevention. 27th IEEE Asian Test Symposium (ATS’18). https://doi.org/10.1109/ats.2018.00028","ama":"Liu C, Schneider E, Kampmann M, Hellebrand S, Wunderlich H-J. Extending Aging Monitors for Early Life and Wear-Out Failure Prevention. In: 27th IEEE Asian Test Symposium (ATS’18). ; 2018. doi:10.1109/ats.2018.00028"},"year":"2018","doi":"10.1109/ats.2018.00028","_id":"10575","date_updated":"2022-05-11T17:11:53Z","status":"public","date_created":"2019-07-05T08:14:58Z","publication_status":"published","publication_identifier":{"isbn":["9781538694664"]},"author":[{"full_name":"Liu, Chang","first_name":"Chang","last_name":"Liu"},{"full_name":"Schneider, Eric","first_name":"Eric","last_name":"Schneider"},{"last_name":"Kampmann","id":"10935","first_name":"Matthias","full_name":"Kampmann, Matthias"},{"last_name":"Hellebrand","id":"209","first_name":"Sybille","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"department":[{"_id":"48"}],"publication":"27th IEEE Asian Test Symposium (ATS'18)","user_id":"209","title":"Extending Aging Monitors for Early Life and Wear-Out Failure Prevention"},{"date_updated":"2022-05-11T16:17:41Z","_id":"13078","type":"misc","citation":{"mla":"Kampmann, Matthias, and Sybille Hellebrand. X-Tolerante Prüfzellengruppierung Für Den Test Mit Erhöhter Betriebsfrequenz. 2017.","bibtex":"@book{Kampmann_Hellebrand_2017, place={29. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’17), Lübeck, Germany}, title={X-tolerante Prüfzellengruppierung für den Test mit erhöhter Betriebsfrequenz}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2017} }","chicago":"Kampmann, Matthias, and Sybille Hellebrand. X-Tolerante Prüfzellengruppierung Für Den Test Mit Erhöhter Betriebsfrequenz. 29. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’17), Lübeck, Germany, 2017.","apa":"Kampmann, M., & Hellebrand, S. (2017). X-tolerante Prüfzellengruppierung für den Test mit erhöhter Betriebsfrequenz.","ama":"Kampmann M, Hellebrand S. X-Tolerante Prüfzellengruppierung Für Den Test Mit Erhöhter Betriebsfrequenz.; 2017.","ieee":"M. Kampmann and S. Hellebrand, X-tolerante Prüfzellengruppierung für den Test mit erhöhter Betriebsfrequenz. 29. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’17), Lübeck, Germany, 2017.","short":"M. Kampmann, S. Hellebrand, X-Tolerante Prüfzellengruppierung Für Den Test Mit Erhöhter Betriebsfrequenz, 29. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’17), Lübeck, Germany, 2017."},"year":"2017","language":[{"iso":"eng"}],"title":"X-tolerante Prüfzellengruppierung für den Test mit erhöhter Betriebsfrequenz","user_id":"209","place":"29. Workshop \"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\" (TuZ'17), Lübeck, Germany","status":"public","date_created":"2019-08-28T12:06:26Z","author":[{"last_name":"Kampmann","id":"10935","first_name":"Matthias","full_name":"Kampmann, Matthias"},{"first_name":"Sybille","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","id":"209"}],"keyword":["WORKSHOP"],"department":[{"_id":"48"}]},{"type":"conference","year":"2017","citation":{"ieee":"M. Kampmann and S. Hellebrand, “Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test,” 2017, doi: 10.1109/ddecs.2017.7934564.","short":"M. Kampmann, S. Hellebrand, in: 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17), IEEE, 2017.","mla":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17), IEEE, 2017, doi:10.1109/ddecs.2017.7934564.","bibtex":"@inproceedings{Kampmann_Hellebrand_2017, title={Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test}, DOI={10.1109/ddecs.2017.7934564}, booktitle={20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17)}, publisher={IEEE}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2017} }","ama":"Kampmann M, Hellebrand S. Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. In: 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). IEEE; 2017. doi:10.1109/ddecs.2017.7934564","apa":"Kampmann, M., & Hellebrand, S. (2017). Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). https://doi.org/10.1109/ddecs.2017.7934564","chicago":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” In 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). IEEE, 2017. https://doi.org/10.1109/ddecs.2017.7934564."},"language":[{"iso":"eng"}],"doi":"10.1109/ddecs.2017.7934564","_id":"10576","date_updated":"2022-05-11T17:14:51Z","publication_identifier":{"isbn":["9781538604724"]},"publication_status":"published","status":"public","date_created":"2019-07-05T08:23:56Z","publisher":"IEEE","author":[{"first_name":"Matthias","full_name":"Kampmann, Matthias","last_name":"Kampmann","id":"10935"},{"first_name":"Sybille","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","last_name":"Hellebrand","id":"209"}],"publication":"20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS'17)","department":[{"_id":"48"}],"title":"Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test","user_id":"209"},{"title":"X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test","user_id":"209","place":"Hiroshima, Japan","status":"public","date_created":"2019-08-28T08:53:04Z","author":[{"first_name":"Matthias","full_name":"Kampmann, Matthias","last_name":"Kampmann","id":"10935"},{"full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","first_name":"Sybille","id":"209","last_name":"Hellebrand"}],"publisher":"IEEE","publication":"25th IEEE Asian Test Symposium (ATS'16)","department":[{"_id":"48"}],"doi":"10.1109/ats.2016.20","date_updated":"2022-01-06T06:51:27Z","_id":"12975","citation":{"apa":"Kampmann, M., & Hellebrand, S. (2016). X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test. In 25th IEEE Asian Test Symposium (ATS’16) (pp. 1–6). Hiroshima, Japan: IEEE. https://doi.org/10.1109/ats.2016.20","ama":"Kampmann M, Hellebrand S. X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test. In: 25th IEEE Asian Test Symposium (ATS’16). Hiroshima, Japan: IEEE; 2016:1-6. doi:10.1109/ats.2016.20","chicago":"Kampmann, Matthias, and Sybille Hellebrand. “X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test.” In 25th IEEE Asian Test Symposium (ATS’16), 1–6. Hiroshima, Japan: IEEE, 2016. https://doi.org/10.1109/ats.2016.20.","bibtex":"@inproceedings{Kampmann_Hellebrand_2016, place={Hiroshima, Japan}, title={X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test}, DOI={10.1109/ats.2016.20}, booktitle={25th IEEE Asian Test Symposium (ATS’16)}, publisher={IEEE}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2016}, pages={1–6} }","mla":"Kampmann, Matthias, and Sybille Hellebrand. “X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test.” 25th IEEE Asian Test Symposium (ATS’16), IEEE, 2016, pp. 1–6, doi:10.1109/ats.2016.20.","short":"M. Kampmann, S. Hellebrand, in: 25th IEEE Asian Test Symposium (ATS’16), IEEE, Hiroshima, Japan, 2016, pp. 1–6.","ieee":"M. Kampmann and S. Hellebrand, “X Marks the Spot: Scan-Flip-Flop Clustering for Faster-than-at-Speed Test,” in 25th IEEE Asian Test Symposium (ATS’16), 2016, pp. 1–6."},"type":"conference","year":"2016","page":"1-6","language":[{"iso":"eng"}]},{"year":"2015","type":"conference","citation":{"ieee":"M. Kampmann, M. A. Kochte, E. Schneider, T. Indlekofer, S. Hellebrand, and H.-J. Wunderlich, “Optimized Selection of Frequencies for Faster-Than-at-Speed Test,” in 24th IEEE Asian Test Symposium (ATS’15), 2015, pp. 109–114.","short":"M. Kampmann, M. A. Kochte, E. Schneider, T. Indlekofer, S. Hellebrand, H.-J. Wunderlich, in: 24th IEEE Asian Test Symposium (ATS’15), IEEE, Mumbai, India, 2015, pp. 109–114.","mla":"Kampmann, Matthias, et al. “Optimized Selection of Frequencies for Faster-Than-at-Speed Test.” 24th IEEE Asian Test Symposium (ATS’15), IEEE, 2015, pp. 109–14, doi:10.1109/ats.2015.26.","bibtex":"@inproceedings{Kampmann_A. Kochte_Schneider_Indlekofer_Hellebrand_Wunderlich_2015, place={Mumbai, India}, title={Optimized Selection of Frequencies for Faster-Than-at-Speed Test}, DOI={10.1109/ats.2015.26}, booktitle={24th IEEE Asian Test Symposium (ATS’15)}, publisher={IEEE}, author={Kampmann, Matthias and A. Kochte, Michael and Schneider, Eric and Indlekofer, Thomas and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2015}, pages={109–114} }","chicago":"Kampmann, Matthias, Michael A. Kochte, Eric Schneider, Thomas Indlekofer, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Optimized Selection of Frequencies for Faster-Than-at-Speed Test.” In 24th IEEE Asian Test Symposium (ATS’15), 109–14. Mumbai, India: IEEE, 2015. https://doi.org/10.1109/ats.2015.26.","apa":"Kampmann, M., A. Kochte, M., Schneider, E., Indlekofer, T., Hellebrand, S., & Wunderlich, H.-J. (2015). Optimized Selection of Frequencies for Faster-Than-at-Speed Test. In 24th IEEE Asian Test Symposium (ATS’15) (pp. 109–114). Mumbai, India: IEEE. https://doi.org/10.1109/ats.2015.26","ama":"Kampmann M, A. Kochte M, Schneider E, Indlekofer T, Hellebrand S, Wunderlich H-J. Optimized Selection of Frequencies for Faster-Than-at-Speed Test. In: 24th IEEE Asian Test Symposium (ATS’15). Mumbai, India: IEEE; 2015:109-114. doi:10.1109/ats.2015.26"},"page":"109-114","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:51:27Z","_id":"12976","doi":"10.1109/ats.2015.26","author":[{"full_name":"Kampmann, Matthias","first_name":"Matthias","id":"10935","last_name":"Kampmann"},{"last_name":"A. Kochte","first_name":"Michael","full_name":"A. Kochte, Michael"},{"last_name":"Schneider","full_name":"Schneider, Eric","first_name":"Eric"},{"first_name":"Thomas","full_name":"Indlekofer, Thomas","last_name":"Indlekofer"},{"last_name":"Hellebrand","id":"209","first_name":"Sybille","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939"},{"full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim","last_name":"Wunderlich"}],"publisher":"IEEE","publication":"24th IEEE Asian Test Symposium (ATS'15)","department":[{"_id":"48"}],"status":"public","date_created":"2019-08-28T09:03:08Z","place":"Mumbai, India","title":"Optimized Selection of Frequencies for Faster-Than-at-Speed Test","user_id":"209"},{"language":[{"iso":"eng"}],"type":"misc","year":"2015","citation":{"ieee":"S. Hellebrand, T. Indlekofer, M. Kampmann, M. Kochte, C. Liu, and H.-J. Wunderlich, Effiziente Auswahl von Testfrequenzen für den Test kleiner Verzögerungsfehler. 27. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’15), Bad Urach, Germany, 2015.","short":"S. Hellebrand, T. Indlekofer, M. Kampmann, M. Kochte, C. Liu, H.-J. Wunderlich, Effiziente Auswahl von Testfrequenzen Für Den Test Kleiner Verzögerungsfehler, 27. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’15), Bad Urach, Germany, 2015.","mla":"Hellebrand, Sybille, et al. Effiziente Auswahl von Testfrequenzen Für Den Test Kleiner Verzögerungsfehler. 2015.","bibtex":"@book{Hellebrand_Indlekofer_Kampmann_Kochte_Liu_Wunderlich_2015, place={27. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’15), Bad Urach, Germany}, title={Effiziente Auswahl von Testfrequenzen für den Test kleiner Verzögerungsfehler}, author={Hellebrand, Sybille and Indlekofer, Thomas and Kampmann, Matthias and Kochte, Michael and Liu, Chang and Wunderlich, Hans-Joachim}, year={2015} }","apa":"Hellebrand, S., Indlekofer, T., Kampmann, M., Kochte, M., Liu, C., & Wunderlich, H.-J. (2015). Effiziente Auswahl von Testfrequenzen für den Test kleiner Verzögerungsfehler. 27. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’15), Bad Urach, Germany.","ama":"Hellebrand S, Indlekofer T, Kampmann M, Kochte M, Liu C, Wunderlich H-J. Effiziente Auswahl von Testfrequenzen Für Den Test Kleiner Verzögerungsfehler. 27. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’15), Bad Urach, Germany; 2015.","chicago":"Hellebrand, Sybille, Thomas Indlekofer, Matthias Kampmann, Michael Kochte, Chang Liu, and Hans-Joachim Wunderlich. Effiziente Auswahl von Testfrequenzen Für Den Test Kleiner Verzögerungsfehler. 27. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’15), Bad Urach, Germany, 2015."},"_id":"13077","date_updated":"2022-01-06T06:51:28Z","status":"public","date_created":"2019-08-28T12:05:44Z","author":[{"id":"209","last_name":"Hellebrand","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","first_name":"Sybille"},{"full_name":"Indlekofer, Thomas","first_name":"Thomas","last_name":"Indlekofer"},{"last_name":"Kampmann","id":"10935","first_name":"Matthias","full_name":"Kampmann, Matthias"},{"full_name":"Kochte, Michael","first_name":"Michael","last_name":"Kochte"},{"last_name":"Liu","full_name":"Liu, Chang","first_name":"Chang"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"department":[{"_id":"48"}],"keyword":["Workshop"],"user_id":"659","title":"Effiziente Auswahl von Testfrequenzen für den Test kleiner Verzögerungsfehler","place":"27. Workshop \"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\" (TuZ'15), Bad Urach, Germany"},{"doi":"10.1109/test.2014.7035360","date_updated":"2022-01-06T06:51:27Z","_id":"12977","year":"2014","citation":{"chicago":"Hellebrand, Sybille, Thomas Indlekofer, Matthias Kampmann, Michael A. Kochte, Chang Liu, and Hans-Joachim Wunderlich. “FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects.” In IEEE International Test Conference (ITC’14). Seattle, Washington, USA: IEEE, 2014. https://doi.org/10.1109/test.2014.7035360.","ama":"Hellebrand S, Indlekofer T, Kampmann M, A. Kochte M, Liu C, Wunderlich H-J. FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects. In: IEEE International Test Conference (ITC’14). Seattle, Washington, USA: IEEE; 2014. doi:10.1109/test.2014.7035360","apa":"Hellebrand, S., Indlekofer, T., Kampmann, M., A. Kochte, M., Liu, C., & Wunderlich, H.-J. (2014). FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects. In IEEE International Test Conference (ITC’14). Seattle, Washington, USA: IEEE. https://doi.org/10.1109/test.2014.7035360","mla":"Hellebrand, Sybille, et al. “FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects.” IEEE International Test Conference (ITC’14), IEEE, 2014, doi:10.1109/test.2014.7035360.","bibtex":"@inproceedings{Hellebrand_Indlekofer_Kampmann_A. Kochte_Liu_Wunderlich_2014, place={Seattle, Washington, USA}, title={FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects}, DOI={10.1109/test.2014.7035360}, booktitle={IEEE International Test Conference (ITC’14)}, publisher={IEEE}, author={Hellebrand, Sybille and Indlekofer, Thomas and Kampmann, Matthias and A. Kochte, Michael and Liu, Chang and Wunderlich, Hans-Joachim}, year={2014} }","short":"S. Hellebrand, T. Indlekofer, M. Kampmann, M. A. Kochte, C. Liu, H.-J. Wunderlich, in: IEEE International Test Conference (ITC’14), IEEE, Seattle, Washington, USA, 2014.","ieee":"S. Hellebrand, T. Indlekofer, M. Kampmann, M. A. Kochte, C. Liu, and H.-J. Wunderlich, “FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects,” in IEEE International Test Conference (ITC’14), 2014."},"type":"conference","language":[{"iso":"eng"}],"title":"FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects","user_id":"209","place":"Seattle, Washington, USA","date_created":"2019-08-28T09:04:45Z","status":"public","department":[{"_id":"48"}],"publication":"IEEE International Test Conference (ITC'14)","author":[{"first_name":"Sybille","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","id":"209"},{"last_name":"Indlekofer","full_name":"Indlekofer, Thomas","first_name":"Thomas"},{"last_name":"Kampmann","id":"10935","first_name":"Matthias","full_name":"Kampmann, Matthias"},{"first_name":"Michael","full_name":"A. Kochte, Michael","last_name":"A. Kochte"},{"last_name":"Liu","full_name":"Liu, Chang","first_name":"Chang"},{"first_name":"Hans-Joachim","full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich"}],"publisher":"IEEE"}]