@article{51518, abstract = {{In applications of piezoelectric actuators and sensors, the dependability and particularly the reliability throughout their lifetime are vital to manufacturers and end-users and are enabled through condition-monitoring approaches. Existing approaches often utilize impedance measurements over a range of frequencies or velocity measurements and require additional equipment or sensors, such as a laser Doppler vibrometer. Furthermore, the non-negligible effects of varying operating conditions are often unconsidered. To minimize the need for additional sensors while maintaining the dependability of piezoelectric bending actuators irrespective of varying operating conditions, an online diagnostics approach is proposed. To this end, time- and frequency-domain features are extracted from monitored current signals to reflect hairline crack development in bending actuators. For validation of applicability, the presented analysis method was evaluated on piezoelectric bending actuators subjected to accelerated lifetime tests at varying voltage amplitudes and under external damping conditions. In the presence of a crack and due to a diminished stiffness, the resonance frequency decreases and the root-mean-square amplitude of the current signal simultaneously abruptly drops during the lifetime tests. Furthermore, the piezoelectric crack surfaces clapping is reflected in higher harmonics of the current signal. Thus, time-domain features and harmonics of the current signals are sufficient to diagnose hairline cracks in the actuators.}}, author = {{Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Hemsel, Tobias and Sextro, Walter}}, issn = {{2079-9292}}, journal = {{Electronics}}, keywords = {{piezoelectric transducer, self-sensing, fault detection, diagnostics, hairline crack, condition monitoring}}, number = {{3}}, publisher = {{MDPI AG}}, title = {{{Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions}}}, doi = {{10.3390/electronics13030521}}, volume = {{13}}, year = {{2024}}, } @inproceedings{47234, author = {{Sehlmeyer, Birte and Kampmann, Rebecca and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias }}, booktitle = {{Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)}}, location = {{Dresden}}, title = {{{Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells}}}, year = {{2023}}, } @inproceedings{47235, author = {{Kampmann, Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias}}, booktitle = {{Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)}}, location = {{Dresden}}, title = {{{Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells}}}, year = {{2023}}, } @inproceedings{51117, author = {{Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}}, location = {{Jeju, Korea}}, title = {{{Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}}}, year = {{2023}}, } @inproceedings{51118, author = {{Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}}, location = {{Incheon, Korea}}, title = {{{Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}}}, year = {{2023}}, } @inproceedings{51119, author = {{Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}}, location = {{Jeju, Korea}}, title = {{{Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}}}, year = {{2023}}, } @inbook{33500, abstract = {{This article is dedicated to piezoelectric ultrasonic power transducers that differ to well known medical ultrasonic diagnostic apparatus or non destructive testing devices by the level of power in use; typically several tens of up to more than thousand watts are used in a multitude of different applications. After a short introduction including historical development, the first focus is on theoretical background of the operating principle, design and mechanical modeling. As piezoelectric elements transform electrical to mechanical energy and vice versa, equivalent circuit modeling is also described. After that, sample applications are delineated by the matter wherein ultrasound generates unique effects: incredible high pressure level as well in air as in water, micro-bubbles generating temperature peaks for very short time instances in fluids, acoustoplastic effect, enhancement of diffusion and recrystallization in solids, friction manipulation, incremental deformation and micro-cracking of surfaces, or even generation of macroscopic movements in motors. At the end, some future directions ranging from novel modeling approaches to advanced control and new materials are addressed.}}, author = {{Hemsel, Tobias and Twiefel, Jens}}, booktitle = {{Reference Module in Materials Science and Materials Engineering}}, isbn = {{978-0-12-803581-8}}, keywords = {{Equivalent circuit model, Langevin transducer, Lumped parameter model, Piezoelectric transducer, Ultrasonic processes, Ultrasound}}, publisher = {{Elsevier}}, title = {{{Piezoelectric Ultrasonic Power Transducers}}}, doi = {{10.1016/b978-0-12-819728-8.00047-4}}, year = {{2022}}, } @inproceedings{30371, abstract = {{To achieve optimum bond results at ultrasonic bonding thick copper wire on sensitive components is quite challenging. Bearing in mind that high normal force and ultrasonic power are needed for bond quality but as well increase stress and finally failure risk of the substrate, methods should be found to achieve high bond quality even at lower bond parameters. Therefore, bond experiments with different bond tool grove geometries have been conducted for copper and aluminum wire on direct copper bonded (DCB) substrates to investigate the impact of geometric parameters on bond formation and bond quality. The wire material depending impact of geometry changes on the bond formation and deformation was quantified. Additionally, a bonding parameter design of experiments (DOE) has been conducted for the reference and the most promising groove geometry. Higher shear values were achieved at reduced vertical tool displacement for most bonding parameter combinations, compared to the reference tool. This behavior allows for reducing ultrasonic power to obtain equal shear values; consequently, mechanical stresses in the interface decrease. This could potentially reduce the risk of chip damage and thus yield loss.}}, author = {{Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}}, isbn = {{ISBN 978-3-8007-5757-2 }}, location = {{Berlin}}, pages = {{138--143}}, publisher = {{VDE VERLAG GMBH}}, title = {{{Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}}}, year = {{2022}}, } @inproceedings{34104, abstract = {{ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB's and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area.}}, author = {{Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}}, publisher = {{IEEE}}, title = {{{Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}}}, doi = {{10.1109/estc55720.2022.9939478}}, year = {{2022}}, } @techreport{52045, author = {{Scheidemann, Claus and Hemsel, Tobias and Sextro, Walter}}, publisher = {{LibreCat University}}, title = {{{Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen}}}, doi = {{10.2314/KXP:1879655276}}, year = {{2022}}, } @article{21436, abstract = {{Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.}}, author = {{Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}}, issn = {{0026-2714}}, journal = {{Microelectronics Reliability}}, keywords = {{Ultrasonic heavy wire bonding, Co-simulation, ANSYS, MATLAB, Process optimization, Friction coefficient, Copper-copper, Aluminium-copper}}, pages = {{114077}}, title = {{{Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}}}, doi = {{https://doi.org/10.1016/j.microrel.2021.114077}}, volume = {{119}}, year = {{2021}}, } @inproceedings{17355, abstract = {{Ultrasonic wire bonding is a process to form electrical connections in electronics well established industry. Typically, a clamping tool is pressed on the wire and forced to vibrate at relative high frequency 40 to 100 kHz. The ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes, contamination like oxide layers are removed from the contact zone, the surface roughness is reduced, and with increasing bond duration an metallic connection of wire and substrate is established. It is known that the amount of ultrasonic energy over time directly influences the strength and reliability of the bond connection, but the determination of optimum bond parameters is still a challenging experimental task. For this, in the past different model approaches have been presented, to calculate the bond quality by simulation. Measuring the friction between wire and substrate to validate these models is a challenging task at ultrasonic bonding frequency. Therefore a versatile test rig for bonding experiments at frequencies lower than 1 kHz is setup to get detailed insight into the different phases of the connection process. It includes a piezoelectric force sensor for the measurement of the three-dimensional process forces, an electrodynamic shaker for the vibration excitation and a conventional tension-compression testing machine to apply the bond normal force. Using this test rig, it is possible to observe the different phases of bond formation in detail, validate and enhance existing models and finally optimize bond parameters for different processes.}}, author = {{Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf and Sextro, Walter}}, booktitle = {{CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}}, pages = {{1--6}}, title = {{{Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}}}, year = {{2020}}, } @inproceedings{17706, author = {{Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}}, isbn = {{9781728160498}}, title = {{{Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}}}, doi = {{10.1109/eurosime48426.2020.9152679}}, year = {{2020}}, } @inproceedings{14852, abstract = {{In a variety of industrial applications, liquids are atomized to produce aerosols for further processing. Example applications are the coating of surfaces with paints, the application of ultra-thin adhesive layers and the atomization of fuels for the production of combustible dispersions. In this publication different atomizing principles (standing-wave, capillary-wave, vibrating-mesh) are examined and discussed. Using an optimized standing-wave system, tough liquids with viscosities of up to about 100 Pas could be successfully atomized.}}, author = {{Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter and Sextro, Walter}}, booktitle = {{Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)}}, editor = {{Lötters, Joost and Urban, Gerald}}, keywords = {{atomization, ultrasound, standing-wave, capillarywave, vibrating-mesh}}, location = {{Enschede, The Netherlands}}, pages = {{140--143}}, title = {{{Atomization of Fluids with Ultrasound}}}, year = {{2019}}, } @inproceedings{15244, author = {{Hagedorn, Oliver Ernst Caspar and Pielsticker, Daniel and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{2. VDI-Fachtagung Schwingungen 2019}}, isbn = {{978-3-18-092366-6}}, publisher = {{VDI Verlag GmbH · Düsseldorf 2019}}, title = {{{Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen}}}, year = {{2019}}, } @inproceedings{10258, abstract = {{Für die Zerstäubung hochviskoser Flüssigkeiten werden neben Düsenzerstäubern vor allem UltraschallStehwellenzerstäuber angewendet [1]. Diese ermöglichen ohne weitere Maßnahmen zwar keine gerichtete Zerstäubung, benötigen jedoch im Gegensatz zu Düsenzerstäubern keine hohen Drücke und haben keine hohen Austrittsgeschwindigkeiten. Zur Erzeugung der Ultraschallwellen werden typischerweise piezoelektrische, mit Bolzen verschraubte LangevinWandler verwendet [1-4], die eine starke Schallabstrahlung bei einer elektrischen Eingangsleistung von bis zu einigen Kilowatt erzeugen können. Wie bei jedem anderen schwingenden System emittiert der Ultraschallwandler zunächst eine Wanderwelle. Mit einem Reflektor, der gegenüber der Sonotrode angeordnet ist, wird eine stehende Welle erzeugt. Im Resonanzabstand zwischen Reflektor und Wandler werden abgestrahlte und reflektierte Wellen so überlagert, dass höhere Schalldruckamplituden erzielt werden. Ein einfacher Ansatz zur Maximierung des Schallpegels im Stehwellenfeld ist die Erhöhung der Schwingungsamplituden des Wandlers, die jedoch zu Schäden oder zumindest zu einer Verringerung der Lebensdauer führen kann. Hohe Schalldrücke werden auch bei geringen Abständen zwischen Wandler und Reflektor erreicht. Das Volumen des Schallfeldes ist in diesem Fall jedoch für die meisten Prozesse zu klein. Ein weiterer Ansatz ist die Verwendung zweier entgegengesetzt angeordneter Wandler [5]. In diesem Fall erfordert jedoch die Erzeugung einer stehenden Welle eine genaue Abstimmung von Frequenz und Phase beider Wandler, was eine komplexe Steuerung erfordert. Ebenso ist es möglich, geometrische Randbedingungen des Stehwellensystems zu optimieren, sodass es zu optimaler Interferenz der Wellen kommt. Im Folgenden wird der Anschaulichkeit halber vereinfachend angenommen, dass der Wandler an seiner Sonotrodenoberfläche einzelne Schallstrahlen aussendet, die in Nähe des Wandlers nahezu parallel verlaufen und sich mit zunehmender Entfernung vom Wandler auffächern. Ein einfaches Stehwellensystem, bestehend aus ebener Sonotrode und ebenem Reflektor, erzeugt bei kleinem Abstand zwischen Sonotrode und Reflektor sehr hohe Schallpegel, da nahezu sämtliche ausgesandten Schallstrahlen in Richtung der Sonotrode reflektiert werden positive Interferenz entsteht. Erhöht man jedoch den Abstand zwischen Sonotrode und Reflektor, so nehmen die Verluste durch Schallstrahlen, die den Prozessraum verlassen, zu. Wie Abbildung 1 gezeigt, werden nur Schallstrahlen, die in etwa parallel zur Rotationsachse verlaufen, zum Wandler zurück reflektiert und tragen zum Stehwellenfeld bei. Die Strahlen haben zudem abhängig vom Abstrahlwinkel unterschiedliche Weglängen. Die Stehwellenbedingung ist demnach nur für Strahlen in der Nähe der Rotationsachse exakt erfüllt. Um dies zu vermeiden, müssen die Geometrien von Wandler und Reflektor optimiert werden. In den folgenden Abschnitten wird zunächst ein Optimierungsansatz vorgestellt. Mithilfe eines FiniteElemente-Modells werden die Auswirkungen einer optimierten Geometrie auf den maximalen Schalldruckpegel untersucht. Ergebnisse werden durch Messungen an einem experimentellen Aufbau eines Stehwellensystems validiert. Es wird gezeigt, wie sich die Optimierung der geometrischen Randbedingungen auf die Zerstäubung hochviskoser Flüssigkeiten auswirkt.}}, author = {{Dunst, Paul and Hemsel, Tobias and Bornmann, Peter and Littmann, Walter and Sextro, Walter}}, booktitle = {{DAGA 2019}}, location = {{Rostock}}, title = {{{Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten}}}, year = {{2019}}, } @article{10334, abstract = {{Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.}}, author = {{Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}}, issn = {{0924-4247}}, journal = {{Sensors and Actuators A: Physical}}, keywords = {{Ultrasonic bonding, Ultrasonic welding, Multi-dimensional bonding, Complex vibration, Multi-frequent, Two-dimensional friction model}}, pages = {{653 -- 662}}, title = {{{Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}}}, doi = {{10.1016/j.sna.2019.04.025}}, volume = {{295}}, year = {{2019}}, } @article{9990, abstract = {{The handling of fine powders is an important task in modern production processes. However, as fine powders strongly tend to adhesion and agglomeration, their processing with conventional methods is difficult or impossible. Especially when processing small amounts of highly sensitive fine powders, conventional methods reach their technical limits. In process steps such as dosing, transport, and especially mixing of fine powders new methods are required. Apart from the well-known method of manipulating powder properties by adding chemical additives, this contribution aims at improving the handling of dry fine powders by using vibrations at different frequencies. Modules are presented, which enable the continuous dosing, the homogeneous mixing and the transport of dry fine powders. Finally, these modules are combined for the production of a homogeneous mixture of two dry fine powders.}}, author = {{Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter}}, journal = {{ACTUATOR 2018; 16th International Conference on New Actuators}}, pages = {{142--145}}, title = {{{Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders}}}, year = {{2018}}, } @article{9991, abstract = {{Abstract:Since fine powders tend strongly to adhesion and agglomeration, their processing withconventional methods is difficult or impossible. Typically, in order to enable the handling of finepowders, chemicals are added to increase the flowability and reduce adhesion. This contributionshows that instead of additives also vibrations can be used to increase the flowability, to reduceadhesion and cohesion, and thus to enable or improve processes such as precision dosing, mixing,and transport of very fine powders. The methods for manipulating powder properties are describedin detail and prototypes for experimental studies are presented. It is shown that the handling of finepowders can be improved by using low-frequency, high-frequency or a combination of low- andhigh-frequency vibration.}}, author = {{Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Sextro, Walter}}, journal = {{Actuators 2018, 7(2).}}, keywords = {{powder handling, flowability, dosing, transport, mixing, dispersion, piezoelectricactuators, vibrations}}, pages = {{1--11}}, title = {{{Vibration-Assisted Handling of Dry Fine Powders}}}, doi = {{10.3390/act7020018}}, year = {{2018}}, } @inproceedings{9992, abstract = {{State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.}}, author = {{Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}}, booktitle = {{(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}}, keywords = {{ultrasonic wire-bonding, bond-tool design, parameter identification, statistical engineering}}, pages = {{1--6}}, title = {{{Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}}}, year = {{2018}}, }