[{"department":[{"_id":"151"}],"type":"conference","date_created":"2019-05-27T08:34:21Z","project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"abstract":[{"text":"Ultrasonic wire bonding is an indispensable process in the manufacturing of semiconductor components. It is used for interconnecting the silicon die to e.g. connectors in the housing or to other semiconductors in complex components. In high power applications, such as wind turbines, locomotives or electric vehicles, the thermal and mechanical limits of interconnects made from aluminum are nearing. The limits could be overcome using copper wire bonds, but their manufacturing poses challenges due to the harder material, which leads to increased wear of the bond tools and to less reliable production. To overcome these drawbacks, adaptation of process parameters at runtime is employed. However, the range of parameter values for which a stable process can be maintained is very small, making it necessary to compute suitable parameters beforehand. To this end, and to gain insights into the process itself, the ultrasonic bonding process is modeled. The full model is composed of several partial models, some of which were introduced before. This paper focuses on the modularization of the full model and on the interaction of partial models. All partial models are presented, their interaction is shown and the general outline of the simulation process is given.","lang":"eng"}],"quality_controlled":"1","citation":{"bibtex":"@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015, title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }","ama":"Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>","mla":"Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>.","chicago":"Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>.","short":"T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.","ieee":"T. Meyer <i>et al.</i>, “Modeling and simulation of the ultrasonic wire bonding process,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","apa":"Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding process. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>"},"publication":"2015 17th Electronics Packaging Technology Conference","doi":"10.1109/EPTC.2015.7412377","user_id":"210","language":[{"iso":"eng"}],"_id":"9951","date_updated":"2020-05-07T05:33:52Z","author":[{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Hunstig, Matthias","first_name":"Matthias","last_name":"Hunstig"},{"full_name":"Guth, Karsten","first_name":"Karsten","last_name":"Guth"}],"year":"2015","status":"public","title":"Modeling and simulation of the ultrasonic wire bonding process"},{"user_id":"55222","page":"1109-1117","language":[{"iso":"eng"}],"_id":"9952","date_updated":"2019-09-16T10:47:53Z","title":"A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties","status":"public","year":"2015","author":[{"full_name":"Schulte, Frank","last_name":"Schulte","first_name":"Frank"},{"first_name":"Jan","last_name":"Neuhaus","full_name":"Neuhaus, Jan"},{"last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter","id":"21220"}],"type":"conference","keyword":["Contact Mechanics","Viscoelastic Material","Adhesive Friction","Hysteresis Friction","Energy Dissipation","Vibration"],"department":[{"_id":"151"}],"date_created":"2019-05-27T08:37:22Z","quality_controlled":"1","abstract":[{"text":"The contact between viscoelastic materials e.g. elastomers and a rough surface leads to a special friction characteristic, which differs greatly in its properties comparing to other materials like metals. In practice, this friction combination occurs for example in the tire-road contact, or in the use of rubber gaskets. Due to the frictional forces a system is significantly influenced in its vibrational properties. The friction force is composed of two main components adhesion and hysteresis. The adhesion results from molecular bounds between the contact partners, while the deformation of the viscoelastic material by the roughness of the counter body leads to power loss. This internal friction results in an additional frictional force, which is described by the hysteresis. To simulate the frictional behaviour of elastomers on rough surfaces and thus to determine the energy dissipation in contact, it is necessary to develop a mechanical model which considers the roughness of the contact partners, as well as dynamic effects and the dependence on normal pressure and sliding speed. The viscoelastic material behaviour must also be considered. The contact between two rough surfaces is modelled as a rough rigid layer contacting a rough elas- tic layer. The elastic layer is modelled by point masses connected by Maxwell-elements. This allows the viscoelastic properties of the elastomer to be considered. The behaviour of whole system can be described by equations of motion with integrated constraints. The degrees of freedom of the model depends on the varying contact conditions. A point mass not in contact has two degrees of freedom. A point mass in contact moving along the roughness path can be described by only one degree of freedom. For each Maxwell-Element also an inner coordinate and thus a further degree of freedom is needed. Because of varying contact conditions dur- ing the simulation, the simulation interrupts in case the contact conditions change. Then the equations of motions are adapted with respect to the contact constraints. As a result of the simulation one obtain the energy dissipation and thus the friction char- acteristic during the friction process. It is possible to use these results in three dimensional point-contact elements in order to model contact surfaces on lager length scales.","lang":"eng"}],"publication":"Proceedings of ICoEV 2015 International Conference on Engineering Vibration","citation":{"mla":"Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–17.","bibtex":"@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte, Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }","ama":"Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In: <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>. ; 2015:1109-1117.","ieee":"F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties,” in <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–1117.","apa":"Schulte, F., Neuhaus, J., &#38; Sextro, W. (2015). A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i> (pp. 1109–1117).","chicago":"Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 1109–17, 2015.","short":"F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117."}},{"date_created":"2019-05-27T08:43:55Z","department":[{"_id":"151"}],"type":"conference","citation":{"mla":"Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>.","bibtex":"@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }","ama":"Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>","ieee":"A. Unger <i>et al.</i>, “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","apa":"Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., &#38; Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>","short":"A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.","chicago":"Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>."},"publication":"2015 17th Electronics Packaging Technology Conference","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"abstract":[{"lang":"eng","text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage."}],"quality_controlled":"1","_id":"9954","language":[{"iso":"eng"}],"doi":"10.1109/EPTC.2015.7412375","user_id":"210","author":[{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"id":"21220","first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"full_name":"Eichwald, Paul","first_name":"Paul","last_name":"Eichwald"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}],"year":"2015","title":"Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear","status":"public","date_updated":"2020-05-07T05:33:52Z"},{"type":"journal_article","date_created":"2019-01-10T09:09:00Z","quality_controlled":"1","citation":{"bibtex":"@article{Scheer_Scholz_Rank_Donie_2015, title={Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers}, volume={14}, DOI={<a href=\"https://doi.org/10.1891/1945-8959.14.3.270\">10.1891/1945-8959.14.3.270</a>}, number={3}, journal={Journal of Cognitive Education and Psychology}, author={Scheer, David and Scholz, Markus and Rank, Astrid and Donie, Christian}, year={2015}, pages={270–293} }","ama":"Scheer D, Scholz M, Rank A, Donie C. Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers. <i>Journal of Cognitive Education and Psychology</i>. 2015;14(3):270-293. doi:<a href=\"https://doi.org/10.1891/1945-8959.14.3.270\">10.1891/1945-8959.14.3.270</a>","mla":"Scheer, David, et al. “Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers.” <i>Journal of Cognitive Education and Psychology</i>, vol. 14, no. 3, 2015, pp. 270–93, doi:<a href=\"https://doi.org/10.1891/1945-8959.14.3.270\">10.1891/1945-8959.14.3.270</a>.","chicago":"Scheer, David, Markus Scholz, Astrid Rank, and Christian Donie. “Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers.” <i>Journal of Cognitive Education and Psychology</i> 14, no. 3 (2015): 270–93. <a href=\"https://doi.org/10.1891/1945-8959.14.3.270\">https://doi.org/10.1891/1945-8959.14.3.270</a>.","short":"D. Scheer, M. Scholz, A. Rank, C. Donie, Journal of Cognitive Education and Psychology 14 (2015) 270–293.","ieee":"D. Scheer, M. Scholz, A. Rank, and C. Donie, “Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers,” <i>Journal of Cognitive Education and Psychology</i>, vol. 14, no. 3, pp. 270–293, 2015.","apa":"Scheer, D., Scholz, M., Rank, A., &#38; Donie, C. (2015). Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers. <i>Journal of Cognitive Education and Psychology</i>, <i>14</i>(3), 270–293. <a href=\"https://doi.org/10.1891/1945-8959.14.3.270\">https://doi.org/10.1891/1945-8959.14.3.270</a>"},"issue":"3","publication":"Journal of Cognitive Education and Psychology","volume":14,"user_id":"53748","doi":"10.1891/1945-8959.14.3.270","language":[{"iso":"eng"}],"_id":"6612","page":"270-293","intvolume":"        14","date_updated":"2022-01-06T07:03:13Z","author":[{"id":"53748","full_name":"Scheer, David","last_name":"Scheer","orcid":"0000-0002-0534-7869","first_name":"David"},{"full_name":"Scholz, Markus","first_name":"Markus","last_name":"Scholz"},{"full_name":"Rank, Astrid","last_name":"Rank","first_name":"Astrid"},{"first_name":"Christian","last_name":"Donie","full_name":"Donie, Christian"}],"year":"2015","status":"public","title":"Inclusive Beliefs and Self-Efficacy Concerning Inclusive Education Among German Teacher Trainees and Student Teachers"},{"date_created":"2022-02-24T17:11:16Z","type":"book_chapter","citation":{"mla":"Ficara, Elena. “Contrariety and Contradiction. Hegel and the Berliner Aristotelismus.” <i>Hegel-Studien 49</i>, 2015, pp. 29–56.","ama":"Ficara E. Contrariety and Contradiction. Hegel and the Berliner Aristotelismus. In: <i>Hegel-Studien 49</i>. ; 2015:29-56.","bibtex":"@inbook{Ficara_2015, title={Contrariety and Contradiction. Hegel and the Berliner Aristotelismus}, booktitle={Hegel-Studien 49}, author={Ficara, Elena}, year={2015}, pages={29–56} }","apa":"Ficara, E. (2015). Contrariety and Contradiction. Hegel and the Berliner Aristotelismus. In <i>Hegel-Studien 49</i> (pp. 29–56).","ieee":"E. Ficara, “Contrariety and Contradiction. Hegel and the Berliner Aristotelismus,” in <i>Hegel-Studien 49</i>, 2015, pp. 29–56.","short":"E. Ficara, in: Hegel-Studien 49, 2015, pp. 29–56.","chicago":"Ficara, Elena. “Contrariety and Contradiction. Hegel and the Berliner Aristotelismus.” In <i>Hegel-Studien 49</i>, 29–56, 2015."},"publication":"Hegel-Studien 49","quality_controlled":"1","language":[{"iso":"eng"}],"_id":"30088","page":"29 - 56","user_id":"35768","author":[{"full_name":"Ficara, Elena","last_name":"Ficara","first_name":"Elena","id":"35768"}],"title":"Contrariety and Contradiction. Hegel and the Berliner Aristotelismus","status":"public","year":"2015","date_updated":"2022-03-01T12:06:59Z"},{"status":"public","page":"171-193","_id":"28034","publisher":"Springer VS Verlag","user_id":"49044","editor":[{"full_name":"Glatzmeier, A.","first_name":"A.","last_name":"Glatzmeier"},{"full_name":"Schubert, K.","first_name":"K.","last_name":"Schubert"}],"citation":{"chicago":"Ophuysen, Stefanie van, Bea Bloh, and Johannes Bellmann. “Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen.” In <i>Entscheidung</i>, edited by A. Glatzmeier and K. Schubert, 171–93. Wiesbaden: Springer VS Verlag, 2015. <a href=\"https://doi.org/10.1007/978-3-658-07214-8_9\">https://doi.org/10.1007/978-3-658-07214-8_9</a>.","short":"S. van Ophuysen, B. Bloh, J. Bellmann, in: A. Glatzmeier, K. Schubert (Eds.), Entscheidung, Springer VS Verlag, Wiesbaden, 2015, pp. 171–193.","ieee":"S. van Ophuysen, B. Bloh, and J. Bellmann, “Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen,” in <i>Entscheidung</i>, A. Glatzmeier and K. Schubert, Eds. Wiesbaden: Springer VS Verlag, 2015, pp. 171–193.","apa":"van Ophuysen, S., Bloh, B., &#38; Bellmann, J. (2015). Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen. In A. Glatzmeier &#38; K. Schubert (Eds.), <i>Entscheidung</i> (pp. 171–193). Springer VS Verlag. <a href=\"https://doi.org/10.1007/978-3-658-07214-8_9\">https://doi.org/10.1007/978-3-658-07214-8_9</a>","bibtex":"@inbook{van Ophuysen_Bloh_Bellmann_2015, place={Wiesbaden}, title={Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen}, DOI={<a href=\"https://doi.org/10.1007/978-3-658-07214-8_9\">10.1007/978-3-658-07214-8_9</a>}, booktitle={Entscheidung}, publisher={Springer VS Verlag}, author={van Ophuysen, Stefanie and Bloh, Bea and Bellmann, Johannes}, editor={Glatzmeier, A. and Schubert, K.}, year={2015}, pages={171–193} }","ama":"van Ophuysen S, Bloh B, Bellmann J. Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen. In: Glatzmeier A, Schubert K, eds. <i>Entscheidung</i>. Springer VS Verlag; 2015:171-193. doi:<a href=\"https://doi.org/10.1007/978-3-658-07214-8_9\">10.1007/978-3-658-07214-8_9</a>","mla":"van Ophuysen, Stefanie, et al. “Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen.” <i>Entscheidung</i>, edited by A. Glatzmeier and K. Schubert, Springer VS Verlag, 2015, pp. 171–93, doi:<a href=\"https://doi.org/10.1007/978-3-658-07214-8_9\">10.1007/978-3-658-07214-8_9</a>."},"quality_controlled":"1","place":"Wiesbaden","year":"2015","title":"Entscheidungen im professionellen Handeln von Pädagoginnen und Pädagogen","publication_identifier":{"isbn":["978-3-658-07213-1"]},"author":[{"first_name":"Stefanie","last_name":"van Ophuysen","full_name":"van Ophuysen, Stefanie"},{"full_name":"Bloh, Bea","first_name":"Bea","last_name":"Bloh","id":"69910"},{"last_name":"Bellmann","first_name":"Johannes","full_name":"Bellmann, Johannes"}],"publication_status":"published","date_updated":"2022-01-13T18:48:51Z","language":[{"iso":"ger"}],"doi":"10.1007/978-3-658-07214-8_9","publication":"Entscheidung","extern":"1","date_created":"2021-11-29T15:13:52Z","type":"book_chapter","department":[{"_id":"36"},{"_id":"456"}]},{"publication":"Langmuir","issue":"31","type":"journal_article","keyword":["Electrochemistry","Spectroscopy","Surfaces and Interfaces","Condensed Matter Physics","General Materials Science"],"department":[{"_id":"2"},{"_id":"315"}],"date_created":"2023-01-06T12:53:52Z","publication_status":"published","date_updated":"2023-01-07T10:34:01Z","article_type":"original","intvolume":"        31","year":"2015","title":"Gelled Lyotropic Liquid Crystals","publication_identifier":{"issn":["0743-7463","1520-5827"]},"author":[{"last_name":"Xu","first_name":"Yang","full_name":"Xu, Yang"},{"last_name":"Laupheimer","first_name":"Michaela","full_name":"Laupheimer, Michaela"},{"full_name":"Preisig, Natalie","first_name":"Natalie","last_name":"Preisig"},{"last_name":"Sottmann","first_name":"Thomas","full_name":"Sottmann, Thomas"},{"first_name":"Claudia","orcid":"0000-0003-3179-9997","last_name":"Schmidt","full_name":"Schmidt, Claudia","id":"466"},{"full_name":"Stubenrauch, Cosima","last_name":"Stubenrauch","first_name":"Cosima"}],"doi":"10.1021/acs.langmuir.5b01992","language":[{"iso":"eng"}],"quality_controlled":"1","citation":{"bibtex":"@article{Xu_Laupheimer_Preisig_Sottmann_Schmidt_Stubenrauch_2015, title={Gelled Lyotropic Liquid Crystals}, volume={31}, DOI={<a href=\"https://doi.org/10.1021/acs.langmuir.5b01992\">10.1021/acs.langmuir.5b01992</a>}, number={31}, journal={Langmuir}, publisher={American Chemical Society (ACS)}, author={Xu, Yang and Laupheimer, Michaela and Preisig, Natalie and Sottmann, Thomas and Schmidt, Claudia and Stubenrauch, Cosima}, year={2015}, pages={8589–8598} }","ama":"Xu Y, Laupheimer M, Preisig N, Sottmann T, Schmidt C, Stubenrauch C. Gelled Lyotropic Liquid Crystals. <i>Langmuir</i>. 2015;31(31):8589-8598. doi:<a href=\"https://doi.org/10.1021/acs.langmuir.5b01992\">10.1021/acs.langmuir.5b01992</a>","mla":"Xu, Yang, et al. “Gelled Lyotropic Liquid Crystals.” <i>Langmuir</i>, vol. 31, no. 31, American Chemical Society (ACS), 2015, pp. 8589–98, doi:<a href=\"https://doi.org/10.1021/acs.langmuir.5b01992\">10.1021/acs.langmuir.5b01992</a>.","chicago":"Xu, Yang, Michaela Laupheimer, Natalie Preisig, Thomas Sottmann, Claudia Schmidt, and Cosima Stubenrauch. “Gelled Lyotropic Liquid Crystals.” <i>Langmuir</i> 31, no. 31 (2015): 8589–98. <a href=\"https://doi.org/10.1021/acs.langmuir.5b01992\">https://doi.org/10.1021/acs.langmuir.5b01992</a>.","short":"Y. Xu, M. Laupheimer, N. Preisig, T. Sottmann, C. Schmidt, C. Stubenrauch, Langmuir 31 (2015) 8589–8598.","ieee":"Y. Xu, M. Laupheimer, N. Preisig, T. Sottmann, C. Schmidt, and C. Stubenrauch, “Gelled Lyotropic Liquid Crystals,” <i>Langmuir</i>, vol. 31, no. 31, pp. 8589–8598, 2015, doi: <a href=\"https://doi.org/10.1021/acs.langmuir.5b01992\">10.1021/acs.langmuir.5b01992</a>.","apa":"Xu, Y., Laupheimer, M., Preisig, N., Sottmann, T., Schmidt, C., &#38; Stubenrauch, C. (2015). Gelled Lyotropic Liquid Crystals. <i>Langmuir</i>, <i>31</i>(31), 8589–8598. <a href=\"https://doi.org/10.1021/acs.langmuir.5b01992\">https://doi.org/10.1021/acs.langmuir.5b01992</a>"},"status":"public","user_id":"466","volume":31,"page":"8589-8598","publisher":"American Chemical Society (ACS)","_id":"35332"},{"quality_controlled":"1","publication":"Colloid Process Engineering","citation":{"short":"F. Grewe, J. Ortmeyer, R. Haase, C. 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