@inbook{8887,
  author       = {{Beutner, Marc and Schneider, J}},
  booktitle    = {{Sounds and Audios in E-learning scenarios. Results and Discussions on the basis of the SEEl project}},
  editor       = {{Beutner, Marc}},
  pages        = {{20 -- 32}},
  title        = {{{The strcture of the SEEL Project}}},
  year         = {{2016}},
}

@inbook{8888,
  author       = {{Beutner, Marc and Schneider, J}},
  booktitle    = {{Sounds and Audios in E-learning scenarios. Results and Discussions on the basis of the SEEl project}},
  editor       = {{Beutner, Marc}},
  pages        = {{34 -- 42}},
  title        = {{{Situation of visual impaired in Germany}}},
  year         = {{2016}},
}

@inbook{8889,
  author       = {{Beutner, Marc}},
  booktitle    = {{Sounds and Audios in E-learning scenarios. Results and Discussions on the basis of the SEEl project}},
  editor       = {{Beutner, Marc}},
  pages        = {{56 -- 64}},
  title        = {{{Quasi-Experimental Design concerning learning with sounds in education}}},
  year         = {{2016}},
}

@inbook{8890,
  author       = {{Beutner, Marc and Schneider, J}},
  booktitle    = {{Sounds and Audios in E-learning scenarios. Results and Discussions on the basis of the SEEl project}},
  editor       = {{Beutner, Marc}},
  pages        = {{64 -- 65}},
  title        = {{{The general structure of the SEEL Teacher Training Course}}},
  year         = {{2016}},
}

@inbook{8891,
  author       = {{Beutner, Marc}},
  booktitle    = {{Sounds and Audios in E-learning scenarios. Results and Discussions on the basis of the SEEl project}},
  editor       = {{Beutner, Marc}},
  pages        = {{81 -- 83}},
  title        = {{{Insights in the evaluation results of the SEEL Project}}},
  year         = {{2016}},
}

@proceedings{9688,
  editor       = {{Tönnies, Merle and Ehland, Christoph and Mindt, Ilka}},
  location     = {{Paderborn}},
  publisher    = {{WVT}},
  title        = {{{Anglistentag 2015 Paderborn: Proceedings}}},
  year         = {{2016}},
}

@inbook{9689,
  author       = {{Tönnies, Merle}},
  booktitle    = {{Religion und Kultur}},
  editor       = {{von Stosch, Klaus and Hofmann, Michael and Schmitz, Sabine}},
  pages        = {{81--96}},
  publisher    = {{transcript}},
  title        = {{{Religion im zeitgenössischen britischen Drama}}},
  year         = {{2016}},
}

@article{9690,
  author       = {{Tönnies, Merle}},
  journal      = {{Anglistik. International Journal of English Studies}},
  number       = {{1}},
  pages        = {{113--124}},
  title        = {{{The Use of Comic Effects in Memoirs of British Asian Adolescence: Twenty-First Century Writers Looking Back at the 1970s and 1980s}}},
  volume       = {{27}},
  year         = {{2016}},
}

@article{9691,
  author       = {{Tönnies, Merle and Brüning, Joana and Sand, Andrea}},
  journal      = {{Zeitschrift für Anglistik und Amerikanistik}},
  number       = {{3}},
  pages        = {{301--320}},
  title        = {{{The Duality of Page and Stage: Constructing Lyrical Voices in Contemporary British Poetry Written for Performance}}},
  volume       = {{64}},
  year         = {{2016}},
}

@inbook{9697,
  author       = {{Strauß, Sara}},
  booktitle    = {{Traces of Aging: Old Age and Memory in Contemporary Narrative}},
  editor       = {{Moreno, Marta Cerezo  and Soler, Nieves Pascual}},
  pages        = {{133--147}},
  publisher    = {{transcript}},
  title        = {{{Memory, Dementia and Narrative Identity in Alice Munro’s ‘The Bear Came Over the Mountain’}}},
  volume       = {{9}},
  year         = {{2016}},
}

@misc{9729,
  author       = {{Flotmann-Scholz, Christina}},
  booktitle    = {{Journal for the Study of British Cultures}},
  number       = {{1}},
  pages        = {{75--78}},
  title        = {{{The Making of English Popular Culture. ed. by John Storey}}},
  volume       = {{23}},
  year         = {{2016}},
}

@misc{9731,
  author       = {{Flotmann-Scholz, Christina}},
  booktitle    = {{Literaturwissenschaftliches Jahrbuch}},
  pages        = {{259--262}},
  title        = {{{Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl}}},
  volume       = {{57}},
  year         = {{2016}},
}

@inbook{9815,
  author       = {{Herzig, Bardo and Martin, Alexander and Klar, Tilman-Mathies}},
  booktitle    = {{Deutsch Digital. Band 1 Theorie}},
  editor       = {{Knopf, J. and Abraham, U.}},
  pages        = {{69--97}},
  publisher    = {{Schneider Verlag Hohengeren}},
  title        = {{{Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht und Beispiele}}},
  volume       = {{3}},
  year         = {{2016}},
}

@article{9835,
  author       = {{Sperling, J. and Bartley, Tim and Donati, G. and Barbieri, M. and Jin, X.-M. and Datta, A. and Vogel, W. and Walmsley, I. A.}},
  issn         = {{0031-9007}},
  journal      = {{Physical Review Letters}},
  title        = {{{Quantum Correlations from the Conditional Statistics of Incomplete Data}}},
  doi          = {{10.1103/physrevlett.117.083601}},
  year         = {{2016}},
}

@article{9836,
  abstract     = {{<jats:title>Abstract</jats:title><jats:p>Quantum mechanics establishes the ultimate limit to the scaling of the precision on any parameter, by identifying optimal probe states and measurements. While this paradigm is, at least in principle, adequate for the metrology of quantum channels involving the estimation of phase and loss parameters, we show that estimating the loss parameters associated with a quantum channel and a realistic quantum detector are fundamentally different. While Fock states are provably optimal for the former, we identify a crossover in the nature of the optimal probe state for estimating detector imperfections as a function of the loss parameter using Fisher information as a benchmark. We provide theoretical results for on-off and homodyne detectors, the most widely used detectors in quantum photonics technologies, when using Fock states and coherent states as probes.</jats:p>}},
  author       = {{Barbieri, Marco and Datta, Animesh and Bartley, Tim and Jin, Xian-Min and Kolthammer, W. Steven and Walmsley, Ian A.}},
  issn         = {{2299-114X}},
  journal      = {{Quantum Measurements and Quantum Metrology}},
  title        = {{{Quantum enhanced estimation of optical detector efficiencies}}},
  doi          = {{10.1515/qmetro-2016-0002}},
  year         = {{2016}},
}

@inproceedings{985,
  author       = {{v. Rossem, S. and Tavernier, W. and Peuster, Manuel and Colle, D. and Pickavet, M. and Demeester, P.}},
  booktitle    = {{Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track}},
  title        = {{{Monitoring and debugging using an SDK for NFV-powered telecom applications}}},
  year         = {{2016}},
}

@inproceedings{9955,
  abstract     = {{Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.}},
  author       = {{Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}},
  booktitle    = {{IEEE 66th Electronic Components and Technology Conference}},
  keywords     = {{finite element simulation, wire bonding, tool geometry}},
  pages        = {{2103--2110}},
  title        = {{{Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}}},
  doi          = {{10.1109/ECTC.2016.234}},
  year         = {{2016}},
}

@article{9957,
  abstract     = {{Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL – Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit, sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in Form einer modifizierten Bondmaschine. Intelligent production of heavy copper wire bonds It is the aim of this innovation-project to develop a self-optimization system for ultrasonic copper wire bonding. It is part of the leading edge cluster “it’s OWL”. The bonding machine will be able to react autonomously to changing boundary conditions to ensure constant and reliable bonding results. For this, the hole bonding process is modeled in great detail and newest self-optimization techniques are utilized. A prototype-system incorporated in a serial machine is used for evaluation.}},
  author       = {{Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}},
  journal      = {{wt-online}},
  pages        = {{512--519}},
  title        = {{{Kupferbondverbindungen intelligent herstellen}}},
  volume       = {{7/8}},
  year         = {{2016}},
}

@inproceedings{9958,
  abstract     = {{The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceutical or coatings industry particle sizes of processed powders are getting smaller and smaller. Fine powders are primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces. This leads to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory conveyors) for transport. A rather new method for transporting these fine powders is based on ultrasonic vibrations, which are used to reduce friction and adhesion between powder and the substrate. One very effective set-up consists of a pipe, which vibrates harmoniously in axial direction at low frequency combined with a pulsed radial high frequency vibration. The high frequency vibration accelerates the particles perpendicular to the surface of the pipe, which in average leads to lower normal and thereby smaller friction force. With coordinated friction manipulation the powder acceleration can be varied so that the powder may be greatly accelerated and only slightly decelerated in each excitation period of the low frequency axial vibration of the pipe. The amount of powder flow is adjustable by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile for comparable high volume and fine dosing using one setup. Within this contribution an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration and a piezoelectric actuator for the radial high frequency vibration is described. An analytical model is shown, that simulates the powder velocity. Finally, simulation results are validated by experimental data for different driving parameters such as amplitude of low frequency vibration, pipe material and inclination angle.}},
  author       = {{Dunst, Paul and Sextro, Walter and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}},
  booktitle    = {{PAMM Proc. Appl. Math. Mech. 16}},
  pages        = {{635--636}},
  title        = {{{Transportation of dry fine powders by coordinated friction manipulation}}},
  doi          = {{10.1002/pamm.201610306}},
  year         = {{2016}},
}

@inproceedings{9959,
  abstract     = {{Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties.}},
  author       = {{Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}},
  booktitle    = {{IEEE 66th Electronic Components and Technology Conference}},
  keywords     = {{Ultrasonic copper wire bonding, Al-oxide, Cuoxide, oxide-free, roughness, morphology}},
  pages        = {{2111--2118}},
  title        = {{{Effect of different oxide layers on the ultrasonic copper wire bond process}}},
  doi          = {{10.1109/ECTC.2016.91}},
  year         = {{2016}},
}