---
_id: '51119'
author:
- first_name: Claus
  full_name: Scheidemann, Claus
  id: '38259'
  last_name: Scheidemann
- first_name: Oliver Ernst Caspar
  full_name: Hagedorn, Oliver Ernst Caspar
  id: '53321'
  last_name: Hagedorn
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation
    of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process.
    In: ; 2023.'
  apa: Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., &#38; Sextro, W. (2023). <i>Experimental
    Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding
    Process</i>. International Conference on Functional Materials &#38; Devices 2023
    (ICFMD 2023), Jeju, Korea.
  bibtex: '@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental
    Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding
    Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel,
    Tobias and Sextro, Walter}, year={2023} }'
  chicago: Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter
    Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in
    the Ultrasonic Wire Bonding Process,” 2023.
  ieee: C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental
    Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding
    Process,” presented at the International Conference on Functional Materials &#38;
    Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
  mla: Scheidemann, Claus, et al. <i>Experimental Investigation of Bond Formation
    and Wire Deformation in the Ultrasonic Wire Bonding Process</i>. 2023.
  short: 'C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.'
conference:
  end_date: 2023-11-03
  location: Jeju, Korea
  name: International Conference on Functional Materials & Devices 2023 (ICFMD 2023)
  start_date: 2023-10-31
date_created: 2024-02-01T16:03:41Z
date_updated: 2024-02-01T16:04:33Z
department:
- _id: '151'
language:
- iso: eng
status: public
title: Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic
  Wire Bonding Process
type: conference_abstract
user_id: '38259'
year: '2023'
...
---
_id: '30371'
abstract:
- lang: eng
  text: "To achieve optimum bond results at ultrasonic bonding thick copper wire on
    sensitive components is quite challenging.\r\nBearing in mind that high normal
    force and ultrasonic power are needed for bond quality but as well increase stress
    and finally failure risk of the substrate, methods should be found to achieve
    high bond quality even at lower bond parameters. Therefore, bond experiments with
    different bond tool grove geometries have been conducted for copper and aluminum
    wire on direct copper bonded (DCB) substrates to investigate the impact of geometric
    parameters on bond formation and bond quality. The wire material depending impact
    of geometry changes on the bond formation and deformation was quantified. Additionally,
    a bonding parameter design of experiments (DOE) has been conducted for the reference
    and the most promising groove geometry. Higher shear values were achieved at reduced
    vertical tool displacement for most bonding parameter combinations, compared to
    the reference tool. This behavior allows for reducing ultrasonic power to obtain
    equal shear values; consequently, mechanical stresses in the interface decrease.
    This could potentially reduce the risk of chip damage and thus yield loss."
author:
- first_name: Oliver Ernst Caspar
  full_name: Hagedorn, Oliver Ernst Caspar
  id: '53321'
  last_name: Hagedorn
- first_name: Marian
  full_name: Broll, Marian
  last_name: Broll
- first_name: Olaf
  full_name: Kirsch, Olaf
  last_name: Kirsch
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation
    of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic
    Thick Wire Bonding. In: <i>CIPS 2022 - 12th International Conference on Integrated
    Power Electronics Systems</i>. VDE VERLAG GMBH; 2022:138-143.'
  apa: Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., &#38; Sextro, W. (2022).
    Experimental Investigation of the Influence of different Bond Tool Grooves on
    the Bond Quality for Ultrasonic Thick Wire Bonding. <i>CIPS 2022 - 12th International
    Conference on Integrated Power Electronics Systems</i>, 138–143.
  bibtex: '@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin},
    title={Experimental Investigation of the Influence of different Bond Tool Grooves
    on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 -
    12th International Conference on Integrated Power Electronics Systems}, publisher={VDE
    VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch,
    Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }'
  chicago: 'Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel,
    and Walter Sextro. “Experimental Investigation of the Influence of Different Bond
    Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In <i>CIPS
    2022 - 12th International Conference on Integrated Power Electronics Systems</i>,
    138–43. Berlin: VDE VERLAG GMBH, 2022.'
  ieee: O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental
    Investigation of the Influence of different Bond Tool Grooves on the Bond Quality
    for Ultrasonic Thick Wire Bonding,” in <i>CIPS 2022 - 12th International Conference
    on Integrated Power Electronics Systems</i>, Berlin, 2022, pp. 138–143.
  mla: Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence
    of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.”
    <i>CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems</i>,
    VDE VERLAG GMBH, 2022, pp. 138–43.
  short: 'O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022
    - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG
    GMBH, Berlin, 2022, pp. 138–143.'
conference:
  end_date: 2022.03.17
  location: Berlin
  name: CIPS 2022 - 12th International Conference on Integrated Power Electronics
    Systems
  start_date: 2022.03.15
date_created: 2022-03-17T15:00:06Z
date_updated: 2023-09-21T14:22:17Z
department:
- _id: '151'
language:
- iso: eng
page: 138-143
place: Berlin
publication: CIPS 2022 - 12th International Conference on Integrated Power Electronics
  Systems
publication_identifier:
  isbn:
  - 'ISBN 978-3-8007-5757-2 '
publisher: VDE VERLAG GMBH
quality_controlled: '1'
status: public
title: Experimental Investigation of the Influence of different Bond Tool Grooves
  on the Bond Quality for Ultrasonic Thick Wire Bonding
type: conference
user_id: '210'
year: '2022'
...
---
_id: '15244'
author:
- first_name: Oliver Ernst Caspar
  full_name: Hagedorn, Oliver Ernst Caspar
  id: '53321'
  last_name: Hagedorn
- first_name: Daniel
  full_name: Pielsticker, Daniel
  id: '76966'
  last_name: Pielsticker
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen
    mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: <i>2. VDI-Fachtagung
    Schwingungen 2019</i>. VDI Verlag GmbH · Düsseldorf 2019; 2019.'
  apa: Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., &#38; Sextro, W. (2019). Messung
    hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten
    Umgebungen. In <i>2. VDI-Fachtagung Schwingungen 2019</i>. VDI Verlag GmbH · Düsseldorf
    2019.
  bibtex: '@inproceedings{Hagedorn_Pielsticker_Hemsel_Sextro_2019, title={Messung
    hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten
    Umgebungen}, booktitle={2. VDI-Fachtagung Schwingungen 2019}, publisher={VDI Verlag
    GmbH · Düsseldorf 2019}, author={Hagedorn, Oliver Ernst Caspar and Pielsticker,
    Daniel and Hemsel, Tobias and Sextro, Walter}, year={2019} }'
  chicago: Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter
    Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie
    in räumlich eingeschränkten Umgebungen.” In <i>2. VDI-Fachtagung Schwingungen
    2019</i>. VDI Verlag GmbH · Düsseldorf 2019, 2019.
  ieee: O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter
    In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,”
    in <i>2. VDI-Fachtagung Schwingungen 2019</i>, 2019.
  mla: Hagedorn, Oliver Ernst Caspar, et al. “Messung hochfrequenter In-Plane-Schwingungen
    mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” <i>2. VDI-Fachtagung
    Schwingungen 2019</i>, VDI Verlag GmbH · Düsseldorf 2019, 2019.
  short: 'O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung
    Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.'
date_created: 2019-12-04T11:59:52Z
date_updated: 2022-01-06T06:52:19Z
department:
- _id: '151'
language:
- iso: ger
publication: 2. VDI-Fachtagung Schwingungen 2019
publication_identifier:
  isbn:
  - 978-3-18-092366-6
publisher: VDI Verlag GmbH · Düsseldorf 2019
status: public
title: Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich
  eingeschränkten Umgebungen
type: conference
user_id: '53321'
year: '2019'
...