[{"year":"2022","title":"Enhanced process development by simulation of ultrasonic heavy wire bonding","publisher":"Shaker","date_created":"2022-12-07T14:03:17Z","abstract":[{"lang":"ger","text":"Das Ultraschall-Dickdrahtbonden mit Aluminiumdraht ist ein Standardverfahren zur elektrischenKontaktierung von Leistungshalbleitermodulen. Die steigenden Anforderungen an die Effizienzund Zuverlässigkeit der Module haben zu technologischen Weiterentwicklungen geführt und eswerden vermehrt Kupferdrähte mit wesentlich besseren elektrischen und thermischen Eigenschafteneingesetzt. Hieraus resultieren durch höhere Prozesskräfte und Ultraschallleistung neueHerausforderungen bei der Prozessentwicklung; hierfür wird ein Simulationsmodell zur Verbesserungder Prozessentwicklung entwickelt.In Ultraschall-Drahtbondversuchen mit 400 m Aluminium und Kupfer Drähten wurde der Einflussder Prozessparameter auf die Bondqualität untersucht; diese Ergebnisse und zusätzliche Messungender Drahtdeformation und Schwingungen wurden für die Formulierung der Anforderungenund zur Validierung der Ergebnisse des Simulationsmodells genutzt.Es wurde ein Prozessmodell, basierend auf einer Co-Simulation zwischen MATLAB und ANSYS,entwickelt; hierbei wurden die phyiskalischen Phänomene wie die Ultraschall Werkstoffentfestigung,der Verbindungsaufbau und die dynamischen Systemeigenschaften abgebildet.Basierend auf einer Zug-Druck-Prüfmaschine wurde ein Prüfstand zur Identifikation der Modellparameterentwickelt. In zusätzlichen Druckversuchen mit den Bonddrähten mit und ohneUltraschallanregung wurde die Reduktion der Umformkräfte unter Ultraschalleinfluss untersucht.Mit dem entwickelten Prozessmodell wurden die Parameterstudien aus den Ultraschall-Drahtbondversuchensimuliert und direkt mit den experimentellen Ergebnissen verglichen, wobei sich einerelativ gute Übereinstimmung zwischen Simulation und Messung sowohl für Aluminium, als auchfür Kupfer, erzielen ließ."},{"lang":"eng","text":"Ultrasonic heavy wire bonding with aluminium wire is a standard process to produce electricalcontacts in power semiconductor modules. The increasing demands on the efficiency and reliabilityof the modules have led to technological developments and copper wires with significantlybetter electrical and thermal properties are used more often nowadays. This results in new challengesin process development due to higher process forces and ultrasonic power; for this purpose,a simulation model is developed to improve process development.Ultrasonic wire bonding tests with 400 m aluminium and copper wires were carried out to investigatethe influence of the process parameters on the bond quality; these results and additionalmeasurements of wire deformation and vibrations were used to define the requirements for themodel and validate the results of the simulation.A process model based on a co-simulation was developed between MATLAB and ANSYS; thephysical phenomena such as ultrasonic softening of the wire material, bond formation and dynamicbehaviour of the components were considered.Based on a tensile-compression testing machine, a test rig was developed to identify the modelparameters. In additional compression tests with the wires with and without ultrasonic excitation,the reduction of the forming forces under ultrasonic influence was characterised.With the developed process model, the parameter studies from the ultrasonic wire bond testswere simulated and directly compared with the experimental results; a relative good agreementbetween simulation and measurement could be achieved for both aluminium and copper."}],"language":[{"iso":"eng"}],"citation":{"ieee":"R. Schemmel, <i>Enhanced process development by simulation of ultrasonic heavy wire bonding</i>, vol. 13. Shaker, 2022.","chicago":"Schemmel, Reinhard. <i>Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding</i>. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2022. <a href=\"https://doi.org/10.17619/UNIPB/1-1280\">https://doi.org/10.17619/UNIPB/1-1280</a>.","ama":"Schemmel R. <i>Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding</i>. Vol 13. Shaker; 2022. doi:<a href=\"https://doi.org/10.17619/UNIPB/1-1280\">10.17619/UNIPB/1-1280</a>","short":"R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.","mla":"Schemmel, Reinhard. <i>Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding</i>. Shaker, 2022, doi:<a href=\"https://doi.org/10.17619/UNIPB/1-1280\">10.17619/UNIPB/1-1280</a>.","bibtex":"@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Enhanced process development by simulation of ultrasonic heavy wire bonding}, volume={13}, DOI={<a href=\"https://doi.org/10.17619/UNIPB/1-1280\">10.17619/UNIPB/1-1280</a>}, publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","apa":"Schemmel, R. (2022). <i>Enhanced process development by simulation of ultrasonic heavy wire bonding</i> (Vol. 13). Shaker. <a href=\"https://doi.org/10.17619/UNIPB/1-1280\">https://doi.org/10.17619/UNIPB/1-1280</a>"},"intvolume":"        13","page":"174","publication_status":"published","publication_identifier":{"isbn":["\t978-3-8440-8527-3"]},"related_material":{"link":[{"url":"https://www.shaker.eu/en/content/catalogue/index.asp?lang=en&ID=8&ISBN=978-3-8440-8527-3&search=yes","relation":"dissertation_contains"}]},"main_file_link":[{"url":"https://digital.ub.uni-paderborn.de/hs/id/6223291","open_access":"1"}],"doi":"10.17619/UNIPB/1-1280","oa":"1","date_updated":"2022-12-07T14:15:23Z","author":[{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"}],"supervisor":[{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"volume":13,"status":"public","type":"dissertation","_id":"34272","series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","user_id":"210","department":[{"_id":"151"}]},{"abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area."}],"status":"public","type":"journal_article","publication":"Microelectronics Reliability","keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"language":[{"iso":"eng"}],"_id":"21436","user_id":"210","department":[{"_id":"151"}],"year":"2021","citation":{"bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol. 119, 2021, p. 114077, doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>, <i>119</i>, 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>. 2021;119:114077. doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>"},"page":"114077","intvolume":"       119","publication_status":"published","quality_controlled":"1","publication_identifier":{"issn":["0026-2714"]},"title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","doi":"https://doi.org/10.1016/j.microrel.2021.114077","date_updated":"2023-09-21T14:15:33Z","author":[{"first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647"},{"first_name":"Viktor","full_name":"Krieger, Viktor","last_name":"Krieger"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_created":"2021-03-10T09:37:02Z","volume":119},{"language":[{"iso":"eng"}],"department":[{"_id":"151"}],"user_id":"210","_id":"17355","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a process to form electrical connections in electronics well established industry. Typically, a clamping tool is pressed on the wire and forced to vibrate at relative high frequency 40 to 100 kHz. The ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes, contamination like oxide layers are removed from the contact zone, the surface roughness is reduced, and with increasing bond duration an metallic connection of wire and substrate is established. It is known that the amount of ultrasonic energy over time directly influences the strength and reliability of the bond connection, but the determination of optimum bond parameters is still a challenging experimental task. For this, in the past different model approaches have been presented, to calculate the bond quality by simulation. Measuring the friction between wire and substrate to validate these models is a challenging task at ultrasonic bonding frequency. Therefore a versatile test rig for bonding experiments at frequencies lower than 1 kHz is setup to get detailed insight into the different phases of the connection process. It includes a piezoelectric force sensor for the measurement of the three-dimensional process forces, an electrodynamic shaker for the vibration excitation and a conventional tension-compression testing machine to apply the bond normal force. Using this test rig, it is possible to observe the different phases of bond formation in detail, validate and enhance existing models and finally optimize bond parameters for different processes."}],"publication":"CIPS 2020; 11th International Conference on Integrated Power Electronics Systems","type":"conference","title":"Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding","author":[{"first_name":"Reinhard","full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel"},{"last_name":"Scheidemann","full_name":"Scheidemann, Claus","id":"38259","first_name":"Claus"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"first_name":"Olaf ","full_name":"Kirsch, Olaf ","last_name":"Kirsch"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"date_created":"2020-07-06T07:41:21Z","date_updated":"2023-09-21T14:27:32Z","page":"1-6","citation":{"chicago":"Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf  Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In <i>CIPS 2020; 11th International Conference on Integrated Power Electronics Systems</i>, 1–6, 2020.","ieee":"R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in <i>CIPS 2020; 11th International Conference on Integrated Power Electronics Systems</i>, 2020, pp. 1–6.","ama":"Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. In: <i>CIPS 2020; 11th International Conference on Integrated Power Electronics Systems</i>. ; 2020:1-6.","mla":"Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” <i>CIPS 2020; 11th International Conference on Integrated Power Electronics Systems</i>, 2020, pp. 1–6.","short":"R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.","bibtex":"@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}, author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf  and Sextro, Walter}, year={2020}, pages={1–6} }","apa":"Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., &#38; Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. <i>CIPS 2020; 11th International Conference on Integrated Power Electronics Systems</i>, 1–6."},"year":"2020","quality_controlled":"1"},{"date_updated":"2023-09-21T14:16:41Z","author":[{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"first_name":"Viktor","full_name":"Krieger, Viktor","last_name":"Krieger"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_created":"2020-08-07T09:49:17Z","title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","doi":"10.1109/eurosime48426.2020.9152679","publication_identifier":{"isbn":["9781728160498"]},"publication_status":"published","year":"2020","citation":{"ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>.","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020. <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">https://doi.org/10.1109/eurosime48426.2020.9152679</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. ; 2020. doi:<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.","bibtex":"@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020, doi:<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>.","apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">https://doi.org/10.1109/eurosime48426.2020.9152679</a>"},"_id":"17706","department":[{"_id":"151"}],"user_id":"210","language":[{"iso":"eng"}],"publication":"2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","type":"conference","status":"public"},{"language":[{"iso":"eng"}],"ddc":["620"],"file":[{"success":1,"relation":"main_file","content_type":"application/pdf","file_size":1010930,"file_name":"2380-4505-2019.1.000509.pdf","access_level":"closed","file_id":"15413","date_updated":"2019-12-24T21:43:59Z","date_created":"2019-12-24T21:43:59Z","creator":"schemmel"}],"abstract":[{"lang":"eng","text":"<jats:p> Ultrasonic joining is a common industrial process. To build electrical connections in the electronics industry, uni-axial and torsional ultrasonic vibration have been used to join different types of workpieces for decades. Many influencing factors like ultrasonic power, bond normal force, bond duration and frequency are known to have a high impact on bond quality and reliability. Multi-dimensional bonding has been investigated in the past to increase ultrasonic power and consequently bond strength. This contribution is focused on the comparison of circular, multi-frequency planar and uniaxial vibration trajectories used for ultrasonic bonding of copper pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic microscopy and interface cross-sections. </jats:p>"}],"publication":"International Symposium on Microelectronics","title":"Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding","date_created":"2019-12-24T21:41:04Z","year":"2019","quality_controlled":"1","file_date_updated":"2019-12-24T21:43:59Z","department":[{"_id":"151"}],"user_id":"210","_id":"15412","status":"public","type":"conference","conference":{"name":"International Symposium on Microelectronics","location":"Boston"},"doi":"10.4071/2380-4505-2019.1.000509","author":[{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"last_name":"Dymel","full_name":"Dymel, Collin","first_name":"Collin"},{"full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"}],"date_updated":"2023-09-21T14:28:50Z","page":"509-514","citation":{"mla":"Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” <i>International Symposium on Microelectronics</i>, 2019, pp. 509–14, doi:<a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>.","bibtex":"@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }","short":"R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.","apa":"Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. <i>International Symposium on Microelectronics</i>, 509–514. <a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">https://doi.org/10.4071/2380-4505-2019.1.000509</a>","ama":"Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In: <i>International Symposium on Microelectronics</i>. ; 2019:509-514. doi:<a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>","chicago":"Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In <i>International Symposium on Microelectronics</i>, 509–14, 2019. <a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">https://doi.org/10.4071/2380-4505-2019.1.000509</a>.","ieee":"R. Schemmel <i>et al.</i>, “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in <i>International Symposium on Microelectronics</i>, Boston, 2019, pp. 509–514, doi: <a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>."},"has_accepted_license":"1","publication_identifier":{"issn":["2380-4505"]},"publication_status":"published"},{"project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"_id":"10334","user_id":"210","department":[{"_id":"151"}],"keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"],"language":[{"iso":"eng"}],"type":"journal_article","publication":"Sensors and Actuators A: Physical","abstract":[{"lang":"eng","text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed."}],"status":"public","date_updated":"2023-09-21T14:12:15Z","author":[{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"last_name":"Dymel","id":"66833","full_name":"Dymel, Collin","first_name":"Collin"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_created":"2019-07-01T07:32:07Z","volume":295,"title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding","doi":"10.1016/j.sna.2019.04.025","publication_identifier":{"issn":["0924-4247"]},"quality_controlled":"1","year":"2019","citation":{"ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662, 2019, doi: <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295 (2019): 653–62. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>.","ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>","short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>, vol. 295, 2019, pp. 653–62, doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>"},"intvolume":"       295","page":"653 - 662"},{"abstract":[{"lang":"eng","text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach."}],"status":"public","type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"language":[{"iso":"eng"}],"project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"_id":"9992","user_id":"210","department":[{"_id":"151"}],"year":"2018","citation":{"ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018.","ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6.","apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6).","bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6."},"page":"1-6","quality_controlled":"1","title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","date_updated":"2020-05-07T05:33:56Z","author":[{"full_name":"Dymel, Collin","id":"66833","last_name":"Dymel","first_name":"Collin"},{"first_name":"Paul","full_name":"Eichwald, Paul","last_name":"Eichwald"},{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"date_created":"2019-05-27T10:18:10Z"},{"year":"2018","page":"41-44","citation":{"apa":"Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44).","bibtex":"@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }","short":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","mla":"Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","chicago":"Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44, 2018.","ieee":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","ama":"Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44."},"quality_controlled":"1","title":"Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding","date_updated":"2020-05-07T05:33:56Z","date_created":"2019-05-27T10:19:18Z","author":[{"first_name":"Collin","id":"66833","full_name":"Dymel, Collin","last_name":"Dymel"},{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"}],"abstract":[{"lang":"eng","text":"Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories."}],"status":"public","publication":"(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)","type":"conference","keyword":["ultrasonic two-dimensional bonding","electrical interconnection","process parameters"],"language":[{"iso":"eng"}],"_id":"9993","project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"department":[{"_id":"151"}],"user_id":"210"},{"quality_controlled":"1","year":"2018","place":"Stuttgart, Germany","citation":{"apa":"Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany.","short":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.","bibtex":"@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart, Germany}, title={Effects of different working frequencies on the joint formation in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={230–235} }","mla":"Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35.","ama":"Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects of different working frequencies on the joint formation in copper wire bonding. In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.","ieee":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.","chicago":"Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart, Germany, 2018."},"page":"230-235","date_updated":"2020-05-07T05:33:56Z","date_created":"2019-05-27T10:24:37Z","author":[{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"}],"title":"Effects of different working frequencies on the joint formation in copper wire bonding","type":"conference","publication":"CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)","abstract":[{"text":"Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high influence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the influence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure.","lang":"eng"}],"status":"public","project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"_id":"9997","user_id":"210","department":[{"_id":"151"}],"language":[{"iso":"eng"}]},{"citation":{"bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.","mla":"Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 2018, pp. 1–12.","apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In <i>6th European Conference on Computational Mechanics (ECCM 6)</i> (pp. 1–12). Glasgow, UK.","ama":"Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations in ultrasonic heavy wire bonding. In: <i>6th European Conference on Computational Mechanics (ECCM 6)</i>. Glasgow, UK; 2018:1-12.","chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” In <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 1–12. Glasgow, UK, 2018.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 2018, pp. 1–12."},"page":"1-12","year":"2018","place":"Glasgow, UK","title":"Numerical and experimental investigations in ultrasonic heavy wire bonding","author":[{"first_name":"Reinhard","id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel"},{"first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2019-05-27T10:24:38Z","date_updated":"2019-09-23T08:48:04Z","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process."}],"type":"conference","publication":"6th European Conference on Computational Mechanics (ECCM 6)","language":[{"iso":"eng"}],"user_id":"55222","department":[{"_id":"151"}],"_id":"9998"},{"year":"2017","citation":{"ieee":"P. Eichwald <i>et al.</i>, “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","chicago":"Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i> Vol. 2017, No. 1 (2017).","ama":"Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>. 2017;Vol. 2017, No. 1.","short":"P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).","bibtex":"@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }","mla":"Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","apa":"Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>, <i>Vol. 2017</i>, <i>No. 1</i>."},"quality_controlled":"1","title":"Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design","date_updated":"2020-05-07T05:33:54Z","author":[{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"}],"date_created":"2019-05-27T09:32:42Z","volume":"Vol. 2017, No. 1","abstract":[{"text":"In power electronics, copper connector pins are e.g. used to connect control boards with power modules. The new chip generation based on SiC and GaN technology increase the power density of semiconductor modules significantly with junction temperatures reaching 200°C. To enable reliable operation at such high temperature, the soldering of these connector pins should be substituted by a multi-dimensional copper-copper bonding technology. A copper pin welded directly on DBC substrate also simplifies the assembly. With this aim, a proper bond tool and a suitable connector pin geometry are designed. This paper presents a two-dimensional trajectory approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the intention to minimize mechanical stresses exposed to the substrate. This is achieved using a multi-dimensional vibration system with multiple transducers known from flip chip bonding. Applying a planar relative motion between the bonding piece and the substrate increases the induced frictional power compared to one-dimensional excitation. The core of this work is the development of a new tool design which enables a reliable and effective transmission of the multidimensional vibration into the contact area between nail-shaped bonding piece and substrate. For this purpose, different bonding tool as well as bonding piece designs are discussed. A proper bonding tool design is selected based on the simulated alternatives. This tool is examined in bonding experiments and the results are presented. In addition, different grades of hardness for bonding piece and substrate are examined as well as different bonding parameters. Optical inspection of the bonded area shows the emergence of initial micro welds in form of a ring which is growing in direction of the interface boundaries with increasing bonding duration.","lang":"eng"}],"status":"public","type":"journal_article","publication":"IMAPSource","keyword":["International Symposium on Microelectronics"],"language":[{"iso":"eng"}],"project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"_id":"9973","user_id":"210","department":[{"_id":"151"}]},{"date_updated":"2019-05-27T09:49:49Z","date_created":"2019-05-27T09:48:10Z","author":[{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"title":"MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall","place":"Kiel 2017","year":"2017","page":"611-614","citation":{"chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In <i>43. Deutsche Jahrestagung Für Akustik</i>, 611–14. Kiel 2017, 2017.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in <i>43. Deutsche Jahrestagung für Akustik</i>, 2017, pp. 611–614.","ama":"Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: <i>43. Deutsche Jahrestagung Für Akustik</i>. Kiel 2017; 2017:611-614.","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }","mla":"Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” <i>43. Deutsche Jahrestagung Für Akustik</i>, 2017, pp. 611–14.","apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In <i>43. Deutsche Jahrestagung für Akustik</i> (pp. 611–614). Kiel 2017."},"_id":"9982","department":[{"_id":"151"}],"user_id":"55222","keyword":["wire bonding","dynamic behavior","modeling"],"language":[{"iso":"eng"}],"publication":"43. Deutsche Jahrestagung für Akustik","type":"conference","abstract":[{"lang":"ger","text":"ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren."}],"status":"public"},{"publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","type":"conference","status":"public","abstract":[{"lang":"eng","text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage."}],"department":[{"_id":"151"}],"user_id":"210","_id":"9968","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"language":[{"iso":"eng"}],"keyword":["the Ultrasonic Wire Bonding Process"],"quality_controlled":"1","page":"251-254","citation":{"apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan.","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016."},"place":"IEEE CPMT Symposium Japan","year":"2016","author":[{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"date_created":"2019-05-27T09:20:10Z","date_updated":"2020-05-07T05:33:53Z","title":"Validated Simulation of the Ultrasonic Wire Bonding Process"}]