@inproceedings{51119,
  author       = {{Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}},
  location     = {{Jeju, Korea}},
  title        = {{{Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}}},
  year         = {{2023}},
}

@inproceedings{30371,
  abstract     = {{To achieve optimum bond results at ultrasonic bonding thick copper wire on sensitive components is quite challenging.
Bearing in mind that high normal force and ultrasonic power are needed for bond quality but as well increase stress and finally failure risk of the substrate, methods should be found to achieve high bond quality even at lower bond parameters. Therefore, bond experiments with different bond tool grove geometries have been conducted for copper and aluminum wire on direct copper bonded (DCB) substrates to investigate the impact of geometric parameters on bond formation and bond quality. The wire material depending impact of geometry changes on the bond formation and deformation was quantified. Additionally, a bonding parameter design of experiments (DOE) has been conducted for the reference and the most promising groove geometry. Higher shear values were achieved at reduced vertical tool displacement for most bonding parameter combinations, compared to the reference tool. This behavior allows for reducing ultrasonic power to obtain equal shear values; consequently, mechanical stresses in the interface decrease. This could potentially reduce the risk of chip damage and thus yield loss.}},
  author       = {{Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}},
  isbn         = {{ISBN 978-3-8007-5757-2 }},
  location     = {{Berlin}},
  pages        = {{138--143}},
  publisher    = {{VDE VERLAG GMBH}},
  title        = {{{Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}}},
  year         = {{2022}},
}

@inproceedings{15244,
  author       = {{Hagedorn, Oliver Ernst Caspar and Pielsticker, Daniel and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{2. VDI-Fachtagung Schwingungen 2019}},
  isbn         = {{978-3-18-092366-6}},
  publisher    = {{VDI Verlag GmbH · Düsseldorf 2019}},
  title        = {{{Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen}}},
  year         = {{2019}},
}