[{"place":"Paderborn","year":"2025","page":"247","citation":{"chicago":"Lange, Sven. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Paderborn: Universitätsbibliothek Paderborn, 2025. <a href=\"https://doi.org/10.17619/UNIPB/1-2436\">https://doi.org/10.17619/UNIPB/1-2436</a>.","ieee":"S. Lange, <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Paderborn: Universitätsbibliothek Paderborn, 2025.","ama":"Lange S. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Universitätsbibliothek Paderborn; 2025. doi:<a href=\"https://doi.org/10.17619/UNIPB/1-2436\">10.17619/UNIPB/1-2436</a>","mla":"Lange, Sven. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Universitätsbibliothek Paderborn, 2025, doi:<a href=\"https://doi.org/10.17619/UNIPB/1-2436\">10.17619/UNIPB/1-2436</a>.","bibtex":"@book{Lange_2025, place={Paderborn}, title={Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme}, DOI={<a href=\"https://doi.org/10.17619/UNIPB/1-2436\">10.17619/UNIPB/1-2436</a>}, publisher={Universitätsbibliothek Paderborn}, author={Lange, Sven}, year={2025} }","short":"S. Lange, Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme, Universitätsbibliothek Paderborn, Paderborn, 2025.","apa":"Lange, S. (2025). <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Universitätsbibliothek Paderborn. <a href=\"https://doi.org/10.17619/UNIPB/1-2436\">https://doi.org/10.17619/UNIPB/1-2436</a>"},"publication_status":"published","title":"Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme","doi":"10.17619/UNIPB/1-2436","main_file_link":[{"url":"https://digital.ub.uni-paderborn.de/hs/content/titleinfo/8122147","open_access":"1"}],"publisher":"Universitätsbibliothek Paderborn","oa":"1","date_updated":"2025-11-12T10:15:29Z","supervisor":[{"last_name":"Förstner","orcid":"0000-0001-7059-9862","full_name":"Förstner, Jens","id":"158","first_name":"Jens"},{"first_name":"Marcus","last_name":"Stiemer","full_name":"Stiemer, Marcus"}],"date_created":"2025-11-12T10:06:39Z","author":[{"first_name":"Sven","orcid":"0009-0007-9150-2266 ","last_name":"Lange","id":"38240","full_name":"Lange, Sven"}],"abstract":[{"lang":"eng","text":"Diese Dissertation befasst sich mit der Entwicklung eines induktiv-basierten Lokalisierungsverfahrens mittels planarer Spulen, das auf magnetischer Kopplung beruht. Grundlage ist die elektromagnetische Induktion, bei der sich die entstehende Spannung proportional zur Gegeninduktivität verhält. Das Verfahren arbeitet im physikalischen Nahfeld und im Frequenzbereich von einigen kHz bis MHz, um eine effiziente Kopplung ohne Ausbreitung elektromagnetischer Wellen zu gewährleisten. Im Vergleich zu etablierten Verfahren wie GPS oder Ultraschall zeigt die induktive Ortung Vorteile bei kurzer Reichweite, insbesondere durch hohe Genauigkeit im Zentimeterbereich und geringe Materialabhängigkeit. Zudem lässt sie sich in bestehende Technologien wie bei der drahtlosen Energieübertragung integrieren und durch Sensorfusion mit anderen Verfahren kombinieren. Zur Modellierung und Optimierung werden physikalische Eigenschaften von planaren Spulen und EM-Feldern analysiert und elektrische Ersatzschaltbilder eingesetzt. Die geometriebasierte Berechnung der Gegeninduktivität ermöglicht die Entwicklung und Bewertung geeigneter Ortungsalgorithmen. Stochastische Filterverfahren verbessern zusätzlich die Robustheit gegenüber Umgebungseinflüssen. Abschließend wird eine modulare Simulationsplattform vorgestellt, die als Grundlage für die Generierung von Trainingsdaten sowie zur Weiterentwicklung von Mess-, Ortungs- und Filtermethoden dient."},{"lang":"eng","text":"This dissertation addresses the development of an inductively based localization method using planar coils, which relies on magnetic coupling. The underlying principle is electromagnetic induction, where the resulting voltage is proportional to the mutual inductance. The method operates in the physical near field and within a frequency range from a few kHz to MHz, ensuring efficient coupling without the propagation of electromagnetic waves. Compared to established methods such as GPS or ultrasound, inductive localization offers advantages at short range—particularly high accuracy in the centimeter range and low dependency on surrounding materials. Additionally, it can be integrated into existing technologies, such as wireless power transfer systems, and combined with other methods through sensor fusion. To support modeling and optimization, the physical properties of planar coils and electromagnetic fields are analyzed, and equivalent electrical circuit models are used. Geometry-based calculations of mutual inductance enable the development and evaluation of suitable localization algorithms. Stochastic filtering methods further enhance robustness against environmental influences. Finally, a modular simulation platform is presented, which serves as a foundation for generating training data as well as for the further development of measurement, localization, and filtering methods."}],"status":"public","type":"dissertation","language":[{"iso":"ger"}],"_id":"62167","department":[{"_id":"59"},{"_id":"61"},{"_id":"485"}],"user_id":"38240"},{"user_id":"38240","department":[{"_id":"59"}],"project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"_id":"56782","language":[{"iso":"eng"}],"type":"conference","publication":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","status":"public","date_created":"2024-10-29T10:35:08Z","author":[{"last_name":"Lange","orcid":"0009-0007-9150-2266 ","full_name":"Lange, Sven","id":"38240","first_name":"Sven"},{"first_name":"Marcel","full_name":"Olbrich, Marcel","last_name":"Olbrich"},{"last_name":"Hemker","full_name":"Hemker, Dennis","first_name":"Dennis"},{"first_name":"Jad","full_name":"Maalouly, Jad","last_name":"Maalouly"},{"full_name":"Kutter, Jürgen","last_name":"Kutter","first_name":"Jürgen"},{"first_name":"Dominik","last_name":"Schröder","full_name":"Schröder, Dominik"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"full_name":"Kleinen, Michael","last_name":"Kleinen","first_name":"Michael"},{"first_name":"Andreas","last_name":"Grünwaldt","full_name":"Grünwaldt, Andreas"},{"last_name":"Bärenfänger","full_name":"Bärenfänger, Jörg","first_name":"Jörg"},{"first_name":"Harald","full_name":"Mathis, Harald","last_name":"Mathis"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"}],"publisher":"IEEE","date_updated":"2025-03-17T12:14:38Z","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/10722681"}],"doi":"10.1109/emceurope59828.2024.10722681","conference":{"end_date":"2024-09-05","location":"Bruges, Belgium","name":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","start_date":"2024-09-02"},"title":"A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method","publication_status":"published","citation":{"chicago":"Lange, Sven, Marcel Olbrich, Dennis Hemker, Jad Maalouly, Jürgen Kutter, Dominik Schröder, Christian Hedayat, et al. “A Hybrid Data Generation Approach for the Development of an AI-Based EMC Interference Recognition Method.” In <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. Bruges, Belgium: IEEE, 2024. <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">https://doi.org/10.1109/emceurope59828.2024.10722681</a>.","ieee":"S. Lange <i>et al.</i>, “A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method,” presented at the 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Bruges, Belgium, 2024, doi: <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">10.1109/emceurope59828.2024.10722681</a>.","ama":"Lange S, Olbrich M, Hemker D, et al. A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method. In: <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">10.1109/emceurope59828.2024.10722681</a>","apa":"Lange, S., Olbrich, M., Hemker, D., Maalouly, J., Kutter, J., Schröder, D., Hedayat, C., Kleinen, M., Grünwaldt, A., Bärenfänger, J., Mathis, H., &#38; Kuhn, H. (2024). A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method. <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Bruges, Belgium. <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">https://doi.org/10.1109/emceurope59828.2024.10722681</a>","short":"S. Lange, M. Olbrich, D. Hemker, J. Maalouly, J. Kutter, D. Schröder, C. Hedayat, M. Kleinen, A. Grünwaldt, J. Bärenfänger, H. Mathis, H. Kuhn, in: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Bruges, Belgium, 2024.","mla":"Lange, Sven, et al. “A Hybrid Data Generation Approach for the Development of an AI-Based EMC Interference Recognition Method.” <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>, IEEE, 2024, doi:<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">10.1109/emceurope59828.2024.10722681</a>.","bibtex":"@inproceedings{Lange_Olbrich_Hemker_Maalouly_Kutter_Schröder_Hedayat_Kleinen_Grünwaldt_Bärenfänger_et al._2024, place={Bruges, Belgium}, title={A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method}, DOI={<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">10.1109/emceurope59828.2024.10722681</a>}, booktitle={2024 International Symposium on Electromagnetic Compatibility – EMC Europe}, publisher={IEEE}, author={Lange, Sven and Olbrich, Marcel and Hemker, Dennis and Maalouly, Jad and Kutter, Jürgen and Schröder, Dominik and Hedayat, Christian and Kleinen, Michael and Grünwaldt, Andreas and Bärenfänger, Jörg and et al.}, year={2024} }"},"place":"Bruges, Belgium","year":"2024"},{"conference":{"location":"Brugge, Belgium ","end_date":"2024-09-05","start_date":"2024-09-02","name":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe"},"doi":"10.1109/emceurope59828.2024.10722094","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/10722094"}],"title":"Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications","author":[{"first_name":"Jad","full_name":"Maalouly, Jad","last_name":"Maalouly"},{"first_name":"Dennis","full_name":"Hemker, Dennis","last_name":"Hemker"},{"orcid":"0009-0007-9150-2266 ","last_name":"Lange","id":"38240","full_name":"Lange, Sven","first_name":"Sven"},{"first_name":"Marcel","full_name":"Olbrich, Marcel","last_name":"Olbrich"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"last_name":"Kutter","full_name":"Kutter, Jürgen","first_name":"Jürgen"},{"first_name":"Harald","full_name":"Mathis, Harald","last_name":"Mathis"}],"date_created":"2024-10-29T10:34:53Z","date_updated":"2025-03-17T12:14:48Z","publisher":"IEEE","citation":{"mla":"Maalouly, Jad, et al. “Evaluation of Simulated and Real Measurement Data for AI-Based Interference Classification in EMC Applications.” <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>, IEEE, 2024, doi:<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">10.1109/emceurope59828.2024.10722094</a>.","bibtex":"@inproceedings{Maalouly_Hemker_Lange_Olbrich_Hedayat_Kutter_Mathis_2024, place={Brugge, Belgium }, title={Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications}, DOI={<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">10.1109/emceurope59828.2024.10722094</a>}, booktitle={2024 International Symposium on Electromagnetic Compatibility – EMC Europe}, publisher={IEEE}, author={Maalouly, Jad and Hemker, Dennis and Lange, Sven and Olbrich, Marcel and Hedayat, Christian and Kutter, Jürgen and Mathis, Harald}, year={2024} }","short":"J. Maalouly, D. Hemker, S. Lange, M. Olbrich, C. Hedayat, J. Kutter, H. Mathis, in: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Brugge, Belgium , 2024.","apa":"Maalouly, J., Hemker, D., Lange, S., Olbrich, M., Hedayat, C., Kutter, J., &#38; Mathis, H. (2024). Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications. <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium . <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">https://doi.org/10.1109/emceurope59828.2024.10722094</a>","ieee":"J. Maalouly <i>et al.</i>, “Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications,” presented at the 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium , 2024, doi: <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">10.1109/emceurope59828.2024.10722094</a>.","chicago":"Maalouly, Jad, Dennis Hemker, Sven Lange, Marcel Olbrich, Christian Hedayat, Jürgen Kutter, and Harald Mathis. “Evaluation of Simulated and Real Measurement Data for AI-Based Interference Classification in EMC Applications.” In <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. Brugge, Belgium : IEEE, 2024. <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">https://doi.org/10.1109/emceurope59828.2024.10722094</a>.","ama":"Maalouly J, Hemker D, Lange S, et al. Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications. In: <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">10.1109/emceurope59828.2024.10722094</a>"},"place":"Brugge, Belgium ","year":"2024","publication_status":"published","language":[{"iso":"eng"}],"department":[{"_id":"59"}],"user_id":"38240","_id":"56781","project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"status":"public","publication":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","type":"conference"},{"project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"_id":"56924","user_id":"38240","department":[{"_id":"59"}],"language":[{"iso":"eng"}],"type":"conference","publication":"2024 Smart Systems Integration Conference and Exhibition (SSI)","status":"public","date_updated":"2025-03-17T12:14:22Z","publisher":"IEEE","date_created":"2024-11-06T13:36:01Z","author":[{"first_name":"Marcus","last_name":"Stiemer","full_name":"Stiemer, Marcus"},{"first_name":"Sven","orcid":"0009-0007-9150-2266 ","last_name":"Lange","full_name":"Lange, Sven","id":"38240"},{"first_name":"Dominik","last_name":"Schröder","full_name":"Schröder, Dominik"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"first_name":"Jad","full_name":"Maalouly, Jad","last_name":"Maalouly"},{"full_name":"Hemker, Dennis","last_name":"Hemker","first_name":"Dennis"},{"first_name":"Harald","full_name":"Mathis, Harald","last_name":"Mathis"}],"title":"Enhancing Information Extraction in EMC Measurements through Artificial Intelligence","conference":{"start_date":"2024-04-26","name":"2024 Smart Systems Integration Conference and Exhibition (SSI)","location":"Hamburg","end_date":"2024-04-28"},"doi":"10.1109/ssi63222.2024.10740546","publication_status":"published","year":"2024","place":"Hamburg","citation":{"ama":"Stiemer M, Lange S, Schröder D, et al. Enhancing Information Extraction in EMC Measurements through Artificial Intelligence. In: <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>. IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>","ieee":"M. Stiemer <i>et al.</i>, “Enhancing Information Extraction in EMC Measurements through Artificial Intelligence,” presented at the 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg, 2024, doi: <a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>.","chicago":"Stiemer, Marcus, Sven Lange, Dominik Schröder, Christian Hedayat, Jad Maalouly, Dennis Hemker, and Harald Mathis. “Enhancing Information Extraction in EMC Measurements through Artificial Intelligence.” In <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>. Hamburg: IEEE, 2024. <a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">https://doi.org/10.1109/ssi63222.2024.10740546</a>.","apa":"Stiemer, M., Lange, S., Schröder, D., Hedayat, C., Maalouly, J., Hemker, D., &#38; Mathis, H. (2024). Enhancing Information Extraction in EMC Measurements through Artificial Intelligence. <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>. 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg. <a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">https://doi.org/10.1109/ssi63222.2024.10740546</a>","mla":"Stiemer, Marcus, et al. “Enhancing Information Extraction in EMC Measurements through Artificial Intelligence.” <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>, IEEE, 2024, doi:<a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>.","bibtex":"@inproceedings{Stiemer_Lange_Schröder_Hedayat_Maalouly_Hemker_Mathis_2024, place={Hamburg}, title={Enhancing Information Extraction in EMC Measurements through Artificial Intelligence}, DOI={<a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>}, booktitle={2024 Smart Systems Integration Conference and Exhibition (SSI)}, publisher={IEEE}, author={Stiemer, Marcus and Lange, Sven and Schröder, Dominik and Hedayat, Christian and Maalouly, Jad and Hemker, Dennis and Mathis, Harald}, year={2024} }","short":"M. Stiemer, S. Lange, D. Schröder, C. Hedayat, J. Maalouly, D. Hemker, H. Mathis, in: 2024 Smart Systems Integration Conference and Exhibition (SSI), IEEE, Hamburg, 2024."}},{"title":"Using Autoencoders to Classify EMC Problems in Electronic System Development","doi":"10.5194/ars-22-53-2024","conference":{"start_date":"2023-09-26","name":"Kleinheubacher Berichte 2023","location":"Miltenberg","end_date":"2023-09-28"},"main_file_link":[{"url":"https://ars.copernicus.org/articles/22/53/2024/"}],"date_updated":"2025-03-17T12:13:32Z","volume":22,"author":[{"last_name":"Maalouly","full_name":"Maalouly, J.","first_name":"J."},{"first_name":"D.","last_name":"Hemker","full_name":"Hemker, D."},{"last_name":"Hedayat","full_name":"Hedayat, C.","first_name":"C."},{"first_name":"M.","full_name":"Olbrich, M.","last_name":"Olbrich"},{"orcid":"0009-0007-9150-2266 ","last_name":"Lange","full_name":"Lange, Sven","id":"38240","first_name":"Sven"},{"full_name":"Mathis, H.","last_name":"Mathis","first_name":"H."}],"date_created":"2024-11-29T10:05:47Z","year":"2024","page":"53–59","intvolume":"        22","citation":{"ieee":"J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, and H. Mathis, “Using Autoencoders to Classify EMC Problems in Electronic System Development,” <i>Advances in Radio Science</i>, vol. 22, pp. 53–59, 2024, doi: <a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>.","chicago":"Maalouly, J., D. Hemker, C. Hedayat, M. Olbrich, Sven Lange, and H. Mathis. “Using Autoencoders to Classify EMC Problems in Electronic System Development.” <i>Advances in Radio Science</i> 22 (2024): 53–59. <a href=\"https://doi.org/10.5194/ars-22-53-2024\">https://doi.org/10.5194/ars-22-53-2024</a>.","ama":"Maalouly J, Hemker D, Hedayat C, Olbrich M, Lange S, Mathis H. Using Autoencoders to Classify EMC Problems in Electronic System Development. <i>Advances in Radio Science</i>. 2024;22:53–59. doi:<a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>","apa":"Maalouly, J., Hemker, D., Hedayat, C., Olbrich, M., Lange, S., &#38; Mathis, H. (2024). Using Autoencoders to Classify EMC Problems in Electronic System Development. <i>Advances in Radio Science</i>, <i>22</i>, 53–59. <a href=\"https://doi.org/10.5194/ars-22-53-2024\">https://doi.org/10.5194/ars-22-53-2024</a>","short":"J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, H. Mathis, Advances in Radio Science 22 (2024) 53–59.","bibtex":"@article{Maalouly_Hemker_Hedayat_Olbrich_Lange_Mathis_2024, title={Using Autoencoders to Classify EMC Problems in Electronic System Development}, volume={22}, DOI={<a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>}, journal={Advances in Radio Science}, author={Maalouly, J. and Hemker, D. and Hedayat, C. and Olbrich, M. and Lange, Sven and Mathis, H.}, year={2024}, pages={53–59} }","mla":"Maalouly, J., et al. “Using Autoencoders to Classify EMC Problems in Electronic System Development.” <i>Advances in Radio Science</i>, vol. 22, 2024, pp. 53–59, doi:<a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>."},"publication_status":"published","language":[{"iso":"eng"}],"_id":"57499","project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","status":"public","publication":"Advances in Radio Science","type":"journal_article"},{"_id":"49890","department":[{"_id":"59"},{"_id":"61"},{"_id":"485"}],"user_id":"158","keyword":["Planar coils","inductive locating","magnetic fields","environmental influences","eddy currents","tet_topic_hf","tet_enas"],"language":[{"iso":"eng"}],"publication":"2023 IEEE Conference on Antenna Measurements and Applications (CAMA)","type":"conference","abstract":[{"text":"In this paper, the influence of the environment on an inductive location system is analyzed. In the inductive location method, high frequency magnetic fields generated by planar coils lead to induction in other coils, which is used for localization analysis. Magnetic fields are not affected by changes in the dielectric properties of the environment, which is an advantage over other localization methods. However, electrical material parameters can still affect the localization results by indirect effects. For this reason, in this publication the influence will be investigated using real material parameters and their effects on the localization will be considered, so that the robustness and the limits of the inductive localization can be evaluated.","lang":"eng"}],"status":"public","publisher":"IEEE","date_updated":"2024-11-30T19:31:57Z","date_created":"2023-12-20T08:36:58Z","author":[{"first_name":"Sven","id":"38240","full_name":"Lange, Sven","orcid":"0009-0007-9150-2266 ","last_name":"Lange"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"},{"first_name":"Jens","id":"158","full_name":"Förstner, Jens","orcid":"0000-0001-7059-9862","last_name":"Förstner"}],"title":"Characterization of Various Environmental Influences on the Inductive Localization","doi":"10.1109/cama57522.2023.10352780","conference":{"start_date":"2023-11-15","name":"2023 IEEE Conference on Antenna Measurements and Applications (CAMA)","location":"Genoa, Italy ","end_date":"2023-11-17"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/10352780"}],"publication_identifier":{"eisbn":["979-8-3503-2304-7"]},"publication_status":"published","year":"2023","place":"Genoa, Italy ","citation":{"chicago":"Lange, Sven, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, and Jens Förstner. “Characterization of Various Environmental Influences on the Inductive Localization.” In <i>2023 IEEE Conference on Antenna Measurements and Applications (CAMA)</i>. Genoa, Italy : IEEE, 2023. <a href=\"https://doi.org/10.1109/cama57522.2023.10352780\">https://doi.org/10.1109/cama57522.2023.10352780</a>.","ieee":"S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, and J. Förstner, “Characterization of Various Environmental Influences on the Inductive Localization,” presented at the 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy , 2023, doi: <a href=\"https://doi.org/10.1109/cama57522.2023.10352780\">10.1109/cama57522.2023.10352780</a>.","ama":"Lange S, Hilleringmann U, Hedayat C, Kuhn H, Förstner J. Characterization of Various Environmental Influences on the Inductive Localization. In: <i>2023 IEEE Conference on Antenna Measurements and Applications (CAMA)</i>. IEEE; 2023. doi:<a href=\"https://doi.org/10.1109/cama57522.2023.10352780\">10.1109/cama57522.2023.10352780</a>","bibtex":"@inproceedings{Lange_Hilleringmann_Hedayat_Kuhn_Förstner_2023, place={Genoa, Italy }, title={Characterization of Various Environmental Influences on the Inductive Localization}, DOI={<a href=\"https://doi.org/10.1109/cama57522.2023.10352780\">10.1109/cama57522.2023.10352780</a>}, booktitle={2023 IEEE Conference on Antenna Measurements and Applications (CAMA)}, publisher={IEEE}, author={Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian and Kuhn, Harald and Förstner, Jens}, year={2023} }","mla":"Lange, Sven, et al. “Characterization of Various Environmental Influences on the Inductive Localization.” <i>2023 IEEE Conference on Antenna Measurements and Applications (CAMA)</i>, IEEE, 2023, doi:<a href=\"https://doi.org/10.1109/cama57522.2023.10352780\">10.1109/cama57522.2023.10352780</a>.","short":"S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy , 2023.","apa":"Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., &#38; Förstner, J. (2023). Characterization of Various Environmental Influences on the Inductive Localization. <i>2023 IEEE Conference on Antenna Measurements and Applications (CAMA)</i>. 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy . <a href=\"https://doi.org/10.1109/cama57522.2023.10352780\">https://doi.org/10.1109/cama57522.2023.10352780</a>"}},{"status":"public","abstract":[{"text":"In this paper, machine learning techniques will be used to classify different PCB layouts given their electromagnetic frequency spectra. These spectra result from a simulated near-field measurement of electric field strengths at different locations. Measured values consist of real and imaginary parts (amplitude and phase) in X, Y and Z directions. Training data was obtained in the time domain by varying transmission line geometries (size, distance and signaling). It was then transformed into the frequency domain and used as deep neural network input. Principal component analysis was applied to reduce the sample dimension. The results show that classifying different designs is possible with high accuracy based on synthetic data. Future work comprises measurements of real, custom-made PCB with varying parameters to adapt the simulation model and also test the neural network. Finally, the trained model could be used to give hints about the error’s cause when overshooting EMC limits.","lang":"eng"}],"publication":"2022 Kleinheubach Conference","type":"conference","language":[{"iso":"eng"}],"keyword":["emc","pcb","electronic system development","machine learning","neural network"],"department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","_id":"34140","project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"citation":{"ama":"Maalouly J, Hemker D, Hedayat C, et al. AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development. In: <i>2022 Kleinheubach Conference</i>. IEEE; 2022.","ieee":"J. Maalouly <i>et al.</i>, “AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development,” presented at the 2022 Kleinheubach Conference, Miltenberg, Germany, 2022.","chicago":"Maalouly, Jad, Dennis Hemker, Christian Hedayat, Christian Rückert, Ivan Kaufmann, Marcel Olbrich, Sven Lange, and Harald Mathis. “AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development.” In <i>2022 Kleinheubach Conference</i>. Miltenberg, Germany: IEEE, 2022.","apa":"Maalouly, J., Hemker, D., Hedayat, C., Rückert, C., Kaufmann, I., Olbrich, M., Lange, S., &#38; Mathis, H. (2022). AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development. <i>2022 Kleinheubach Conference</i>. 2022 Kleinheubach Conference, Miltenberg, Germany.","mla":"Maalouly, Jad, et al. “AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development.” <i>2022 Kleinheubach Conference</i>, IEEE, 2022.","bibtex":"@inproceedings{Maalouly_Hemker_Hedayat_Rückert_Kaufmann_Olbrich_Lange_Mathis_2022, place={Miltenberg, Germany}, title={AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development}, booktitle={2022 Kleinheubach Conference}, publisher={IEEE}, author={Maalouly, Jad and Hemker, Dennis and Hedayat, Christian and Rückert, Christian and Kaufmann, Ivan and Olbrich, Marcel and Lange, Sven and Mathis, Harald}, year={2022} }","short":"J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich, S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany, 2022."},"year":"2022","place":"Miltenberg, Germany","publication_identifier":{"eisbn":["978-3-948571-07-8"]},"publication_status":"published","conference":{"location":"Miltenberg, Germany","end_date":"2022-09-29","start_date":"2022-09-27","name":"2022 Kleinheubach Conference"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9954484"}],"title":"AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development","author":[{"last_name":"Maalouly","full_name":"Maalouly, Jad","first_name":"Jad"},{"first_name":"Dennis","full_name":"Hemker, Dennis","last_name":"Hemker"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"last_name":"Rückert","full_name":"Rückert, Christian","first_name":"Christian"},{"last_name":"Kaufmann","full_name":"Kaufmann, Ivan","first_name":"Ivan"},{"full_name":"Olbrich, Marcel","last_name":"Olbrich","first_name":"Marcel"},{"id":"38240","full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"full_name":"Mathis, Harald","last_name":"Mathis","first_name":"Harald"}],"date_created":"2022-11-24T14:21:17Z","date_updated":"2022-11-24T14:21:34Z","publisher":"IEEE"},{"date_updated":"2022-10-04T11:35:11Z","publisher":"IEEE","date_created":"2022-10-04T11:26:11Z","author":[{"last_name":"Lange","id":"38240","full_name":"Lange, Sven","first_name":"Sven"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"first_name":"Harald","last_name":"Kuhn","full_name":"Kuhn, Harald"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"title":"Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings","doi":"10.1109/ssi56489.2022.9901416","conference":{"name":"2022 Smart Systems Integration (SSI)","start_date":"2022-04-27","end_date":"2022-04-28","location":"Grenoble, France"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9901416"}],"publication_identifier":{"eisbn":["978-1-6654-8849-5"]},"publication_status":"published","year":"2022","place":"Grenoble, France","citation":{"ieee":"S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>.","chicago":"Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In <i>2022 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>.","ama":"Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>","short":"S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.","mla":"Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” <i>2022 Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>.","bibtex":"@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, place={Grenoble, France}, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }","apa":"Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. <i>2022 Smart Systems Integration (SSI)</i>. 2022 Smart Systems Integration (SSI), Grenoble, France. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>"},"_id":"33508","project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","keyword":["Simulation Environment","Inductive Localization","Coil Parameters","Inductive Applications","Near-Field"],"language":[{"iso":"eng"}],"publication":"2022 Smart Systems Integration (SSI)","type":"conference","abstract":[{"text":"In this work, methods will be evaluated to numerically calculate the passive electrical parameters of planar coils. These parameters can then be used to optimize inductive applications such as wireless power transmission. The focus here will be on inductive localization, which uses high-frequency magnetic fields and the resulting induced voltage to provide localization through the coupling parameter mutual inductance. To achieve localization with high accuracy and best possible operation (resonance, signal strength, etc.), the coil parameters need to be well known. For this reason, some numerical methods for the calculation of these quantities are presented and validated. In addition, the physical effects are thereby considered in more detail, allowing the localization procedure to be better optimized compared to simulative black-box methods. The goal should be a dedicated simulation platform for planar coils to be able to develop training data for neural networks and to test and optimize localization algorithms.","lang":"eng"}],"status":"public"},{"keyword":["Machine Learning","CNN","Hashing","semi-supervised learning"],"language":[{"iso":"eng"}],"abstract":[{"lang":"eng","text":"In the manufacture of real wood products, defects can quickly occur during the production process. To quickly sort out these defects, a system is needed that finds damage in the irregularly structured surfaces of the product. The difficulty in this task is that each surface is visually different and no standard defects can be defined. Thus, damage detection using correlation does not work, so this paper will test different machine learning methods. To evaluate different machine learning methods, a data set is needed. For this reason, the available samples were recorded manually using a static fixed camera. Subsequently, the images were divided into sub-images, which resulted in a relatively small data set. Next, a convolutional neural network (CNN) was constructed to classify the images. However, this approach did not lead to a generalized solution, so the dataset was hashed using the a- and pHash. These hash values were then trained with a fully supervised system that will later serve as a reference model, in the semi-supervised learning procedures. To improve the supervised model and not have to label every data point, semi-supervised learning methods are used in the following. For this purpose, the CEAL method (wrapper method) is considered in the first and then the Π-Model (intrinsically semi-supervised)."}],"publication":"2022 Smart Systems Integration (SSI)","title":"Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods","publisher":"IEEE","date_created":"2022-10-04T11:35:55Z","year":"2022","project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"_id":"33510","user_id":"38240","department":[{"_id":"59"},{"_id":"485"}],"status":"public","type":"conference","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9901433"}],"doi":"10.1109/ssi56489.2022.9901433","conference":{"location":"Grenoble, France","end_date":"2022-04-28","start_date":"2022-04-27","name":"2022 Smart Systems Integration (SSI)"},"date_updated":"2022-10-04T11:37:39Z","author":[{"first_name":"Tom","full_name":"Sander, Tom","last_name":"Sander"},{"id":"38240","full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","first_name":"Ulrich"},{"first_name":"Volker","full_name":"Geneiß, Volker","last_name":"Geneiß"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"first_name":"Harald","last_name":"Kuhn","full_name":"Kuhn, Harald"}],"place":"Grenoble, France","citation":{"chicago":"Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneiß, Christian Hedayat, and Harald Kuhn. “Detection of Defects on Irregularly Structured Surfaces Using Supervised and Semi-Supervised Learning Methods.” In <i>2022 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901433\">https://doi.org/10.1109/ssi56489.2022.9901433</a>.","ieee":"T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, and H. Kuhn, “Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: <a href=\"https://doi.org/10.1109/ssi56489.2022.9901433\">10.1109/ssi56489.2022.9901433</a>.","ama":"Sander T, Lange S, Hilleringmann U, Geneiß V, Hedayat C, Kuhn H. Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901433\">10.1109/ssi56489.2022.9901433</a>","bibtex":"@inproceedings{Sander_Lange_Hilleringmann_Geneiß_Hedayat_Kuhn_2022, place={Grenoble, France}, title={Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods}, DOI={<a href=\"https://doi.org/10.1109/ssi56489.2022.9901433\">10.1109/ssi56489.2022.9901433</a>}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneiß, Volker and Hedayat, Christian and Kuhn, Harald}, year={2022} }","mla":"Sander, Tom, et al. “Detection of Defects on Irregularly Structured Surfaces Using Supervised and Semi-Supervised Learning Methods.” <i>2022 Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901433\">10.1109/ssi56489.2022.9901433</a>.","short":"T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.","apa":"Sander, T., Lange, S., Hilleringmann, U., Geneiß, V., Hedayat, C., &#38; Kuhn, H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. <i>2022 Smart Systems Integration (SSI)</i>. 2022 Smart Systems Integration (SSI), Grenoble, France. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901433\">https://doi.org/10.1109/ssi56489.2022.9901433</a>"},"publication_status":"published"},{"type":"conference","status":"public","_id":"33509","project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"department":[{"_id":"59"},{"_id":"61"},{"_id":"485"}],"user_id":"158","publication_identifier":{"eisbn":["978-1-6654-8849-5"]},"publication_status":"published","place":"Grenoble, France","citation":{"chicago":"Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Förstner. “Far-Field Calculation from Magnetic Huygens Box Data Using the Boundary Element Method.” In <i>2022 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901431\">https://doi.org/10.1109/ssi56489.2022.9901431</a>.","ieee":"C. Marschalt <i>et al.</i>, “Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: <a href=\"https://doi.org/10.1109/ssi56489.2022.9901431\">10.1109/ssi56489.2022.9901431</a>.","ama":"Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901431\">10.1109/ssi56489.2022.9901431</a>","apa":"Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., Sievers, D., &#38; Förstner, J. (2022). Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. <i>2022 Smart Systems Integration (SSI)</i>. 2022 Smart Systems Integration (SSI), Grenoble, France. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901431\">https://doi.org/10.1109/ssi56489.2022.9901431</a>","mla":"Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box Data Using the Boundary Element Method.” <i>2022 Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901431\">10.1109/ssi56489.2022.9901431</a>.","bibtex":"@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Förstner_2022, place={Grenoble, France}, title={Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method}, DOI={<a href=\"https://doi.org/10.1109/ssi56489.2022.9901431\">10.1109/ssi56489.2022.9901431</a>}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt, Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Förstner, Jens}, year={2022} }","short":"C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022."},"date_updated":"2024-11-30T19:32:14Z","author":[{"first_name":"Christoph","last_name":"Marschalt","full_name":"Marschalt, Christoph"},{"first_name":"Dominik","last_name":"Schroder","full_name":"Schroder, Dominik"},{"first_name":"Sven","last_name":"Lange","orcid":"0009-0007-9150-2266 ","id":"38240","full_name":"Lange, Sven"},{"last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179","first_name":"Ulrich"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"},{"first_name":"Denis","full_name":"Sievers, Denis","last_name":"Sievers"},{"last_name":"Förstner","orcid":"0000-0001-7059-9862","id":"158","full_name":"Förstner, Jens","first_name":"Jens"}],"doi":"10.1109/ssi56489.2022.9901431","conference":{"end_date":"2022-04-28","location":"Grenoble, France","name":"2022 Smart Systems Integration (SSI)","start_date":"2022-04-27"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9901431"}],"publication":"2022 Smart Systems Integration (SSI)","abstract":[{"text":"In this publication a novel method for far-field prediction from magnetic Huygens box data based on the boundary element method (BEM) is presented. Two examples are considered for the validation of this method. The first example represents an electric dipole so that the obtained calculations can be compared to an analytical solution. As a second example, a printed circuit board is considered and the calculated far-field is compared to a fullwave simulation. In both cases, the calculations for different field integral equations are under comparison, and the results indicate that the presented method performs very well with a combined field integral equation, for the specified problem, when only magnetic Huygens box data is given.","lang":"eng"}],"keyword":["Near-Field Scanning","Huygens Box","Boundary Element Method","Method of Moments","tet_topic_hf","tet_enas"],"language":[{"iso":"eng"}],"year":"2022","publisher":"IEEE","date_created":"2022-10-04T11:31:43Z","title":"Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method"},{"user_id":"38240","department":[{"_id":"59"},{"_id":"485"}],"project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"_id":"22480","language":[{"iso":"eng"}],"keyword":["Location awareness","Coils","Couplings","Nonuniform electric fields","Magnetic separation","Neural networks","Training data"],"type":"conference","publication":"22nd IEEE International Conference on Industrial Technology (ICIT)","status":"public","abstract":[{"lang":"eng","text":"In this publication important aspects for the implementation of inductive locating are explained. The miniaturized sensor platform called Sens-o-Spheres is used as an application of this locating method. The sensor platform is applied in bioreactors in order to obtain the environmental parameters, which makes a localization by magnetic fields necessary. Since the properties of magnetic fields in the localization area are very different from the wave characteristics, the principle of inductive localization is investigated in this publication and explained by using electrical equivalent circuit diagrams. Thereby, inductive localization uses the coupling or the mutual inductivities between coils, which is noticeable by an induced voltage. Therefore some properties and procedures are explained to extract the location of Sens-o-Spheres or other industrial sensor platforms from the couplings of the coils. One method calculates the location from an adapted ratio calculation and the other method uses neural networks and stochastic filters to obtain the results. In the end, these results are evaluated and compared."}],"author":[{"first_name":"Sven","id":"38240","full_name":"Lange, Sven","last_name":"Lange"},{"first_name":"Dominik","full_name":"Schröder, Dominik","last_name":"Schröder"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"last_name":"Kuhn","full_name":"Kuhn, Harald","first_name":"Harald"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"date_created":"2021-06-20T23:25:54Z","date_updated":"2022-01-06T06:55:33Z","publisher":"IEEE","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9453609"}],"doi":"10.1109/icit46573.2021.9453609","conference":{"end_date":"2021-03-12","location":"Valencia, Spain ","name":"22nd IEEE International Conference on Industrial Technology (ICIT)","start_date":"2021-03-10"},"title":"Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses","publication_status":"published","publication_identifier":{"isbn":["9781728157306"]},"citation":{"ama":"Lange S, Schröder D, Hedayat C, Kuhn H, Hilleringmann U. Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In: <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>.  Valencia, Spain : IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>","ieee":"S. Lange, D. Schröder, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses,” in <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>, Valencia, Spain , 2021.","chicago":"Lange, Sven, Dominik Schröder, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” In <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>.  Valencia, Spain : IEEE, 2021. <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">https://doi.org/10.1109/icit46573.2021.9453609</a>.","bibtex":"@inproceedings{Lange_Schröder_Hedayat_Kuhn_Hilleringmann_2021, place={ Valencia, Spain }, title={Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses}, DOI={<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>}, booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Lange, Sven and Schröder, Dominik and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }","short":"S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE,  Valencia, Spain , 2021.","mla":"Lange, Sven, et al. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>.","apa":"Lange, S., Schröder, D., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021). Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>.  Valencia, Spain : IEEE. <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">https://doi.org/10.1109/icit46573.2021.9453609</a>"},"year":"2021","place":" Valencia, Spain "},{"publication_status":"published","publication_identifier":{"isbn":["9781728157306"]},"year":"2021","place":"Valencia, Spain ","citation":{"apa":"Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H., &#38; Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>. Valencia, Spain : IEEE. <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">https://doi.org/10.1109/icit46573.2021.9453646</a>","bibtex":"@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_Gockel_2021, place={Valencia, Spain }, title={Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction}, DOI={<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>}, booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneis, Volker and Hedayat, Christian and Kuhn, Harald and Gockel, Franz-Barthold}, year={2021} }","short":"T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.","mla":"Sander, Tom, et al. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>.","chicago":"Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian Hedayat, Harald Kuhn, and Franz-Barthold Gockel. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” In <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>. Valencia, Spain : IEEE, 2021. <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">https://doi.org/10.1109/icit46573.2021.9453646</a>.","ieee":"T. Sander <i>et al.</i>, “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction,” in <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>, Valencia, Spain , 2021.","ama":"Sander T, Lange S, Hilleringmann U, et al. Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In: <i>22nd IEEE International Conference on Industrial Technology (ICIT)</i>. Valencia, Spain : IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>"},"date_updated":"2022-01-06T06:55:33Z","publisher":"IEEE","author":[{"first_name":"Tom","full_name":"Sander, Tom","last_name":"Sander"},{"last_name":"Lange","full_name":"Lange, Sven","id":"38240","first_name":"Sven"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"},{"first_name":"Volker","last_name":"Geneis","full_name":"Geneis, Volker"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"last_name":"Kuhn","full_name":"Kuhn, Harald","first_name":"Harald"},{"first_name":"Franz-Barthold","last_name":"Gockel","full_name":"Gockel, Franz-Barthold"}],"date_created":"2021-06-20T23:32:11Z","title":"Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9453646"}],"doi":"10.1109/icit46573.2021.9453646","conference":{"name":"22nd IEEE International Conference on Industrial Technology (ICIT)","start_date":"2021-03-10","end_date":"2021-03-12","location":"Valencia, Spain "},"type":"conference","publication":"22nd IEEE International Conference on Industrial Technology (ICIT)","abstract":[{"lang":"eng","text":"During the industrial processing of materials for the manufacture of new products, surface defects can quickly occur. In order to achieve high quality without a long time delay, it makes sense to inspect the work pieces so that defective work pieces can be sorted out right at the beginning of the process. At the same time, the evaluation unit should come close the perception of the human eye regarding detection of defects in surfaces. Such defects often manifest themselves by a deviation of the existing structure. The only restriction should be that only matt surfaces should be considered here. Therefore in this work, different classification and image processing algorithms are applied to surface data to identify possible surface damages. For this purpose, the Gabor filter and the FST (Fused Structure and Texture) features generated with it, as well as the salience metric are used on the image processing side. On the classification side, however, deep neural networks, Convolutional Neural Networks (CNN), and autoencoders are used to make a decision. A distinction is also made between training using class labels and without. It turns out later that the salience metric are best performed by CNN. On the other hand, if there is no labeled training data available, a novelty classification can easily be achieved by using autoencoders as well as the salience metric and some filters."}],"status":"public","_id":"22481","user_id":"38240","department":[{"_id":"59"},{"_id":"485"}],"keyword":["Image Processing","Defect Detection","wooden surfaces","Machine Learning","Neural Networks"],"language":[{"iso":"eng"}]},{"status":"public","type":"conference","department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","_id":"22532","citation":{"ama":"Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In: <i>2021 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>","chicago":"Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” In <i>2021 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">https://doi.org/10.1109/ssi52265.2021.9466958</a>.","ieee":"S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field,” in <i>2021 Smart Systems Integration (SSI)</i>, Grenoble, France , 2021.","mla":"Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>.","bibtex":"@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, place={Grenoble, France}, title={Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }","short":"S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2021.","apa":"Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021). Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In <i>2021 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">https://doi.org/10.1109/ssi52265.2021.9466958</a>"},"place":"Grenoble, France","publication_identifier":{"isbn":["9781665440929"]},"publication_status":"published","conference":{"end_date":"2021-04-29","location":"Grenoble, France ","name":"2021 Smart Systems Integration (SSI)","start_date":"2021-04-27"},"doi":"10.1109/ssi52265.2021.9466958","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9466958"}],"author":[{"last_name":"Lange","full_name":"Lange, Sven","id":"38240","first_name":"Sven"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"last_name":"Kuhn","full_name":"Kuhn, Harald","first_name":"Harald"},{"first_name":"Ulrich","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann"}],"date_updated":"2022-01-06T06:55:36Z","abstract":[{"lang":"eng","text":"In this publication, further elements of the newly developed inductive localization in the near field are presented. The advantage of inductive localization is the usage of the magnetic fields, which have a very low influence of non-metallic materials in the environment and thus follows good applications in the area of medicine and biochemistry. This allows a precise localization of sensor platforms in inhomogeneous mixtures of materials, where classical methods have major problems with inhomogeneous dielectric conductivity or density. The calculation of the localization of the searched object differs from other methods such as ultrasound or electromagnetic waves due to the source-free propagation of the magnetic field. Therefore, new mathematical evaluation methods and systematic adaptations are necessary, which are presented in this paper in circuit analysis. For this purpose, the exact circuit influences of one coil and the influence of another coil are investigated and which resonance circuit should be selected for both coils for a inductive localization with optimized signal strength."}],"publication":"2021 Smart Systems Integration (SSI)","language":[{"iso":"eng"}],"keyword":["Electrotechnical Characteristics of Real Coils","Inductive Localization","Resonant Circuit","Mutual Inductance","Near-Field"],"year":"2021","title":"Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field","date_created":"2021-07-05T19:31:52Z","publisher":"IEEE"},{"language":[{"iso":"eng"}],"keyword":["Near-Field Scanner","Near-Field to Far-Field Transformation","Directivity","Surface Equivalence Theorem","Huygens’ Box"],"abstract":[{"text":"In this publication, the near-field to far-field transformation using the self-built near-field scanner NFS3000 is examined with regard to its geometry. This device allows to measure electric and magnetic fields in small distances to the DUT (Device under Test) with high geometric precision and high sensitivity. Leading to a fast examination of EMC (Electromagnetic Compatibility) problems, because the electromagnetic properties are better understandable and therefore easier to solve than e.g. measurements in a far-field chamber. In addition, it is possible to extrapolate the near-fields into the far-field and to determine the radiation pattern of antennas and emitting objects. For this purpose, this paper deals with the basis of this transformation, the so-called surface equivalence theorem. This principle is then adapted to the measurement of near-field scanners and implemented accordingly. Due to the non-ideal design of the near-field scanner, the effects on a far-field transformation are finally presented and discussed.","lang":"eng"}],"publication":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","title":"Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000","date_created":"2021-03-18T13:43:53Z","publisher":"IEEE","year":"2020","department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","_id":"21541","project":[{"_id":"52","name":"Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"status":"public","type":"conference","doi":"10.1109/emceurope48519.2020.9245697","conference":{"start_date":"2020-09-23","name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","location":"Rome, Italy ","end_date":"2020-09-25"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9245697"}],"author":[{"id":"38240","full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"last_name":"Schroder","full_name":"Schroder, Dominik","first_name":"Dominik"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"last_name":"Hangmann","full_name":"Hangmann, Christian","first_name":"Christian"},{"full_name":"Otto, Thomas","last_name":"Otto","first_name":"Thomas"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"date_updated":"2022-01-06T06:55:03Z","citation":{"apa":"Lange, S., Schroder, D., Hedayat, C., Hangmann, C., Otto, T., &#38; Hilleringmann, U. (2020). Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. In <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. Rome, Italy : IEEE. <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">https://doi.org/10.1109/emceurope48519.2020.9245697</a>","short":"S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.","bibtex":"@inproceedings{Lange_Schroder_Hedayat_Hangmann_Otto_Hilleringmann_2020, title={Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000}, DOI={<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>}, booktitle={2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat, Christian and Hangmann, Christian and Otto, Thomas and Hilleringmann, Ulrich}, year={2020} }","mla":"Lange, Sven, et al. “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.” <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>.","ama":"Lange S, Schroder D, Hedayat C, Hangmann C, Otto T, Hilleringmann U. Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. In: <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>","ieee":"S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, and U. Hilleringmann, “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000,” in <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>, Rome, Italy , 2020.","chicago":"Lange, Sven, Dominik Schroder, Christian Hedayat, Christian Hangmann, Thomas Otto, and Ulrich Hilleringmann. “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.” In <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. IEEE, 2020. <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">https://doi.org/10.1109/emceurope48519.2020.9245697</a>."},"related_material":{"record":[{"status":"public","relation":"original","id":"21541"}]},"publication_identifier":{"isbn":["978-1-7281-5580-7"],"issn":["2325-0364 "],"eisbn":["978-1-7281-5579-1"]},"publication_status":"published"},{"publication":"Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis","abstract":[{"text":"Using near-field (NF) scan data to predict the far-field (FF) behaviour of radiating electronic systems represents a novel method to accompany the whole RF design process. This approach involves so-called Huygens' box as an efficient radiation model inside an electromagnetic (EM) simulation tool and then transforms the scanned NF measured data into the FF. For this, the basic idea of the Huygens'box principle and the NF-to-FF transformation are briefly presented. The NF is measured on the Huygens' box around a device under test using anNF scanner, recording the magnitude and phase of the site-related magnetic and electric components. A comparison between a fullwave simulation and the measurement results shows a good similarity in both the NF and the simulated and transformed FF.Thus, this method is applicable to predict the FF behaviour of any electronic system by measuring the NF. With this knowledge, the RF design can be improved due to allowing a significant reduction of EM compatibility failure at the end of the development flow. In addition, the very efficient FF radiation model can be used for detailed investigations in various environments and the impact of such an equivalent radiation source on other electronic systems can be assessed.","lang":"eng"}],"keyword":["Huygens' box","NF-to-FF transformation","efficient FF radiation model","FF behaviour","EMI assessment","PCB","near-field measurements","efficient radiation model","far-field behaviour","RF design process","far-field prediction","Huygens'box principle","fullwave simulation","electronic system radiation","equivalent radiation source","electromagnetic simulation tool","near-field scan data","EM compatibility failure reduction"],"language":[{"iso":"eng"}],"edition":"1","year":"2020","publisher":" The Institution of Engineering and Technology (IET)","date_created":"2021-03-18T13:49:49Z","title":"Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs","type":"book_chapter","status":"public","_id":"21542","project":[{"_id":"52","name":"Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"department":[{"_id":"485"}],"user_id":"38240","publication_identifier":{"isbn":["9781839530494","9781839530500"]},"publication_status":"published","related_material":{"record":[{"status":"public","relation":"other","id":"21542"}]},"place":"Croyton, UK","page":"315-346 (32)","citation":{"ieee":"D. Schröder, S. Lange, C. Hangmann, and C. Hedayat, “Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs,” in <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i>, 1st ed., Croyton, UK:  The Institution of Engineering and Technology (IET), 2020, pp. 315-346 (32).","chicago":"Schröder, Dominik, Sven Lange, Christian Hangmann, and Christian Hedayat. “Far-Field Prediction Combining Simulations with near-Field Measurements for EMI Assessment of PCBs.” In <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i>, 1st ed., 315-346 (32). Croyton, UK:  The Institution of Engineering and Technology (IET), 2020. <a href=\"https://doi.org/10.1049/pbcs072e_ch14\">https://doi.org/10.1049/pbcs072e_ch14</a>.","ama":"Schröder D, Lange S, Hangmann C, Hedayat C. Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs. In: <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i>. 1st ed. Croyton, UK:  The Institution of Engineering and Technology (IET); 2020:315-346 (32). doi:<a href=\"https://doi.org/10.1049/pbcs072e_ch14\">10.1049/pbcs072e_ch14</a>","short":"D. Schröder, S. Lange, C. Hangmann, C. Hedayat, in: Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis, 1st ed.,  The Institution of Engineering and Technology (IET), Croyton, UK, 2020, pp. 315-346 (32).","bibtex":"@inbook{Schröder_Lange_Hangmann_Hedayat_2020, place={Croyton, UK}, edition={1}, title={Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs}, DOI={<a href=\"https://doi.org/10.1049/pbcs072e_ch14\">10.1049/pbcs072e_ch14</a>}, booktitle={Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis}, publisher={ The Institution of Engineering and Technology (IET)}, author={Schröder, Dominik and Lange, Sven and Hangmann, Christian and Hedayat, Christian}, year={2020}, pages={315-346 (32)} }","mla":"Schröder, Dominik, et al. “Far-Field Prediction Combining Simulations with near-Field Measurements for EMI Assessment of PCBs.” <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i>, 1st ed.,  The Institution of Engineering and Technology (IET), 2020, pp. 315-346 (32), doi:<a href=\"https://doi.org/10.1049/pbcs072e_ch14\">10.1049/pbcs072e_ch14</a>.","apa":"Schröder, D., Lange, S., Hangmann, C., &#38; Hedayat, C. (2020). Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs. In <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i> (1st ed., pp. 315-346 (32)). Croyton, UK:  The Institution of Engineering and Technology (IET). <a href=\"https://doi.org/10.1049/pbcs072e_ch14\">https://doi.org/10.1049/pbcs072e_ch14</a>"},"date_updated":"2022-01-06T06:55:03Z","author":[{"first_name":"Dominik","last_name":"Schröder","full_name":"Schröder, Dominik"},{"first_name":"Sven","id":"38240","full_name":"Lange, Sven","last_name":"Lange"},{"first_name":"Christian","last_name":"Hangmann","full_name":"Hangmann, Christian"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"}],"doi":"10.1049/pbcs072e_ch14","main_file_link":[{"url":"https://digital-library.theiet.org/content/books/10.1049/pbcs072e_ch14"}]},{"department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","_id":"21524","project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"language":[{"iso":"eng"}],"keyword":["oxygen content","inhomogeneous ambient media","magnetic field","inductive locating method","miniaturized wireless sensors","inhomogeneous dielectrics","conventional rod probes","Sens-o-Spheres measure","frequency 13.56 MHz"],"publication":"2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)","type":"conference","status":"public","abstract":[{"text":"For the measurement of process data in bioreactors, very small wireless sensors are currently under development to replace the conventional rod probes. The so-called Sens-o-Spheres measure the temperature and in future the oxygen content and the pH of fluids. In order to evaluate the distribution of the measured values within the process, it is necessary to locate the wireless sensors. Because of the small size of the sphere (diameter 8 mm), inhomogeneous ambient media and the size of the reactor (less than 2 m), an inductive locating by magnetic fields with a frequency of f = 13.56 MHz is necessary. Since the behaviour of the magnetic field is very different from that of the electromagnetic wave, new locating methods are required, which are presented in this paper.","lang":"eng"}],"date_created":"2021-03-17T09:52:41Z","author":[{"first_name":"Sven","full_name":"Lange, Sven","id":"38240","last_name":"Lange"},{"first_name":"Dominik","full_name":"Schröder, Dominik","last_name":"Schröder"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"first_name":"Thomas","full_name":"Otto, Thomas","last_name":"Otto"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"}],"date_updated":"2022-01-06T06:55:03Z","doi":"10.1109/newcas44328.2019.8961227","conference":{"location":"Munich, Germany","end_date":"2019-06-26","start_date":"2019-06-23","name":"2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/8961227"}],"title":"Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics","related_material":{"record":[{"status":"public","id":"21524","relation":"earlier_version"}]},"publication_identifier":{"isbn":["9781728110318"]},"publication_status":"published","citation":{"ama":"Lange S, Schröder D, Hedayat C, Otto T, Hilleringmann U. Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics. In: <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. ; 2019. doi:<a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>","ieee":"S. Lange, D. Schröder, C. Hedayat, T. Otto, and U. Hilleringmann, “Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics,” in <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>, Munich, Germany, 2019.","chicago":"Lange, Sven, Dominik Schröder, Christian Hedayat, Thomas Otto, and Ulrich Hilleringmann. “Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics.” In <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>, 2019. <a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">https://doi.org/10.1109/newcas44328.2019.8961227</a>.","apa":"Lange, S., Schröder, D., Hedayat, C., Otto, T., &#38; Hilleringmann, U. (2019). Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics. In <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. Munich, Germany. <a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">https://doi.org/10.1109/newcas44328.2019.8961227</a>","mla":"Lange, Sven, et al. “Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics.” <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>, 2019, doi:<a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>.","bibtex":"@inproceedings{Lange_Schröder_Hedayat_Otto_Hilleringmann_2019, title={Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics}, DOI={<a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>}, booktitle={2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)}, author={Lange, Sven and Schröder, Dominik and Hedayat, Christian and Otto, Thomas and Hilleringmann, Ulrich}, year={2019} }","short":"S. Lange, D. Schröder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), 2019."},"year":"2019"},{"author":[{"first_name":"Sven","last_name":"Lange","orcid":"0009-0007-9150-2266 ","full_name":"Lange, Sven","id":"38240"},{"full_name":"Büker, Maik-Julian","last_name":"Büker","first_name":"Maik-Julian"},{"first_name":"Denis","full_name":"Sievers, Denis","last_name":"Sievers"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"orcid":"0000-0001-7059-9862","last_name":"Förstner","id":"158","full_name":"Förstner, Jens","first_name":"Jens"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"},{"first_name":"Thomas","full_name":"Otto, Thomas","last_name":"Otto"}],"date_updated":"2024-11-30T19:32:36Z","conference":{"start_date":"2019-04-10","name":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","location":"Barcelona, Spain ","end_date":"2019-04-11"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/8727831"}],"related_material":{"record":[{"status":"deleted","id":"9265","relation":"other"}]},"publication_identifier":{"isbn":["978-3-8007-4919-5"]},"publication_status":"published","page":"1-4","citation":{"apa":"Lange, S., Büker, M.-J., Sievers, D., Hedayat, C., Förstner, J., Hilleringmann, U., &#38; Otto, T. (2019). Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.","bibtex":"@inproceedings{Lange_Büker_Sievers_Hedayat_Förstner_Hilleringmann_Otto_2019, place={Berlin · Offenbach}, title={Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission}, booktitle={Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems}, publisher={VDE VERLAG GMBH}, author={Lange, Sven and Büker, Maik-Julian and Sievers, Denis and Hedayat, Christian and Förstner, Jens and Hilleringmann, Ulrich and Otto, Thomas}, year={2019}, pages={1–4} }","mla":"Lange, Sven, et al. “Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.” <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, VDE VERLAG GMBH, 2019, pp. 1–4.","short":"S. Lange, M.-J. Büker, D. Sievers, C. Hedayat, J. Förstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, VDE VERLAG GMBH, Berlin · Offenbach, 2019, pp. 1–4.","ama":"Lange S, Büker M-J, Sievers D, et al. Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. In: <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>. VDE VERLAG GMBH; 2019:1-4.","chicago":"Lange, Sven, Maik-Julian Büker, Denis Sievers, Christian Hedayat, Jens Förstner, Ulrich Hilleringmann, and Thomas Otto. “Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.” In <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4. Berlin · Offenbach: VDE VERLAG GMBH, 2019.","ieee":"S. Lange <i>et al.</i>, “Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission,” in <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, Barcelona, Spain , 2019, pp. 1–4."},"place":"Berlin · Offenbach","department":[{"_id":"59"},{"_id":"61"},{"_id":"485"}],"user_id":"158","_id":"21462","type":"conference","status":"public","date_created":"2021-03-12T09:46:55Z","publisher":"VDE VERLAG GMBH","title":"Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission","year":"2019","language":[{"iso":"eng"}],"keyword":["tet_enas"],"publication":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","abstract":[{"text":"This paper presents a new methodology by using a multiple coil array for energy transmission. The complex current strengths of the transmitting coil array are calculated by having the knowledge about of the mutual inductances and the symmetries of the transmitting coil array, so that its resulting magnetic field mainly penetrates only the receiving coil and is strongly attenuated outside. This method is used for an optimized wireless energy transmission but can also be implemented for other inductive applications.","lang":"eng"}]}]