@article{1771,
  abstract     = {{Die (Wieder-)Einführung einer Vermögensteuer ist in den vergangenen Jahren erneut in den Fokus der politischen Diskussion gerückt. Der vorliegende Beitrag vermittelt einen Eindruck von den Belastungswirkungen, die aus der Umsetzung von aktuell vorliegenden Besteuerungskonzepten resultieren würden. Auf der Basis von realen Jahresabschlussdaten wird eine mehrperiodige Veranlagungssimulation durchgeführt, die insbesondere ermöglicht, den zu erwartenden Eigenkapitalverzehr sowie den Anstieg der Steuerbelastung für die betrachtete Stichprobe zu quantifizieren. Von besonderem Interesse sind hierbei Unternehmen, deren laufende Erträge nicht ausreichen, um die Belastungen durch die Vermögensteuer zu tragen und damit einem Substanzverzehr ausgesetzt sind. Es zeigt sich, dass etwa die Hälfte der Unternehmen im Untersuchungszeitraum von sechs Jahren in mindestens einem Jahr einen Substanzverzehr erfährt. Der Vermögensteuer kommt somit keinesfalls der vielfach postulierte Charakter einer eher mäßig belastenden und im Wesentlichen substanzverschonenden Steuer zu. Zusatzbelastungen von knapp 100 bis zu 300 % der Ertragsteuerlast sind keine Seltenheit und veranschaulichen das Gefährdungspotenzial dieser Steuer für den Wirtschaftsstandort Deutschland.}},
  author       = {{Hoppe, Thomas and Maiterth, Ralf and Sureth-Sloane, Caren}},
  issn         = {{0341-2687}},
  journal      = {{Schmalenbachs Zeitschrift für betriebswirtschaftliche Forschung}},
  keywords     = {{Steuerbelastung, Substanzbesteuerung, Ungleiche Vermögensverteilung, Veranlagungssimulation, Vermögensteuer}},
  number       = {{1}},
  pages        = {{3--45}},
  publisher    = {{Springer Nature}},
  title        = {{{Eigenkapitalverzehr und Substanzbesteuerung deutscher Unternehmen durch eine Vermögensteuer – eine empirische Analyse}}},
  doi          = {{10.1007/s41471-016-0005-x}},
  volume       = {{68}},
  year         = {{2016}},
}

@inproceedings{191,
  abstract     = {{One purpose of requirement refinement is that higher-level requirements have to be translated to something usable by developers. Since customer requirements are often written in natural language by end users, they lack precision, completeness and consistency. Although user stories are often used in the requirement elicitation process in order to describe the possibilities how to interact with the software, there is always something unspoken. Here, we present techniques how to automatically refine vague software descriptions. Thus, we can bridge the gap by first revising natural language utterances from higher-level to more detailed customer requirements, before functionality matters. We therefore focus on the resolution of semantically incomplete user-generated sentences (i.e. non-instantiated arguments of predicates) and provide ontology-based gap-filling suggestions how to complete unverbalized information in the user’s demand.}},
  author       = {{Geierhos, Michaela and Bäumer, Frederik Simon}},
  booktitle    = {{Proceedings of the 21st International Conference on Applications of Natural Language to Information Systems (NLDB)}},
  editor       = {{Métais, Elisabeth  and Meziane, Farid  and Saraee, Mohamad  and Sugumaran, Vijayan  and Vadera, Sunil }},
  isbn         = {{978-3-319-41753-0}},
  keywords     = {{Requirement refinement, Concept expansion, Ontology-based instantiation of predicate-argument structure}},
  location     = {{Salford, UK}},
  pages        = {{37--47}},
  publisher    = {{Springer}},
  title        = {{{How to Complete Customer Requirements: Using Concept Expansion for Requirement Refinement}}},
  doi          = {{10.1007/978-3-319-41754-7_4}},
  volume       = {{9612}},
  year         = {{2016}},
}

@article{23754,
  author       = {{Fechner, Sabine and Dettweiler, Yvonne and Sieve, Bernhard and Ulrich, Nina and Böhm, Dominic and Schanze, Sascha}},
  issn         = {{0944-5846}},
  journal      = {{CHEMKON}},
  number       = {{2}},
  pages        = {{71--78}},
  title        = {{{Egg-races als gesellschaftsfähige naturwissenschaftliche Wettbewerbe für jedermann?}}},
  doi          = {{10.1002/ckon.201610270}},
  volume       = {{23}},
  year         = {{2016}},
}

@article{5762,
  abstract     = {{This paper introduces the problem of communication pattern adaption for a distributed self-adjusting binary search tree. We propose a simple local algorithm that is closely related to the over thirty-year-old idea of splay trees and evaluate its adaption performance in the distributed scenario if different communication patterns are provided. 
To do so, the process of self-adjustment is modeled similarly to a basic network creation game in which the nodes want to communicate with only a certain subset of all nodes. 
We show that, in general, the game (i.e., the process of local adjustments) does not converge, and that convergence is related to certain structures of the communication interests, which we call conflicts. 
We classify conflicts and show that for two communication scenarios in which convergence is guaranteed, the self-adjusting tree performs well. 
Furthermore, we investigate the different classes of conflicts separately and show that, for a certain class of conflicts, the performance of the tree network is asymptotically as good as the performance for converging instances.
However, for the other conflict classes, a distributed self-adjusting binary search tree adapts poorly.}},
  author       = {{Strothmann, Thim Frederik}},
  issn         = {{1526-1719}},
  journal      = {{Journal of Graph Algorithms and Applications}},
  number       = {{1}},
  pages        = {{79--100}},
  publisher    = {{Journal of Graph Algorithms and Applications}},
  title        = {{{The Impact of Communication Patterns on Distributed Self-Adjusting Binary Search Tree}}},
  doi          = {{10.7155/jgaa.00385}},
  volume       = {{20}},
  year         = {{2016}},
}

@inbook{8565,
  author       = {{Liebendörfer, Michael and Göller, Robin}},
  booktitle    = {{Hanse-Kolloquium zur Hochschuldidaktik der Mathematik 2014 Beiträge zum gleichnamigen Symposium am 7. & 8. November 2014 an der Westfälischen Wilhelms-Universität Münster}},
  editor       = {{Paravicini, Walther and Schnieder, Jörn}},
  isbn         = {{978-3-942197-99-1}},
  pages        = {{119--141}},
  publisher    = {{WTM-Verlag für wissenschaftliche Texte und Medien}},
  title        = {{{Abschreiben - ein Problem in mathematischen Lehrveranstaltungen?}}},
  year         = {{2016}},
}

@inproceedings{9955,
  abstract     = {{Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.}},
  author       = {{Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}},
  booktitle    = {{IEEE 66th Electronic Components and Technology Conference}},
  keywords     = {{finite element simulation, wire bonding, tool geometry}},
  pages        = {{2103--2110}},
  title        = {{{Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}}},
  doi          = {{10.1109/ECTC.2016.234}},
  year         = {{2016}},
}

@inproceedings{9959,
  abstract     = {{Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties.}},
  author       = {{Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}},
  booktitle    = {{IEEE 66th Electronic Components and Technology Conference}},
  keywords     = {{Ultrasonic copper wire bonding, Al-oxide, Cuoxide, oxide-free, roughness, morphology}},
  pages        = {{2111--2118}},
  title        = {{{Effect of different oxide layers on the ultrasonic copper wire bond process}}},
  doi          = {{10.1109/ECTC.2016.91}},
  year         = {{2016}},
}

@inproceedings{9960,
  abstract     = {{Ultrasonic wire bonding is a common technology for connecting electrodes of electronic components like power modules. Nowadays, bond connections are often made of copper instead of aluminum due to its thermal and mechanical assets. One of the main cost factors in the wire bonding process is the acquisition cost of consumables such as bonding tools. For copper wire bonding tool lifetime is much lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge bonding tools that was validated by observing wear patterns with a scanning electron microscope. The wear coefficient is determined in long-term bonding tests. The application of Fleischer´s wear approach incorporating frictional power to a finite element simulation of the bonding processes is used to shift element nodes depending on the rising frictional power for finite element modeling. The presented simulation method can be used to take tool wear into consideration for creating tools with increased lifetime. This enables the production of reliable bond connections using heavy as well as thin wire of any material. The paper discusses the predominant influences of wear on the main tool functions and their changes over tool life. Furthermore, the influence of the tool groove angle on the tool wear was investigated. One of the main results is that the wear is largest during the last phase of each bonding process, when the contact area between tool and wire is largest.}},
  author       = {{Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}},
  booktitle    = {{IEEE CPMT Symposium Japan, 2016}},
  title        = {{{Micro Wear Modeling in Copper Wire Wedge Bonding}}},
  year         = {{2016}},
}

@inproceedings{9961,
  abstract     = {{Redundancy is a common approach to improve system reliability, availability and safety in technical systems. It is achieved by adding functionally equivalent elements that enable the system to remain operational even though one or more of those elements fail. This paper begins with an overview on the various terminologies and methods for redundancy concepts that can be modeled sufficiently using established reliability analysis methods. However, these approaches yield very complex system models, which limits their applicability. In current research, Bayesian Networks (BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used for reliability analysis because of their benefits in modeling complex systems and in representing multi-state variables. However, these approaches lack appropriate methods to model all commonly used redundancy concepts. To overcome this limitation, three different modeling approaches based on BNs and DBNs are described in this paper. Addressing those approaches, the benefits and limitations of BNs and DBNs for modeling reliability of redundant technical systems are discussed and evaluated.}},
  author       = {{Kaul, Thorben and Meyer, Tobias and Sextro, Walter}},
  booktitle    = {{Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016}},
  title        = {{{Modeling of Complex Redundancy in Technical Systems with Bayesian Networks}}},
  year         = {{2016}},
}

@inproceedings{9964,
  abstract     = {{This paper presents a benchmark data set for condition monitoring of rolling bearings in combination with an extensive description of the corresponding bearing damage, the data set generation by experiments and results of datadriven classifications used as a diagnostic method. The diagnostic method uses the motor current signal of an electromechanical drive system for bearing diagnostic. The advantage of this approach in general is that no additional sensors are required, as current measurements can be performed in existing frequency inverters. This will help to reduce the cost of future condition monitoring systems. A particular novelty of the present approach is the monitoring of damage in external bearings which are installed in the drive system but outside the electric motor. Nevertheless, the motor current signal is used as input for the detection of the damage. Moreover, a wide distribution of bearing damage is considered for the benchmark data set. The results of the classifications show that the motor current signal can be used to identify and classify bearing damage within the drive system. However, the classification accuracy is still low compared to classifications based on vibration signals. Further, dependency on properties of those bearing damage that were used for the generation of training data are observed, because training with data of artificially generated and real bearing damages lead to different accuracies. Altogether a verified and systematically generated data set is presented and published online for further research}},
  author       = {{Lessmeier, Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}},
  booktitle    = {{European Conference of the Prognostics and Health Management Society}},
  title        = {{{Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification}}},
  year         = {{2016}},
}

@inproceedings{9966,
  abstract     = {{Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented.}},
  author       = {{Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}},
  booktitle    = {{IEEE 66th Electronic Components and Technology Conference}},
  keywords     = {{Self-optimization, adaptive system, bond process, copper wire}},
  pages        = {{622--628}},
  title        = {{{Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}}},
  doi          = {{10.1109/ECTC.2016.215}},
  year         = {{2016}},
}

@inproceedings{9968,
  abstract     = {{To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.}},
  author       = {{Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}},
  booktitle    = {{Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}},
  keywords     = {{the Ultrasonic Wire Bonding Process}},
  pages        = {{251--254}},
  title        = {{{Validated Simulation of the Ultrasonic Wire Bonding Process}}},
  year         = {{2016}},
}

@inproceedings{4374,
  author       = {{Zimmermann, Steffen and Herrmann, Philipp and Kundisch, Dennis and Nault, Barrie}},
  booktitle    = {{Workshop on IS Design and Economic Behavior (ISDEB)}},
  location     = {{Ilmenau, Germany}},
  title        = {{{How do different Sources of the Variance of Online Consumer Ratings matter?}}},
  year         = {{2016}},
}

@article{6551,
  author       = {{Bause, Fabian and Rautenberg, Jens and Feldmann, Nadine and Webersen, Manuel and Claes, Leander and Gravenkamp, Hauke and Henning, Bernd}},
  journal      = {{Measurement Science and Technology}},
  keywords     = {{material characterization, material parameters, acoustic waveguide, daming, ultrasonic transducer}},
  number       = {{10}},
  title        = {{{Ultrasonic transmission measurements in the characterization of viscoelasticity utilizing polymeric waveguides}}},
  doi          = {{10.1088/0957-0233/27/10/105601}},
  volume       = {{27}},
  year         = {{2016}},
}

@inproceedings{158,
  abstract     = {{While requirements focus on how the user interacts with the system, user stories concentrate on the purpose of software features. But in practice, functional requirements are also described in user stories. For this reason, requirements clarification is needed, especially when they are written in natural language and do not stick to any templates (e.g., "as an X, I want Y so that Z ..."). However, there is a lot of implicit knowledge that is not expressed in words. As a result, natural language requirements descriptions may suffer from incompleteness. Existing approaches try to formalize natural language or focus only on entirely missing and not on deficient requirements. In this paper, we therefore present an approach to detect knowledge gaps in user-generated software requirements for interactive requirement clarification: We provide tailored suggestions to the users in order to get more precise descriptions. For this purpose, we identify not fully instantiated predicate argument structures in requirements written in natural language and use context information to realize what was meant by the user.}},
  author       = {{Bäumer, Frederik Simon and Geierhos, Michaela}},
  booktitle    = {{Proceedings of the 22nd International Conference on Information and Software Technologies (ICIST)}},
  editor       = {{Dregvaite, Giedre  and Damasevicius, Robertas }},
  isbn         = {{978-3-319-46253-0}},
  keywords     = {{Natural language requirements clarification, Syntactically incomplete requirements, Compensatory user stories}},
  location     = {{Druskininkai, Lithuania}},
  pages        = {{549--558}},
  publisher    = {{Springer}},
  title        = {{{Running out of Words: How Similar User Stories Can Help to Elaborate Individual Natural Language Requirement Descriptions}}},
  doi          = {{10.1007/978-3-319-46254-7_44}},
  volume       = {{639}},
  year         = {{2016}},
}

@article{29250,
  author       = {{Steinhardt, Isabel}},
  journal      = {{Zeitschrift für Hochschulentwicklung}},
  number       = {{1}},
  pages        = {{225--237}},
  title        = {{{Habitussensibilisierung durch Videoanalysen von Lehramtsstudierenden}}},
  doi          = {{10.3217/zfhe-11-01/13}},
  volume       = {{11}},
  year         = {{2016}},
}

@inbook{31487,
  author       = {{Scharlau, Ingrid and Keding, Gesche}},
  booktitle    = {{Pädagogische Hochschulentwicklung: von der Programmatik zur Implementierung}},
  editor       = {{Brahm, Taiga and Jenert, Tobias and Euler, Dieter}},
  isbn         = {{9783658120665}},
  pages        = {{39 -- 55}},
  publisher    = {{Springer VS Verlag}},
  title        = {{{Die Vergnügungen der anderen: Fachsensible Hochschuldidaktik als neuer Weg zwischen allgemeiner und fachspezifischer Hochschuldidaktik}}},
  doi          = {{10.1007/978-3-658-12067-2_3}},
  year         = {{2016}},
}

@inproceedings{31491,
  author       = {{Scharlau, Ingrid}},
  booktitle    = {{Hanse-Kolloquium zur Hochschuldidaktik der Mathematik 2014}},
  editor       = {{Schnieder, Jörn and Paravicini, Walther}},
  isbn         = {{978-3-942197-97-7}},
  pages        = {{183 -- 197}},
  publisher    = {{wtm-Verlag}},
  title        = {{{Mathematik schreiben}}},
  year         = {{2016}},
}

@inbook{31492,
  author       = {{Keding, Gesche and Scharlau, Ingrid}},
  booktitle    = {{Schreibberatung und Schreibförderung. Impulse aus Theorie, Empirie und Praxis}},
  editor       = {{Ballweg, Sandra}},
  pages        = {{115 --134}},
  publisher    = {{Lang}},
  title        = {{{Drei Einflüsse auf Schreibberatung und ein integriertes Modell der Selbststeuerung für Schreibberaterinnen und Schreibberater}}},
  year         = {{2016}},
}

@inproceedings{23585,
  author       = {{Gräßler, Iris and Taplick, Patrick and Pottebaum, Jens and Scholle, Philipp and Reiher, Thomas}},
  booktitle    = {{Proceedings of the DESIGN 2016 14th International Design Conference, International DESIGN Conference, Band 1}},
  editor       = {{Marjanovic, Dorian and Storga, Mario and Pavkovic, Neven and Bojcetic, Nenad and Skec, Stanko}},
  publisher    = {{Design Society}},
  title        = {{{Data Management for additive manufacturing: survey on requirements and current state}}},
  volume       = {{1}},
  year         = {{2016}},
}

