[{"author":[{"id":"8736","last_name":"Flotmann-Scholz","first_name":"Christina","full_name":"Flotmann-Scholz, Christina"}],"status":"public","year":"2016","title":"The Making of English Popular Culture. ed. by John Storey","intvolume":"        23","date_updated":"2022-01-06T07:04:19Z","publication_status":"published","language":[{"iso":"eng"}],"_id":"9729","page":"75-78","volume":23,"user_id":"32277","citation":{"chicago":"Flotmann-Scholz, Christina. “The Making of English Popular Culture. Ed. by John Storey.” <i>Journal for the Study of British Cultures</i>, 2016.","short":"C. Flotmann-Scholz, Journal for the Study of British Cultures 23 (2016) 75–78.","ieee":"C. Flotmann-Scholz, “The Making of English Popular Culture. ed. by John Storey,” <i>Journal for the Study of British Cultures</i>, vol. 23, no. 1. pp. 75–78, 2016.","apa":"Flotmann-Scholz, C. (2016). The Making of English Popular Culture. ed. by John Storey. <i>Journal for the Study of British Cultures</i>.","bibtex":"@article{Flotmann-Scholz_2016, title={The Making of English Popular Culture. ed. by John Storey}, volume={23}, number={1}, journal={Journal for the Study of British Cultures}, author={Flotmann-Scholz, Christina}, year={2016}, pages={75–78} }","ama":"Flotmann-Scholz C. The Making of English Popular Culture. ed. by John Storey. <i>Journal for the Study of British Cultures</i>. 2016;23(1):75-78.","mla":"Flotmann-Scholz, Christina. “The Making of English Popular Culture. Ed. by John Storey.” <i>Journal for the Study of British Cultures</i>, vol. 23, no. 1, 2016, pp. 75–78."},"issue":"1","publication":"Journal for the Study of British Cultures","date_created":"2019-05-13T07:39:21Z","department":[{"_id":"36"},{"_id":"1"},{"_id":"380"}],"type":"review"},{"citation":{"mla":"Flotmann-Scholz, Christina. “Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl.” <i>Literaturwissenschaftliches Jahrbuch</i>, vol. 57, 2016, pp. 259–62.","ama":"Flotmann-Scholz C. Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl. <i>Literaturwissenschaftliches Jahrbuch</i>. 2016;57:259-262.","bibtex":"@article{Flotmann-Scholz_2016, title={Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl}, volume={57}, journal={Literaturwissenschaftliches Jahrbuch}, author={Flotmann-Scholz, Christina}, year={2016}, pages={259–262} }","apa":"Flotmann-Scholz, C. (2016). Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl. <i>Literaturwissenschaftliches Jahrbuch</i>.","ieee":"C. Flotmann-Scholz, “Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl,” <i>Literaturwissenschaftliches Jahrbuch</i>, vol. 57. pp. 259–262, 2016.","chicago":"Flotmann-Scholz, Christina. “Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl.” <i>Literaturwissenschaftliches Jahrbuch</i>, 2016.","short":"C. Flotmann-Scholz, Literaturwissenschaftliches Jahrbuch 57 (2016) 259–262."},"publication":"Literaturwissenschaftliches Jahrbuch","department":[{"_id":"36"},{"_id":"1"},{"_id":"380"}],"type":"review","date_created":"2019-05-13T07:42:53Z","intvolume":"        57","date_updated":"2022-01-06T07:04:19Z","publication_status":"published","author":[{"id":"8736","last_name":"Flotmann-Scholz","first_name":"Christina","full_name":"Flotmann-Scholz, Christina"}],"status":"public","title":"Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl","year":"2016","volume":57,"user_id":"32277","language":[{"iso":"eng"}],"_id":"9731","page":"259-262"},{"series_title":"Deutschdidaktik in der Primarstufe","_id":"9815","language":[{"iso":"eng"}],"publisher":"Schneider Verlag Hohengeren","page":"69-97","editor":[{"full_name":"Knopf, J.","first_name":"J.","last_name":"Knopf"},{"full_name":"Abraham, U.","last_name":"Abraham","first_name":"U."}],"volume":3,"user_id":"38923","author":[{"last_name":"Herzig","first_name":"Bardo","full_name":"Herzig, Bardo"},{"full_name":"Martin, Alexander","first_name":"Alexander","last_name":"Martin"},{"id":"35771","full_name":"Klar, Tilman-Mathies","last_name":"Klar","first_name":"Tilman-Mathies"}],"status":"public","title":"Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht und Beispiele","year":"2016","intvolume":"         3","date_updated":"2022-01-06T07:04:22Z","publication_status":"published","place":"Baltmannsweiler","date_created":"2019-05-15T09:03:42Z","type":"book_chapter","citation":{"bibtex":"@inbook{Herzig_Martin_Klar_2016, place={Baltmannsweiler}, series={Deutschdidaktik in der Primarstufe}, title={Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht und Beispiele}, volume={3}, booktitle={Deutsch Digital. Band 1 Theorie}, publisher={Schneider Verlag Hohengeren}, author={Herzig, Bardo and Martin, Alexander and Klar, Tilman-Mathies}, editor={Knopf, J. and Abraham, U.Editors}, year={2016}, pages={69–97}, collection={Deutschdidaktik in der Primarstufe} }","ama":"Herzig B, Martin A, Klar T-M. Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht und Beispiele. In: Knopf J, Abraham U, eds. <i>Deutsch Digital. Band 1 Theorie</i>. Vol 3. Deutschdidaktik in der Primarstufe. Baltmannsweiler: Schneider Verlag Hohengeren; 2016:69-97.","mla":"Herzig, Bardo, et al. “Smartphone Und Tablet – Medienpädagogische Und Technische Grundlagen, Potential Für Den Deutschunterricht Und Beispiele.” <i>Deutsch Digital. Band 1 Theorie</i>, edited by J. Knopf and U. Abraham, vol. 3, Schneider Verlag Hohengeren, 2016, pp. 69–97.","short":"B. Herzig, A. Martin, T.-M. Klar, in: J. Knopf, U. Abraham (Eds.), Deutsch Digital. Band 1 Theorie, Schneider Verlag Hohengeren, Baltmannsweiler, 2016, pp. 69–97.","chicago":"Herzig, Bardo, Alexander Martin, and Tilman-Mathies Klar. “Smartphone Und Tablet – Medienpädagogische Und Technische Grundlagen, Potential Für Den Deutschunterricht Und Beispiele.” In <i>Deutsch Digital. Band 1 Theorie</i>, edited by J. Knopf and U. Abraham, 3:69–97. Deutschdidaktik in Der Primarstufe. Baltmannsweiler: Schneider Verlag Hohengeren, 2016.","ieee":"B. Herzig, A. Martin, and T.-M. Klar, “Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht und Beispiele,” in <i>Deutsch Digital. Band 1 Theorie</i>, vol. 3, J. Knopf and U. Abraham, Eds. Baltmannsweiler: Schneider Verlag Hohengeren, 2016, pp. 69–97.","apa":"Herzig, B., Martin, A., &#38; Klar, T.-M. (2016). Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht und Beispiele. In J. Knopf &#38; U. Abraham (Eds.), <i>Deutsch Digital. Band 1 Theorie</i> (Vol. 3, pp. 69–97). Baltmannsweiler: Schneider Verlag Hohengeren."},"publication":"Deutsch Digital. Band 1 Theorie"},{"date_updated":"2020-02-26T14:39:40Z","publication_status":"published","title":"Quantum Correlations from the Conditional Statistics of Incomplete Data","year":"2016","status":"public","author":[{"full_name":"Sperling, J.","last_name":"Sperling","first_name":"J."},{"id":"49683","first_name":"Tim","last_name":"Bartley","full_name":"Bartley, Tim"},{"full_name":"Donati, G.","first_name":"G.","last_name":"Donati"},{"full_name":"Barbieri, M.","first_name":"M.","last_name":"Barbieri"},{"first_name":"X.-M.","last_name":"Jin","full_name":"Jin, X.-M."},{"first_name":"A.","last_name":"Datta","full_name":"Datta, A."},{"first_name":"W.","last_name":"Vogel","full_name":"Vogel, W."},{"last_name":"Walmsley","first_name":"I. A.","full_name":"Walmsley, I. A."}],"publication_identifier":{"issn":["0031-9007","1079-7114"]},"doi":"10.1103/physrevlett.117.083601","user_id":"49683","_id":"9835","language":[{"iso":"eng"}],"publication":"Physical Review Letters","citation":{"ama":"Sperling J, Bartley T, Donati G, et al. Quantum Correlations from the Conditional Statistics of Incomplete Data. <i>Physical Review Letters</i>. 2016. doi:<a href=\"https://doi.org/10.1103/physrevlett.117.083601\">10.1103/physrevlett.117.083601</a>","bibtex":"@article{Sperling_Bartley_Donati_Barbieri_Jin_Datta_Vogel_Walmsley_2016, title={Quantum Correlations from the Conditional Statistics of Incomplete Data}, DOI={<a href=\"https://doi.org/10.1103/physrevlett.117.083601\">10.1103/physrevlett.117.083601</a>}, journal={Physical Review Letters}, author={Sperling, J. and Bartley, Tim and Donati, G. and Barbieri, M. and Jin, X.-M. and Datta, A. and Vogel, W. and Walmsley, I. A.}, year={2016} }","mla":"Sperling, J., et al. “Quantum Correlations from the Conditional Statistics of Incomplete Data.” <i>Physical Review Letters</i>, 2016, doi:<a href=\"https://doi.org/10.1103/physrevlett.117.083601\">10.1103/physrevlett.117.083601</a>.","short":"J. Sperling, T. Bartley, G. Donati, M. Barbieri, X.-M. Jin, A. Datta, W. Vogel, I.A. Walmsley, Physical Review Letters (2016).","chicago":"Sperling, J., Tim Bartley, G. Donati, M. Barbieri, X.-M. Jin, A. Datta, W. Vogel, and I. A. Walmsley. “Quantum Correlations from the Conditional Statistics of Incomplete Data.” <i>Physical Review Letters</i>, 2016. <a href=\"https://doi.org/10.1103/physrevlett.117.083601\">https://doi.org/10.1103/physrevlett.117.083601</a>.","apa":"Sperling, J., Bartley, T., Donati, G., Barbieri, M., Jin, X.-M., Datta, A., … Walmsley, I. A. (2016). Quantum Correlations from the Conditional Statistics of Incomplete Data. <i>Physical Review Letters</i>. <a href=\"https://doi.org/10.1103/physrevlett.117.083601\">https://doi.org/10.1103/physrevlett.117.083601</a>","ieee":"J. Sperling <i>et al.</i>, “Quantum Correlations from the Conditional Statistics of Incomplete Data,” <i>Physical Review Letters</i>, 2016."},"type":"journal_article","department":[{"_id":"15"}],"date_created":"2019-05-17T14:08:09Z"},{"citation":{"mla":"Barbieri, Marco, et al. “Quantum Enhanced Estimation of Optical Detector Efficiencies.” <i>Quantum Measurements and Quantum Metrology</i>, 2016, doi:<a href=\"https://doi.org/10.1515/qmetro-2016-0002\">10.1515/qmetro-2016-0002</a>.","ama":"Barbieri M, Datta A, Bartley T, Jin X-M, Kolthammer WS, Walmsley IA. Quantum enhanced estimation of optical detector efficiencies. <i>Quantum Measurements and Quantum Metrology</i>. 2016. doi:<a href=\"https://doi.org/10.1515/qmetro-2016-0002\">10.1515/qmetro-2016-0002</a>","bibtex":"@article{Barbieri_Datta_Bartley_Jin_Kolthammer_Walmsley_2016, title={Quantum enhanced estimation of optical detector efficiencies}, DOI={<a href=\"https://doi.org/10.1515/qmetro-2016-0002\">10.1515/qmetro-2016-0002</a>}, journal={Quantum Measurements and Quantum Metrology}, author={Barbieri, Marco and Datta, Animesh and Bartley, Tim and Jin, Xian-Min and Kolthammer, W. Steven and Walmsley, Ian A.}, year={2016} }","apa":"Barbieri, M., Datta, A., Bartley, T., Jin, X.-M., Kolthammer, W. S., &#38; Walmsley, I. A. (2016). Quantum enhanced estimation of optical detector efficiencies. <i>Quantum Measurements and Quantum Metrology</i>. <a href=\"https://doi.org/10.1515/qmetro-2016-0002\">https://doi.org/10.1515/qmetro-2016-0002</a>","ieee":"M. Barbieri, A. Datta, T. Bartley, X.-M. Jin, W. S. Kolthammer, and I. A. Walmsley, “Quantum enhanced estimation of optical detector efficiencies,” <i>Quantum Measurements and Quantum Metrology</i>, 2016.","short":"M. Barbieri, A. Datta, T. Bartley, X.-M. Jin, W.S. Kolthammer, I.A. Walmsley, Quantum Measurements and Quantum Metrology (2016).","chicago":"Barbieri, Marco, Animesh Datta, Tim Bartley, Xian-Min Jin, W. Steven Kolthammer, and Ian A. Walmsley. “Quantum Enhanced Estimation of Optical Detector Efficiencies.” <i>Quantum Measurements and Quantum Metrology</i>, 2016. <a href=\"https://doi.org/10.1515/qmetro-2016-0002\">https://doi.org/10.1515/qmetro-2016-0002</a>."},"publication":"Quantum Measurements and Quantum Metrology","abstract":[{"lang":"eng","text":"<jats:title>Abstract</jats:title><jats:p>Quantum mechanics establishes the ultimate limit to the scaling of the precision on any parameter, by identifying optimal probe states and measurements. While this paradigm is, at least in principle, adequate for the metrology of quantum channels involving the estimation of phase and loss parameters, we show that estimating the loss parameters associated with a quantum channel and a realistic quantum detector are fundamentally different. While Fock states are provably optimal for the former, we identify a crossover in the nature of the optimal probe state for estimating detector imperfections as a function of the loss parameter using Fisher information as a benchmark. We provide theoretical results for on-off and homodyne detectors, the most widely used detectors in quantum photonics technologies, when using Fock states and coherent states as probes.</jats:p>"}],"date_created":"2019-05-17T14:08:35Z","department":[{"_id":"15"}],"type":"journal_article","author":[{"full_name":"Barbieri, Marco","last_name":"Barbieri","first_name":"Marco"},{"full_name":"Datta, Animesh","first_name":"Animesh","last_name":"Datta"},{"id":"49683","first_name":"Tim","last_name":"Bartley","full_name":"Bartley, Tim"},{"full_name":"Jin, Xian-Min","first_name":"Xian-Min","last_name":"Jin"},{"last_name":"Kolthammer","first_name":"W. Steven","full_name":"Kolthammer, W. Steven"},{"full_name":"Walmsley, Ian A.","last_name":"Walmsley","first_name":"Ian A."}],"publication_identifier":{"issn":["2299-114X"]},"status":"public","title":"Quantum enhanced estimation of optical detector efficiencies","year":"2016","publication_status":"published","date_updated":"2020-02-26T14:38:03Z","language":[{"iso":"eng"}],"_id":"9836","user_id":"49683","doi":"10.1515/qmetro-2016-0002"},{"date_created":"2017-11-27T10:22:29Z","file":[{"file_id":"1084","content_type":"application/pdf","success":1,"file_name":"8521284.pdf","file_size":305293,"access_level":"closed","relation":"main_file","date_updated":"2017-12-21T12:16:53Z","open_access":1,"date_created":"2017-12-21T12:16:53Z","creator":"tabu"}],"department":[{"_id":"75"}],"type":"conference","citation":{"ieee":"S. v. Rossem, W. Tavernier, M. Peuster, D. Colle, M. Pickavet, and P. Demeester, “Monitoring and debugging using an SDK for NFV-powered telecom applications,” in <i>Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track</i>, 2016.","apa":"v. Rossem, S., Tavernier, W., Peuster, M., Colle, D., Pickavet, M., &#38; Demeester, P. (2016). Monitoring and debugging using an SDK for NFV-powered telecom applications. In <i>Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track</i>.","chicago":"Rossem, S. v., W. Tavernier, Manuel Peuster, D. Colle, M. Pickavet, and P. Demeester. “Monitoring and Debugging Using an SDK for NFV-Powered Telecom Applications.” In <i>Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track</i>, 2016.","short":"S. v. Rossem, W. Tavernier, M. Peuster, D. Colle, M. Pickavet, P. Demeester, in: Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track, 2016.","mla":"v. Rossem, S., et al. “Monitoring and Debugging Using an SDK for NFV-Powered Telecom Applications.” <i>Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track</i>, 2016.","bibtex":"@inproceedings{v. Rossem_Tavernier_Peuster_Colle_Pickavet_Demeester_2016, title={Monitoring and debugging using an SDK for NFV-powered telecom applications}, booktitle={Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track}, author={v. Rossem, S. and Tavernier, W. and Peuster, Manuel and Colle, D. and Pickavet, M. and Demeester, P.}, year={2016} }","ama":"v. Rossem S, Tavernier W, Peuster M, Colle D, Pickavet M, Demeester P. Monitoring and debugging using an SDK for NFV-powered telecom applications. In: <i>Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track</i>. ; 2016."},"file_date_updated":"2017-12-21T12:16:53Z","publication":"Proc. IEEE Conference on Network Function Virtualization and Software Defined Network (NFV-SDN), Demo Track","project":[{"call_identifier":"5G PPP Phase 1","name":"SONATA NFV: Agile Service Development and Orchestration in 5G Virtualized Networks","grant_number":"671517","_id":"25"}],"_id":"985","user_id":"126","ddc":["004"],"author":[{"last_name":"v. Rossem","first_name":"S.","full_name":"v. Rossem, S."},{"full_name":"Tavernier, W.","last_name":"Tavernier","first_name":"W."},{"last_name":"Peuster","first_name":"Manuel","full_name":"Peuster, Manuel","id":"13271"},{"full_name":"Colle, D.","last_name":"Colle","first_name":"D."},{"full_name":"Pickavet, M.","first_name":"M.","last_name":"Pickavet"},{"last_name":"Demeester","first_name":"P.","full_name":"Demeester, P."}],"status":"public","title":"Monitoring and debugging using an SDK for NFV-powered telecom applications","year":"2016","accept":"1","date_updated":"2019-01-03T13:18:55Z"},{"title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","status":"public","year":"2016","author":[{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"}],"date_updated":"2020-05-07T05:33:52Z","page":"2103-2110","language":[{"iso":"eng"}],"_id":"9955","doi":"10.1109/ECTC.2016.234","user_id":"210","publication":"IEEE 66th Electronic Components and Technology Conference","citation":{"mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110.","chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>","short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }"},"quality_controlled":"1","abstract":[{"text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.","lang":"eng"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"date_created":"2019-05-27T08:47:52Z","type":"conference","keyword":["finite element simulation","wire bonding","tool geometry"],"department":[{"_id":"151"}]},{"page":"512-519","language":[{"iso":"eng"}],"_id":"9957","user_id":"210","volume":"7/8","year":"2016","title":"Kupferbondverbindungen intelligent herstellen","status":"public","author":[{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"full_name":"Biermann, Florian","last_name":"Biermann","first_name":"Florian"},{"full_name":"Guth, Karsten","first_name":"Karsten","last_name":"Guth"}],"date_updated":"2020-05-07T05:33:52Z","date_created":"2019-05-27T08:53:18Z","type":"journal_article","department":[{"_id":"151"}],"publication":"wt-online","popular_science":"1","citation":{"ama":"Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. <i>wt-online</i>. 2016;7/8:512-519.","bibtex":"@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online}, author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}, year={2016}, pages={512–519} }","mla":"Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i>, vol. 7/8, 2016, pp. 512–19.","chicago":"Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i> 7/8 (2016): 512–19.","short":"M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.","apa":"Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M., … Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. <i>Wt-Online</i>, <i>7/8</i>, 512–519.","ieee":"M. Brökelmann <i>et al.</i>, “Kupferbondverbindungen intelligent herstellen,” <i>wt-online</i>, vol. 7/8, pp. 512–519, 2016."},"abstract":[{"text":"Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL – Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit, sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in Form einer modifizierten Bondmaschine. Intelligent production of heavy copper wire bonds It is the aim of this innovation-project to develop a self-optimization system for ultrasonic copper wire bonding. It is part of the leading edge cluster “it’s OWL”. The bonding machine will be able to react autonomously to changing boundary conditions to ensure constant and reliable bonding results. For this, the hole bonding process is modeled in great detail and newest self-optimization techniques are utilized. A prototype-system incorporated in a serial machine is used for evaluation.","lang":"eng"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}]},{"author":[{"full_name":"Dunst, Paul","first_name":"Paul","last_name":"Dunst","id":"22130"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Bornmann, Peter","first_name":"Peter","last_name":"Bornmann"},{"id":"210","last_name":"Hemsel","first_name":"Tobias","full_name":"Hemsel, Tobias"},{"full_name":"Littmann, Walter","last_name":"Littmann","first_name":"Walter"}],"year":"2016","status":"public","title":"Transportation of dry fine powders by coordinated friction manipulation","date_updated":"2019-05-27T08:59:25Z","language":[{"iso":"eng"}],"_id":"9958","page":"635-636","doi":"10.1002/pamm.201610306","user_id":"55222","citation":{"ieee":"P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation of dry fine powders by coordinated friction manipulation,” in <i>PAMM Proc. Appl. Math. Mech. 16</i>, 2016, pp. 635–636.","apa":"Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., &#38; Littmann, W. (2016). Transportation of dry fine powders by coordinated friction manipulation. In <i>PAMM Proc. Appl. Math. Mech. 16</i> (pp. 635–636). Braunschweig. <a href=\"https://doi.org/10.1002/pamm.201610306\">https://doi.org/10.1002/pamm.201610306</a>","chicago":"Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann. “Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In <i>PAMM Proc. Appl. Math. Mech. 16</i>, 635–36. Braunschweig, 2016. <a href=\"https://doi.org/10.1002/pamm.201610306\">https://doi.org/10.1002/pamm.201610306</a>.","short":"P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc. Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.","mla":"Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” <i>PAMM Proc. Appl. Math. Mech. 16</i>, 2016, pp. 635–36, doi:<a href=\"https://doi.org/10.1002/pamm.201610306\">10.1002/pamm.201610306</a>.","bibtex":"@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig}, title={Transportation of dry fine powders by coordinated friction manipulation}, DOI={<a href=\"https://doi.org/10.1002/pamm.201610306\">10.1002/pamm.201610306</a>}, booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636} }","ama":"Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry fine powders by coordinated friction manipulation. In: <i>PAMM Proc. Appl. Math. Mech. 16</i>. Braunschweig; 2016:635-636. doi:<a href=\"https://doi.org/10.1002/pamm.201610306\">10.1002/pamm.201610306</a>"},"publication":"PAMM Proc. Appl. Math. Mech. 16","abstract":[{"text":"The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceutical or coatings industry particle sizes of processed powders are getting smaller and smaller. Fine powders are primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces. This leads to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory conveyors) for transport. A rather new method for transporting these fine powders is based on ultrasonic vibrations, which are used to reduce friction and adhesion between powder and the substrate. One very effective set-up consists of a pipe, which vibrates harmoniously in axial direction at low frequency combined with a pulsed radial high frequency vibration. The high frequency vibration accelerates the particles perpendicular to the surface of the pipe, which in average leads to lower normal and thereby smaller friction force. With coordinated friction manipulation the powder acceleration can be varied so that the powder may be greatly accelerated and only slightly decelerated in each excitation period of the low frequency axial vibration of the pipe. The amount of powder flow is adjustable by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile for comparable high volume and fine dosing using one setup. Within this contribution an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration and a piezoelectric actuator for the radial high frequency vibration is described. An analytical model is shown, that simulates the powder velocity. Finally, simulation results are validated by experimental data for different driving parameters such as amplitude of low frequency vibration, pipe material and inclination angle.","lang":"eng"}],"place":"Braunschweig","date_created":"2019-05-27T08:57:25Z","department":[{"_id":"151"}],"type":"conference"},{"year":"2016","status":"public","title":"Effect of different oxide layers on the ultrasonic copper wire bond process","author":[{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"last_name":"Grydin","first_name":"Olexandr","full_name":"Grydin, Olexandr"},{"last_name":"Hengsbach","first_name":"Florian","full_name":"Hengsbach, Florian"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"full_name":"Schaper, Mirko","first_name":"Mirko","last_name":"Schaper"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"date_updated":"2019-09-16T10:38:59Z","page":"2111-2118","language":[{"iso":"eng"}],"_id":"9959","user_id":"55222","doi":"10.1109/ECTC.2016.91","publication":"IEEE 66th Electronic Components and Technology Conference","citation":{"short":"F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.","ama":"Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2111-2118. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>","chicago":"Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2111–18, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>.","bibtex":"@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }","mla":"Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–18, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.91\">10.1109/ECTC.2016.91</a>.","apa":"Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2111–2118). <a href=\"https://doi.org/10.1109/ECTC.2016.91\">https://doi.org/10.1109/ECTC.2016.91</a>","ieee":"F. Eacock <i>et al.</i>, “Effect of different oxide layers on the ultrasonic copper wire bond process,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2111–2118."},"abstract":[{"lang":"eng","text":"Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties."}],"quality_controlled":"1","date_created":"2019-05-27T09:00:50Z","keyword":["Ultrasonic copper wire bonding","Al-oxide","Cuoxide","oxide-free","roughness","morphology"],"type":"conference","department":[{"_id":"151"}]},{"author":[{"last_name":"Eichwald","first_name":"Paul","full_name":"Eichwald, Paul"},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"full_name":"Eacock, Florian","first_name":"Florian","last_name":"Eacock"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}],"year":"2016","title":"Micro Wear Modeling in Copper Wire Wedge Bonding","status":"public","date_updated":"2020-05-07T05:33:53Z","_id":"9960","language":[{"iso":"eng"}],"user_id":"210","citation":{"short":"P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.","chicago":"Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge Bonding.” In <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","apa":"Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &#38; Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In <i>IEEE CPMT Symposium Japan, 2016</i>.","ieee":"P. Eichwald <i>et al.</i>, “Micro Wear Modeling in Copper Wire Wedge Bonding,” in <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","ama":"Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge Bonding. In: <i>IEEE CPMT Symposium Japan, 2016</i>. ; 2016.","bibtex":"@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016, title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}, year={2016} }","mla":"Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” <i>IEEE CPMT Symposium Japan, 2016</i>, 2016."},"publication":"IEEE CPMT Symposium Japan, 2016","project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a common technology for connecting electrodes of electronic components like power modules. Nowadays, bond connections are often made of copper instead of aluminum due to its thermal and mechanical assets. One of the main cost factors in the wire bonding process is the acquisition cost of consumables such as bonding tools. For copper wire bonding tool lifetime is much lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge bonding tools that was validated by observing wear patterns with a scanning electron microscope. The wear coefficient is determined in long-term bonding tests. The application of Fleischer´s wear approach incorporating frictional power to a finite element simulation of the bonding processes is used to shift element nodes depending on the rising frictional power for finite element modeling. The presented simulation method can be used to take tool wear into consideration for creating tools with increased lifetime. This enables the production of reliable bond connections using heavy as well as thin wire of any material. The paper discusses the predominant influences of wear on the main tool functions and their changes over tool life. Furthermore, the influence of the tool groove angle on the tool wear was investigated. One of the main results is that the wear is largest during the last phase of each bonding process, when the contact area between tool and wire is largest."}],"quality_controlled":"1","date_created":"2019-05-27T09:07:19Z","department":[{"_id":"151"}],"type":"conference"},{"quality_controlled":"1","abstract":[{"text":"Redundancy is a common approach to improve system reliability, availability and safety in technical systems. It is achieved by adding functionally equivalent elements that enable the system to remain operational even though one or more of those elements fail. This paper begins with an overview on the various terminologies and methods for redundancy concepts that can be modeled sufficiently using established reliability analysis methods. However, these approaches yield very complex system models, which limits their applicability. In current research, Bayesian Networks (BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used for reliability analysis because of their benefits in modeling complex systems and in representing multi-state variables. However, these approaches lack appropriate methods to model all commonly used redundancy concepts. To overcome this limitation, three different modeling approaches based on BNs and DBNs are described in this paper. Addressing those approaches, the benefits and limitations of BNs and DBNs for modeling reliability of redundant technical systems are discussed and evaluated.","lang":"eng"}],"publication":"Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016","citation":{"ieee":"T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks,” in <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2016). Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>.","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” In <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","short":"T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016.","mla":"Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }","ama":"Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In: <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>. ; 2016."},"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T09:10:07Z","date_updated":"2019-09-30T08:05:55Z","title":"Modeling of Complex Redundancy in Technical Systems with Bayesian Networks","status":"public","year":"2016","author":[{"first_name":"Thorben","last_name":"Kaul","full_name":"Kaul, Thorben","id":"14802"},{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"}],"user_id":"55222","_id":"9961","language":[{"iso":"eng"}]},{"department":[{"_id":"151"}],"keyword":["Kinematics and compliances","flexible viscoelastic suspension model","frictional rolling contact analysis","frictional power distribution."],"type":"conference","place":"Cyberjaya, Malaysia, 2016","date_created":"2019-05-27T09:13:14Z","abstract":[{"text":"Tire-wheel assembly is the only connection between road and vehicle. Contacting directly with road within postcard size of contact area, it is mounted and guided by the suspension system. Therefore kinematics and compliances of suspension system greatly influence the frictional coupling of tire tread elements and road surface asperities by affecting pressure and sliding velocity distribution in the contact zone. This study emphasizes the development of a numerical methodology for frictional rolling contact analysis with focus on interaction of suspension system dynamics and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody system of the multi-link rear suspension is established, where both flexible and rigid bodies are modeled to allow large displacements with included elastic effects. To meet accuracy requirements for the high frequency applications, such as road excitations, the amplitude- and frequency-dependency of rubber-metal bushings is included. Furthermore the proposed flexible viscoelastic suspension model is enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic response and covers any road excitations by tread submodel connected to road surface model. Concerning the verification and validation procedure numerous experiments are carried out to confirm the validity and the accuracy of both the developed submodels and the entire model. The devised approach makes it possible to investigate the influence of suspension system design on dynamical rolling contact and to evaluate tire tread wear. Therefore it can be a useful tool to predict frictional power distribution within the contact area under more realistic conditions.","lang":"eng"}],"citation":{"chicago":"Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using ADAMS.” In <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 1–12. Cyberjaya, Malaysia, 2016, 2016.","short":"S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.","apa":"Kohl, S., Sextro, W., &#38; Schulze, S. (2016). Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i> (pp. 1–12). Cyberjaya, Malaysia, 2016.","ieee":"S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS,” in <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 2016, pp. 1–12.","ama":"Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In: <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i> Cyberjaya, Malaysia, 2016; 2016:1-12.","bibtex":"@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016}, title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016}, pages={1–12} }","mla":"Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using ADAMS.” <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 2016, pp. 1–12."},"publication":"The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.","user_id":"55222","language":[{"iso":"eng"}],"_id":"9963","page":"1-12","date_updated":"2019-05-27T09:13:54Z","author":[{"first_name":"Sergej","last_name":"Kohl","full_name":"Kohl, Sergej"},{"id":"21220","first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"},{"full_name":"Schulze, Sebastian","last_name":"Schulze","first_name":"Sebastian"}],"year":"2016","title":"Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS","status":"public"},{"date_created":"2019-05-27T09:14:22Z","department":[{"_id":"151"}],"type":"conference","citation":{"mla":"Lessmeier, Christian, et al. “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.” <i>European Conference of the Prognostics and Health Management Society</i>, 2016.","bibtex":"@inproceedings{Lessmeier_Kimotho_Zimmer_Sextro_2016, title={Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification}, booktitle={European Conference of the Prognostics and Health Management Society}, author={Lessmeier, Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}, year={2016} }","ama":"Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In: <i>European Conference of the Prognostics and Health Management Society</i>. ; 2016.","ieee":"C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in <i>European Conference of the Prognostics and Health Management Society</i>, 2016.","apa":"Lessmeier, C., Kimotho, J. K., Zimmer, D., &#38; Sextro, W. (2016). Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In <i>European Conference of the Prognostics and Health Management Society</i>.","chicago":"Lessmeier, Christian, James Kuria Kimotho, Detmar Zimmer, and Walter Sextro. “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.” In <i>European Conference of the Prognostics and Health Management Society</i>, 2016.","short":"C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference of the Prognostics and Health Management Society, 2016."},"publication":"European Conference of the Prognostics and Health Management Society","abstract":[{"text":"This paper presents a benchmark data set for condition monitoring of rolling bearings in combination with an extensive description of the corresponding bearing damage, the data set generation by experiments and results of datadriven classifications used as a diagnostic method. The diagnostic method uses the motor current signal of an electromechanical drive system for bearing diagnostic. The advantage of this approach in general is that no additional sensors are required, as current measurements can be performed in existing frequency inverters. This will help to reduce the cost of future condition monitoring systems. A particular novelty of the present approach is the monitoring of damage in external bearings which are installed in the drive system but outside the electric motor. Nevertheless, the motor current signal is used as input for the detection of the damage. Moreover, a wide distribution of bearing damage is considered for the benchmark data set. The results of the classifications show that the motor current signal can be used to identify and classify bearing damage within the drive system. However, the classification accuracy is still low compared to classifications based on vibration signals. Further, dependency on properties of those bearing damage that were used for the generation of training data are observed, because training with data of artificially generated and real bearing damages lead to different accuracies. Altogether a verified and systematically generated data set is presented and published online for further research","lang":"eng"}],"quality_controlled":"1","language":[{"iso":"eng"}],"_id":"9964","user_id":"55222","author":[{"last_name":"Lessmeier","first_name":"Christian","full_name":"Lessmeier, Christian"},{"last_name":"Kimotho","first_name":"James Kuria","full_name":"Kimotho, James Kuria"},{"first_name":"Detmar","last_name":"Zimmer","full_name":"Zimmer, Detmar"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"}],"year":"2016","status":"public","title":"Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification","date_updated":"2019-09-16T10:35:40Z"},{"abstract":[{"text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented.","lang":"eng"}],"quality_controlled":"1","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"publication":"IEEE 66th Electronic Components and Technology Conference","citation":{"ieee":"T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–628.","apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 622–628). <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 622–28, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>.","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.","mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–28, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>.","bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","ama":"Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:622-628. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>"},"type":"conference","keyword":["Self-optimization","adaptive system","bond process","copper wire"],"department":[{"_id":"151"}],"date_created":"2019-05-27T09:17:26Z","date_updated":"2020-05-07T05:33:53Z","title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","year":"2016","status":"public","author":[{"full_name":"Meyer , Tobias","first_name":"Tobias","last_name":"Meyer "},{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"last_name":"Hunstig","first_name":"Matthias","full_name":"Hunstig, Matthias"},{"last_name":"Guth","first_name":"Karsten","full_name":"Guth, Karsten"}],"doi":"10.1109/ECTC.2016.215","user_id":"210","page":"622-628","_id":"9966","language":[{"iso":"eng"}]},{"user_id":"55222","_id":"9967","language":[{"iso":"eng"}],"page":"1-11","date_updated":"2019-05-27T09:19:49Z","author":[{"last_name":"Schulze","first_name":"Sebastian","full_name":"Schulze, Sebastian"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"last_name":"Kohl","first_name":"Sergej","full_name":"Kohl, Sergej"}],"year":"2016","title":"Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems","status":"public","department":[{"_id":"151"}],"type":"conference","keyword":["model reduction","modal description","flexible multibody systems"],"date_created":"2019-05-27T09:19:20Z","abstract":[{"lang":"eng","text":"Multibody models of mechatronic systems are usually interdisciplinary and are continuously gaining complexity, due to a growing demand for comprehensive models of systems including effects of electro mechanics, elastic bodies, contacts and friction. To be capable of simulating large models with subassemblies and contact between bodies, reduction techniques are required, which need certain experience in the choice of parameters. This publication discusses different possibilities for the modal description of structures in flexible multibody models with application to an Adaptive Frontlighting System in ADAMS. It will be shown that mode count, assembling of structures before and after modal reduction and influence of damping parameters of particular structures and subassemblies affect the behavior of the entire system. A common reduction technique for flexible structures in multibody models is the component mode synthesis, which uses a certain number of modes for description of the modal behavior of a structure. The influence of the mode count will be shown by means of different modal descriptions of one structure that contributes to a comprehensive model. Another study will prove that modal data of subassemblies and assemblies of modal reduced single structures lead to different models. The definition of damping parameters depends on the number of structures that have been added to an assembly before modal reduction and on the number of modal reduced structures. The comparison of subassemblies and the entire model to experimental data will highlight the accuracy, computational overhead, complexity of models and modeling efficiency of the comprehensive model for the frontlighting system."}],"citation":{"short":"S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.","chicago":"Schulze, Sebastian, Walter Sextro, and Sergej Kohl. “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” In <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>, 1–11, 2016.","apa":"Schulze, S., Sextro, W., &#38; Kohl, S. (2016). Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i> (pp. 1–11).","ieee":"S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems,” in <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>, 2016, pp. 1–11.","ama":"Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In: <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>. ; 2016:1-11.","bibtex":"@inproceedings{Schulze_Sextro_Kohl_2016, title={Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems}, booktitle={2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016}, author={Schulze, Sebastian and Sextro, Walter and Kohl, Sergej}, year={2016}, pages={1–11} }","mla":"Schulze, Sebastian, et al. “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>, 2016, pp. 1–11."},"publication":"2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016"},{"user_id":"210","page":"251-254","language":[{"iso":"eng"}],"_id":"9968","date_updated":"2020-05-07T05:33:53Z","title":"Validated Simulation of the Ultrasonic Wire Bonding Process","status":"public","year":"2016","author":[{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard","id":"28647"},{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"type":"conference","keyword":["the Ultrasonic Wire Bonding Process"],"department":[{"_id":"151"}],"date_created":"2019-05-27T09:20:10Z","place":"IEEE CPMT Symposium Japan","quality_controlled":"1","abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","citation":{"ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan.","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016."}},{"citation":{"ama":"Hammer M. Wave interaction in photonic integrated circuits: Hybrid analytical / numerical coupled mode modeling. In: Broquin J-E, Nunzi Conti G, eds. <i>Integrated Optics: Devices, Materials, and Technologies XX</i>. SPIE; 2016:975018-975018-8. doi:<a href=\"https://doi.org/10.1117/12.2214331\">10.1117/12.2214331</a>","bibtex":"@inproceedings{Hammer_2016, title={Wave interaction in photonic integrated circuits: Hybrid analytical / numerical coupled mode modeling}, DOI={<a href=\"https://doi.org/10.1117/12.2214331\">10.1117/12.2214331</a>}, number={9750}, booktitle={Integrated Optics: Devices, Materials, and Technologies XX}, publisher={SPIE}, author={Hammer, Manfred}, editor={Broquin, Jean-Emmanuel and Nunzi Conti, GualtieroEditors}, year={2016}, pages={975018-975018–8} }","mla":"Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid Analytical / Numerical Coupled Mode Modeling.” <i>Integrated Optics: Devices, Materials, and Technologies XX</i>, edited by Jean-Emmanuel Broquin and Gualtiero Nunzi Conti, no. 9750, SPIE, 2016, pp. 975018-975018–8, doi:<a href=\"https://doi.org/10.1117/12.2214331\">10.1117/12.2214331</a>.","chicago":"Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid Analytical / Numerical Coupled Mode Modeling.” In <i>Integrated Optics: Devices, Materials, and Technologies XX</i>, edited by Jean-Emmanuel Broquin and Gualtiero Nunzi Conti, 975018-975018–8. SPIE, 2016. <a href=\"https://doi.org/10.1117/12.2214331\">https://doi.org/10.1117/12.2214331</a>.","short":"M. Hammer, in: J.-E. Broquin, G. Nunzi Conti (Eds.), Integrated Optics: Devices, Materials, and Technologies XX, SPIE, 2016, pp. 975018-975018–8.","apa":"Hammer, M. (2016). Wave interaction in photonic integrated circuits: Hybrid analytical / numerical coupled mode modeling. In J.-E. Broquin &#38; G. Nunzi Conti (Eds.), <i>Integrated Optics: Devices, Materials, and Technologies XX</i> (pp. 975018-975018–8). San Francisco, USA: SPIE. <a href=\"https://doi.org/10.1117/12.2214331\">https://doi.org/10.1117/12.2214331</a>","ieee":"M. Hammer, “Wave interaction in photonic integrated circuits: Hybrid analytical / numerical coupled mode modeling,” in <i>Integrated Optics: Devices, Materials, and Technologies XX</i>, San Francisco, USA, 2016, no. 9750, pp. 975018-975018–8."},"editor":[{"full_name":"Broquin, Jean-Emmanuel","last_name":"Broquin","first_name":"Jean-Emmanuel"},{"first_name":"Gualtiero","last_name":"Nunzi Conti","full_name":"Nunzi Conti, Gualtiero"}],"user_id":"55706","_id":"3934","publisher":"SPIE","page":"975018-975018-8 ","conference":{"name":"Photonics West 2016/OPTO 2016","location":"San Francisco, USA"},"status":"public","department":[{"_id":"61"}],"keyword":["tet_topic_waveguide","tet_topic_numerics"],"type":"conference","date_created":"2018-08-20T09:25:13Z","abstract":[{"text":"Typical optical integrated circuits combine elements, like straight and curved waveguides, or cavities, the simulation and design of which is well established through numerical eigenproblem-solvers. It remains to predict the interaction of these modes. We address this task by a ”Hybrid” variant (HCMT) of Coupled Mode Theory. Using methods from finite-element numerics, the optical properties of a circuit are approximated by superpositions of eigen-solutions for its constituents, leading to quantitative, low-dimensional, and interpretable models in the frequency domain. Spectral scans are complemented by the direct computation of supermode properties (spectral positions and linewidths, coupling-induced phase shifts). This contribution outlines the theoretical background, and discusses briefly limitations and implementational details, with the help of an example of a 2-D coupled-resonator-optical-waveguide configuration.","lang":"eng"}],"issue":"9750","publication":"Integrated Optics: Devices, Materials, and Technologies XX","doi":"10.1117/12.2214331","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:59:56Z","publication_status":"published","author":[{"id":"48077","full_name":"Hammer, Manfred","orcid":"0000-0002-6331-9348","first_name":"Manfred","last_name":"Hammer"}],"year":"2016","title":"Wave interaction in photonic integrated circuits: Hybrid analytical / numerical coupled mode modeling"},{"file_date_updated":"2018-08-20T13:35:02Z","citation":{"mla":"Meyers, Thorsten, et al. “Low-Voltage DNTT-Based Thin-Film Transistors and Inverters for Flexible Electronics.” <i>Microelectronic Engineering</i>, vol. 174, Elsevier BV, 2016, pp. 35–39, doi:<a href=\"https://doi.org/10.1016/j.mee.2016.12.018\">10.1016/j.mee.2016.12.018</a>.","apa":"Meyers, T., Vidor, F. F., Brassat, K., Lindner, J., &#38; Hilleringmann, U. (2016). Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics. <i>Microelectronic Engineering</i>, <i>174</i>, 35–39. <a href=\"https://doi.org/10.1016/j.mee.2016.12.018\">https://doi.org/10.1016/j.mee.2016.12.018</a>","ieee":"T. Meyers, F. F. Vidor, K. Brassat, J. Lindner, and U. Hilleringmann, “Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics,” <i>Microelectronic Engineering</i>, vol. 174, pp. 35–39, 2016.","chicago":"Meyers, Thorsten, Fábio F. Vidor, Katharina Brassat, Jörg Lindner, and Ulrich Hilleringmann. “Low-Voltage DNTT-Based Thin-Film Transistors and Inverters for Flexible Electronics.” <i>Microelectronic Engineering</i> 174 (2016): 35–39. <a href=\"https://doi.org/10.1016/j.mee.2016.12.018\">https://doi.org/10.1016/j.mee.2016.12.018</a>.","short":"T. Meyers, F.F. Vidor, K. Brassat, J. Lindner, U. Hilleringmann, Microelectronic Engineering 174 (2016) 35–39.","ama":"Meyers T, Vidor FF, Brassat K, Lindner J, Hilleringmann U. Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics. <i>Microelectronic Engineering</i>. 2016;174:35-39. doi:<a href=\"https://doi.org/10.1016/j.mee.2016.12.018\">10.1016/j.mee.2016.12.018</a>","bibtex":"@article{Meyers_Vidor_Brassat_Lindner_Hilleringmann_2016, title={Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics}, volume={174}, DOI={<a href=\"https://doi.org/10.1016/j.mee.2016.12.018\">10.1016/j.mee.2016.12.018</a>}, journal={Microelectronic Engineering}, publisher={Elsevier BV}, author={Meyers, Thorsten and Vidor, Fábio F. and Brassat, Katharina and Lindner, Jörg and Hilleringmann, Ulrich}, year={2016}, pages={35–39} }"},"status":"public","has_accepted_license":"1","page":"35-39","publisher":"Elsevier BV","_id":"3956","user_id":"55706","ddc":["530"],"volume":174,"publication":"Microelectronic Engineering","abstract":[{"lang":"eng","text":"In this article we present an integration technique for low-voltage DNTT-based TFTs for flexible electronic applications.\r\nTherefore, a high-k nanocomposite combining the flexibility of its polymericmatrix and the high permittivity\r\nof the incorporated inorganic material was used as gate dielectric layer. The influence of a conventional\r\nphotolithography process upon the dielectric layer is analyzed regarding electrical instabilities in the device characteristics.\r\nThe impact of an implemented sacrificial layer to reduce chemical stress to the insulating film during\r\nphotolithography is evaluated. Furthermore, first inverter circuits were integrated and electrically characterized.\r\nAdditionally, the implementation of this sacrificial layer can be used for future complementary circuit design."}],"file":[{"content_type":"application/pdf","success":1,"file_id":"3957","date_updated":"2018-08-20T13:35:02Z","relation":"main_file","file_size":758984,"access_level":"closed","file_name":"Now-voltage DNTT-based thin-film transistors and inverters for flexible electronics.pdf","date_created":"2018-08-20T13:35:02Z","creator":"hclaudia"}],"date_created":"2018-08-20T13:33:05Z","type":"journal_article","department":[{"_id":"286"},{"_id":"15"}],"title":"Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics","year":"2016","publication_identifier":{"issn":["0167-9317"]},"author":[{"full_name":"Meyers, Thorsten","first_name":"Thorsten","last_name":"Meyers"},{"first_name":"Fábio F.","last_name":"Vidor","full_name":"Vidor, Fábio F."},{"id":"11305","full_name":"Brassat, Katharina","first_name":"Katharina","last_name":"Brassat"},{"full_name":"Lindner, Jörg","first_name":"Jörg","last_name":"Lindner","id":"20797"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"publication_status":"published","date_updated":"2022-01-06T07:00:00Z","article_type":"original","intvolume":"       174","language":[{"iso":"eng"}],"doi":"10.1016/j.mee.2016.12.018"},{"citation":{"short":"K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, J. Lindner, in: 2016.","chicago":"Brassat, Katharina, Arne Rüdiger, Julius Bürger, W. Bremser, Oliver Strube, and Jörg Lindner. “Enzyme Mediated Autodeposition of Protein Particles on Nanosphere Lithographically Nanostructured Surfaces ,” 2016.","apa":"Brassat, K., Rüdiger, A., Bürger, J., Bremser, W., Strube, O., &#38; Lindner, J. (2016). Enzyme mediated autodeposition of protein particles on nanosphere lithographically nanostructured surfaces . Presented at the E-MRS Fall Meeting 2016, Warsaw (Poland).","ieee":"K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, and J. Lindner, “Enzyme mediated autodeposition of protein particles on nanosphere lithographically nanostructured surfaces ,” presented at the E-MRS Fall Meeting 2016, Warsaw (Poland), 2016.","ama":"Brassat K, Rüdiger A, Bürger J, Bremser W, Strube O, Lindner J. Enzyme mediated autodeposition of protein particles on nanosphere lithographically nanostructured surfaces . In: ; 2016.","bibtex":"@inproceedings{Brassat_Rüdiger_Bürger_Bremser_Strube_Lindner_2016, title={Enzyme mediated autodeposition of protein particles on nanosphere lithographically nanostructured surfaces }, author={Brassat, Katharina and Rüdiger, Arne and Bürger, Julius and Bremser, W. and Strube, Oliver and Lindner, Jörg}, year={2016} }","mla":"Brassat, Katharina, et al. <i>Enzyme Mediated Autodeposition of Protein Particles on Nanosphere Lithographically Nanostructured Surfaces </i>. 2016."},"date_created":"2018-08-21T12:19:28Z","department":[{"_id":"286"},{"_id":"15"}],"type":"conference","author":[{"id":"11305","last_name":"Brassat","first_name":"Katharina","full_name":"Brassat, Katharina"},{"full_name":"Rüdiger, Arne","last_name":"Rüdiger","first_name":"Arne"},{"full_name":"Bürger, Julius","first_name":"Julius","last_name":"Bürger","id":"46952"},{"full_name":"Bremser, W.","last_name":"Bremser","first_name":"W."},{"last_name":"Strube","first_name":"Oliver","full_name":"Strube, Oliver"},{"id":"20797","full_name":"Lindner, Jörg","last_name":"Lindner","first_name":"Jörg"}],"conference":{"location":"Warsaw (Poland)","name":"E-MRS Fall Meeting 2016","start_date":"2016-09-19","end_date":"2016-09-22"},"status":"public","title":"Enzyme mediated autodeposition of protein particles on nanosphere lithographically nanostructured surfaces ","year":"2016","date_updated":"2022-01-06T07:00:06Z","_id":"4004","language":[{"iso":"eng"}],"user_id":"55706"}]