---
_id: '34272'
abstract:
- lang: ger
text: Das Ultraschall-Dickdrahtbonden mit Aluminiumdraht ist ein Standardverfahren
zur elektrischenKontaktierung von Leistungshalbleitermodulen. Die steigenden Anforderungen
an die Effizienzund Zuverlässigkeit der Module haben zu technologischen Weiterentwicklungen
geführt und eswerden vermehrt Kupferdrähte mit wesentlich besseren elektrischen
und thermischen Eigenschafteneingesetzt. Hieraus resultieren durch höhere Prozesskräfte
und Ultraschallleistung neueHerausforderungen bei der Prozessentwicklung; hierfür
wird ein Simulationsmodell zur Verbesserungder Prozessentwicklung entwickelt.In
Ultraschall-Drahtbondversuchen mit 400 m Aluminium und Kupfer Drähten wurde der
Einflussder Prozessparameter auf die Bondqualität untersucht; diese Ergebnisse
und zusätzliche Messungender Drahtdeformation und Schwingungen wurden für die
Formulierung der Anforderungenund zur Validierung der Ergebnisse des Simulationsmodells
genutzt.Es wurde ein Prozessmodell, basierend auf einer Co-Simulation zwischen
MATLAB und ANSYS,entwickelt; hierbei wurden die phyiskalischen Phänomene wie die
Ultraschall Werkstoffentfestigung,der Verbindungsaufbau und die dynamischen Systemeigenschaften
abgebildet.Basierend auf einer Zug-Druck-Prüfmaschine wurde ein Prüfstand zur
Identifikation der Modellparameterentwickelt. In zusätzlichen Druckversuchen mit
den Bonddrähten mit und ohneUltraschallanregung wurde die Reduktion der Umformkräfte
unter Ultraschalleinfluss untersucht.Mit dem entwickelten Prozessmodell wurden
die Parameterstudien aus den Ultraschall-Drahtbondversuchensimuliert und direkt
mit den experimentellen Ergebnissen verglichen, wobei sich einerelativ gute Übereinstimmung
zwischen Simulation und Messung sowohl für Aluminium, als auchfür Kupfer, erzielen
ließ.
- lang: eng
text: Ultrasonic heavy wire bonding with aluminium wire is a standard process to
produce electricalcontacts in power semiconductor modules. The increasing demands
on the efficiency and reliabilityof the modules have led to technological developments
and copper wires with significantlybetter electrical and thermal properties are
used more often nowadays. This results in new challengesin process development
due to higher process forces and ultrasonic power; for this purpose,a simulation
model is developed to improve process development.Ultrasonic wire bonding tests
with 400 m aluminium and copper wires were carried out to investigatethe influence
of the process parameters on the bond quality; these results and additionalmeasurements
of wire deformation and vibrations were used to define the requirements for themodel
and validate the results of the simulation.A process model based on a co-simulation
was developed between MATLAB and ANSYS; thephysical phenomena such as ultrasonic
softening of the wire material, bond formation and dynamicbehaviour of the components
were considered.Based on a tensile-compression testing machine, a test rig was
developed to identify the modelparameters. In additional compression tests with
the wires with and without ultrasonic excitation,the reduction of the forming
forces under ultrasonic influence was characterised.With the developed process
model, the parameter studies from the ultrasonic wire bond testswere simulated
and directly compared with the experimental results; a relative good agreementbetween
simulation and measurement could be achieved for both aluminium and copper.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
citation:
ama: Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy
Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280
apa: Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic
heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280
bibtex: '@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Enhanced process development by simulation of ultrasonic heavy wire bonding},
volume={13}, DOI={10.17619/UNIPB/1-1280},
publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften
des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic
Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik.
Shaker, 2022. https://doi.org/10.17619/UNIPB/1-1280.
ieee: R. Schemmel, Enhanced process development by simulation of ultrasonic heavy
wire bonding, vol. 13. Shaker, 2022.
mla: Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic
Heavy Wire Bonding. Shaker, 2022, doi:10.17619/UNIPB/1-1280.
short: R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy
Wire Bonding, Shaker, 2022.
date_created: 2022-12-07T14:03:17Z
date_updated: 2022-12-07T14:15:23Z
department:
- _id: '151'
doi: 10.17619/UNIPB/1-1280
intvolume: ' 13'
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://digital.ub.uni-paderborn.de/hs/id/6223291
oa: '1'
page: '174'
publication_identifier:
isbn:
- "\t978-3-8440-8527-3"
publication_status: published
publisher: Shaker
related_material:
link:
- relation: dissertation_contains
url: https://www.shaker.eu/en/content/catalogue/index.asp?lang=en&ID=8&ISBN=978-3-8440-8527-3&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Enhanced process development by simulation of ultrasonic heavy wire bonding
type: dissertation
user_id: '210'
volume: 13
year: '2022'
...
---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '17355'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a process to form electrical connections in electronics
well established industry. Typically, a clamping tool is pressed on the wire and
forced to vibrate at relative high frequency 40 to 100 kHz. The ultrasonic vibration
is transmitted through the wire into the interface between wire and substrate.
Due to frictional processes, contamination like oxide layers are removed from
the contact zone, the surface roughness is reduced, and with increasing bond duration
an metallic connection of wire and substrate is established. It is known that
the amount of ultrasonic energy over time directly influences the strength and
reliability of the bond connection, but the determination of optimum bond parameters
is still a challenging experimental task. For this, in the past different model
approaches have been presented, to calculate the bond quality by simulation. Measuring
the friction between wire and substrate to validate these models is a challenging
task at ultrasonic bonding frequency. Therefore a versatile test rig for bonding
experiments at frequencies lower than 1 kHz is setup to get detailed insight into
the different phases of the connection process. It includes a piezoelectric force
sensor for the measurement of the three-dimensional process forces, an electrodynamic
shaker for the vibration excitation and a conventional tension-compression testing
machine to apply the bond normal force. Using this test rig, it is possible to
observe the different phases of bond formation in detail, validate and enhance
existing models and finally optimize bond parameters for different processes.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: 'Olaf '
full_name: 'Kirsch, Olaf '
last_name: Kirsch
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis
and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS
2020; 11th International Conference on Integrated Power Electronics Systems.
; 2020:1-6.'
apa: Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020).
Experimental analysis and modelling of bond formation in ultrasonic heavy wire
bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics
Systems, 1–6.
bibtex: '@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental
analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS
2020; 11th International Conference on Integrated Power Electronics Systems},
author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch,
Olaf and Sextro, Walter}, year={2020}, pages={1–6} }'
chicago: Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf Kirsch, and
Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic
Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated
Power Electronics Systems, 1–6, 2020.
ieee: R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental
analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in
CIPS 2020; 11th International Conference on Integrated Power Electronics Systems,
2020, pp. 1–6.
mla: Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation
in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference
on Integrated Power Electronics Systems, 2020, pp. 1–6.
short: 'R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020;
11th International Conference on Integrated Power Electronics Systems, 2020, pp.
1–6.'
date_created: 2020-07-06T07:41:21Z
date_updated: 2023-09-21T14:27:32Z
department:
- _id: '151'
language:
- iso: eng
page: 1-6
publication: CIPS 2020; 11th International Conference on Integrated Power Electronics
Systems
quality_controlled: '1'
status: public
title: Experimental analysis and modelling of bond formation in ultrasonic heavy wire
bonding
type: conference
user_id: '210'
year: '2020'
...
---
_id: '17706'
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. In: 2020 21st International
Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679'
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679
bibtex: '@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679},
booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel,
Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020}
}'
chicago: Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation
of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In 2020
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems (EuroSimE), 2020. https://doi.org/10.1109/eurosime48426.2020.9152679.
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” 2020 21st International Conference on Thermal,
Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.
short: 'R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International
Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
in Microelectronics and Microsystems (EuroSimE), 2020.'
date_created: 2020-08-07T09:49:17Z
date_updated: 2023-09-21T14:16:41Z
department:
- _id: '151'
doi: 10.1109/eurosime48426.2020.9152679
language:
- iso: eng
publication: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
publication_identifier:
isbn:
- '9781728160498'
publication_status: published
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: conference
user_id: '210'
year: '2020'
...
---
_id: '15412'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. To build electrical
connections in the electronics industry, uni-axial and torsional ultrasonic vibration
have been used to join different types of workpieces for decades. Many influencing
factors like ultrasonic power, bond normal force, bond duration and frequency
are known to have a high impact on bond quality and reliability. Multi-dimensional
bonding has been investigated in the past to increase ultrasonic power and consequently
bond strength. This contribution is focused on the comparison of circular, multi-frequency
planar and uniaxial vibration trajectories used for ultrasonic bonding of copper
pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic
microscopy and interface cross-sections.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Collin
full_name: Dymel, Collin
last_name: Dymel
- first_name: Tobias
full_name: Hemsel, Tobias
last_name: Hemsel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
last_name: Sextro
citation:
ama: 'Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration
trajectories on quality and failure modes in ultrasonic bonding. In: International
Symposium on Microelectronics. ; 2019:509-514. doi:10.4071/2380-4505-2019.1.000509'
apa: Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M.,
& Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on
quality and failure modes in ultrasonic bonding. International Symposium on
Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
bibtex: '@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019,
title={Impact of multi-dimensional vibration trajectories on quality and failure
modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509},
booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard
and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias
and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }'
chicago: Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias
Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration
Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International
Symposium on Microelectronics, 509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
ieee: 'R. Schemmel et al., “Impact of multi-dimensional vibration trajectories
on quality and failure modes in ultrasonic bonding,” in International Symposium
on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.'
mla: Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories
on Quality and Failure Modes in Ultrasonic Bonding.” International Symposium
on Microelectronics, 2019, pp. 509–14, doi:10.4071/2380-4505-2019.1.000509.
short: 'R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann,
W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.'
conference:
location: Boston
name: International Symposium on Microelectronics
date_created: 2019-12-24T21:41:04Z
date_updated: 2023-09-21T14:28:50Z
ddc:
- '620'
department:
- _id: '151'
doi: 10.4071/2380-4505-2019.1.000509
file:
- access_level: closed
content_type: application/pdf
creator: schemmel
date_created: 2019-12-24T21:43:59Z
date_updated: 2019-12-24T21:43:59Z
file_id: '15413'
file_name: 2380-4505-2019.1.000509.pdf
file_size: 1010930
relation: main_file
success: 1
file_date_updated: 2019-12-24T21:43:59Z
has_accepted_license: '1'
language:
- iso: eng
page: 509-514
publication: International Symposium on Microelectronics
publication_identifier:
issn:
- 2380-4505
publication_status: published
quality_controlled: '1'
status: public
title: Impact of multi-dimensional vibration trajectories on quality and failure modes
in ultrasonic bonding
type: conference
user_id: '210'
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. In the electronics industry
it is used to form electrical connections, including those of dissimilar materials.
Multiple influencing factors in ultrasonic joining are known and extensively investigated;
process parameters like ultrasonic power, bond force, and bonding frequency of
the ultrasonic vibration are known to have a high impact on a reliable joining
process and need to be adapted for each new application with different geometry
or materials. This contribution is focused on increasing ultrasonic power transmitted
to the interface and keeping mechanical stresses during ultrasonic bonding low
by using a multi-dimensional ultrasonic transducer concept. Bonding results for
a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
bonding are discussed.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors
and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025'
apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro,
W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.
https://doi.org/10.1016/j.sna.2019.04.025'
bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
volume={295}, DOI={10.1016/j.sna.2019.04.025},
journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
Walter}, year={2019}, pages={653–662} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295
(2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.'
ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
“Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662,
2019, doi: 10.1016/j.sna.2019.04.025.'
mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical,
vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.'
short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: ' 295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9992'
abstract:
- lang: eng
text: State-of-the-art industrial compact high power electronic packages require
copper-copper interconnections with larger cross sections made by ultrasonic bonding.
In comparison to aluminium-copper, copper-copper interconnections require increased
normal forces and ultrasonic power, which might lead to substrate damage due to
increased mechanical stresses. One option to raise friction energy without increasing
vibration amplitude between wire and substrate or bonding force is the use of
two-dimensional vibration. The first part of this contribution reports on the
development of a novel bonding system that executes two-dimensional vibrations
of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
bonds only form properly when surfaces are clean, oxide free and activated, the
geometries of tool-tip and pin were optimised using finite element analysis. To
maximize the area of the bonded annulus the distribution of normal pressure was
optimized by varying the convexity of the bottom side of the pin. Second, a statistical
model obtained from an experimental parameter study shows the influence of different
bonding parameters on the bond result. To find bonding parameters with the minimum
number of tests, the experiments have been planned using a D-optimal experimental
design approach.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
of weld formation in a novel two-dimensional copper-copper bonding process. In:
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany). ; 2018:1-6.'
apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process. In (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany)
(pp. 1–6).
bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
title={Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany), 1–6, 2018.
ieee: C. Dymel et al., “Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process,” in (Proceedings
of 7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9997'
abstract:
- lang: eng
text: Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding
are known and extensively investigated. A constructively settable but rarely examined
parameter is the bonding frequency. In case of bonding on challenging substrates,
e.g. supple substruc- tures, a high influence of the working frequency is observed.
The choice of the working frequency is typically based on experimental investigations
for a certain component or substrate and needs to be evaluated anew for new applications.
A profound understanding of the influence of the working frequency is required
to achieve a reliable bond process and a short process development. Here a generalized
model for the numerical simulation of the bond formation with respect to the dynamics
of the substructure is presented. The simulation results are compared to experiments
using 300 µm copper wire at different working frequencies and geometries of the
substructure.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects
of different working frequencies on the joint formation in copper wire bonding.
In: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018). Stuttgart, Germany; 2018:230-235.'
apa: Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., & Hunstig,
M. (2018). Effects of different working frequencies on the joint formation in
copper wire bonding. In CIPS 2018 - 10th International Conference on Integrated
Power Electronics Systems (CIPS 2018) (pp. 230–235). Stuttgart, Germany.
bibtex: '@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart,
Germany}, title={Effects of different working frequencies on the joint formation
in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference
on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard
and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael
and Hunstig, Matthias}, year={2018}, pages={230–235} }'
chicago: Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael
Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on
the Joint Formation in Copper Wire Bonding.” In CIPS 2018 - 10th International
Conference on Integrated Power Electronics Systems (CIPS 2018), 230–35. Stuttgart,
Germany, 2018.
ieee: R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig,
“Effects of different working frequencies on the joint formation in copper wire
bonding,” in CIPS 2018 - 10th International Conference on Integrated Power
Electronics Systems (CIPS 2018), 2018, pp. 230–235.
mla: Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the
Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference
on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
short: 'R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig,
in: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.'
date_created: 2019-05-27T10:24:37Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
language:
- iso: eng
page: 230-235
place: Stuttgart, Germany
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018)
quality_controlled: '1'
status: public
title: Effects of different working frequencies on the joint formation in copper wire
bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9998'
abstract:
- lang: eng
text: Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals
of semiconductor modules in power electronics. The wire is clamped with a tool
by a normal force and ultrasonic vibration is transmitted through the wire into
the interface between wire and substrate. Due to frictional processes contaminations
like oxide layers are removed from the contact zone and the surface roughness
is reduced, thus the real contact area is increased. In the next step of bond
formation, thermomechanical forces create micro-junctions between the wire and
substrate and the bond strength increases. The bond parameters like the bond normal
force, the ultrasonic vibration amplitude and the geometry of the clamping tool
show a high influence on the strength and reliability of the wire bond and need
to be investigated in detail. Therefore, in this contribution the dynamical behaviour
of the ultrasonic system, the wire and the substrate are modeled in form of substructures,
which are connected by the friction contacts between tool and wire and between
wire and substrate. Approaches for modelling the time variant contact behaviour,
the substrate dynamics, and the model order reduction for a time efficient simulation
are described to simulate the full bonding process.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations
in ultrasonic heavy wire bonding. In: 6th European Conference on Computational
Mechanics (ECCM 6). Glasgow, UK; 2018:1-12.'
apa: Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental
investigations in ultrasonic heavy wire bonding. In 6th European Conference
on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical
and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th
European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }'
chicago: Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental
Investigations in Ultrasonic Heavy Wire Bonding.” In 6th European Conference
on Computational Mechanics (ECCM 6), 1–12. Glasgow, UK, 2018.
ieee: R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations
in ultrasonic heavy wire bonding,” in 6th European Conference on Computational
Mechanics (ECCM 6), 2018, pp. 1–12.
mla: Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic
Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM
6), 2018, pp. 1–12.
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational
Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.'
date_created: 2019-05-27T10:24:38Z
date_updated: 2019-09-23T08:48:04Z
department:
- _id: '151'
language:
- iso: eng
page: 1-12
place: Glasgow, UK
publication: 6th European Conference on Computational Mechanics (ECCM 6)
status: public
title: Numerical and experimental investigations in ultrasonic heavy wire bonding
type: conference
user_id: '55222'
year: '2018'
...
---
_id: '9973'
abstract:
- lang: eng
text: In power electronics, copper connector pins are e.g. used to connect control
boards with power modules. The new chip generation based on SiC and GaN technology
increase the power density of semiconductor modules significantly with junction
temperatures reaching 200°C. To enable reliable operation at such high temperature,
the soldering of these connector pins should be substituted by a multi-dimensional
copper-copper bonding technology. A copper pin welded directly on DBC substrate
also simplifies the assembly. With this aim, a proper bond tool and a suitable
connector pin geometry are designed. This paper presents a two-dimensional trajectory
approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the
intention to minimize mechanical stresses exposed to the substrate. This is achieved
using a multi-dimensional vibration system with multiple transducers known from
flip chip bonding. Applying a planar relative motion between the bonding piece
and the substrate increases the induced frictional power compared to one-dimensional
excitation. The core of this work is the development of a new tool design which
enables a reliable and effective transmission of the multidimensional vibration
into the contact area between nail-shaped bonding piece and substrate. For this
purpose, different bonding tool as well as bonding piece designs are discussed.
A proper bonding tool design is selected based on the simulated alternatives.
This tool is examined in bonding experiments and the results are presented. In
addition, different grades of hardness for bonding piece and substrate are examined
as well as different bonding parameters. Optical inspection of the bonded area
shows the emergence of initial micro welds in form of a ring which is growing
in direction of the interface boundaries with increasing bonding duration.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper
Bonding – New Challenges for Tool Design. IMAPSource. 2017;Vol. 2017, No.
1.
apa: Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann,
M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New
Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
bibtex: '@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017,
title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design},
volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff,
Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann,
Michael and Hunstig, Matthias}, year={2017} }'
chicago: Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas
Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic
Copper Bonding – New Challenges for Tool Design.” IMAPSource Vol. 2017,
No. 1 (2017).
ieee: P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding –
New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
mla: Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges
for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
short: P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann,
M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
date_created: 2019-05-27T09:32:42Z
date_updated: 2020-05-07T05:33:54Z
department:
- _id: '151'
keyword:
- International Symposium on Microelectronics
language:
- iso: eng
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: IMAPSource
quality_controlled: '1'
status: public
title: Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
type: journal_article
user_id: '210'
volume: Vol. 2017, No. 1
year: '2017'
...
---
_id: '9982'
abstract:
- lang: ger
text: ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten
genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung
kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der
geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb
verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der
Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte
zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen
Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein
einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde
in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands
zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung
entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt
die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld
von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer
zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller
Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die
sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie
verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung
bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L
/2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude
und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren
Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend
Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten
basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel
2017; 2017:611-614.'
apa: 'Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für
Akustik (pp. 611–614). Kiel 2017.'
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS:
Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43.
Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias
and Sextro, Walter}, year={2017}, pages={611–614} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile
Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche
Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.'
ieee: 'R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für
Akustik, 2017, pp. 611–614.'
mla: 'Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten
Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017,
pp. 611–14.'
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik,
Kiel 2017, 2017, pp. 611–614.'
date_created: 2019-05-27T09:48:10Z
date_updated: 2019-05-27T09:49:49Z
department:
- _id: '151'
keyword:
- wire bonding
- dynamic behavior
- modeling
language:
- iso: eng
page: 611-614
place: Kiel 2017
publication: 43. Deutsche Jahrestagung für Akustik
status: public
title: 'MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall'
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...