---
_id: '62167'
abstract:
- lang: eng
  text: Diese Dissertation befasst sich mit der Entwicklung eines induktiv-basierten
    Lokalisierungsverfahrens mittels planarer Spulen, das auf magnetischer Kopplung
    beruht. Grundlage ist die elektromagnetische Induktion, bei der sich die entstehende
    Spannung proportional zur Gegeninduktivität verhält. Das Verfahren arbeitet im
    physikalischen Nahfeld und im Frequenzbereich von einigen kHz bis MHz, um eine
    effiziente Kopplung ohne Ausbreitung elektromagnetischer Wellen zu gewährleisten.
    Im Vergleich zu etablierten Verfahren wie GPS oder Ultraschall zeigt die induktive
    Ortung Vorteile bei kurzer Reichweite, insbesondere durch hohe Genauigkeit im
    Zentimeterbereich und geringe Materialabhängigkeit. Zudem lässt sie sich in bestehende
    Technologien wie bei der drahtlosen Energieübertragung integrieren und durch Sensorfusion
    mit anderen Verfahren kombinieren. Zur Modellierung und Optimierung werden physikalische
    Eigenschaften von planaren Spulen und EM-Feldern analysiert und elektrische Ersatzschaltbilder
    eingesetzt. Die geometriebasierte Berechnung der Gegeninduktivität ermöglicht
    die Entwicklung und Bewertung geeigneter Ortungsalgorithmen. Stochastische Filterverfahren
    verbessern zusätzlich die Robustheit gegenüber Umgebungseinflüssen. Abschließend
    wird eine modulare Simulationsplattform vorgestellt, die als Grundlage für die
    Generierung von Trainingsdaten sowie zur Weiterentwicklung von Mess-, Ortungs-
    und Filtermethoden dient.
- lang: eng
  text: This dissertation addresses the development of an inductively based localization
    method using planar coils, which relies on magnetic coupling. The underlying principle
    is electromagnetic induction, where the resulting voltage is proportional to the
    mutual inductance. The method operates in the physical near field and within a
    frequency range from a few kHz to MHz, ensuring efficient coupling without the
    propagation of electromagnetic waves. Compared to established methods such as
    GPS or ultrasound, inductive localization offers advantages at short range—particularly
    high accuracy in the centimeter range and low dependency on surrounding materials.
    Additionally, it can be integrated into existing technologies, such as wireless
    power transfer systems, and combined with other methods through sensor fusion.
    To support modeling and optimization, the physical properties of planar coils
    and electromagnetic fields are analyzed, and equivalent electrical circuit models
    are used. Geometry-based calculations of mutual inductance enable the development
    and evaluation of suitable localization algorithms. Stochastic filtering methods
    further enhance robustness against environmental influences. Finally, a modular
    simulation platform is presented, which serves as a foundation for generating
    training data as well as for the further development of measurement, localization,
    and filtering methods.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
citation:
  ama: Lange S. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter
    Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>.
    Universitätsbibliothek Paderborn; 2025. doi:<a href="https://doi.org/10.17619/UNIPB/1-2436">10.17619/UNIPB/1-2436</a>
  apa: Lange, S. (2025). <i>Analyse und Modellierung eines induktiven Ortungsprozesses
    unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>.
    Universitätsbibliothek Paderborn. <a href="https://doi.org/10.17619/UNIPB/1-2436">https://doi.org/10.17619/UNIPB/1-2436</a>
  bibtex: '@book{Lange_2025, place={Paderborn}, title={Analyse und Modellierung eines
    induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen
    planarer Spulensysteme}, DOI={<a href="https://doi.org/10.17619/UNIPB/1-2436">10.17619/UNIPB/1-2436</a>},
    publisher={Universitätsbibliothek Paderborn}, author={Lange, Sven}, year={2025}
    }'
  chicago: 'Lange, Sven. <i>Analyse und Modellierung eines induktiven Ortungsprozesses
    unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>.
    Paderborn: Universitätsbibliothek Paderborn, 2025. <a href="https://doi.org/10.17619/UNIPB/1-2436">https://doi.org/10.17619/UNIPB/1-2436</a>.'
  ieee: 'S. Lange, <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter
    Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>.
    Paderborn: Universitätsbibliothek Paderborn, 2025.'
  mla: Lange, Sven. <i>Analyse und Modellierung eines induktiven Ortungsprozesses
    unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>.
    Universitätsbibliothek Paderborn, 2025, doi:<a href="https://doi.org/10.17619/UNIPB/1-2436">10.17619/UNIPB/1-2436</a>.
  short: S. Lange, Analyse und Modellierung eines induktiven Ortungsprozesses unter
    Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme,
    Universitätsbibliothek Paderborn, Paderborn, 2025.
date_created: 2025-11-12T10:06:39Z
date_updated: 2025-11-12T10:15:29Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
doi: 10.17619/UNIPB/1-2436
language:
- iso: ger
main_file_link:
- open_access: '1'
  url: https://digital.ub.uni-paderborn.de/hs/content/titleinfo/8122147
oa: '1'
page: '247'
place: Paderborn
publication_status: published
publisher: Universitätsbibliothek Paderborn
status: public
supervisor:
- first_name: Jens
  full_name: Förstner, Jens
  id: '158'
  last_name: Förstner
  orcid: 0000-0001-7059-9862
- first_name: Marcus
  full_name: Stiemer, Marcus
  last_name: Stiemer
title: Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung
  der elektromagnetischen Wechselwirkungen planarer Spulensysteme
type: dissertation
user_id: '38240'
year: '2025'
...
---
_id: '56782'
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Marcel
  full_name: Olbrich, Marcel
  last_name: Olbrich
- first_name: Dennis
  full_name: Hemker, Dennis
  last_name: Hemker
- first_name: Jad
  full_name: Maalouly, Jad
  last_name: Maalouly
- first_name: Jürgen
  full_name: Kutter, Jürgen
  last_name: Kutter
- first_name: Dominik
  full_name: Schröder, Dominik
  last_name: Schröder
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Michael
  full_name: Kleinen, Michael
  last_name: Kleinen
- first_name: Andreas
  full_name: Grünwaldt, Andreas
  last_name: Grünwaldt
- first_name: Jörg
  full_name: Bärenfänger, Jörg
  last_name: Bärenfänger
- first_name: Harald
  full_name: Mathis, Harald
  last_name: Mathis
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
citation:
  ama: 'Lange S, Olbrich M, Hemker D, et al. A Hybrid Data Generation Approach for
    the Development of an AI-based EMC Interference Recognition Method. In: <i>2024
    International Symposium on Electromagnetic Compatibility – EMC Europe</i>. IEEE;
    2024. doi:<a href="https://doi.org/10.1109/emceurope59828.2024.10722681">10.1109/emceurope59828.2024.10722681</a>'
  apa: Lange, S., Olbrich, M., Hemker, D., Maalouly, J., Kutter, J., Schröder, D.,
    Hedayat, C., Kleinen, M., Grünwaldt, A., Bärenfänger, J., Mathis, H., &#38; Kuhn,
    H. (2024). A Hybrid Data Generation Approach for the Development of an AI-based
    EMC Interference Recognition Method. <i>2024 International Symposium on Electromagnetic
    Compatibility – EMC Europe</i>. 2024 International Symposium on Electromagnetic
    Compatibility – EMC Europe, Bruges, Belgium. <a href="https://doi.org/10.1109/emceurope59828.2024.10722681">https://doi.org/10.1109/emceurope59828.2024.10722681</a>
  bibtex: '@inproceedings{Lange_Olbrich_Hemker_Maalouly_Kutter_Schröder_Hedayat_Kleinen_Grünwaldt_Bärenfänger_et
    al._2024, place={Bruges, Belgium}, title={A Hybrid Data Generation Approach for
    the Development of an AI-based EMC Interference Recognition Method}, DOI={<a href="https://doi.org/10.1109/emceurope59828.2024.10722681">10.1109/emceurope59828.2024.10722681</a>},
    booktitle={2024 International Symposium on Electromagnetic Compatibility – EMC
    Europe}, publisher={IEEE}, author={Lange, Sven and Olbrich, Marcel and Hemker,
    Dennis and Maalouly, Jad and Kutter, Jürgen and Schröder, Dominik and Hedayat,
    Christian and Kleinen, Michael and Grünwaldt, Andreas and Bärenfänger, Jörg and
    et al.}, year={2024} }'
  chicago: 'Lange, Sven, Marcel Olbrich, Dennis Hemker, Jad Maalouly, Jürgen Kutter,
    Dominik Schröder, Christian Hedayat, et al. “A Hybrid Data Generation Approach
    for the Development of an AI-Based EMC Interference Recognition Method.” In <i>2024
    International Symposium on Electromagnetic Compatibility – EMC Europe</i>. Bruges,
    Belgium: IEEE, 2024. <a href="https://doi.org/10.1109/emceurope59828.2024.10722681">https://doi.org/10.1109/emceurope59828.2024.10722681</a>.'
  ieee: 'S. Lange <i>et al.</i>, “A Hybrid Data Generation Approach for the Development
    of an AI-based EMC Interference Recognition Method,” presented at the 2024 International
    Symposium on Electromagnetic Compatibility – EMC Europe, Bruges, Belgium, 2024,
    doi: <a href="https://doi.org/10.1109/emceurope59828.2024.10722681">10.1109/emceurope59828.2024.10722681</a>.'
  mla: Lange, Sven, et al. “A Hybrid Data Generation Approach for the Development
    of an AI-Based EMC Interference Recognition Method.” <i>2024 International Symposium
    on Electromagnetic Compatibility – EMC Europe</i>, IEEE, 2024, doi:<a href="https://doi.org/10.1109/emceurope59828.2024.10722681">10.1109/emceurope59828.2024.10722681</a>.
  short: 'S. Lange, M. Olbrich, D. Hemker, J. Maalouly, J. Kutter, D. Schröder, C.
    Hedayat, M. Kleinen, A. Grünwaldt, J. Bärenfänger, H. Mathis, H. Kuhn, in: 2024
    International Symposium on Electromagnetic Compatibility – EMC Europe, IEEE, Bruges,
    Belgium, 2024.'
conference:
  end_date: 2024-09-05
  location: Bruges, Belgium
  name: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe
  start_date: 2024-09-02
date_created: 2024-10-29T10:35:08Z
date_updated: 2025-03-17T12:14:38Z
department:
- _id: '59'
doi: 10.1109/emceurope59828.2024.10722681
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/10722681
place: Bruges, Belgium
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe
publication_status: published
publisher: IEEE
status: public
title: A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference
  Recognition Method
type: conference
user_id: '38240'
year: '2024'
...
---
_id: '56781'
author:
- first_name: Jad
  full_name: Maalouly, Jad
  last_name: Maalouly
- first_name: Dennis
  full_name: Hemker, Dennis
  last_name: Hemker
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Marcel
  full_name: Olbrich, Marcel
  last_name: Olbrich
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Jürgen
  full_name: Kutter, Jürgen
  last_name: Kutter
- first_name: Harald
  full_name: Mathis, Harald
  last_name: Mathis
citation:
  ama: 'Maalouly J, Hemker D, Lange S, et al. Evaluation of Simulated and Real Measurement
    Data for AI-based Interference Classification in EMC Applications. In: <i>2024
    International Symposium on Electromagnetic Compatibility – EMC Europe</i>. IEEE;
    2024. doi:<a href="https://doi.org/10.1109/emceurope59828.2024.10722094">10.1109/emceurope59828.2024.10722094</a>'
  apa: Maalouly, J., Hemker, D., Lange, S., Olbrich, M., Hedayat, C., Kutter, J.,
    &#38; Mathis, H. (2024). Evaluation of Simulated and Real Measurement Data for
    AI-based Interference Classification in EMC Applications. <i>2024 International
    Symposium on Electromagnetic Compatibility – EMC Europe</i>. 2024 International
    Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium . <a
    href="https://doi.org/10.1109/emceurope59828.2024.10722094">https://doi.org/10.1109/emceurope59828.2024.10722094</a>
  bibtex: '@inproceedings{Maalouly_Hemker_Lange_Olbrich_Hedayat_Kutter_Mathis_2024,
    place={Brugge, Belgium }, title={Evaluation of Simulated and Real Measurement
    Data for AI-based Interference Classification in EMC Applications}, DOI={<a href="https://doi.org/10.1109/emceurope59828.2024.10722094">10.1109/emceurope59828.2024.10722094</a>},
    booktitle={2024 International Symposium on Electromagnetic Compatibility – EMC
    Europe}, publisher={IEEE}, author={Maalouly, Jad and Hemker, Dennis and Lange,
    Sven and Olbrich, Marcel and Hedayat, Christian and Kutter, Jürgen and Mathis,
    Harald}, year={2024} }'
  chicago: 'Maalouly, Jad, Dennis Hemker, Sven Lange, Marcel Olbrich, Christian Hedayat,
    Jürgen Kutter, and Harald Mathis. “Evaluation of Simulated and Real Measurement
    Data for AI-Based Interference Classification in EMC Applications.” In <i>2024
    International Symposium on Electromagnetic Compatibility – EMC Europe</i>. Brugge,
    Belgium : IEEE, 2024. <a href="https://doi.org/10.1109/emceurope59828.2024.10722094">https://doi.org/10.1109/emceurope59828.2024.10722094</a>.'
  ieee: 'J. Maalouly <i>et al.</i>, “Evaluation of Simulated and Real Measurement
    Data for AI-based Interference Classification in EMC Applications,” presented
    at the 2024 International Symposium on Electromagnetic Compatibility – EMC Europe,
    Brugge, Belgium , 2024, doi: <a href="https://doi.org/10.1109/emceurope59828.2024.10722094">10.1109/emceurope59828.2024.10722094</a>.'
  mla: Maalouly, Jad, et al. “Evaluation of Simulated and Real Measurement Data for
    AI-Based Interference Classification in EMC Applications.” <i>2024 International
    Symposium on Electromagnetic Compatibility – EMC Europe</i>, IEEE, 2024, doi:<a
    href="https://doi.org/10.1109/emceurope59828.2024.10722094">10.1109/emceurope59828.2024.10722094</a>.
  short: 'J. Maalouly, D. Hemker, S. Lange, M. Olbrich, C. Hedayat, J. Kutter, H.
    Mathis, in: 2024 International Symposium on Electromagnetic Compatibility – EMC
    Europe, IEEE, Brugge, Belgium , 2024.'
conference:
  end_date: 2024-09-05
  location: 'Brugge, Belgium '
  name: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe
  start_date: 2024-09-02
date_created: 2024-10-29T10:34:53Z
date_updated: 2025-03-17T12:14:48Z
department:
- _id: '59'
doi: 10.1109/emceurope59828.2024.10722094
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/10722094
place: 'Brugge, Belgium '
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2024 International Symposium on Electromagnetic Compatibility – EMC Europe
publication_status: published
publisher: IEEE
status: public
title: Evaluation of Simulated and Real Measurement Data for AI-based Interference
  Classification in EMC Applications
type: conference
user_id: '38240'
year: '2024'
...
---
_id: '56924'
author:
- first_name: Marcus
  full_name: Stiemer, Marcus
  last_name: Stiemer
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Dominik
  full_name: Schröder, Dominik
  last_name: Schröder
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Jad
  full_name: Maalouly, Jad
  last_name: Maalouly
- first_name: Dennis
  full_name: Hemker, Dennis
  last_name: Hemker
- first_name: Harald
  full_name: Mathis, Harald
  last_name: Mathis
citation:
  ama: 'Stiemer M, Lange S, Schröder D, et al. Enhancing Information Extraction in
    EMC Measurements through Artificial Intelligence. In: <i>2024 Smart Systems Integration
    Conference and Exhibition (SSI)</i>. IEEE; 2024. doi:<a href="https://doi.org/10.1109/ssi63222.2024.10740546">10.1109/ssi63222.2024.10740546</a>'
  apa: Stiemer, M., Lange, S., Schröder, D., Hedayat, C., Maalouly, J., Hemker, D.,
    &#38; Mathis, H. (2024). Enhancing Information Extraction in EMC Measurements
    through Artificial Intelligence. <i>2024 Smart Systems Integration Conference
    and Exhibition (SSI)</i>. 2024 Smart Systems Integration Conference and Exhibition
    (SSI), Hamburg. <a href="https://doi.org/10.1109/ssi63222.2024.10740546">https://doi.org/10.1109/ssi63222.2024.10740546</a>
  bibtex: '@inproceedings{Stiemer_Lange_Schröder_Hedayat_Maalouly_Hemker_Mathis_2024,
    place={Hamburg}, title={Enhancing Information Extraction in EMC Measurements through
    Artificial Intelligence}, DOI={<a href="https://doi.org/10.1109/ssi63222.2024.10740546">10.1109/ssi63222.2024.10740546</a>},
    booktitle={2024 Smart Systems Integration Conference and Exhibition (SSI)}, publisher={IEEE},
    author={Stiemer, Marcus and Lange, Sven and Schröder, Dominik and Hedayat, Christian
    and Maalouly, Jad and Hemker, Dennis and Mathis, Harald}, year={2024} }'
  chicago: 'Stiemer, Marcus, Sven Lange, Dominik Schröder, Christian Hedayat, Jad
    Maalouly, Dennis Hemker, and Harald Mathis. “Enhancing Information Extraction
    in EMC Measurements through Artificial Intelligence.” In <i>2024 Smart Systems
    Integration Conference and Exhibition (SSI)</i>. Hamburg: IEEE, 2024. <a href="https://doi.org/10.1109/ssi63222.2024.10740546">https://doi.org/10.1109/ssi63222.2024.10740546</a>.'
  ieee: 'M. Stiemer <i>et al.</i>, “Enhancing Information Extraction in EMC Measurements
    through Artificial Intelligence,” presented at the 2024 Smart Systems Integration
    Conference and Exhibition (SSI), Hamburg, 2024, doi: <a href="https://doi.org/10.1109/ssi63222.2024.10740546">10.1109/ssi63222.2024.10740546</a>.'
  mla: Stiemer, Marcus, et al. “Enhancing Information Extraction in EMC Measurements
    through Artificial Intelligence.” <i>2024 Smart Systems Integration Conference
    and Exhibition (SSI)</i>, IEEE, 2024, doi:<a href="https://doi.org/10.1109/ssi63222.2024.10740546">10.1109/ssi63222.2024.10740546</a>.
  short: 'M. Stiemer, S. Lange, D. Schröder, C. Hedayat, J. Maalouly, D. Hemker, H.
    Mathis, in: 2024 Smart Systems Integration Conference and Exhibition (SSI), IEEE,
    Hamburg, 2024.'
conference:
  end_date: 2024-04-28
  location: Hamburg
  name: 2024 Smart Systems Integration Conference and Exhibition (SSI)
  start_date: 2024-04-26
date_created: 2024-11-06T13:36:01Z
date_updated: 2025-03-17T12:14:22Z
department:
- _id: '59'
doi: 10.1109/ssi63222.2024.10740546
language:
- iso: eng
place: Hamburg
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2024 Smart Systems Integration Conference and Exhibition (SSI)
publication_status: published
publisher: IEEE
status: public
title: Enhancing Information Extraction in EMC Measurements through Artificial Intelligence
type: conference
user_id: '38240'
year: '2024'
...
---
_id: '57499'
author:
- first_name: J.
  full_name: Maalouly, J.
  last_name: Maalouly
- first_name: D.
  full_name: Hemker, D.
  last_name: Hemker
- first_name: C.
  full_name: Hedayat, C.
  last_name: Hedayat
- first_name: M.
  full_name: Olbrich, M.
  last_name: Olbrich
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: H.
  full_name: Mathis, H.
  last_name: Mathis
citation:
  ama: Maalouly J, Hemker D, Hedayat C, Olbrich M, Lange S, Mathis H. Using Autoencoders
    to Classify EMC Problems in Electronic System Development. <i>Advances in Radio
    Science</i>. 2024;22:53–59. doi:<a href="https://doi.org/10.5194/ars-22-53-2024">10.5194/ars-22-53-2024</a>
  apa: Maalouly, J., Hemker, D., Hedayat, C., Olbrich, M., Lange, S., &#38; Mathis,
    H. (2024). Using Autoencoders to Classify EMC Problems in Electronic System Development.
    <i>Advances in Radio Science</i>, <i>22</i>, 53–59. <a href="https://doi.org/10.5194/ars-22-53-2024">https://doi.org/10.5194/ars-22-53-2024</a>
  bibtex: '@article{Maalouly_Hemker_Hedayat_Olbrich_Lange_Mathis_2024, title={Using
    Autoencoders to Classify EMC Problems in Electronic System Development}, volume={22},
    DOI={<a href="https://doi.org/10.5194/ars-22-53-2024">10.5194/ars-22-53-2024</a>},
    journal={Advances in Radio Science}, author={Maalouly, J. and Hemker, D. and Hedayat,
    C. and Olbrich, M. and Lange, Sven and Mathis, H.}, year={2024}, pages={53–59}
    }'
  chicago: 'Maalouly, J., D. Hemker, C. Hedayat, M. Olbrich, Sven Lange, and H. Mathis.
    “Using Autoencoders to Classify EMC Problems in Electronic System Development.”
    <i>Advances in Radio Science</i> 22 (2024): 53–59. <a href="https://doi.org/10.5194/ars-22-53-2024">https://doi.org/10.5194/ars-22-53-2024</a>.'
  ieee: 'J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, and H. Mathis,
    “Using Autoencoders to Classify EMC Problems in Electronic System Development,”
    <i>Advances in Radio Science</i>, vol. 22, pp. 53–59, 2024, doi: <a href="https://doi.org/10.5194/ars-22-53-2024">10.5194/ars-22-53-2024</a>.'
  mla: Maalouly, J., et al. “Using Autoencoders to Classify EMC Problems in Electronic
    System Development.” <i>Advances in Radio Science</i>, vol. 22, 2024, pp. 53–59,
    doi:<a href="https://doi.org/10.5194/ars-22-53-2024">10.5194/ars-22-53-2024</a>.
  short: J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, H. Mathis, Advances
    in Radio Science 22 (2024) 53–59.
conference:
  end_date: 2023-09-28
  location: Miltenberg
  name: Kleinheubacher Berichte 2023
  start_date: 2023-09-26
date_created: 2024-11-29T10:05:47Z
date_updated: 2025-03-17T12:13:32Z
department:
- _id: '59'
- _id: '485'
doi: 10.5194/ars-22-53-2024
intvolume: '        22'
language:
- iso: eng
main_file_link:
- url: https://ars.copernicus.org/articles/22/53/2024/
page: 53–59
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: Advances in Radio Science
publication_status: published
status: public
title: Using Autoencoders to Classify EMC Problems in Electronic System Development
type: journal_article
user_id: '38240'
volume: 22
year: '2024'
...
---
_id: '49890'
abstract:
- lang: eng
  text: In this paper, the influence of the environment on an inductive location system
    is analyzed. In the inductive location method, high frequency magnetic fields
    generated by planar coils lead to induction in other coils, which is used for
    localization analysis. Magnetic fields are not affected by changes in the dielectric
    properties of the environment, which is an advantage over other localization methods.
    However, electrical material parameters can still affect the localization results
    by indirect effects. For this reason, in this publication the influence will be
    investigated using real material parameters and their effects on the localization
    will be considered, so that the robustness and the limits of the inductive localization
    can be evaluated.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  id: '20179'
  last_name: Hilleringmann
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Jens
  full_name: Förstner, Jens
  id: '158'
  last_name: Förstner
  orcid: 0000-0001-7059-9862
citation:
  ama: 'Lange S, Hilleringmann U, Hedayat C, Kuhn H, Förstner J. Characterization
    of Various Environmental Influences on the Inductive Localization. In: <i>2023
    IEEE Conference on Antenna Measurements and Applications (CAMA)</i>. IEEE; 2023.
    doi:<a href="https://doi.org/10.1109/cama57522.2023.10352780">10.1109/cama57522.2023.10352780</a>'
  apa: Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., &#38; Förstner, J. (2023).
    Characterization of Various Environmental Influences on the Inductive Localization.
    <i>2023 IEEE Conference on Antenna Measurements and Applications (CAMA)</i>. 2023
    IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy
    . <a href="https://doi.org/10.1109/cama57522.2023.10352780">https://doi.org/10.1109/cama57522.2023.10352780</a>
  bibtex: '@inproceedings{Lange_Hilleringmann_Hedayat_Kuhn_Förstner_2023, place={Genoa,
    Italy }, title={Characterization of Various Environmental Influences on the Inductive
    Localization}, DOI={<a href="https://doi.org/10.1109/cama57522.2023.10352780">10.1109/cama57522.2023.10352780</a>},
    booktitle={2023 IEEE Conference on Antenna Measurements and Applications (CAMA)},
    publisher={IEEE}, author={Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian
    and Kuhn, Harald and Förstner, Jens}, year={2023} }'
  chicago: 'Lange, Sven, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, and
    Jens Förstner. “Characterization of Various Environmental Influences on the Inductive
    Localization.” In <i>2023 IEEE Conference on Antenna Measurements and Applications
    (CAMA)</i>. Genoa, Italy : IEEE, 2023. <a href="https://doi.org/10.1109/cama57522.2023.10352780">https://doi.org/10.1109/cama57522.2023.10352780</a>.'
  ieee: 'S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, and J. Förstner, “Characterization
    of Various Environmental Influences on the Inductive Localization,” presented
    at the 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa,
    Italy , 2023, doi: <a href="https://doi.org/10.1109/cama57522.2023.10352780">10.1109/cama57522.2023.10352780</a>.'
  mla: Lange, Sven, et al. “Characterization of Various Environmental Influences on
    the Inductive Localization.” <i>2023 IEEE Conference on Antenna Measurements and
    Applications (CAMA)</i>, IEEE, 2023, doi:<a href="https://doi.org/10.1109/cama57522.2023.10352780">10.1109/cama57522.2023.10352780</a>.
  short: 'S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE
    Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy
    , 2023.'
conference:
  end_date: 2023-11-17
  location: 'Genoa, Italy '
  name: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA)
  start_date: 2023-11-15
date_created: 2023-12-20T08:36:58Z
date_updated: 2024-11-30T19:31:57Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
doi: 10.1109/cama57522.2023.10352780
keyword:
- Planar coils
- inductive locating
- magnetic fields
- environmental influences
- eddy currents
- tet_topic_hf
- tet_enas
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/10352780
place: 'Genoa, Italy '
publication: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA)
publication_identifier:
  eisbn:
  - 979-8-3503-2304-7
publication_status: published
publisher: IEEE
status: public
title: Characterization of Various Environmental Influences on the Inductive Localization
type: conference
user_id: '158'
year: '2023'
...
---
_id: '34140'
abstract:
- lang: eng
  text: In this paper, machine learning techniques will be used to classify different
    PCB layouts given their electromagnetic frequency spectra. These spectra result
    from a simulated near-field measurement of electric field strengths at different
    locations. Measured values consist of real and imaginary parts (amplitude and
    phase) in X, Y and Z directions. Training data was obtained in the time domain
    by varying transmission line geometries (size, distance and signaling). It was
    then transformed into the frequency domain and used as deep neural network input.
    Principal component analysis was applied to reduce the sample dimension. The results
    show that classifying different designs is possible with high accuracy based on
    synthetic data. Future work comprises measurements of real, custom-made PCB with
    varying parameters to adapt the simulation model and also test the neural network.
    Finally, the trained model could be used to give hints about the error’s cause
    when overshooting EMC limits.
author:
- first_name: Jad
  full_name: Maalouly, Jad
  last_name: Maalouly
- first_name: Dennis
  full_name: Hemker, Dennis
  last_name: Hemker
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Christian
  full_name: Rückert, Christian
  last_name: Rückert
- first_name: Ivan
  full_name: Kaufmann, Ivan
  last_name: Kaufmann
- first_name: Marcel
  full_name: Olbrich, Marcel
  last_name: Olbrich
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Harald
  full_name: Mathis, Harald
  last_name: Mathis
citation:
  ama: 'Maalouly J, Hemker D, Hedayat C, et al. AI Assisted Interference Classification
    to Improve EMC Troubleshooting in Electronic System Development. In: <i>2022 Kleinheubach
    Conference</i>. IEEE; 2022.'
  apa: Maalouly, J., Hemker, D., Hedayat, C., Rückert, C., Kaufmann, I., Olbrich,
    M., Lange, S., &#38; Mathis, H. (2022). AI Assisted Interference Classification
    to Improve EMC Troubleshooting in Electronic System Development. <i>2022 Kleinheubach
    Conference</i>. 2022 Kleinheubach Conference, Miltenberg, Germany.
  bibtex: '@inproceedings{Maalouly_Hemker_Hedayat_Rückert_Kaufmann_Olbrich_Lange_Mathis_2022,
    place={Miltenberg, Germany}, title={AI Assisted Interference Classification to
    Improve EMC Troubleshooting in Electronic System Development}, booktitle={2022
    Kleinheubach Conference}, publisher={IEEE}, author={Maalouly, Jad and Hemker,
    Dennis and Hedayat, Christian and Rückert, Christian and Kaufmann, Ivan and Olbrich,
    Marcel and Lange, Sven and Mathis, Harald}, year={2022} }'
  chicago: 'Maalouly, Jad, Dennis Hemker, Christian Hedayat, Christian Rückert, Ivan
    Kaufmann, Marcel Olbrich, Sven Lange, and Harald Mathis. “AI Assisted Interference
    Classification to Improve EMC Troubleshooting in Electronic System Development.”
    In <i>2022 Kleinheubach Conference</i>. Miltenberg, Germany: IEEE, 2022.'
  ieee: J. Maalouly <i>et al.</i>, “AI Assisted Interference Classification to Improve
    EMC Troubleshooting in Electronic System Development,” presented at the 2022 Kleinheubach
    Conference, Miltenberg, Germany, 2022.
  mla: Maalouly, Jad, et al. “AI Assisted Interference Classification to Improve EMC
    Troubleshooting in Electronic System Development.” <i>2022 Kleinheubach Conference</i>,
    IEEE, 2022.
  short: 'J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich,
    S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany,
    2022.'
conference:
  end_date: 2022-09-29
  location: Miltenberg, Germany
  name: 2022 Kleinheubach Conference
  start_date: 2022-09-27
date_created: 2022-11-24T14:21:17Z
date_updated: 2022-11-24T14:21:34Z
department:
- _id: '59'
- _id: '485'
keyword:
- emc
- pcb
- electronic system development
- machine learning
- neural network
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9954484
place: Miltenberg, Germany
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Kleinheubach Conference
publication_identifier:
  eisbn:
  - 978-3-948571-07-8
publication_status: published
publisher: IEEE
status: public
title: AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic
  System Development
type: conference
user_id: '38240'
year: '2022'
...
---
_id: '33508'
abstract:
- lang: eng
  text: In this work, methods will be evaluated to numerically calculate the passive
    electrical parameters of planar coils. These parameters can then be used to optimize
    inductive applications such as wireless power transmission. The focus here will
    be on inductive localization, which uses high-frequency magnetic fields and the
    resulting induced voltage to provide localization through the coupling parameter
    mutual inductance. To achieve localization with high accuracy and best possible
    operation (resonance, signal strength, etc.), the coil parameters need to be well
    known. For this reason, some numerical methods for the calculation of these quantities
    are presented and validated. In addition, the physical effects are thereby considered
    in more detail, allowing the localization procedure to be better optimized compared
    to simulative black-box methods. The goal should be a dedicated simulation platform
    for planar coils to be able to develop training data for neural networks and to
    test and optimize localization algorithms.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
citation:
  ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization
    of a 3D Environment for the Design of an Inductively Based Locating Method by
    Coil Couplings. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022. doi:<a
    href="https://doi.org/10.1109/ssi56489.2022.9901416">10.1109/ssi56489.2022.9901416</a>'
  apa: Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2022). Modeling
    and Characterization of a 3D Environment for the Design of an Inductively Based
    Locating Method by Coil Couplings. <i>2022 Smart Systems Integration (SSI)</i>.
    2022 Smart Systems Integration (SSI), Grenoble, France. <a href="https://doi.org/10.1109/ssi56489.2022.9901416">https://doi.org/10.1109/ssi56489.2022.9901416</a>
  bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, place={Grenoble,
    France}, title={Modeling and Characterization of a 3D Environment for the Design
    of an Inductively Based Locating Method by Coil Couplings}, DOI={<a href="https://doi.org/10.1109/ssi56489.2022.9901416">10.1109/ssi56489.2022.9901416</a>},
    booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
    Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022}
    }'
  chicago: 'Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
    “Modeling and Characterization of a 3D Environment for the Design of an Inductively
    Based Locating Method by Coil Couplings.” In <i>2022 Smart Systems Integration
    (SSI)</i>. Grenoble, France: IEEE, 2022. <a href="https://doi.org/10.1109/ssi56489.2022.9901416">https://doi.org/10.1109/ssi56489.2022.9901416</a>.'
  ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization
    of a 3D Environment for the Design of an Inductively Based Locating Method by
    Coil Couplings,” presented at the 2022 Smart Systems Integration (SSI), Grenoble,
    France, 2022, doi: <a href="https://doi.org/10.1109/ssi56489.2022.9901416">10.1109/ssi56489.2022.9901416</a>.'
  mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for
    the Design of an Inductively Based Locating Method by Coil Couplings.” <i>2022
    Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901416">10.1109/ssi56489.2022.9901416</a>.
  short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems
    Integration (SSI), IEEE, Grenoble, France, 2022.'
conference:
  end_date: 2022-04-28
  location: Grenoble, France
  name: 2022 Smart Systems Integration (SSI)
  start_date: 2022-04-27
date_created: 2022-10-04T11:26:11Z
date_updated: 2022-10-04T11:35:11Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901416
keyword:
- Simulation Environment
- Inductive Localization
- Coil Parameters
- Inductive Applications
- Near-Field
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901416
place: Grenoble, France
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_identifier:
  eisbn:
  - 978-1-6654-8849-5
publication_status: published
publisher: IEEE
status: public
title: Modeling and Characterization of a 3D Environment for the Design of an Inductively
  Based Locating Method by Coil Couplings
type: conference
user_id: '38240'
year: '2022'
...
---
_id: '33510'
abstract:
- lang: eng
  text: In the manufacture of real wood products, defects can quickly occur during
    the production process. To quickly sort out these defects, a system is needed
    that finds damage in the irregularly structured surfaces of the product. The difficulty
    in this task is that each surface is visually different and no standard defects
    can be defined. Thus, damage detection using correlation does not work, so this
    paper will test different machine learning methods. To evaluate different machine
    learning methods, a data set is needed. For this reason, the available samples
    were recorded manually using a static fixed camera. Subsequently, the images were
    divided into sub-images, which resulted in a relatively small data set. Next,
    a convolutional neural network (CNN) was constructed to classify the images. However,
    this approach did not lead to a generalized solution, so the dataset was hashed
    using the a- and pHash. These hash values were then trained with a fully supervised
    system that will later serve as a reference model, in the semi-supervised learning
    procedures. To improve the supervised model and not have to label every data point,
    semi-supervised learning methods are used in the following. For this purpose,
    the CEAL method (wrapper method) is considered in the first and then the Π-Model
    (intrinsically semi-supervised).
author:
- first_name: Tom
  full_name: Sander, Tom
  last_name: Sander
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
- first_name: Volker
  full_name: Geneiß, Volker
  last_name: Geneiß
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
citation:
  ama: 'Sander T, Lange S, Hilleringmann U, Geneiß V, Hedayat C, Kuhn H. Detection
    of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised
    Learning Methods. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022.
    doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901433">10.1109/ssi56489.2022.9901433</a>'
  apa: Sander, T., Lange, S., Hilleringmann, U., Geneiß, V., Hedayat, C., &#38; Kuhn,
    H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised
    and Semi-Supervised Learning Methods. <i>2022 Smart Systems Integration (SSI)</i>.
    2022 Smart Systems Integration (SSI), Grenoble, France. <a href="https://doi.org/10.1109/ssi56489.2022.9901433">https://doi.org/10.1109/ssi56489.2022.9901433</a>
  bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneiß_Hedayat_Kuhn_2022, place={Grenoble,
    France}, title={Detection of Defects on Irregularly Structured Surfaces using
    Supervised and Semi-Supervised Learning Methods}, DOI={<a href="https://doi.org/10.1109/ssi56489.2022.9901433">10.1109/ssi56489.2022.9901433</a>},
    booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Sander,
    Tom and Lange, Sven and Hilleringmann, Ulrich and Geneiß, Volker and Hedayat,
    Christian and Kuhn, Harald}, year={2022} }'
  chicago: 'Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneiß, Christian
    Hedayat, and Harald Kuhn. “Detection of Defects on Irregularly Structured Surfaces
    Using Supervised and Semi-Supervised Learning Methods.” In <i>2022 Smart Systems
    Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href="https://doi.org/10.1109/ssi56489.2022.9901433">https://doi.org/10.1109/ssi56489.2022.9901433</a>.'
  ieee: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, and H. Kuhn,
    “Detection of Defects on Irregularly Structured Surfaces using Supervised and
    Semi-Supervised Learning Methods,” presented at the 2022 Smart Systems Integration
    (SSI), Grenoble, France, 2022, doi: <a href="https://doi.org/10.1109/ssi56489.2022.9901433">10.1109/ssi56489.2022.9901433</a>.'
  mla: Sander, Tom, et al. “Detection of Defects on Irregularly Structured Surfaces
    Using Supervised and Semi-Supervised Learning Methods.” <i>2022 Smart Systems
    Integration (SSI)</i>, IEEE, 2022, doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901433">10.1109/ssi56489.2022.9901433</a>.
  short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in:
    2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.'
conference:
  end_date: 2022-04-28
  location: Grenoble, France
  name: 2022 Smart Systems Integration (SSI)
  start_date: 2022-04-27
date_created: 2022-10-04T11:35:55Z
date_updated: 2022-10-04T11:37:39Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901433
keyword:
- Machine Learning
- CNN
- Hashing
- semi-supervised learning
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901433
place: Grenoble, France
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Detection of Defects on Irregularly Structured Surfaces using Supervised and
  Semi-Supervised Learning Methods
type: conference
user_id: '38240'
year: '2022'
...
---
_id: '33509'
abstract:
- lang: eng
  text: In this publication a novel method for far-field prediction from magnetic
    Huygens box data based on the boundary element method (BEM) is presented. Two
    examples are considered for the validation of this method. The first example represents
    an electric dipole so that the obtained calculations can be compared to an analytical
    solution. As a second example, a printed circuit board is considered and the calculated
    far-field is compared to a fullwave simulation. In both cases, the calculations
    for different field integral equations are under comparison, and the results indicate
    that the presented method performs very well with a combined field integral equation,
    for the specified problem, when only magnetic Huygens box data is given.
author:
- first_name: Christoph
  full_name: Marschalt, Christoph
  last_name: Marschalt
- first_name: Dominik
  full_name: Schroder, Dominik
  last_name: Schroder
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  id: '20179'
  last_name: Hilleringmann
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Denis
  full_name: Sievers, Denis
  last_name: Sievers
- first_name: Jens
  full_name: Förstner, Jens
  id: '158'
  last_name: Förstner
  orcid: 0000-0001-7059-9862
citation:
  ama: 'Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic
    Huygens Box Data using the Boundary Element Method. In: <i>2022 Smart Systems
    Integration (SSI)</i>. IEEE; 2022. doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>'
  apa: Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn,
    H., Sievers, D., &#38; Förstner, J. (2022). Far-field Calculation from magnetic
    Huygens Box Data using the Boundary Element Method. <i>2022 Smart Systems Integration
    (SSI)</i>. 2022 Smart Systems Integration (SSI), Grenoble, France. <a href="https://doi.org/10.1109/ssi56489.2022.9901431">https://doi.org/10.1109/ssi56489.2022.9901431</a>
  bibtex: '@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Förstner_2022,
    place={Grenoble, France}, title={Far-field Calculation from magnetic Huygens Box
    Data using the Boundary Element Method}, DOI={<a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>},
    booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt,
    Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and
    Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Förstner, Jens}, year={2022}
    }'
  chicago: 'Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann,
    Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Förstner. “Far-Field Calculation
    from Magnetic Huygens Box Data Using the Boundary Element Method.” In <i>2022
    Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href="https://doi.org/10.1109/ssi56489.2022.9901431">https://doi.org/10.1109/ssi56489.2022.9901431</a>.'
  ieee: 'C. Marschalt <i>et al.</i>, “Far-field Calculation from magnetic Huygens
    Box Data using the Boundary Element Method,” presented at the 2022 Smart Systems
    Integration (SSI), Grenoble, France, 2022, doi: <a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>.'
  mla: Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box
    Data Using the Boundary Element Method.” <i>2022 Smart Systems Integration (SSI)</i>,
    IEEE, 2022, doi:<a href="https://doi.org/10.1109/ssi56489.2022.9901431">10.1109/ssi56489.2022.9901431</a>.
  short: 'C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn,
    D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble,
    France, 2022.'
conference:
  end_date: 2022-04-28
  location: Grenoble, France
  name: 2022 Smart Systems Integration (SSI)
  start_date: 2022-04-27
date_created: 2022-10-04T11:31:43Z
date_updated: 2024-11-30T19:32:14Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901431
keyword:
- Near-Field Scanning
- Huygens Box
- Boundary Element Method
- Method of Moments
- tet_topic_hf
- tet_enas
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901431
place: Grenoble, France
project:
- _id: '52'
  name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_identifier:
  eisbn:
  - 978-1-6654-8849-5
publication_status: published
publisher: IEEE
status: public
title: Far-field Calculation from magnetic Huygens Box Data using the Boundary Element
  Method
type: conference
user_id: '158'
year: '2022'
...
---
_id: '22480'
abstract:
- lang: eng
  text: In this publication important aspects for the implementation of inductive
    locating are explained. The miniaturized sensor platform called Sens-o-Spheres
    is used as an application of this locating method. The sensor platform is applied
    in bioreactors in order to obtain the environmental parameters, which makes a
    localization by magnetic fields necessary. Since the properties of magnetic fields
    in the localization area are very different from the wave characteristics, the
    principle of inductive localization is investigated in this publication and explained
    by using electrical equivalent circuit diagrams. Thereby, inductive localization
    uses the coupling or the mutual inductivities between coils, which is noticeable
    by an induced voltage. Therefore some properties and procedures are explained
    to extract the location of Sens-o-Spheres or other industrial sensor platforms
    from the couplings of the coils. One method calculates the location from an adapted
    ratio calculation and the other method uses neural networks and stochastic filters
    to obtain the results. In the end, these results are evaluated and compared.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Dominik
  full_name: Schröder, Dominik
  last_name: Schröder
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
citation:
  ama: 'Lange S, Schröder D, Hedayat C, Kuhn H, Hilleringmann U. Development of Methods
    for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms
    in Bioprocesses. In: <i>22nd IEEE International Conference on Industrial Technology
    (ICIT)</i>.  Valencia, Spain : IEEE; 2021. doi:<a href="https://doi.org/10.1109/icit46573.2021.9453609">10.1109/icit46573.2021.9453609</a>'
  apa: 'Lange, S., Schröder, D., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021).
    Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized
    Sensor Platforms in Bioprocesses. In <i>22nd IEEE International Conference on
    Industrial Technology (ICIT)</i>.  Valencia, Spain : IEEE. <a href="https://doi.org/10.1109/icit46573.2021.9453609">https://doi.org/10.1109/icit46573.2021.9453609</a>'
  bibtex: '@inproceedings{Lange_Schröder_Hedayat_Kuhn_Hilleringmann_2021, place={
    Valencia, Spain }, title={Development of Methods for Coil-Based Localization by
    Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses}, DOI={<a href="https://doi.org/10.1109/icit46573.2021.9453609">10.1109/icit46573.2021.9453609</a>},
    booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)},
    publisher={IEEE}, author={Lange, Sven and Schröder, Dominik and Hedayat, Christian
    and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }'
  chicago: 'Lange, Sven, Dominik Schröder, Christian Hedayat, Harald Kuhn, and Ulrich
    Hilleringmann. “Development of Methods for Coil-Based Localization by Magnetic
    Fields of Miniaturized Sensor Platforms in Bioprocesses.” In <i>22nd IEEE International
    Conference on Industrial Technology (ICIT)</i>.  Valencia, Spain : IEEE, 2021.
    <a href="https://doi.org/10.1109/icit46573.2021.9453609">https://doi.org/10.1109/icit46573.2021.9453609</a>.'
  ieee: S. Lange, D. Schröder, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Development
    of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor
    Platforms in Bioprocesses,” in <i>22nd IEEE International Conference on Industrial
    Technology (ICIT)</i>, Valencia, Spain , 2021.
  mla: Lange, Sven, et al. “Development of Methods for Coil-Based Localization by
    Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” <i>22nd IEEE
    International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a
    href="https://doi.org/10.1109/icit46573.2021.9453609">10.1109/icit46573.2021.9453609</a>.
  short: 'S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE
    International Conference on Industrial Technology (ICIT), IEEE,  Valencia, Spain
    , 2021.'
conference:
  end_date: 2021-03-12
  location: 'Valencia, Spain '
  name: 22nd IEEE International Conference on Industrial Technology (ICIT)
  start_date: 2021-03-10
date_created: 2021-06-20T23:25:54Z
date_updated: 2022-01-06T06:55:33Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/icit46573.2021.9453609
keyword:
- Location awareness
- Coils
- Couplings
- Nonuniform electric fields
- Magnetic separation
- Neural networks
- Training data
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9453609
place: ' Valencia, Spain '
project:
- _id: '52'
  name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: 22nd IEEE International Conference on Industrial Technology (ICIT)
publication_identifier:
  isbn:
  - '9781728157306'
publication_status: published
publisher: IEEE
status: public
title: Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized
  Sensor Platforms in Bioprocesses
type: conference
user_id: '38240'
year: '2021'
...
---
_id: '22481'
abstract:
- lang: eng
  text: During the industrial processing of materials for the manufacture of new products,
    surface defects can quickly occur. In order to achieve high quality without a
    long time delay, it makes sense to inspect the work pieces so that defective work
    pieces can be sorted out right at the beginning of the process. At the same time,
    the evaluation unit should come close the perception of the human eye regarding
    detection of defects in surfaces. Such defects often manifest themselves by a
    deviation of the existing structure. The only restriction should be that only
    matt surfaces should be considered here. Therefore in this work, different classification
    and image processing algorithms are applied to surface data to identify possible
    surface damages. For this purpose, the Gabor filter and the FST (Fused Structure
    and Texture) features generated with it, as well as the salience metric are used
    on the image processing side. On the classification side, however, deep neural
    networks, Convolutional Neural Networks (CNN), and autoencoders are used to make
    a decision. A distinction is also made between training using class labels and
    without. It turns out later that the salience metric are best performed by CNN.
    On the other hand, if there is no labeled training data available, a novelty classification
    can easily be achieved by using autoencoders as well as the salience metric and
    some filters.
author:
- first_name: Tom
  full_name: Sander, Tom
  last_name: Sander
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
- first_name: Volker
  full_name: Geneis, Volker
  last_name: Geneis
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Franz-Barthold
  full_name: Gockel, Franz-Barthold
  last_name: Gockel
citation:
  ama: 'Sander T, Lange S, Hilleringmann U, et al. Detection of Defects on Irregular
    Structured Surfaces by Image Processing Methods for Feature Extraction. In: <i>22nd
    IEEE International Conference on Industrial Technology (ICIT)</i>. Valencia, Spain
    : IEEE; 2021. doi:<a href="https://doi.org/10.1109/icit46573.2021.9453646">10.1109/icit46573.2021.9453646</a>'
  apa: 'Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H.,
    &#38; Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces
    by Image Processing Methods for Feature Extraction. In <i>22nd IEEE International
    Conference on Industrial Technology (ICIT)</i>. Valencia, Spain : IEEE. <a href="https://doi.org/10.1109/icit46573.2021.9453646">https://doi.org/10.1109/icit46573.2021.9453646</a>'
  bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_Gockel_2021,
    place={Valencia, Spain }, title={Detection of Defects on Irregular Structured
    Surfaces by Image Processing Methods for Feature Extraction}, DOI={<a href="https://doi.org/10.1109/icit46573.2021.9453646">10.1109/icit46573.2021.9453646</a>},
    booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)},
    publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich
    and Geneis, Volker and Hedayat, Christian and Kuhn, Harald and Gockel, Franz-Barthold},
    year={2021} }'
  chicago: 'Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian
    Hedayat, Harald Kuhn, and Franz-Barthold Gockel. “Detection of Defects on Irregular
    Structured Surfaces by Image Processing Methods for Feature Extraction.” In <i>22nd
    IEEE International Conference on Industrial Technology (ICIT)</i>. Valencia, Spain
    : IEEE, 2021. <a href="https://doi.org/10.1109/icit46573.2021.9453646">https://doi.org/10.1109/icit46573.2021.9453646</a>.'
  ieee: T. Sander <i>et al.</i>, “Detection of Defects on Irregular Structured Surfaces
    by Image Processing Methods for Feature Extraction,” in <i>22nd IEEE International
    Conference on Industrial Technology (ICIT)</i>, Valencia, Spain , 2021.
  mla: Sander, Tom, et al. “Detection of Defects on Irregular Structured Surfaces
    by Image Processing Methods for Feature Extraction.” <i>22nd IEEE International
    Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href="https://doi.org/10.1109/icit46573.2021.9453646">10.1109/icit46573.2021.9453646</a>.
  short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B.
    Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT),
    IEEE, Valencia, Spain , 2021.'
conference:
  end_date: 2021-03-12
  location: 'Valencia, Spain '
  name: 22nd IEEE International Conference on Industrial Technology (ICIT)
  start_date: 2021-03-10
date_created: 2021-06-20T23:32:11Z
date_updated: 2022-01-06T06:55:33Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/icit46573.2021.9453646
keyword:
- Image Processing
- Defect Detection
- wooden surfaces
- Machine Learning
- Neural Networks
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9453646
place: 'Valencia, Spain '
publication: 22nd IEEE International Conference on Industrial Technology (ICIT)
publication_identifier:
  isbn:
  - '9781728157306'
publication_status: published
publisher: IEEE
status: public
title: Detection of Defects on Irregular Structured Surfaces by Image Processing Methods
  for Feature Extraction
type: conference
user_id: '38240'
year: '2021'
...
---
_id: '22532'
abstract:
- lang: eng
  text: In this publication, further elements of the newly developed inductive localization
    in the near field are presented. The advantage of inductive localization is the
    usage of the magnetic fields, which have a very low influence of non-metallic
    materials in the environment and thus follows good applications in the area of
    medicine and biochemistry. This allows a precise localization of sensor platforms
    in inhomogeneous mixtures of materials, where classical methods have major problems
    with inhomogeneous dielectric conductivity or density. The calculation of the
    localization of the searched object differs from other methods such as ultrasound
    or electromagnetic waves due to the source-free propagation of the magnetic field.
    Therefore, new mathematical evaluation methods and systematic adaptations are
    necessary, which are presented in this paper in circuit analysis. For this purpose,
    the exact circuit influences of one coil and the influence of another coil are
    investigated and which resonance circuit should be selected for both coils for
    a inductive localization with optimized signal strength.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Harald
  full_name: Kuhn, Harald
  last_name: Kuhn
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
citation:
  ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of
    Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization
    in the Near Field. In: <i>2021 Smart Systems Integration (SSI)</i>. Grenoble,
    France: IEEE; 2021. doi:<a href="https://doi.org/10.1109/ssi52265.2021.9466958">10.1109/ssi52265.2021.9466958</a>'
  apa: 'Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021). Adaptation
    and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic
    Field-Based Localization in the Near Field. In <i>2021 Smart Systems Integration
    (SSI)</i>. Grenoble, France: IEEE. <a href="https://doi.org/10.1109/ssi52265.2021.9466958">https://doi.org/10.1109/ssi52265.2021.9466958</a>'
  bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, place={Grenoble,
    France}, title={Adaptation and Optimization of Planar Coils for a More Accurate
    and Far-Reaching Magnetic Field-Based Localization in the Near Field}, DOI={<a
    href="https://doi.org/10.1109/ssi52265.2021.9466958">10.1109/ssi52265.2021.9466958</a>},
    booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
    Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021}
    }'
  chicago: 'Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
    “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching
    Magnetic Field-Based Localization in the Near Field.” In <i>2021 Smart Systems
    Integration (SSI)</i>. Grenoble, France: IEEE, 2021. <a href="https://doi.org/10.1109/ssi52265.2021.9466958">https://doi.org/10.1109/ssi52265.2021.9466958</a>.'
  ieee: S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization
    of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization
    in the Near Field,” in <i>2021 Smart Systems Integration (SSI)</i>, Grenoble,
    France , 2021.
  mla: Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More
    Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.”
    <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href="https://doi.org/10.1109/ssi52265.2021.9466958">10.1109/ssi52265.2021.9466958</a>.
  short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems
    Integration (SSI), IEEE, Grenoble, France, 2021.'
conference:
  end_date: 2021-04-29
  location: 'Grenoble, France '
  name: 2021 Smart Systems Integration (SSI)
  start_date: 2021-04-27
date_created: 2021-07-05T19:31:52Z
date_updated: 2022-01-06T06:55:36Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/ssi52265.2021.9466958
keyword:
- Electrotechnical Characteristics of Real Coils
- Inductive Localization
- Resonant Circuit
- Mutual Inductance
- Near-Field
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9466958
place: Grenoble, France
publication: 2021 Smart Systems Integration (SSI)
publication_identifier:
  isbn:
  - '9781665440929'
publication_status: published
publisher: IEEE
status: public
title: Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching
  Magnetic Field-Based Localization in the Near Field
type: conference
user_id: '38240'
year: '2021'
...
---
_id: '21541'
abstract:
- lang: eng
  text: In this publication, the near-field to far-field transformation using the
    self-built near-field scanner NFS3000 is examined with regard to its geometry.
    This device allows to measure electric and magnetic fields in small distances
    to the DUT (Device under Test) with high geometric precision and high sensitivity.
    Leading to a fast examination of EMC (Electromagnetic Compatibility) problems,
    because the electromagnetic properties are better understandable and therefore
    easier to solve than e.g. measurements in a far-field chamber. In addition, it
    is possible to extrapolate the near-fields into the far-field and to determine
    the radiation pattern of antennas and emitting objects. For this purpose, this
    paper deals with the basis of this transformation, the so-called surface equivalence
    theorem. This principle is then adapted to the measurement of near-field scanners
    and implemented accordingly. Due to the non-ideal design of the near-field scanner,
    the effects on a far-field transformation are finally presented and discussed.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Dominik
  full_name: Schroder, Dominik
  last_name: Schroder
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Christian
  full_name: Hangmann, Christian
  last_name: Hangmann
- first_name: Thomas
  full_name: Otto, Thomas
  last_name: Otto
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
citation:
  ama: 'Lange S, Schroder D, Hedayat C, Hangmann C, Otto T, Hilleringmann U. Investigation
    of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field
    Transformation by the NFS3000. In: <i>2020 International Symposium on Electromagnetic
    Compatibility - EMC EUROPE</i>. IEEE; 2020. doi:<a href="https://doi.org/10.1109/emceurope48519.2020.9245697">10.1109/emceurope48519.2020.9245697</a>'
  apa: 'Lange, S., Schroder, D., Hedayat, C., Hangmann, C., Otto, T., &#38; Hilleringmann,
    U. (2020). Investigation of the Surface Equivalence Principle on a Metal Surface
    for a Near-Field to Far-Field Transformation by the NFS3000. In <i>2020 International
    Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. Rome, Italy : IEEE.
    <a href="https://doi.org/10.1109/emceurope48519.2020.9245697">https://doi.org/10.1109/emceurope48519.2020.9245697</a>'
  bibtex: '@inproceedings{Lange_Schroder_Hedayat_Hangmann_Otto_Hilleringmann_2020,
    title={Investigation of the Surface Equivalence Principle on a Metal Surface for
    a Near-Field to Far-Field Transformation by the NFS3000}, DOI={<a href="https://doi.org/10.1109/emceurope48519.2020.9245697">10.1109/emceurope48519.2020.9245697</a>},
    booktitle={2020 International Symposium on Electromagnetic Compatibility - EMC
    EUROPE}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat,
    Christian and Hangmann, Christian and Otto, Thomas and Hilleringmann, Ulrich},
    year={2020} }'
  chicago: Lange, Sven, Dominik Schroder, Christian Hedayat, Christian Hangmann, Thomas
    Otto, and Ulrich Hilleringmann. “Investigation of the Surface Equivalence Principle
    on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.”
    In <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>.
    IEEE, 2020. <a href="https://doi.org/10.1109/emceurope48519.2020.9245697">https://doi.org/10.1109/emceurope48519.2020.9245697</a>.
  ieee: S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, and U. Hilleringmann,
    “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field
    to Far-Field Transformation by the NFS3000,” in <i>2020 International Symposium
    on Electromagnetic Compatibility - EMC EUROPE</i>, Rome, Italy , 2020.
  mla: Lange, Sven, et al. “Investigation of the Surface Equivalence Principle on
    a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.”
    <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>,
    IEEE, 2020, doi:<a href="https://doi.org/10.1109/emceurope48519.2020.9245697">10.1109/emceurope48519.2020.9245697</a>.
  short: 'S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann,
    in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
    IEEE, 2020.'
conference:
  end_date: 2020-09-25
  location: 'Rome, Italy '
  name: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE
  start_date: 2020-09-23
date_created: 2021-03-18T13:43:53Z
date_updated: 2022-01-06T06:55:03Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/emceurope48519.2020.9245697
keyword:
- Near-Field Scanner
- Near-Field to Far-Field Transformation
- Directivity
- Surface Equivalence Theorem
- Huygens’ Box
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9245697
project:
- _id: '52'
  name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE
publication_identifier:
  eisbn:
  - 978-1-7281-5579-1
  isbn:
  - 978-1-7281-5580-7
  issn:
  - '2325-0364 '
publication_status: published
publisher: IEEE
related_material:
  record:
  - id: '21541'
    relation: original
    status: public
status: public
title: Investigation of the Surface Equivalence Principle on a Metal Surface for a
  Near-Field to Far-Field Transformation by the NFS3000
type: conference
user_id: '38240'
year: '2020'
...
---
_id: '21542'
abstract:
- lang: eng
  text: Using near-field (NF) scan data to predict the far-field (FF) behaviour of
    radiating electronic systems represents a novel method to accompany the whole
    RF design process. This approach involves so-called Huygens' box as an efficient
    radiation model inside an electromagnetic (EM) simulation tool and then transforms
    the scanned NF measured data into the FF. For this, the basic idea of the Huygens'box
    principle and the NF-to-FF transformation are briefly presented. The NF is measured
    on the Huygens' box around a device under test using anNF scanner, recording the
    magnitude and phase of the site-related magnetic and electric components. A comparison
    between a fullwave simulation and the measurement results shows a good similarity
    in both the NF and the simulated and transformed FF.Thus, this method is applicable
    to predict the FF behaviour of any electronic system by measuring the NF. With
    this knowledge, the RF design can be improved due to allowing a significant reduction
    of EM compatibility failure at the end of the development flow. In addition, the
    very efficient FF radiation model can be used for detailed investigations in various
    environments and the impact of such an equivalent radiation source on other electronic
    systems can be assessed.
author:
- first_name: Dominik
  full_name: Schröder, Dominik
  last_name: Schröder
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Christian
  full_name: Hangmann, Christian
  last_name: Hangmann
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
citation:
  ama: 'Schröder D, Lange S, Hangmann C, Hedayat C. Far-field prediction combining
    simulations with near-field measurements for EMI assessment of PCBs. In: <i>Tensorial
    Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i>.
    1st ed. Croyton, UK:  The Institution of Engineering and Technology (IET); 2020:315-346
    (32). doi:<a href="https://doi.org/10.1049/pbcs072e_ch14">10.1049/pbcs072e_ch14</a>'
  apa: 'Schröder, D., Lange, S., Hangmann, C., &#38; Hedayat, C. (2020). Far-field
    prediction combining simulations with near-field measurements for EMI assessment
    of PCBs. In <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity
    and EMC Analysis</i> (1st ed., pp. 315-346 (32)). Croyton, UK:  The Institution
    of Engineering and Technology (IET). <a href="https://doi.org/10.1049/pbcs072e_ch14">https://doi.org/10.1049/pbcs072e_ch14</a>'
  bibtex: '@inbook{Schröder_Lange_Hangmann_Hedayat_2020, place={Croyton, UK}, edition={1},
    title={Far-field prediction combining simulations with near-field measurements
    for EMI assessment of PCBs}, DOI={<a href="https://doi.org/10.1049/pbcs072e_ch14">10.1049/pbcs072e_ch14</a>},
    booktitle={Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity
    and EMC Analysis}, publisher={ The Institution of Engineering and Technology (IET)},
    author={Schröder, Dominik and Lange, Sven and Hangmann, Christian and Hedayat,
    Christian}, year={2020}, pages={315-346 (32)} }'
  chicago: 'Schröder, Dominik, Sven Lange, Christian Hangmann, and Christian Hedayat.
    “Far-Field Prediction Combining Simulations with near-Field Measurements for EMI
    Assessment of PCBs.” In <i>Tensorial Analysis of Networks (TAN) Modelling for
    PCB Signal Integrity and EMC Analysis</i>, 1st ed., 315-346 (32). Croyton, UK:  The
    Institution of Engineering and Technology (IET), 2020. <a href="https://doi.org/10.1049/pbcs072e_ch14">https://doi.org/10.1049/pbcs072e_ch14</a>.'
  ieee: 'D. Schröder, S. Lange, C. Hangmann, and C. Hedayat, “Far-field prediction
    combining simulations with near-field measurements for EMI assessment of PCBs,”
    in <i>Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity
    and EMC Analysis</i>, 1st ed., Croyton, UK:  The Institution of Engineering and
    Technology (IET), 2020, pp. 315-346 (32).'
  mla: Schröder, Dominik, et al. “Far-Field Prediction Combining Simulations with
    near-Field Measurements for EMI Assessment of PCBs.” <i>Tensorial Analysis of
    Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis</i>, 1st ed.,  The
    Institution of Engineering and Technology (IET), 2020, pp. 315-346 (32), doi:<a
    href="https://doi.org/10.1049/pbcs072e_ch14">10.1049/pbcs072e_ch14</a>.
  short: 'D. Schröder, S. Lange, C. Hangmann, C. Hedayat, in: Tensorial Analysis
    of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis, 1st ed.,  The
    Institution of Engineering and Technology (IET), Croyton, UK, 2020, pp. 315-346
    (32).'
date_created: 2021-03-18T13:49:49Z
date_updated: 2022-01-06T06:55:03Z
department:
- _id: '485'
doi: 10.1049/pbcs072e_ch14
edition: '1'
keyword:
- Huygens' box
- NF-to-FF transformation
- efficient FF radiation model
- FF behaviour
- EMI assessment
- PCB
- near-field measurements
- efficient radiation model
- far-field behaviour
- RF design process
- far-field prediction
- Huygens'box principle
- fullwave simulation
- electronic system radiation
- equivalent radiation source
- electromagnetic simulation tool
- near-field scan data
- EM compatibility failure reduction
language:
- iso: eng
main_file_link:
- url: https://digital-library.theiet.org/content/books/10.1049/pbcs072e_ch14
page: 315-346 (32)
place: Croyton, UK
project:
- _id: '52'
  name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity
  and EMC Analysis
publication_identifier:
  isbn:
  - '9781839530494'
  - '9781839530500'
publication_status: published
publisher: ' The Institution of Engineering and Technology (IET)'
related_material:
  record:
  - id: '21542'
    relation: other
    status: public
status: public
title: Far-field prediction combining simulations with near-field measurements for
  EMI assessment of PCBs
type: book_chapter
user_id: '38240'
year: '2020'
...
---
_id: '21524'
abstract:
- lang: eng
  text: For the measurement of process data in bioreactors, very small wireless sensors
    are currently under development to replace the conventional rod probes. The so-called
    Sens-o-Spheres measure the temperature and in future the oxygen content and the
    pH of fluids. In order to evaluate the distribution of the measured values within
    the process, it is necessary to locate the wireless sensors. Because of the small
    size of the sphere (diameter 8 mm), inhomogeneous ambient media and the size of
    the reactor (less than 2 m), an inductive locating by magnetic fields with a frequency
    of f = 13.56 MHz is necessary. Since the behaviour of the magnetic field is very
    different from that of the electromagnetic wave, new locating methods are required,
    which are presented in this paper.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
- first_name: Dominik
  full_name: Schröder, Dominik
  last_name: Schröder
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Thomas
  full_name: Otto, Thomas
  last_name: Otto
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
citation:
  ama: 'Lange S, Schröder D, Hedayat C, Otto T, Hilleringmann U. Inductive Locating
    Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics.
    In: <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>.
    ; 2019. doi:<a href="https://doi.org/10.1109/newcas44328.2019.8961227">10.1109/newcas44328.2019.8961227</a>'
  apa: Lange, S., Schröder, D., Hedayat, C., Otto, T., &#38; Hilleringmann, U. (2019).
    Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous
    Dielectrics. In <i>2019 17th IEEE International New Circuits and Systems Conference
    (NEWCAS)</i>. Munich, Germany. <a href="https://doi.org/10.1109/newcas44328.2019.8961227">https://doi.org/10.1109/newcas44328.2019.8961227</a>
  bibtex: '@inproceedings{Lange_Schröder_Hedayat_Otto_Hilleringmann_2019, title={Inductive
    Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics},
    DOI={<a href="https://doi.org/10.1109/newcas44328.2019.8961227">10.1109/newcas44328.2019.8961227</a>},
    booktitle={2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)},
    author={Lange, Sven and Schröder, Dominik and Hedayat, Christian and Otto, Thomas
    and Hilleringmann, Ulrich}, year={2019} }'
  chicago: Lange, Sven, Dominik Schröder, Christian Hedayat, Thomas Otto, and Ulrich
    Hilleringmann. “Inductive Locating Method to Locate Miniaturized Wireless Sensors
    within Inhomogeneous Dielectrics.” In <i>2019 17th IEEE International New Circuits
    and Systems Conference (NEWCAS)</i>, 2019. <a href="https://doi.org/10.1109/newcas44328.2019.8961227">https://doi.org/10.1109/newcas44328.2019.8961227</a>.
  ieee: S. Lange, D. Schröder, C. Hedayat, T. Otto, and U. Hilleringmann, “Inductive
    Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics,”
    in <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>,
    Munich, Germany, 2019.
  mla: Lange, Sven, et al. “Inductive Locating Method to Locate Miniaturized Wireless
    Sensors within Inhomogeneous Dielectrics.” <i>2019 17th IEEE International New
    Circuits and Systems Conference (NEWCAS)</i>, 2019, doi:<a href="https://doi.org/10.1109/newcas44328.2019.8961227">10.1109/newcas44328.2019.8961227</a>.
  short: 'S. Lange, D. Schröder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th
    IEEE International New Circuits and Systems Conference (NEWCAS), 2019.'
conference:
  end_date: 2019-06-26
  location: Munich, Germany
  name: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)
  start_date: 2019-06-23
date_created: 2021-03-17T09:52:41Z
date_updated: 2022-01-06T06:55:03Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/newcas44328.2019.8961227
keyword:
- oxygen content
- inhomogeneous ambient media
- magnetic field
- inductive locating method
- miniaturized wireless sensors
- inhomogeneous dielectrics
- conventional rod probes
- Sens-o-Spheres measure
- frequency 13.56 MHz
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/8961227
project:
- _id: '52'
  name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)
publication_identifier:
  isbn:
  - '9781728110318'
publication_status: published
related_material:
  record:
  - id: '21524'
    relation: earlier_version
    status: public
status: public
title: Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous
  Dielectrics
type: conference
user_id: '38240'
year: '2019'
...
---
_id: '21462'
abstract:
- lang: eng
  text: This paper presents a new methodology by using a multiple coil array for energy
    transmission. The complex current strengths of the transmitting coil array are
    calculated by having the knowledge about of the mutual inductances and the symmetries
    of the transmitting coil array, so that its resulting magnetic field mainly penetrates
    only the receiving coil and is strongly attenuated outside. This method is used
    for an optimized wireless energy transmission but can also be implemented for
    other inductive applications.
author:
- first_name: Sven
  full_name: Lange, Sven
  id: '38240'
  last_name: Lange
  orcid: '0009-0007-9150-2266 '
- first_name: Maik-Julian
  full_name: Büker, Maik-Julian
  last_name: Büker
- first_name: Denis
  full_name: Sievers, Denis
  last_name: Sievers
- first_name: Christian
  full_name: Hedayat, Christian
  last_name: Hedayat
- first_name: Jens
  full_name: Förstner, Jens
  id: '158'
  last_name: Förstner
  orcid: 0000-0001-7059-9862
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  last_name: Hilleringmann
- first_name: Thomas
  full_name: Otto, Thomas
  last_name: Otto
citation:
  ama: 'Lange S, Büker M-J, Sievers D, et al. Method of superposing a multiple driven
    magnetic field to minimize stray fields around the receiver for inductive wireless
    power transmission. In: <i>Smart Systems Integration; 13th International Conference
    and Exhibition on Integration Issues of Miniaturized Systems</i>. VDE VERLAG GMBH;
    2019:1-4.'
  apa: Lange, S., Büker, M.-J., Sievers, D., Hedayat, C., Förstner, J., Hilleringmann,
    U., &#38; Otto, T. (2019). Method of superposing a multiple driven magnetic field
    to minimize stray fields around the receiver for inductive wireless power transmission.
    <i>Smart Systems Integration; 13th International Conference and Exhibition on
    Integration Issues of Miniaturized Systems</i>, 1–4.
  bibtex: '@inproceedings{Lange_Büker_Sievers_Hedayat_Förstner_Hilleringmann_Otto_2019,
    place={Berlin · Offenbach}, title={Method of superposing a multiple driven magnetic
    field to minimize stray fields around the receiver for inductive wireless power
    transmission}, booktitle={Smart Systems Integration; 13th International Conference
    and Exhibition on Integration Issues of Miniaturized Systems}, publisher={VDE
    VERLAG GMBH}, author={Lange, Sven and Büker, Maik-Julian and Sievers, Denis and
    Hedayat, Christian and Förstner, Jens and Hilleringmann, Ulrich and Otto, Thomas},
    year={2019}, pages={1–4} }'
  chicago: 'Lange, Sven, Maik-Julian Büker, Denis Sievers, Christian Hedayat, Jens
    Förstner, Ulrich Hilleringmann, and Thomas Otto. “Method of Superposing a Multiple
    Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive
    Wireless Power Transmission.” In <i>Smart Systems Integration; 13th International
    Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.
    Berlin · Offenbach: VDE VERLAG GMBH, 2019.'
  ieee: S. Lange <i>et al.</i>, “Method of superposing a multiple driven magnetic
    field to minimize stray fields around the receiver for inductive wireless power
    transmission,” in <i>Smart Systems Integration; 13th International Conference
    and Exhibition on Integration Issues of Miniaturized Systems</i>, Barcelona, Spain
    , 2019, pp. 1–4.
  mla: Lange, Sven, et al. “Method of Superposing a Multiple Driven Magnetic Field
    to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.”
    <i>Smart Systems Integration; 13th International Conference and Exhibition on
    Integration Issues of Miniaturized Systems</i>, VDE VERLAG GMBH, 2019, pp. 1–4.
  short: 'S. Lange, M.-J. Büker, D. Sievers, C. Hedayat, J. Förstner, U. Hilleringmann,
    T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition
    on Integration Issues of Miniaturized Systems, VDE VERLAG GMBH, Berlin · Offenbach,
    2019, pp. 1–4.'
conference:
  end_date: 2019-04-11
  location: 'Barcelona, Spain '
  name: Smart Systems Integration; 13th International Conference and Exhibition on
    Integration Issues of Miniaturized Systems
  start_date: 2019-04-10
date_created: 2021-03-12T09:46:55Z
date_updated: 2024-11-30T19:32:36Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
keyword:
- tet_enas
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/8727831
page: 1-4
place: Berlin · Offenbach
publication: Smart Systems Integration; 13th International Conference and Exhibition
  on Integration Issues of Miniaturized Systems
publication_identifier:
  isbn:
  - 978-3-8007-4919-5
publication_status: published
publisher: VDE VERLAG GMBH
related_material:
  record:
  - id: '9265'
    relation: other
    status: deleted
status: public
title: Method of superposing a multiple driven magnetic field to minimize stray fields
  around the receiver for inductive wireless power transmission
type: conference
user_id: '158'
year: '2019'
...
